CN103222845A - Method for packaging multi-lens full-view endoscope - Google Patents
Method for packaging multi-lens full-view endoscope Download PDFInfo
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- CN103222845A CN103222845A CN2013101765256A CN201310176525A CN103222845A CN 103222845 A CN103222845 A CN 103222845A CN 2013101765256 A CN2013101765256 A CN 2013101765256A CN 201310176525 A CN201310176525 A CN 201310176525A CN 103222845 A CN103222845 A CN 103222845A
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- packing
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- endoscope
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- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 12
- 238000012856 packing Methods 0.000 claims description 33
- 239000007787 solid Substances 0.000 claims description 33
- 230000000007 visual effect Effects 0.000 claims description 25
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- 238000007796 conventional method Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 6
- 210000001035 gastrointestinal tract Anatomy 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 239000002775 capsule Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 210000000936 intestine Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000009747 swallowing Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310176525.6A CN103222845B (en) | 2013-05-14 | 2013-05-14 | The method for packing of the full full-view endoscope of a kind of many camera lenses |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310176525.6A CN103222845B (en) | 2013-05-14 | 2013-05-14 | The method for packing of the full full-view endoscope of a kind of many camera lenses |
Publications (2)
Publication Number | Publication Date |
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CN103222845A true CN103222845A (en) | 2013-07-31 |
CN103222845B CN103222845B (en) | 2015-08-05 |
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Family Applications (1)
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CN201310176525.6A Active CN103222845B (en) | 2013-05-14 | 2013-05-14 | The method for packing of the full full-view endoscope of a kind of many camera lenses |
Country Status (1)
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CN (1) | CN103222845B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104952829A (en) * | 2014-03-31 | 2015-09-30 | 广东丹邦科技有限公司 | Flexible circuit substrate with bending multi-chip package and manufacturing method thereof |
CN107863338A (en) * | 2017-11-08 | 2018-03-30 | 奥肯思(北京)科技有限公司 | A kind of boxlike three-dimensional systematic encapsulation |
CN107911628A (en) * | 2017-12-28 | 2018-04-13 | 信利光电股份有限公司 | Multi-cam component and multi-cam assembly |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002102224A2 (en) * | 2001-06-18 | 2002-12-27 | Given Imaging Ltd. | In vivo sensing device with a circuit board having rigid sections and flexible sections |
US20060241422A1 (en) * | 2005-03-31 | 2006-10-26 | Given Imaging Ltd. | Antenna for in-vivo imaging system |
US20060264704A1 (en) * | 2004-01-19 | 2006-11-23 | Olympus Corporation | Capsule-type medical apparatus |
WO2007125918A1 (en) * | 2006-04-25 | 2007-11-08 | Olympus Medical Systems Corp. | Encapsulated endoscope |
CN101480334A (en) * | 2008-01-10 | 2009-07-15 | 清华大学 | Full visual acquisition system for organism in body cavity |
CN101646380A (en) * | 2007-03-30 | 2010-02-10 | 奥林巴斯医疗株式会社 | The manufacture method of capsule medical apparatus and capsule medical apparatus |
CN102186398A (en) * | 2008-12-09 | 2011-09-14 | 奥林巴斯医疗株式会社 | Encapsulated medical device and method for manufacturing same |
CN102781303A (en) * | 2010-02-01 | 2012-11-14 | 塞拉芬·尼盖茨·伊图瓦 | Spherical capsule video endoscopy |
-
2013
- 2013-05-14 CN CN201310176525.6A patent/CN103222845B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002102224A2 (en) * | 2001-06-18 | 2002-12-27 | Given Imaging Ltd. | In vivo sensing device with a circuit board having rigid sections and flexible sections |
US20060264704A1 (en) * | 2004-01-19 | 2006-11-23 | Olympus Corporation | Capsule-type medical apparatus |
US20060241422A1 (en) * | 2005-03-31 | 2006-10-26 | Given Imaging Ltd. | Antenna for in-vivo imaging system |
WO2007125918A1 (en) * | 2006-04-25 | 2007-11-08 | Olympus Medical Systems Corp. | Encapsulated endoscope |
CN101646380A (en) * | 2007-03-30 | 2010-02-10 | 奥林巴斯医疗株式会社 | The manufacture method of capsule medical apparatus and capsule medical apparatus |
CN101480334A (en) * | 2008-01-10 | 2009-07-15 | 清华大学 | Full visual acquisition system for organism in body cavity |
CN102186398A (en) * | 2008-12-09 | 2011-09-14 | 奥林巴斯医疗株式会社 | Encapsulated medical device and method for manufacturing same |
CN102781303A (en) * | 2010-02-01 | 2012-11-14 | 塞拉芬·尼盖茨·伊图瓦 | Spherical capsule video endoscopy |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104952829A (en) * | 2014-03-31 | 2015-09-30 | 广东丹邦科技有限公司 | Flexible circuit substrate with bending multi-chip package and manufacturing method thereof |
CN107863338A (en) * | 2017-11-08 | 2018-03-30 | 奥肯思(北京)科技有限公司 | A kind of boxlike three-dimensional systematic encapsulation |
CN107911628A (en) * | 2017-12-28 | 2018-04-13 | 信利光电股份有限公司 | Multi-cam component and multi-cam assembly |
Also Published As
Publication number | Publication date |
---|---|
CN103222845B (en) | 2015-08-05 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: NATIONAL CENTER FOR ADVANCED PACKAGING Free format text: FORMER OWNER: INST OF MICROELECTRONICS, C. A. S Effective date: 20150228 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 100029 CHAOYANG, BEIJING TO: 214135 WUXI, JIANGSU PROVINCE |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20150228 Address after: Taihu international science and Technology Park in Jiangsu province Wuxi City Linghu road 214135 Wuxi national hi tech Industrial Development Zone No. 200 Chinese Sensor Network International Innovation Park building D1 Applicant after: National Center for Advanced Packaging Co.,Ltd. Address before: 100029 Beijing city Chaoyang District Beitucheng West Road No. 3 Applicant before: Institute of Microelectronics of the Chinese Academy of Sciences |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170818 Address after: 200331 room 155-2, ginkgo Road, Shanghai, Putuo District, China, 4 Patentee after: Shanghai State Intellectual Property Services Co.,Ltd. Address before: Taihu international science and Technology Park in Jiangsu province Wuxi City Linghu road 214135 Wuxi national hi tech Industrial Development Zone No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee before: National Center for Advanced Packaging Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191210 Address after: 214028 Jiangsu New District of Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee after: National Center for Advanced Packaging Co.,Ltd. Address before: 200331 room 155-2, ginkgo Road, Shanghai, Putuo District, China, 4 Patentee before: Shanghai State Intellectual Property Services Co.,Ltd. |