CN103212856B - A method of processing process for a thicker material with ultraviolet laser beams - Google Patents

A method of processing process for a thicker material with ultraviolet laser beams Download PDF

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CN103212856B
CN103212856B CN201210015881.5A CN201210015881A CN103212856B CN 103212856 B CN103212856 B CN 103212856B CN 201210015881 A CN201210015881 A CN 201210015881A CN 103212856 B CN103212856 B CN 103212856B
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cutting
laser
material
method
size
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CN201210015881.5A
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CN103212856A (en
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魏志凌
宁军
蔡猛
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昆山思拓机器有限公司
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Abstract

本发明公开了一种用紫外激光加工较厚材料的工艺方法,所述方法包括如下步骤:步骤S1、根据切割要保留的部分确定切割图形的内/外圈大小;如果要保留内部,则内部尺寸为要求尺寸,向外扩展;如果要保留外部,则外部尺寸为要求尺寸,向内扩展;步骤S2、设置切割螺旋,螺旋间距在0.1~1个光斑尺寸大小,螺旋宽度根据材料厚度设定;步骤S3、调整激光参数进行切割。 The present invention discloses a process of a method for processing a thicker material with ultraviolet laser beams, said method comprising the steps of: step S1, the determination of the cutting pattern / size of the outer partial cut to be retained; To keep the inside of the internal dimensions size is required, extend outwardly; to keep the outside, the outer dimensions of the required size, extend inwardly; step S2, the set cutting helix, the helical pitch of 0.1 to a spot size, the spiral width is set according to the material thickness ; step S3, the adjustment of the laser cutting parameters. 本发明提出的工艺方法拓宽了加工沟槽,这样材料的沟槽回填效果就会减小,激光就能进一步深层切割直到切穿材料;同时,本发明提出的激光路径为螺旋一刀走的方式,比诸如同心圆、同心方框方式的切割速度有显著提高。 The method proposed by the invention process broadens the processing trench, the trench backfill material will reduce the effect of such a laser can be further cut through the material until the cutting depth; the same time, the laser path by the present invention a knife in a spiral manner away, ratio such as concentric circles, concentric block cutting speed is significantly improved manner. 此外,本发明在不改变焦点位置的情况下,提高较厚材料切割效率。 Further, in the present invention without changing the focal position, the cutting thicker materials to improve efficiency.

Description

一种用紫外激光加工较厚材料的工艺方法 A method of processing process for a thicker material with ultraviolet laser beams

技术领域 FIELD

[0001] 本发明属于激光加工技术领域,涉及一种激光加工方法,尤其是涉及一种用紫外激光加工较厚材料的工艺方法。 [0001] The present invention belongs to the technical field of laser processing, relates to a laser processing method, in particular, it relates to a UV laser machining process for thicker materials.

背景技术 Background technique

[0002] 激光切割作为一种新型热切割技术,具有切割速度快,生产效率高,切割表面质量好,热影响区小和环保等优点,己经成为主要的板材加工方式之一,得到越来越广泛的应用。 [0002] As a new thermal cutting laser cutting technology, cutting speed, high efficiency, good surface quality, small heat-affected zone and environmental advantages, has become one of the major sheet metal processing methods, obtain increasingly the more widely used.

[0003]当使用激光来加工较厚材料时,可能会使用到较高的激光功率以进行较快速的处理。 [0003] When a laser to process thicker materials, may be used to a higher laser power than for fast processing. 但是已知的激光技术可能会产生过多的热量与碎肩。 It is known that laser technology may produce excessive heat and broken shoulder. 这些碎肩通常会加大激光进一步加工的难度。 These broken shoulder will usually increase the difficulty of the laser for further processing. 激光进一步切割会受到激光射出材料的沟槽回填的影响。 Laser cutting is further affected by the laser light emitted trench backfill material. 当材料厚度增加时,回填便会变得严重直接阻碍了激光的进一步加工。 When the material thickness increases, it will become a serious backfill directly hindered the further processing of the laser.

[0004] 有鉴于此,如今迫切需要一种新的激光切割厚材料的方法,以提高加工效率。 [0004] In view of this, now an urgent need for a new method of laser cutting a thick material, in order to improve processing efficiency.

发明内容 SUMMARY

[0005] 本发明旨在至少解决现有技术中存在的技术问题之一。 [0005] The present invention aims to solve the technical problems of the prior art at least one present. 为此,本发明的一个目的在于提出一种用紫外激光加工较厚材料的工艺方法,可提高切割较厚材料的加工效率。 To this end, an object of the present invention is to provide a UV laser machining process for thicker materials can improve the processing efficiency cut thicker materials.

[0006] 根据本发明实施例的一种用紫外激光加工较厚材料的工艺方法,所述方法包括如下步骤: [0006] According to one embodiment of the present invention process for thicker UV laser processing of materials, said method comprising the steps of:

[0007] 步骤S1、根据切割要保留的部分确定切割图形的内/外圈大小;如果要保留内部,则内部尺寸为要求尺寸,向外扩展;如果要保留外部,则外部尺寸为要求尺寸,向内扩展; [0007] In step S1, the cut portion to be retained is determined in accordance with inner / outer size of the cutting pattern; if you want to keep the inside, the internal dimensions of the desired size, spreading out; if you want to keep the outside, the outer dimensions of the required size, extended inwardly;

[0008] 步骤S2、设置切割螺旋,螺旋间距在0.1〜1个光斑尺寸大小,螺旋宽度根据材料厚度设定; [0008] In step S2, the set cutting helix, the helical pitch in 0.1~1 a spot size, the spiral width is set according to the material thickness;

[0009] 步骤S3、调整激光参数进行切割。 [0009] Step S3, the adjustment of the laser cutting parameters.

[0010] 本发明的一种实施方式中,所述方法包括拓宽加工沟槽的步骤。 [0010] In one embodiment of the present invention, the method comprises the step of machining the trenches widening.

[0011] 优选地,所述步骤S3中,切割的激光路径为螺旋一刀走的方式;根据切割效果,切割次数根据需要设定为一次或多次。 S3, a laser cutting knife in a spiral path down manner [0011] Preferably, the step of; The effect of cutting, cutting times is set to one or more according to need.

[0012] 本发明的一种实施方式中,所述步骤S2中,螺旋宽度的设定方法为:在焦点位置不变加工时,材料的厚度d小于激光的焦深长度;将焦点位置设置在材料d/2的位置,螺旋宽度大于等于d/2*tan θ,Θ为激光发散角。 [0012] An embodiment of the present invention, the step S2, a method of setting the spiral width is: when the processing at the focal position constant, the thickness d of the material is less than the depth of focus of the laser beam length; provided at the focus position material position d / 2, the spiral width is equal to greater than d / 2 * tan θ, Θ is the laser divergence angle.

[0013] 本发明的有益效果在于,本发明提出的工艺方法拓宽了加工沟槽,这样材料的沟槽回填效果就会减小,激光就能进一步深层切割直到切穿材料;同时,本发明提出的激光路径为螺旋一刀走的方式,比诸如同心圆、同心方框方式的切割速度有显著提高。 [0013] Advantageous effects of the present invention The process of the present invention proposed a broadened processing trench, trench backfill material will reduce the effect of such a laser can be further cut through the material until the cutting depth; the same time, the present invention provides laser knife in a spiral path down the way, such as a significant improvement over concentric circles, concentric block cutting speed mode. 此外,本发明在不改变焦点位置的情况下,提高较厚材料切割效率。 Further, in the present invention without changing the focal position, the cutting thicker materials to improve efficiency.

[0014] 本发明的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本发明的实践了解到。 [0014] Additional aspects and advantages of the invention will be set forth in part in the description which follows, from the following description in part be apparent from, or learned by practice of the present invention.

附图说明 BRIEF DESCRIPTION

[0015] 本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解,其中: [0015] The foregoing and / or other aspects and advantages of the invention will be described with reference to embodiments in conjunction with the embodiments become apparent and more readily appreciated below, wherein:

[0016] 图1为根据本发明一个实施例的工艺方法的流程图。 [0016] FIG. 1 is a flowchart of the process for an embodiment of the present invention embodiment.

[0017] 图2为切割图形示意图。 [0017] FIG. 2 is a schematic view of cutting pattern.

[0018] 图3为根据本发明一个实施例的切割过程示意图。 [0018] FIG. 3 is a schematic diagram of one embodiment of the cutting process of the present invention.

具体实施方式 Detailed ways

[0019] 下面详细描述本发明的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。 [0019] Example embodiments of the present invention is described in detail below, exemplary embodiments of the embodiment shown in the accompanying drawings, wherein same or similar reference numerals designate the same or similar elements or elements having the same or similar functions. 下面通过参考附图描述的实施例是示例性的,仅用于解释本发明,而不能理解为对本发明的限制。 By following with reference to the embodiments described are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0020] 请参阅图1,根据本发明的一种用紫外激光加工较厚材料的工艺方法,所述方法包括如下步骤: [0020] Referring to FIG. 1, according to the present invention, the processing method of a thicker material with ultraviolet laser beams, said method comprising the steps of:

[0021] 步骤S1、根据切割要保留的部分确定切割图形的内/外圈大小;如果要保留内部,则内部尺寸为要求尺寸,向外扩展;如果要保留外部,则外部尺寸为要求尺寸,向内扩展。 [0021] In step S1, the cut portion to be retained is determined in accordance with inner / outer size of the cutting pattern; if you want to keep the inside, the internal dimensions of the desired size, spreading out; if you want to keep the outside, the outer dimensions of the required size, inward extension.

[0022] 步骤S2、设置切割螺旋,螺旋间距在0.1〜1个光斑尺寸大小,螺旋宽度根据材料厚度设定。 [0022] Step S2, the spiral cut provided, 0.1~1 helical pitch in a spot size, the spiral width is set depending on the material thickness. 本实施例中,螺旋宽度的设定方法为:在焦点位置不变加工时,材料的厚度d小于激光的焦深长度;将焦点位置设置在材料d/2的位置,螺旋宽度大于等于d/2*tan θ,Θ为激光发散角。 In this embodiment, a method of setting the spiral width is: when the focus position of the same processing, the material thickness d is smaller than the length of the laser focal depth; the focus position provided at a position Material d / 2, the spiral width is equal to greater than d / 2 * tan θ, Θ is the laser divergence angle. 本发明的一种实施方式中,螺旋宽度的设置可以拓宽加工沟槽,这样材料的沟槽回填效果就会减小,激光就能进一步深层切割直到切穿材料。 One embodiment of the present invention, the width of the helical groove is provided can be widened processing, trench backfill material will reduce the effect of such a laser can be further cut through the material until a deep cut.

[0023] 步骤S3、调整激光参数进行切割。 [0023] Step S3, the adjustment of the laser cutting parameters. 根据切割效果,切割次数根据需要设定为一次或多次;激光路径为螺旋一刀走的方式(可参阅图2),随着加工遍数增加,加工深度随之增加,直到切透(可参阅图3)。 The cutting effect of cutting times is set to one or more according to need; laser knife in a spiral path down manner (refer to FIG. 2), with the increase in the number of machining passes, the machining depth increases, until the cut through (refer image 3).

[0024] 在本说明书的描述中,参考术语“一种实施方式”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。 [0024] In the description of the present specification, reference to the term "an embodiment," etc., means that a particular feature of the described embodiment or exemplary embodiments described herein, the structure, material, or characteristic is included in at least one embodiment of the present invention or the exemplary embodiment in. 在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。 In the present specification, a schematic representation of the above terms necessarily referring to the same embodiment or example. 而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。 Furthermore, the particular features, structures, materials, or characteristics described embodiments or examples may be at any one or more in a proper manner.

[0025] 尽管已经示出和描述了本发明的实施例,本领域的普通技术人员可以理解:在不脱离本发明的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由权利要求及其等同物限定。 [0025] While there has been illustrated and described embodiments of the present invention, those of ordinary skill in the art can be appreciated: that various changes may be made to these embodiments without departing from the principles and spirit of the invention, modifications, substitutions and modifications, the scope of the present invention is defined by the claims and their equivalents.

Claims (4)

1.一种用紫外激光加工较厚材料的工艺方法,其特征在于,所述方法包括如下步骤: 步骤S1、根据切割要保留的部分确定切割图形的内/外圈大小;如果要保留内部,则内部尺寸为要求尺寸,向外扩展;如果要保留外部,则外部尺寸为要求尺寸,向内扩展; 步骤S2、设置切割螺旋,螺旋间距在0.1〜I个光斑尺寸大小,螺旋宽度根据材料厚度设定; 步骤S3、调整激光参数进行切割; 所述步骤S2中,螺旋宽度的设定方法为:在焦点位置不变加工时,材料的厚度d小于激光的焦深长度;将焦点位置设置在材料d/2的位置,螺旋宽度大于等于d/2*tan0,Θ为激光发散角。 A UV laser machining process for thicker material, characterized in that, said method comprising the steps of: step S1, the cutting pattern is determined in / outer partial cut size to be retained; If you want to keep the inside, the internal dimensions of the desired size, spreading out; if you want to keep the outside, the outer dimensions of the required size, extend inwardly; step S2, the set cutting helix, the helical pitch in 0.1~I a spot size, depending on the material thickness of the spiral width set; step S3, the adjustment of the laser cutting parameters; in the step S2, a method of setting the spiral width is: when the focus position of the same processing, the thickness d of the material length is less than the depth of focus of the laser beam; provided at the focus position material position d / 2, the spiral width is equal to greater than d / 2 * tan0, Θ is the laser divergence angle.
2.根据权利要求1所述的用紫外激光加工较厚材料的工艺方法,其特征在于,所述方法包括拓宽加工沟槽的步骤。 According to claim 1, said UV laser processing method of thicker material, wherein said method comprises the step of machining the trenches widening.
3.根据权利要求1所述的用紫外激光加工较厚材料的工艺方法,其特征在于,所述步骤S3中,根据切割效果,切割次数根据需要设定为一次或多次。 According to claim 1, with the UV laser processing method of thicker material, wherein the step S3, according to the effect of cutting, cutting times is set to one or more according to need.
4.根据权利要求1所述的用紫外激光加工较厚材料的工艺方法,其特征在于,所述步骤S3中,切割的激光路径为螺旋一刀走的方式。 The UV laser according to claim 1 thick material processing method, wherein, in the step S3, the path of a laser cutting knife in a spiral manner away.
CN201210015881.5A 2012-01-19 2012-01-19 A method of processing process for a thicker material with ultraviolet laser beams CN103212856B (en)

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CN105618936B (en) * 2014-11-21 2017-12-01 大族激光科技产业集团股份有限公司 One kind of scribing glass using a laser processing method
CN105983786A (en) * 2015-02-04 2016-10-05 大族激光科技产业集团股份有限公司 Method for processing glass with laser
CN106541214A (en) * 2016-09-30 2017-03-29 广东正业科技股份有限公司 Laser cutting equipment and cutting control method and system thereof

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