CN103216742A - High-power LED (Light-Emitting Diode) light source with heat dissipation package - Google Patents
High-power LED (Light-Emitting Diode) light source with heat dissipation package Download PDFInfo
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- CN103216742A CN103216742A CN2012100171415A CN201210017141A CN103216742A CN 103216742 A CN103216742 A CN 103216742A CN 2012100171415 A CN2012100171415 A CN 2012100171415A CN 201210017141 A CN201210017141 A CN 201210017141A CN 103216742 A CN103216742 A CN 103216742A
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- light source
- heat radiation
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- led light
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Abstract
The invention relates to a high-power LED (Light-Emitting Diode) light source with a heat dissipation package, which comprises a substrate, at least one LED chip and a condenser lens, wherein the LED chip is arranged on the surface of the substrate and is bare; the condenser lens covers the LED chip; a sealed heat dissipation chamber is formed among the substrate, the LED chip and the condenser lens; and the heat dissipation chamber is provided with an air duct inlet and an air duct outlet which are communicated with the heat dissipation chamber, so that air flows in and out of the heat dissipation chamber, so that heat around the surface of the LED chip is discharged by air flowing. According to the high-power LED light source with the heat dissipation package, the heat dissipation effect of the LED light source is strengthened in a manner of carrying out air cooling heat dissipation on the surface of the LED chip; and the high-power LED light source with the heat dissipation package has a simple structure and high reliability.
Description
Technical field
The present invention relates to lighting source, relate in particular to a kind of high-power LED light source with heat radiation encapsulation.
Background technology
(Light Emitting Diode LED) is a kind of gallium phosphide (GAP), gallium nitride semi-conducting material luminescent devices that make, that can directly electric energy be converted into luminous energy such as (GAN) to light emitting diode.Because characteristics such as Toxic matter are grown, are quick on the draw, are not contained to its luminous efficiency height, life-span, make its application more and more widely, as light of stage illumination, crystal projection, mobile phone backlight, display screen etc.
In recent years, people are more and more higher to the brightness requirement of led light source, as the light of stage lighting field, yet, follow the lifting of brightness, led chip tends to produce a large amount of heat energy, and the junction temperature of LED is raise, and reduces the emitting brightness and the service life of led chip.Present stage great power LED and the led light source module mainly be to adopt the heat conducting mode of chip bottom, by Heat Conduction Materials such as metal or potteries the heat that led chip sent is transmitted on the fin by the solid mode, take air-cooled mode that this heat is brought in the air again, solve the heat dissipation problem of led light source.Yet the radiating effect of this radiating mode is very limited, especially for high-power or super-high-power LED light source, a large amount of heat accumulations is still arranged on the led chip surface, influences the emitting brightness and the service life of light source.
Summary of the invention
In view of this, must provide a kind of good heat dissipation effect, have a high-power LED light source of heat radiation encapsulation reliably.
Goal of the invention of the present invention is achieved through the following technical solutions:
A kind of high-power LED light source with heat radiation encapsulation comprises substrate, and at least one is arranged at the exposed led chip of described substrate surface, and the collector lens that covers at described led chip.Wherein, form the heat radiation chamber of sealing between described substrate, led chip and the collector lens, described heat radiation chamber is provided with air channel inlet and the ducting outlet that is communicated with it, thereby flows into, flows out described heat radiation chamber for air, led chip surface heat is on every side flowed by air discharge.
High-power LED light source with heat radiation encapsulation of the present invention by the led chip surface being carried out the mode of wind-cooling heat dissipating, is strengthened the radiating effect of led light source, and is simple in structure, the reliability height.
Description of drawings
In order to be easy to explanation, the present invention is done to describe in detail by following preferred embodiment and accompanying drawing.
Fig. 1 is the structural representation of the high-power LED light source with heat radiation encapsulation of first embodiment of the invention.
Fig. 2 is the A portion structure for amplifying schematic diagram of Fig. 1.
Fig. 3 is the arrangement mode structural representation of many hexagon chips.
Fig. 4 is the structural representation of the high-power LED light source with heat radiation encapsulation of second embodiment of the invention.
Fig. 5 is the B portion structure for amplifying schematic diagram of Fig. 4.
The specific embodiment
Figure 1 shows that the structural representation of the high-power LED light source with heat radiation encapsulation of first embodiment of the invention, consult Fig. 2 simultaneously, be the A portion structure for amplifying schematic diagram of Fig. 1, in the embodiment of the present invention, the high-power LED light source 10 with heat radiation encapsulation is single light source.This high-power LED light source 10 with heat radiation encapsulation comprises substrate 101, and the exposed led chip 102 that at least one is arranged at substrate 101 surfaces covers at the collector lens 103 of led chip 102, and the lens holder 104 that is used for fixing collector lens 103.Wherein, form the heat radiation chamber of sealing between substrate 101, led chip 102, collector lens 103 and the lens holder 104.Being shaped as of this heat radiation chamber
Type is provided with the air channel inlet 105 and the ducting outlet 106 that are communicated with it, thereby flows into, flows out this heat radiation chamber for air, led chip 102 surface heats is on every side flowed by air discharge.Because led chip 102 is directly to expose in air, therefore, the air in the heat radiation chamber can flow on led chip 102, distributes heat in its space of living in thereby take away led chip 102.
In other embodiment of the present invention, lens holder 104 also can omit, as long as satisfy the heat radiation chamber that forms sealing between substrate 101, led chip 102 and the collector lens 103, thereby flow into, flow out the heat radiation chamber for air, make led chip surface heat on every side flow to discharge and get final product by air.As: by silica gel the collector lens 103 of a plurality of led chip 102 correspondences being stitched together forms the heat radiation chamber that seals between back and substrate 101, the led chip 102.
In the embodiment of the present invention, led chip 102 can be traditional square chip, also can be the hexagon chip, and the quantity of the led chip 102 of each collector lens 103 correspondence can be single, also can be multiple chips arranged into an array.When led chip 102 is many hexagon chips, can be that the circular or subcircular in center is arranged (as shown in Figure 3) with a chips wherein.Adopt the hexagon chip, help under the situation that does not have the fly's-eye lens (not shown), its imaging facula also can be raised the efficiency near circular.
105 places that enter the mouth, air channel are provided with airstrainer 107, are used for the air that enters in the heat radiation chamber is filtered, and avoid air damage chip by led chip 102 time.And ducting outlet 106 places also are provided with fan 108 (induced draught fan), be used to make the outer air of heat radiation chamber to enter the mouth and 105 enter from described air channel, through back, led chip 102 surface from ducting outlet 106 outflows.Because led chip 102 of the present invention is directly to expose in air, be subjected to dirtyly easily, to make moist, the structure of airstrainer 107 is adopted in the influence of ESD etc., and the exposed led chip 102 of the better protection utilized is arranged.
Certainly, in other embodiment of the present invention, 105 places that also can enter the mouth in the air channel are provided with the blowing fan, but because heat radiation chamber one-tenth
Type, 105 places that enter the mouth in the air channel adopt the blowing fan, and the wind that fan blows out partly can be at reflected back air channel, lens holder 104 place inlet 105, and therefore, the effect that air is flowed is not so good as to adopt at ducting outlet 106 places the effect of induced draught fan.
Again, substrate 101 is the insulation high thermal conductive substrate, and its back side also is provided with radiator 109, the heat dissipation channel that the heat that led chip 102 is produced can be formed by the insulation high thermal conductive substrate fast conducts, outwards dissipate, therefore, the temperature at substrate 101 surface source of light places can reduce rapidly.Promptly, adopt the heat conducting mode of chip bottom, by Heat Conduction Materials such as metal or potteries the heat that led chip 102 is sent is transmitted on the radiator 109 by the solid mode, be dissipated in the air, by this traditional radiating mode, the temperature that helps substrate 101 surface source of light places can reduce rapidly.Therefore, on the basis of traditional heat-dissipating pattern, the wind-cooling heat dissipating mode of subsidiary book invention on exposed led chip surface adds the strong radiating effect of LED again, can effectively solve the heat dissipation problem of led light source, especially for high-power or super-high-power LED light source, effect is more obvious, and is reliable.
In addition, also be provided with shaping mirror group 103 ' on the emitting light path of collector lens 103, be used to collect and the received light of shaping, repeat no more here.
Therefore, the high-power LED light source with heat radiation encapsulation of the present invention by adopting the mode of led chip surface wind-cooling heat dissipating, is strengthened the radiating effect of led light source, and is simple in structure, the reliability height.
Figure 4 shows that the structural representation of the high-power LED light source with heat radiation encapsulation of second embodiment of the invention, consult Fig. 5 simultaneously, be the B portion structure for amplifying schematic diagram of Fig. 4.This high-power LED light source with heat radiation encapsulation is basic identical with the structure of the high-power LED light source with heat radiation encapsulation of first embodiment, and difference is that shown in Figure 4 to have the high-power LED light source that heat radiation encapsulates be multiple light courcess.Specifically, high-power LED light source is the three-color light source (as: red-light source 11, blue light source 12, green-light source 13) that sends different peak wavelengths.The intersection of the emitting light path of this three-color light source also is provided with closes look mirror 14, and the light beam that is used to merge the three-color light source outgoing is a branch of light.
Therefore, the high-power LED light source with heat radiation encapsulation of the present invention by the led chip surface being carried out the mode of wind-cooling heat dissipating, is strengthened the radiating effect of led light source, and is simple in structure, the reliability height.
The specific embodiment of the above is the better embodiment of invention; be not to limit concrete practical range of the present invention with this; scope of the present invention comprises and is not limited to this specific embodiment, and the equivalence that all shapes according to the present invention, structure are done changes and all comprises in protection scope of the present invention.
Claims (11)
1. one kind has the high-power LED light source that heat radiation encapsulates, it is characterized in that, comprise substrate, at least one is arranged at the exposed led chip of described substrate surface, and the collector lens that covers at described led chip, wherein, form the heat radiation chamber of sealing between described substrate, led chip and the collector lens, described heat radiation chamber is provided with air channel inlet and the ducting outlet that is communicated with it, thereby flow into, flow out described heat radiation chamber for air, led chip surface heat is on every side flowed by air discharge.
2. the high-power LED light source with heat radiation encapsulation according to claim 1, it is characterized in that, described ducting outlet place also is provided with fan, is used to make the outer air of heat radiation chamber to enter from porch, described air channel, flows out from ducting outlet behind the led chip surface.
3. the high-power LED light source with heat radiation encapsulation according to claim 1 is characterized in that porch, described air channel also is provided with airstrainer, is used for the air that enters in the heat radiation chamber is filtered.
4. the high-power LED light source with heat radiation encapsulation according to claim 1 is characterized in that the back side of substrate also is provided with radiator.
5. the high-power LED light source with heat radiation encapsulation according to claim 1 is characterized in that, also comprises the lens holder that is used for fixing collector lens, forms the heat radiation chamber of sealing between described substrate, led chip, collector lens and the lens holder.
6. the high-power LED light source with heat radiation encapsulation according to claim 5 is characterized in that, being shaped as of described heat radiation chamber
Type.
7. the high-power LED light source with heat radiation encapsulation according to claim 1 is characterized in that described led chip is the hexagon chip.
8. the high-power LED light source with heat radiation encapsulation according to claim 7 is characterized in that the quantity of described led chip is many, is that the circular or subcircular in center is arranged with a chips wherein.
9. the high-power LED light source with heat radiation encapsulation according to claim 1 is characterized in that, also is provided with the shaping mirror group on the emitting light path of described collector lens, is used to collect and the received light of shaping.
10. according to any described high-power LED light source of claim 1 to 9, it is characterized in that described high-power LED light source is the three-color light source that sends different peak wavelengths with heat radiation encapsulation; The intersection of the emitting light path of described three-color light source also is provided with closes the look mirror, and the light beam that is used to merge the three-color light source outgoing is a branch of light.
11. the high-power LED light source with heat radiation encapsulation according to claim 10 is characterized in that the described look mirror that closes is tabular X-type color combination lens or prism-like X-type color combination lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100171415A CN103216742A (en) | 2012-01-19 | 2012-01-19 | High-power LED (Light-Emitting Diode) light source with heat dissipation package |
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| CN2012100171415A CN103216742A (en) | 2012-01-19 | 2012-01-19 | High-power LED (Light-Emitting Diode) light source with heat dissipation package |
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| CN103216742A true CN103216742A (en) | 2013-07-24 |
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| CN2012100171415A Pending CN103216742A (en) | 2012-01-19 | 2012-01-19 | High-power LED (Light-Emitting Diode) light source with heat dissipation package |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103453502A (en) * | 2013-08-28 | 2013-12-18 | 赵峰 | Heat radiator for outdoor LED (light emitting diode) illumination equipment |
| WO2015143782A1 (en) * | 2014-03-28 | 2015-10-01 | 中兴通讯股份有限公司 | Heat dissipation apparatus for mobile communications device |
| CN106122837A (en) * | 2016-08-10 | 2016-11-16 | 苏州晶品新材料股份有限公司 | A kind of LED projection lamp source using ceramic substrate |
| CN106299086A (en) * | 2016-09-30 | 2017-01-04 | 广州莱迪光电股份有限公司 | A kind of cooling LED encapsulating structure |
| CN112652588A (en) * | 2020-12-04 | 2021-04-13 | 海光信息技术股份有限公司 | Chip packaging structure and chip packaging method |
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| CN201421003Y (en) * | 2009-06-01 | 2010-03-10 | 江西省晶和照明有限公司 | LED street lamp module group |
| CN201819058U (en) * | 2010-09-25 | 2011-05-04 | 大连辉华科技有限公司 | Light emitting diode (LED) lamp |
| CN102141235A (en) * | 2010-02-01 | 2011-08-03 | 中国科学院理化技术研究所 | High-power LED light source |
| CN202002053U (en) * | 2011-01-25 | 2011-10-05 | 惠州雷士光电科技有限公司 | Multi-stage heat radiation type light emitting diode (LED) lamp |
| CN202756930U (en) * | 2012-01-19 | 2013-02-27 | 红蝶科技(深圳)有限公司 | High-power LED light source with heat radiation package |
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2012
- 2012-01-19 CN CN2012100171415A patent/CN103216742A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201421003Y (en) * | 2009-06-01 | 2010-03-10 | 江西省晶和照明有限公司 | LED street lamp module group |
| CN102141235A (en) * | 2010-02-01 | 2011-08-03 | 中国科学院理化技术研究所 | High-power LED light source |
| CN201819058U (en) * | 2010-09-25 | 2011-05-04 | 大连辉华科技有限公司 | Light emitting diode (LED) lamp |
| CN202002053U (en) * | 2011-01-25 | 2011-10-05 | 惠州雷士光电科技有限公司 | Multi-stage heat radiation type light emitting diode (LED) lamp |
| CN202756930U (en) * | 2012-01-19 | 2013-02-27 | 红蝶科技(深圳)有限公司 | High-power LED light source with heat radiation package |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103453502A (en) * | 2013-08-28 | 2013-12-18 | 赵峰 | Heat radiator for outdoor LED (light emitting diode) illumination equipment |
| WO2015143782A1 (en) * | 2014-03-28 | 2015-10-01 | 中兴通讯股份有限公司 | Heat dissipation apparatus for mobile communications device |
| CN106122837A (en) * | 2016-08-10 | 2016-11-16 | 苏州晶品新材料股份有限公司 | A kind of LED projection lamp source using ceramic substrate |
| CN106299086A (en) * | 2016-09-30 | 2017-01-04 | 广州莱迪光电股份有限公司 | A kind of cooling LED encapsulating structure |
| CN112652588A (en) * | 2020-12-04 | 2021-04-13 | 海光信息技术股份有限公司 | Chip packaging structure and chip packaging method |
| CN112652588B (en) * | 2020-12-04 | 2022-11-29 | 海光信息技术股份有限公司 | Chip packaging structure and chip packaging method |
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Address after: Cui Jing Road Shenzhen City, Guangdong province 518118 Pingshan New District No. 35 No. 1 Building 6 East Applicant after: Butterfly Technology (Shenzhen) Limited Address before: 518057, Guangdong, Nanshan District hi tech Industrial Park, Shenzhen District North West Road, No. 5, Galaxy Fengyun building, 3 floor Applicant before: Butterfly Technology (Shenzhen) Limited |
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Application publication date: 20130724 |