CN103220887A - PCB (Printed Circuit Board) grafting process - Google Patents
PCB (Printed Circuit Board) grafting process Download PDFInfo
- Publication number
- CN103220887A CN103220887A CN2013101023966A CN201310102396A CN103220887A CN 103220887 A CN103220887 A CN 103220887A CN 2013101023966 A CN2013101023966 A CN 2013101023966A CN 201310102396 A CN201310102396 A CN 201310102396A CN 103220887 A CN103220887 A CN 103220887A
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- daughter board
- board
- motherboard
- daughter
- interface
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Abstract
The invention discloses a brand new PCB (Printed Circuit Board) grafting process method, which comprises the following steps of: (1) analyzing conditions of a mother board and a daughter board, and cutting the daughter board; (2) cutting an interface of the mother board and the newly implanted daughter board, and preserving a certain amount of gap at the interference of the mother board and the daughter board; (3) utilizing a CCD (Charge Couple Device) positioning device to adjust the daughter board to a standard size, fixing the daughter board on the mother board through a glue film, and bonding the glue film on a front side and a back side of the interference of the mother board and the daughter board so as to totally cover the preserved gap; and (4) penetrating through the glue film to form a hole through specialized laser equipment or other auxiliary equipment, injecting resin glue into the preserved gap, and fixing and bonding the daughter board and the mother board by utilizing the solidification of the resin glue. The brand new PCB grafting process method has concise procedures, and the PCB can be bonded firmly and cannot be polluted.
Description
Technical field
The present invention and a kind of pcb board are transplanted technology, relate in particular to a kind of pcb board grafting technology.
Background technology
At present, along with the competition in market, increasing Electronics Factory requires to produce wiring board in flakes, in the hope of enhancing productivity, reduces production costs.But the list of wiring board is only scrapped a difficult problem that becomes circuit board plant gradually in flakes.For solving this difficult problem, the pcb board implantation technique arises at the historic moment.Injecting glue grafting technology is adopted in the grafting of existing P CB plate, the seamless grafting before of such technology has better effect, but also there is defective in this technology, causes connection firm inadequately as injecting glue is inhomogeneous, glue overflows the pollution pcb board, and the SMT process takes place that easily the plate bent plate sticks up etc.
Summary of the invention
It is succinct to the invention provides a kind of operation, the bonding more firm and not contaminated pcb board grafting technology of pcb board.
For achieving the above object, the present invention has adopted following technical scheme:
A kind of pcb board grafting technology may further comprise the steps:
1) analyzes motherboard and daughter board sheet material situation, daughter board is cut;
2) interface to motherboard and neo-implanted daughter board cuts, and makes the interface of motherboard and daughter board reserve a certain amount of slit;
3) use the CCD positioning equipment to adjust to daughter board after the standard size and be fixed on the motherboard by mucous membrane, described mucoadhesive is in the tow sides of motherboard and daughter board interface, and reserving gaps is all covered;
4) by specialized laser devices or other auxiliary equipment, mucous membrane is penetrated into hole, resin glue is injected in the reserving gaps, utilize the curing of resin glue to make daughter board and the fixing bonding of motherboard.
Preferably, the interface of described motherboard and daughter board is established an arc at least.
The positive and negative bonding mucous membrane of interface becomes enclosure space with reserving gaps, and by passing through specialized laser devices or other auxiliary equipment, pass mucous membrane and inject resin glue to reserving gaps, such injecting glue mode can make resin glue inject reserving gaps adequately and uniformly, does not overflow the situation of polluting pcb board but also glue can not occur; The arc design of interface makes the fixed effect of motherboard and daughter board better.
Compared with prior art, beneficial effect of the present invention is that operation is succinct, and pcb board is bonding more firm, has guaranteed that pcb board is not contaminated.
Description of drawings
Fig. 1 is a flow chart of the present invention;
Fig. 2 is the structural representation that a preferred embodiment of the present invention cuts preceding motherboard and daughter board;
Fig. 3 is the structural representation of motherboard and daughter board after the embodiment grafting among Fig. 2;
Fig. 4 is the structural representation of motherboard and daughter board interface after the grafting among Fig. 3.
Embodiment
Consult Fig. 1-4, this pcb board grafting implementation of processes example comprises motherboard 1, grafting daughter board 2, and reserving gaps 3 is scrapped daughter board 4 and mucous membrane 5; To scrap daughter board 4 and cut removal from motherboard 1, with motherboard 1 with after transplanting daughter board 2 and cutting interface on request, daughter board 2 is accurately adjusted the back by the CCD positioning equipment and is fixed on the motherboard 1 by mucous membrane 5, and make daughter board 2 and motherboard 1 junction leave reserving gaps 3, wherein reserving gaps 3 becomes enclosure space by mucous membrane 5 after bonding.By specialized laser devices or other auxiliary equipment, mucous membrane 5 is penetrated into hole, in reserving gaps 3, inject resin glue, after solidifying, resin glue just grafting daughter board 2 and motherboard 1 are fixed bonding.Inject resin glue at enclosure space and not only can not overflow the pollution pcb board, and resin glue is distributed in the reserving gaps 3 uniformly.
Wherein the curing of resin glue needs in the best curing temperature scope, and curing time is greater than just making the shortest curing time daughter board 2 and motherboard 1 bonding more firm.
Below only be concrete exemplary applications of the present invention, protection scope of the present invention is not constituted any limitation.All employing equivalents or equivalence are replaced and the technical scheme of formation, all drop within the rights protection scope of the present invention
Claims (2)
1. a pcb board grafting technology is characterized in that, may further comprise the steps:
1) analyzes motherboard and daughter board sheet material situation, daughter board is cut;
2) interface to motherboard and neo-implanted daughter board cuts, and makes the interface of motherboard and daughter board reserve a certain amount of slit;
3) use the CCD positioning equipment to adjust to daughter board after the standard size and be fixed on the motherboard by mucous membrane, described mucoadhesive is in the tow sides of motherboard and daughter board interface, and reserving gaps is all covered;
4) by specialized laser devices or other auxiliary equipment, mucous membrane is penetrated into hole, resin glue is injected in the reserving gaps, utilize the curing of resin glue to make daughter board and the fixing bonding of motherboard.
2. pcb board grafting technology according to claim 1 is characterized in that the interface of described motherboard and daughter board is established an arc at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101023966A CN103220887A (en) | 2013-03-28 | 2013-03-28 | PCB (Printed Circuit Board) grafting process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101023966A CN103220887A (en) | 2013-03-28 | 2013-03-28 | PCB (Printed Circuit Board) grafting process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103220887A true CN103220887A (en) | 2013-07-24 |
Family
ID=48818172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101023966A Pending CN103220887A (en) | 2013-03-28 | 2013-03-28 | PCB (Printed Circuit Board) grafting process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103220887A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107770955A (en) * | 2016-08-15 | 2018-03-06 | 鹏鼎控股(深圳)股份有限公司 | The attachment structure of circuit board assembling method and the circuit board after being connect with its group |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003031927A (en) * | 2001-07-13 | 2003-01-31 | Nippon Avionics Co Ltd | Method of manufacturing printed wiring board |
| CN1956630A (en) * | 2005-10-28 | 2007-05-02 | 诠脑电子（深圳）有限公司 | Method of transplating and splicing single board of printed circuit board |
| CN101932198A (en) * | 2010-06-10 | 2010-12-29 | 瀚宇博德科技（江阴）有限公司 | Manufacturing method for transplanting printed circuit board and structure thereof |
-
2013
- 2013-03-28 CN CN2013101023966A patent/CN103220887A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003031927A (en) * | 2001-07-13 | 2003-01-31 | Nippon Avionics Co Ltd | Method of manufacturing printed wiring board |
| CN1956630A (en) * | 2005-10-28 | 2007-05-02 | 诠脑电子（深圳）有限公司 | Method of transplating and splicing single board of printed circuit board |
| CN101932198A (en) * | 2010-06-10 | 2010-12-29 | 瀚宇博德科技（江阴）有限公司 | Manufacturing method for transplanting printed circuit board and structure thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107770955A (en) * | 2016-08-15 | 2018-03-06 | 鹏鼎控股(深圳)股份有限公司 | The attachment structure of circuit board assembling method and the circuit board after being connect with its group |
| CN107770955B (en) * | 2016-08-15 | 2020-04-14 | 鹏鼎控股(深圳)股份有限公司 | Circuit board assembling method and connecting structure of circuit board assembled with same |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130724 |