CN103212551A - Ultrasonic wave cleaning device for wafer - Google Patents
Ultrasonic wave cleaning device for wafer Download PDFInfo
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- CN103212551A CN103212551A CN2013101125283A CN201310112528A CN103212551A CN 103212551 A CN103212551 A CN 103212551A CN 2013101125283 A CN2013101125283 A CN 2013101125283A CN 201310112528 A CN201310112528 A CN 201310112528A CN 103212551 A CN103212551 A CN 103212551A
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Abstract
The invention discloses an ultrasonic wave cleaning device for a wafer. The ultrasonic wave cleaning device for the wafer comprises an ultrasonic wave cleaning groove and a lifting wafer rotating device fixedly arranged on the leaning groove, wherein the lifting wafer rotating device comprises vertical guide posts, a lifting support frame and a wafer box, the vertical guide posts are fixedly connected with the two sides of the cleaning groove, the two sides of the lifting support frame are arranged on the guide posts in a penetrating way, the wafer box is fixedly arranged at the lower end of the lifting support frame, and a rotating shaft is also arranged under the wafer box. The cleaning device can be used for upwards and downwards lifting and rotating sapphire wafers at the same time, so the wafer can do relative movement relative to ultrasonic wave sources and the wafer box, and the problem of wafer surface color differences generated by standing waves and wafer surface cleaning dead corners is effectively solved.
Description
Technical field
The present invention relates to a kind of ultrasonic cleaning equipment, relate in particular to a kind of ultrasonic cleaning equipment that is used for wafer.
Background technology
The supersonic wave cleaning machine principle mainly be transducer with power ultrasonic frequently the acoustic energy in source convert mechanical oscillation to and by cleaning the cleaning fluid radiate supersonic wave of cell wall in trough, the microbubble in the liquid can keep vibrating in the groove thereby make under the effect of sound wave.When acoustic pressure or the sound intensity are under pressure when arriving to a certain degree, bubble will expand rapidly, and is closed suddenly again then.In this section process, the moment of bubble closure produces shock wave, make the pressure and the office's temperature adjustment that produce 1012-1013pa around the bubble, the immense pressure that this ultrasonic cavitation produced can be destroyed insoluble dirt and they are broken up in solution, and the steam type cavitation is to the direct repeated stock of dirt.On the one hand destroy the absorption on dirt and cleaning part surface, thereby can cause the fatigue rupture of crud layer on the other hand and quilt is refuted from the purpose that reaches the cleaning objects surface.
Clean in the cleaning equipment at existing sapphire wafer ultrasonic wave, majority is that the separate single groove cleans, in cleaning process, wafer and ultrasonic wave sound source do not have relative motion, and because there is standing wave (ripple that the coherent wave that two row amplitudes are identical is formed by stacking mutually when propagating in opposite direction is called standing wave) in ultrasonic wave itself on same straight line, when clean wafers, standing wave differs to wafer surface zones of different cleansing power, causes wafer to clean the rear surface and produces aberration.On the other hand, when cleaning, because contact-making surface contact closely between wafer and the film magazine, contact-making surface belongs to ultrasonic dead angle, a little less than the effect relatively of ultrasonic wave to contact-making surface, and in the time of also can causing ultrasonic cleaning, wafer surface generation aberration.In the back road processing of sapphire wafer, the optical element conversion efficiency that the wafer surface aberration finally can cause wafer manufacture to go out is on the low side, reduces product quality.
Summary of the invention
Goal of the invention: the objective of the invention is provides a kind of ultrasonic cleaning equipment that is used for wafer in order to solve the deficiencies in the prior art, solves easily to exist surface colour to tear open after sapphire wafer cleans and influence the problem that following process is produced.
Technical scheme: in order to realize above purpose, a kind of ultrasonic cleaning equipment that is used for wafer of the present invention, comprise ultrasonic cleaner and be fixed on and lift the rotor device on the rinse bath, it is characterized in that: the described rotor device that lifts comprises longitudinally guiding post, lifting support and the film magazine of fixedlying connected with the rinse bath both sides, described lifting support both sides are located on the longitudinally guiding post, described film magazine is fixed on and promotes the support lower end, and the film magazine below also is provided with rotating shaft.
In one embodiment of the invention, described longitudinally guiding capital end is provided with the lifting drive motors, and the lifting drive motors connects ball screw driving lifting support and moves up and down.
In another embodiment of the present invention, described lifting support upper end is provided with rotary drive motor, and rotary drive motor drives the rotating shaft rotation by driving-belt.
Beneficial effect: cleaning device provided by the invention can lift and rotate sapphire wafer up and down simultaneously, and wafer is done relative motion with respect to ultrasonic source and film magazine, effectively solves the wafer surface aberration problem because of standing wave and wafer surface cleaning dead angle generation.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is a structure side view of the present invention;
View after Fig. 3 rises for the present invention promotes support;
Fig. 4 is the relative motion schematic diagram of relative ultrasonic source of sapphire wafer and film magazine.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, further illustrate the present invention.
As shown in Figures 1 and 2, the ultrasonic cleaning equipment that is used for wafer, comprise ultrasonic cleaner 1, ultrasonic source 10 is arranged on the bottom of rinse bath 1 usually, on ultrasonic cleaner 1, be provided with and lift the rotor device, lift the rotor device and be used to the sapphire wafer to be cleaned 11 that promotes, descends, sapphire wafer 11 is rotated.This lifts the rotor device and comprises longitudinally guiding post 2, lifting support 3 and the film magazine 4 of fixedlying connected with ultrasonic cleaner 1 both sides.Promoting support 3 both sides is located on the longitudinally guiding post 2, the top of longitudinally guiding post 2 is provided with lifting drive motors 6, lifting drive motors 6 connects ball screw 7, as shown in Figure 3, promote support 3 and be engaged in 6 drivings of lifting drive motors down with ball screw 7, lifting and descending motion about longitudinally lead 2 carries out.The upper end that promotes support 3 is provided with rotary drive motor 8, and the film magazine 4 that is used to lay sapphire wafer 11 to be cleaned is fixed on and promotes support 3 lower ends, and film magazine 4 belows also are provided with rotating shaft 5, and rotary drive motor 8 drives rotating shafts 5 rotations by driving-belt 9.As shown in Figure 4, after sapphire wafer to be cleaned is prevented putting in film magazine 4, sapphire wafer 11 lower edge contact with rotating shaft 5, when rotary drive motor 8 drives rotating shaft 5 rotations, sapphire wafer 11 is also followed rotating shaft 5 and is rotated together, therefore after adopting this cleaning device, sapphire wafer 11 to be cleaned can both do relative motion with respect to ultrasonic source 10 and film magazine 4, effectively solves the wafer surface aberration problem because of standing wave and wafer surface cleaning dead angle generation.
The foregoing description only is explanation technical conceive of the present invention and characteristics, its objective is to allow to be familiar with these those skilled in the art and can to understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.All spirit essence has been done according to the present invention equivalents or modification all should be encompassed within protection scope of the present invention.
Claims (3)
1. ultrasonic cleaning equipment that is used for wafer, comprise ultrasonic cleaner (1) and be fixed on and lift the rotor device on the ultrasonic cleaner (1), it is characterized in that: the described rotor device that lifts comprises longitudinally guiding post (2), lifting support (3) and the film magazine (4) of fixedlying connected with ultrasonic cleaner (1) both sides, described lifting support (3) both sides are located on the longitudinally guiding post (2), described film magazine (4) is fixed on and promotes support (3) lower end, and film magazine (4) below also is provided with rotating shaft (5).
2. the ultrasonic cleaning equipment that is used for wafer according to claim 1 is characterized in that: described longitudinally guiding post (2) top is provided with lifting drive motors (6), and lifting drive motors (6) connects ball screw (7) driving lifting support (3) and moves up and down.
3. the ultrasonic cleaning equipment that is used for wafer according to claim 1 is characterized in that: described lifting support (3) upper end is provided with rotary drive motor (8), and rotary drive motor (8) drives rotating shaft (5) rotation by driving-belt (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101125283A CN103212551A (en) | 2013-04-02 | 2013-04-02 | Ultrasonic wave cleaning device for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101125283A CN103212551A (en) | 2013-04-02 | 2013-04-02 | Ultrasonic wave cleaning device for wafer |
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| Publication Number | Publication Date |
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| CN103212551A true CN103212551A (en) | 2013-07-24 |
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| CN2013101125283A Pending CN103212551A (en) | 2013-04-02 | 2013-04-02 | Ultrasonic wave cleaning device for wafer |
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| CN (1) | CN103212551A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103433233A (en) * | 2013-08-22 | 2013-12-11 | 英利集团有限公司 | Method for cleaning crystalline silicon corrosion sizing agents, crystalline silicon solar cell and method for manufacturing crystalline silicon solar cell |
| CN104465466A (en) * | 2014-12-26 | 2015-03-25 | 合肥彩虹蓝光科技有限公司 | Multi-size LED chip compatible quartz cleaning cabas |
| CN104826850A (en) * | 2015-06-04 | 2015-08-12 | 天津市环欧半导体材料技术有限公司 | Silicon wafer cleaning basket |
| CN105177717A (en) * | 2015-10-30 | 2015-12-23 | 江苏吉星新材料有限公司 | Washing device for roughly-grinded sapphire |
| CN106877735A (en) * | 2017-02-27 | 2017-06-20 | 南京航空航天大学 | A kind of new Z axis hoistable platform |
| CN107968060A (en) * | 2017-11-21 | 2018-04-27 | 长江存储科技有限责任公司 | Reactive tank for wafer etching |
| CN109715304A (en) * | 2016-09-16 | 2019-05-03 | 艾克维斯塔股份有限公司 | Ultrasonic fluid removes system |
| CN112466780A (en) * | 2020-10-29 | 2021-03-09 | 威科赛乐微电子股份有限公司 | Wafer cleaning tank and wafer cleaning method |
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| CN1139292A (en) * | 1995-04-19 | 1997-01-01 | Memc电子材料有限公司 | Apparatus and method for cleaning semiconductor wafers |
| JPH09260334A (en) * | 1996-03-25 | 1997-10-03 | Kaijo Corp | Semiconductor element washing apparatus |
| CN202155333U (en) * | 2011-07-07 | 2012-03-07 | 苏州赤诚洗净科技有限公司 | Ultrasonic cleaning device of solar battery silicon chip with throwing device |
| CN202428315U (en) * | 2012-01-10 | 2012-09-12 | 青岛嘉星晶电科技股份有限公司 | Ultrasonic cleaning device |
| CN203196939U (en) * | 2013-04-02 | 2013-09-18 | 苏州海铂晶体有限公司 | Ultrasonic cleaning device for wafer |
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2013
- 2013-04-02 CN CN2013101125283A patent/CN103212551A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1139292A (en) * | 1995-04-19 | 1997-01-01 | Memc电子材料有限公司 | Apparatus and method for cleaning semiconductor wafers |
| JPH09260334A (en) * | 1996-03-25 | 1997-10-03 | Kaijo Corp | Semiconductor element washing apparatus |
| CN202155333U (en) * | 2011-07-07 | 2012-03-07 | 苏州赤诚洗净科技有限公司 | Ultrasonic cleaning device of solar battery silicon chip with throwing device |
| CN202428315U (en) * | 2012-01-10 | 2012-09-12 | 青岛嘉星晶电科技股份有限公司 | Ultrasonic cleaning device |
| CN203196939U (en) * | 2013-04-02 | 2013-09-18 | 苏州海铂晶体有限公司 | Ultrasonic cleaning device for wafer |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103433233A (en) * | 2013-08-22 | 2013-12-11 | 英利集团有限公司 | Method for cleaning crystalline silicon corrosion sizing agents, crystalline silicon solar cell and method for manufacturing crystalline silicon solar cell |
| CN103433233B (en) * | 2013-08-22 | 2015-11-25 | 英利集团有限公司 | The cleaning method, crystal silicon solar batteries and preparation method thereof of crystal silicon corrosive slurry |
| CN104465466A (en) * | 2014-12-26 | 2015-03-25 | 合肥彩虹蓝光科技有限公司 | Multi-size LED chip compatible quartz cleaning cabas |
| CN104465466B (en) * | 2014-12-26 | 2017-02-22 | 合肥彩虹蓝光科技有限公司 | Multi-size LED chip compatible quartz cleaning cabas |
| CN104826850A (en) * | 2015-06-04 | 2015-08-12 | 天津市环欧半导体材料技术有限公司 | Silicon wafer cleaning basket |
| CN105177717A (en) * | 2015-10-30 | 2015-12-23 | 江苏吉星新材料有限公司 | Washing device for roughly-grinded sapphire |
| CN109715304A (en) * | 2016-09-16 | 2019-05-03 | 艾克维斯塔股份有限公司 | Ultrasonic fluid removes system |
| CN109715304B (en) * | 2016-09-16 | 2023-03-03 | 艾克维斯塔股份有限公司 | Ultrasonic fluid removal system |
| CN106877735A (en) * | 2017-02-27 | 2017-06-20 | 南京航空航天大学 | A kind of new Z axis hoistable platform |
| CN106877735B (en) * | 2017-02-27 | 2019-04-19 | 南京航空航天大学 | A kind of novel Z axis hoistable platform |
| CN107968060A (en) * | 2017-11-21 | 2018-04-27 | 长江存储科技有限责任公司 | Reactive tank for wafer etching |
| CN112466780A (en) * | 2020-10-29 | 2021-03-09 | 威科赛乐微电子股份有限公司 | Wafer cleaning tank and wafer cleaning method |
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Application publication date: 20130724 |