CN103209549A - Circuit board combination - Google Patents
Circuit board combination Download PDFInfo
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- CN103209549A CN103209549A CN201210008573XA CN201210008573A CN103209549A CN 103209549 A CN103209549 A CN 103209549A CN 201210008573X A CN201210008573X A CN 201210008573XA CN 201210008573 A CN201210008573 A CN 201210008573A CN 103209549 A CN103209549 A CN 103209549A
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- daughter board
- circuit board
- bonding jumper
- combination
- motherboard
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Abstract
A circuit board combination comprises a mother board, a first daughter board and a first metal strip. The first metal strip is locked on the mother board and the first daughter board respectively and electrically connected between the mother board and the first daughter board. The first metal strip is supported between the mother board and the first daughter board, so that the first daughter board is arranged above the mother board in a separation mode, and the first daughter board is approximately perpendicular to the mother board. According to the circuit board combination, the metal strip mainly serves as a current transmission medium between circuit boards for a large current. Compared with the existing circuit board combination with wires serving as the current transmission medium, the circuit board combination is novel in structural design and free of wires, so that wire stranding or wire settling is avoided, difficulty in assembling of the circuit board combination can be greatly reduced, and the attractiveness can be improved. Compared with energy losses of wires, the metal strip is used as the current transmission medium, so that the energy loss is low.
Description
Technical field
The present invention relates to a kind of circuit board combination.
Background technology
At present, the electronic product structure function is complicated day by day, and it is more and more wider to involve technological layer, and the tradesman also can't handle all technological layers separately.Therefore, electronic product tends to the modularization direction gradually and develops.Every profession and trade personnel may only be absorbed in a certain technical field face research and development and produce the corresponding function module, for example wireless communication module, GPS module etc.And the downstream industry personnel these functional modules are provided can provide high degree of integration, multi-functional electronic product to the user.
These functional modules are packaged in the circuit daughter board usually.Have a plurality of pins in the circuit daughter board, be used for being connected with motherboard.The time can these functional modules and circuit daughter board be fitted together by various encapsulation technologies in assembling, for example modal surface mounting technology (Surface Mount Technology, SMT).Be formed with the sawtooth hole pin of (or claiming stamp hole) on the side of circuit daughter board in early days.This kind pin side can form with scolding tin and be connected, so and scolding tin between adhesion strong.Because this pin is distributed in around the circuit substrate, takies the wiring area of circuit substrate, therefore be unfavorable for dwindling the circuit substrate area.
In addition, with power supply unit, (power supply), its be 110V that external cable line (cable) is conveyed into or 220V AC power change into the needed 12V of computer hardware such as motherboard, hard disk, CD-ROM drive or ± the 5V DC power supply.The motherboard of power supply unit is used for most electronic component and is directly plugged on it, demand and heat dissipation problem that the electronic component of especially high electric current (for example, capacitor) needs the big electric current of consideration to pass through.
Yet, contain at present that the normal wire rod that uses is used as connection between the circuit board in the power supply unit of cable management system (cable management), this connects wire rod often walks big electric current because of need and selects many or than the thick line footpath for use, but causes following problems often.(1) organizes difficulty upright, that manage line and space utilization; (2) degree of difficulty in the processing procedure processing; (3) the wire rod line loss influences efficient; And (4) aesthetic problem.
Summary of the invention
The object of the present invention is to provide a kind of circuit board to make up, line is found, managed to existing circuit board combination owing to the employing wire rod as the group that the current delivery media exists and space utilization difficulty, wire rod line loss influence efficient, influence problems such as attractive in appearance to separate.
According to an embodiment of the present invention, the combination of a kind of circuit board comprises motherboard, first daughter board and first bonding jumper.First bonding jumper secures to motherboard and first daughter board respectively, and then is electrically connected between motherboard and first daughter board.First bonding jumper is supported between motherboard and first daughter board, causes first daughter board to be positioned at the motherboard top separatedly, and makes first daughter board vertical motherboard substantially.
In one embodiment of the invention, above-mentioned motherboard has connecting hole.First bonding jumper has perforation.The circuit board combination further comprises rivet and locking part.Rivet has screw and holding section.The holding section is surrounded on the periphery of screw, and is suitable for being sticked in the connecting hole.Locking part passes perforation and connecting hole in regular turn and secures in the screw.
In one embodiment of the invention, the first above-mentioned daughter board has connecting hole.First bonding jumper has perforation.The circuit board combination further comprises rivet and locking part.Rivet has screw and holding section.The holding section is surrounded on the periphery of screw, and is suitable for being sticked in the connecting hole.Locking part passes perforation and connecting hole in regular turn and secures in the screw.
In one embodiment of the invention, the first above-mentioned bonding jumper further comprises the first smooth portion, the second smooth portion, first support portion, second support portion and first kink.First smooth smooth on motherboard.Second smooth smooth on first daughter board.First support portion connects the first smooth portion, and vertical motherboard substantially.Second support portion connects the second smooth portion, and vertical first daughter board substantially.First kink is connected between first support portion and second support portion.
In one embodiment of the invention, the radius of curvature of the first above-mentioned kink is greater than 3 millimeters.
In one embodiment of the invention, above-mentioned second smooth further comprises at least one claw, in order to insert in first daughter board.
In one embodiment of the invention, the side of the first above-mentioned daughter board comprises first pin.The circuit board combination further comprises second daughter board and second bonding jumper.The side of second daughter board comprises second pin.Second bonding jumper has first convergence hole and second convergence hole.First pin and second pin are attached to first convergence hole and second convergence hole respectively, and then second bonding jumper is electrically connected between first daughter board and second daughter board.Second bonding jumper is supported between first daughter board and second daughter board, and makes second daughter board parallel first daughter board substantially.
In one embodiment of the invention, above-mentioned circuit board combination further comprises the 3rd bonding jumper.The 3rd bonding jumper secures to second daughter board respectively and the motherboard of directly pegging graft, and then be electrically connected between motherboard and second daughter board, wherein the 3rd bonding jumper is supported between motherboard and this second daughter board, causes second daughter board to be positioned at the motherboard top separatedly, and makes second daughter board vertical motherboard substantially.
In one embodiment of the invention, the second above-mentioned daughter board has connecting hole.The 3rd bonding jumper has perforation.The circuit board combination further comprises rivet and locking part.Rivet has screw and holding section.The holding section is surrounded on the periphery of screw, and is suitable for being sticked in the connecting hole.Locking part passes perforation and connecting hole in regular turn and secures in the screw.
In one embodiment of the invention, the 3rd above-mentioned bonding jumper further comprises Plug Division, the 3rd smooth portion, the 3rd support portion and second kink.The Plug Division vertically is plugged on the motherboard substantially.The 3rd smooth smooth on second daughter board.The 3rd support portion connects the 3rd smooth portion, and vertical second daughter board substantially.Second kink is connected between Plug Division and the 3rd support portion.
In one embodiment of the invention, the radius of curvature of the second above-mentioned kink is greater than 3 millimeters.
In one embodiment of the invention, above-mentioned the 3rd smooth further comprises at least one claw, in order to insert in second daughter board.
In one embodiment of the invention, the thickness of the first above-mentioned bonding jumper, second bonding jumper and the 3rd bonding jumper is 1.8～1.0 millimeters.
In one embodiment of the invention, the material of the first above-mentioned bonding jumper, second bonding jumper and the 3rd bonding jumper all comprises copper.
Circuit board of the present invention combination, its mainly with bonding jumper as the current delivery media that need walk big electric current between the circuit board.Compared to the known circuit board combination of adopting wire rod as the current delivery media, new construction design of the present invention is because wireless penetration, therefore do not have twisted wire or reason line problem takes place, and then can be reduced in circuit board group of the present invention in a large number and be combined in the difficulty of group on upright, and can promote attractive in appearance.And compared to the energy loss of wire rod, the present invention adopts bonding jumper can have lower energy loss as the current delivery media.In addition, the mode that bonding jumper of the present invention locks with screw is fixed on the circuit board, replaces known back weldering processing procedure, therefore can reduce the processing procedure processing difficulties.
Description of drawings
Fig. 1 is that wherein circuit board group is set up jointly and is loaded on the casing according to the three-dimensional combination figure of the circuit board combination of one embodiment of the invention.
Fig. 2 is another three-dimensional combination figure of the circuit board combination among Fig. 1.
Fig. 3 is the three-dimensional exploded view of the circuit board combination among Fig. 1.
Fig. 4 is the end view of the circuit board combination among Fig. 1.
Fig. 5 is the exploded view of the circuit board combination among Fig. 4.
Fig. 6 A is the partial sectional view of the circuit board combination among Fig. 1, and wherein first bonding jumper does not lock with motherboard as yet.
Fig. 6 B is the partial sectional view of the circuit board combination among Fig. 1, and wherein first bonding jumper locks with motherboard.
Fig. 7 A is the partial sectional view of the circuit board combination among Fig. 1, and wherein first bonding jumper does not lock with first daughter board as yet.
Fig. 7 B is the partial sectional view of the circuit board combination among Fig. 1, and wherein first bonding jumper locks with first daughter board.
Fig. 8 A is the partial sectional view of the circuit board combination among Fig. 2, and wherein the 3rd bonding jumper does not lock with second daughter board as yet.
Fig. 8 B is the partial sectional view of the circuit board combination among Fig. 2, and wherein the 3rd bonding jumper locks with second daughter board.
Wherein, description of reference numerals is as follows:
1: the circuit board combination
100,122,142: connecting hole
120: the first pins
140: the second pins
16: the first bonding jumpers
160a, 164a, 202a: perforation
164: the second smooth portions
166: the second support portions
18: the second bonding jumpers
182: the second convergence holes
200: the Plug Division
204: the three support portions
22: rivet
222: the holding section
3: casing 10: motherboard
12: the first daughter boards
14: the second daughter boards
144: the pawl hole
160: the first smooth portions
162: the first support portions
164b, 202b: claw
168: the first kinks
180: the first convergence holes
20: the three bonding jumpers
202: the three smooth portions
206: the second kinks
220: screw
24: locking part
Embodiment
Below will disclose a plurality of execution mode of the present invention with accompanying drawing, as clearly stated, the details on many practices will be explained in the following description.Yet, should be appreciated that the details on these practices does not use to limit the present invention.That is to say that in part execution mode of the present invention, the details on these practices is inessential.In addition, for the purpose of simplicity of illustration, some known habitual structures and element will illustrate in the mode of simple signal in the accompanying drawings.
A technology type of the present invention is a kind of circuit board combination.More particularly, it mainly is as the current delivery media that need walk big electric current between the circuit board with bonding jumper.Compared to the known circuit board combination of adopting wire rod as the current delivery media, new construction design of the present invention is because wireless penetration, therefore do not have twisted wire or reason line problem takes place, and then can be reduced in circuit board group of the present invention in a large number and be combined in the difficulty of group on upright, and can promote attractive in appearance.And compared to the energy loss of wire rod, the present invention adopts bonding jumper can have lower energy loss as the current delivery media.In addition, bonding jumper of the present invention is to be fixed on the circuit board in the mode that screw locks, and replaces existing back welder's skill, therefore can reduce the processing procedure processing difficulties.
Please refer to Fig. 1, Fig. 2, Fig. 3, Fig. 4 and Fig. 5.Fig. 1 is the three-dimensional combination figure according to the circuit board combination 1 of one embodiment of the invention, and wherein circuit board combination 1 is assembled on the casing 3.Fig. 2 is another three-dimensional combination figure of the circuit board combination 1 among Fig. 1.Fig. 3 is the three-dimensional exploded view of the circuit board combination 1 among Fig. 1.Fig. 4 is the end view of the circuit board combination 1 among Fig. 1.Fig. 5 is the exploded view of the circuit board combination 1 among Fig. 4.
To shown in Figure 5, in present embodiment, circuit board combination 1 of the present invention can be applied to power supply unit, and is assembled in the casing 3 of power supply unit as Fig. 1, but not as limit.In other words, circuit board combination 1 of the present invention can be applied to any electronic product that has a plurality of circuit boards to make up.
As Fig. 1 and shown in Figure 3, in present embodiment, circuit board combination 1 comprises motherboard 10, first daughter board 12 and first bonding jumper 16.The two ends of first bonding jumper 16 of circuit board combination 1 secure to motherboard 10 and first daughter board 12 respectively, and therefore first bonding jumper 16 can be electrically connected between motherboard 10 and first daughter board 12.First bonding jumper 16 of circuit board combination 1 can be supported between motherboard 10 and first daughter board 12, causes first daughter board 12 to be positioned at motherboard 10 tops separatedly, and make first daughter board 12 substantially relative motherboard 10 keep vertical state.
As Fig. 1 and shown in Figure 3, in present embodiment, first bonding jumper 16 of circuit board combination 1 further comprises first smooth 160, second smooth 164, first support portion 162, second support portion 166 and first kink 168.First smooth of first bonding jumper 16 is 160 smooth on motherboard 10.Second smooth of first bonding jumper 16 is 164 smooth on first daughter board 12.First support portion 162 of first bonding jumper 16 connects first smooth 160, and vertical motherboard 10 substantially.Second support portion 166 of first bonding jumper 16 connects second smooth 164, and vertical first daughter board 12 substantially.First kink 168 of first bonding jumper 16 is connected between first support portion 162 and second support portion 166.In other words, interconnective first smooth 160 and first support portion 162, interconnective second smooth 164 and second support portion 166 and interconnective first support portion 162, first kink 168 and second support portion 166 all are the L font substantially.Because first bonding jumper 16 of circuit board combination 1 itself has enough structural strengths, therefore can reach and support the purpose that first daughter board 12 is positioned at motherboard 10 tops separatedly.In other words, first bonding jumper 16 of circuit board combination 1 is except can be used as the current delivery media between motherboard 10 and first daughter board 12, first bonding jumper 16 more can be supported in motherboard 10 and first daughter board 12, make the space between motherboard 10 and first daughter board 12 (for example further do effective utilization, space under first daughter board 12 can additionally be plugged on the motherboard 10 for other electron component), and then the space utilization rate in the increase casing 3.
Please refer to Fig. 6 A and Fig. 6 B.Fig. 6 A is the partial sectional view of the circuit board combination 1 among Fig. 1, and wherein first bonding jumper 16 does not lock with motherboard 10 as yet.Fig. 6 B is the partial sectional view of the circuit board combination 1 among Fig. 1, and wherein first bonding jumper 16 locks with motherboard 10.
Shown in Fig. 6 A and Fig. 6 B, in present embodiment, the motherboard 10 of circuit board combination 1 has connecting hole 100.First bonding jumper 16 of circuit board combination 1 has perforation 160a.Special, the perforation 160a of first bonding jumper 16 is positioned on first smooth 160.Circuit board combination 1 further comprises rivet 22 and locking part 24 (for example, screw).The rivet 22 of circuit board combination 1 has screw 220 and holding section 222.The holding section 222 of rivet 22 is surrounded on the periphery of screw 220, and is suitable for being fastened in the connecting hole 100 of motherboard 10 (that is the holding section 222 that makes rivet 22 is interference engagement with the connecting hole 100 of motherboard 10).The locking part 24 of circuit board combination 1 passes the connecting hole 100 of the perforation 160a of first bonding jumper 16 and motherboard 10 in regular turn and secures in the screw 220 of rivet 22.With this, assembler only needs to lock and can finish easily from the front with locking part 24 when first bonding jumper 16 is secured to motherboard 10.
Please refer to Fig. 7 A and Fig. 7 B.Fig. 7 A is the partial sectional view of the circuit board combination 1 among Fig. 1, and wherein first bonding jumper 16 does not lock with first daughter board 12 as yet.Fig. 7 B is the partial sectional view of the circuit board combination 1 among Fig. 1, and wherein first bonding jumper 16 locks with first daughter board 12.
Shown in Fig. 7 A and Fig. 7 B, in present embodiment, first daughter board 12 of circuit board combination 1 has connecting hole 122.First bonding jumper 16 of circuit board combination 1 has perforation 164a.Special, the perforation 164a of first bonding jumper 16 is positioned on second smooth 164.Circuit board combination 1 further comprises rivet 22 and locking part 24 (for example, screw).The rivet 22 of circuit board combination 1 has screw 220 and holding section 222.The holding section 222 of rivet 22 is surrounded on the periphery of screw 220, and be suitable for being sticked in the connecting hole 122 of first daughter board 12 (that is, make the holding section 222 of rivet 22 and the connecting hole 122 of first daughter board 12 be interference engagement).The locking part 24 of circuit board combination 1 passes the connecting hole 122 of the perforation 164a of first bonding jumper 16 and first daughter board 12 in regular turn and secures in the screw 220 of rivet 22.With this, assembler only needs to lock and can finish easily from the front with locking part 24 when first bonding jumper 16 is secured to first daughter board 12.
In addition, as Fig. 1, Fig. 3 and shown in Figure 5, in order to increase the constant intensity between first bonding jumper 16 and first daughter board 12, in present embodiment, second smooth 164 of first bonding jumper 16 further comprises at least one claw 164b.Second smooth 164 claw 164b is extended by second smooth 164 edge, and can be in order in the pawl hole (not shown) of inserting first daughter board 12, and then reaches the effect that strengthens constant intensity between first bonding jumper 16 and first daughter board 12.The quantity of the claw 164b that comprises on second smooth 164 can flexibly be adjusted according to demand.
In present embodiment, the quantity of circuit board combination 1 first bonding jumper 16 that comprises is 2, but not as limit, can be required and flexibly adjust according to reality.
In an embodiment, the problem that stress is concentrated takes place in first bonding jumper 16 for fear of circuit board combination 1 in the process of making, can design and make the radius of curvature that is connected in first kink 168 between first support portion 162 and second support portion 166 greater than 3 millimeters, but not as limit.
In an embodiment, first bonding jumper 16 of circuit board combination 1 can also first smooth 160 be fixed to motherboard 10 and first daughter board 12 with second smooth 164 respectively by the mode of welding.
As Fig. 1 and shown in Figure 3, in present embodiment, the side of first daughter board 12 of circuit board combination 1 comprises first pin 120.Circuit board combination 1 further comprises second daughter board 14 and second bonding jumper 18.The side of second daughter board 14 of circuit board combination 1 comprises second pin 140.Second bonding jumper 18 of circuit board combination 1 has first convergence hole 180 and second convergence hole 182.First pin 120 of first daughter board 12 and second pin 140 of second daughter board 14 are attached to first convergence hole 180 and second convergence hole 182 of second bonding jumper 18 respectively, and then second bonding jumper 18 is electrically connected between first daughter board 12 and second daughter board 14.Second bonding jumper 18 of circuit board combination 1 is supported between first daughter board 12 and second daughter board 14 (that is, make first daughter board 12 and second daughter board 14 side by side), and makes second daughter board 14 parallel first daughter board 12 substantially.In other words, second bonding jumper 18 of circuit board combination 1 is except can be used as the current delivery media between first daughter board 12 and second daughter board 14, second bonding jumper 18 more can be supported in respectively between first daughter board 12 and second daughter board 14, make the space between first daughter board 12 and second daughter board 14 (for example further do effective utilization, first daughter board 12 and second daughter board 14 mutually over against the surface on can additionally peg graft for other electron component), and then increase space utilization rate in the casing 3.
In present embodiment, after second pin 140 of first pin 120 of first daughter board 12 and second daughter board 14 is attached to first convergence hole 180 and second convergence hole 182 of second bonding jumper 18 respectively, can weld to strengthen the constant intensity between first daughter board 12, second bonding jumper 18 and second daughter board 14 again.
In present embodiment, the quantity of circuit board combination 1 second bonding jumper 18 that comprises is 3, but not as limit, can be required and flexibly adjust according to reality.Similarly, the quantity of first convergence hole 180 that comprises on second bonding jumper 18 and second convergence hole 182 also can be required and flexibly adjust according to the quantity of second pin 140 of first pin 120 of first daughter board 12 and second daughter board 14.
As Fig. 2 and shown in Figure 3, in present embodiment, circuit board combination 1 further comprises the 3rd bonding jumper 20.The 3rd bonding jumper 20 of circuit board combination 1 secures to second daughter board 14 and the motherboard 10 of directly pegging graft respectively, and then is electrically connected between motherboard 10 and second daughter board 14.The 3rd bonding jumper 20 of circuit board combination 1 is supported between motherboard 10 and second daughter board 14, causes second daughter board 14 to be positioned at motherboard 10 tops separatedly, and make second daughter board 14 substantially relative motherboard 10 keep vertical state.
As Fig. 2 and shown in Figure 3, in present embodiment, the 3rd bonding jumper 20 of circuit board combination 1 further comprises Plug Division 200, the 3rd smooth 202, the 3rd support portion 204 and second kink 206.The Plug Division 200 of the 3rd bonding jumper 20 vertically is plugged on the motherboard 10 substantially.The 3rd smooth of the 3rd bonding jumper 20 is 202 smooth on second daughter board 14.The 3rd support portion 204 of the 3rd bonding jumper 20 connects the 3rd smooth 202, and vertical second daughter board 14 substantially.Second kink 206 of the 3rd bonding jumper 20 is connected between Plug Division 200 and the 3rd support portion 204.In other words, the interconnective the 3rd smooth 202 and the 3rd support portion 204 and interconnective Plug Division 200, second kink 206 and the 3rd support portion 204 all are the L font substantially.Because the 3rd bonding jumper 20 of circuit board combination 1 itself has enough structural strengths, therefore can reach and support the purpose that second daughter board 14 is positioned at motherboard 10 tops separatedly.In other words, the 3rd bonding jumper 20 of circuit board combination 1 is except can be used as the current delivery media between motherboard 10 and second daughter board 14, second bonding jumper 18 more can be supported in motherboard 10 and second daughter board 14, make the space between motherboard 10 and second daughter board 14 (for example further do effective utilization, space under second daughter board 14 can additionally be plugged on the motherboard 10 for other electron component), and then the space utilization rate in the increase casing 3.
Please refer to Fig. 8 A and Fig. 8 B.Fig. 8 A is the partial sectional view of the circuit board combination 1 among Fig. 2, and wherein the 3rd bonding jumper 20 does not lock with second daughter board 14 as yet.Fig. 8 B is the partial sectional view of the circuit board combination 1 among Fig. 2, and wherein the 3rd bonding jumper 20 locks with second daughter board 14.
Shown in Fig. 8 A and Fig. 8 B, in present embodiment, second daughter board 14 of circuit board combination 1 has connecting hole 142.The 3rd bonding jumper 20 of circuit board combination 1 has perforation 202a.Special, the perforation 202a of the 3rd bonding jumper 20 is positioned on the 3rd smooth 202.Circuit board combination 1 further comprises rivet 22 and locking part 24.The rivet 22 of circuit board combination 1 has screw 220 and holding section 222.The holding section 222 of rivet 22 is surrounded on the periphery of screw 220, and be suitable for being sticked in the connecting hole 142 of second daughter board 14 (that is, make the holding section 222 of rivet 22 and the connecting hole 142 of second daughter board 14 be interference engagement).The locking part 24 of circuit board combination 1 passes the connecting hole 142 of the perforation 202a of the 3rd bonding jumper 20 and second daughter board 14 in regular turn and secures in the screw 220 of rivet 22.With this, assembler only needs to lock and can finish easily from the front with screw when the 3rd bonding jumper 20 is secured to second daughter board 14.
In addition, as Fig. 2, Fig. 3 and shown in Figure 5, in order to increase the constant intensity between the 3rd bonding jumper 20 and second daughter board 14, in present embodiment, the 3rd smooth 202 of the 3rd bonding jumper 20 further comprises at least one claw 202b.The 3rd smooth 202 claw 202b is extended by the 3rd smooth 202 edge, and can be in order in the pawl hole 144 of inserting second daughter board 14, and then reaches the effect that strengthens constant intensity between the 3rd bonding jumper 20 and second daughter board 14.The quantity of the claw 202b that comprises on the 3rd smooth 202 can flexibly be adjusted according to demand.
In present embodiment, the quantity of circuit board combination 1 the 3rd bonding jumper 20 that comprises is 4, but not as limit, can be required and flexibly adjust according to reality.
In an embodiment, the problem that stress is concentrated takes place in the 3rd bonding jumper 20 for fear of circuit board combination 1 in the process of making, can design and make the radius of curvature that is connected in second kink 206 between Plug Division 200 and the 3rd support portion 204 greater than 3 millimeters, but not as limit.
In an embodiment, the 3rd bonding jumper 20 of circuit board combination 1 can also the 3rd smooth 202 mode by welding be fixed to second daughter board 14.
In an embodiment, the thickness of first bonding jumper 16, second bonding jumper 18 and the 3rd bonding jumper 20 of circuit board combination 1 preferably can be 1.8～1.0 millimeters, but not as limit.In another embodiment, the thickness of first bonding jumper 16, second bonding jumper 18 and the 3rd bonding jumper 20 of circuit board combination 1 still can reach the function of transmission current and support in 0.5～2.0 millimeter scope.
In an embodiment, the material of first bonding jumper 16, second bonding jumper 18 and the 3rd bonding jumper 20 of circuit board combination 1 all comprises copper, but not as limit.For instance, the surface of first bonding jumper 16, second bonding jumper 18 and the 3rd bonding jumper 20 of circuit board combination 1 also can be zinc-plated.
By above detailed description for specific embodiments of the invention, can find out significantly that circuit board combination of the present invention mainly is as the current delivery media that need walk big electric current between the circuit board with bonding jumper.Compared to the available circuit plate combination of adopting wire rod as the current delivery media, new construction design of the present invention is because wireless penetration, therefore do not have twisted wire or reason line problem takes place, and then can be reduced in circuit board group of the present invention in a large number and be combined in the difficulty of group on upright, and can promote attractive in appearance.And compared to the energy loss of wire rod, the present invention adopts bonding jumper can have lower energy loss as the current delivery media.In addition, bonding jumper of the present invention is to be fixed on the circuit board in the mode that screw locks, and replaces existing back weldering processing procedure, therefore can reduce the processing procedure processing difficulties.
Though the present invention discloses as above with execution mode; yet it is not in order to limit the present invention; any person skilled in the art; without departing from the spirit and scope of the present invention; can be used for a variety of modifications and variations, so protection scope of the present invention is as the criterion when looking the scope that appending claims defines.
Claims (14)
1. circuit board combination comprises:
One motherboard;
One first daughter board; And
One first bonding jumper secures to this motherboard and this first daughter board respectively, and then is electrically connected between this motherboard and this first daughter board,
Wherein this first bonding jumper is supported between this motherboard and this first daughter board, causes this first daughter board to be positioned at this motherboard top separatedly, and makes vertical this motherboard of this first daughter board.
2. circuit board combination as claimed in claim 1, wherein this motherboard has a connecting hole, and this first bonding jumper has a perforation, and this circuit board combination also comprises:
One rivet has a screw and a holding section, and this holding section is surrounded on the periphery of this screw, and is suitable for being sticked in this connecting hole; And
One locking part passes this perforation and this connecting hole in regular turn and secures in this screw.
3. circuit board combination as claimed in claim 1, wherein this first daughter board has a connecting hole, and this first bonding jumper has a perforation, and this circuit board combination further comprises:
One rivet has a screw and a holding section, and this holding section is surrounded on the periphery of this screw, and is suitable for being sticked in this connecting hole; And
One locking part passes this perforation and this connecting hole in regular turn and secures in this screw.
4. circuit board combination as claimed in claim 1, wherein this first bonding jumper also comprises:
One first smooth portion, smooth on this motherboard;
One second smooth portion, smooth on this first daughter board;
One first support portion connects this first smooth portion, and vertical this motherboard;
One second support portion connects this second smooth portion, and vertical this first daughter board; And
One first kink is connected between this first support portion and this second support portion.
5. circuit board combination as claimed in claim 4, wherein the radius of curvature of this first kink is greater than 3 millimeters.
6. circuit board combination as claimed in claim 4, wherein this second smooth also comprises at least one claw, in order to insert in this first daughter board.
7. circuit board combination as claimed in claim 1, wherein the side of this first daughter board comprises one first pin, and this circuit board combination further comprises:
One second daughter board, its side comprise one second pin; And
One second bonding jumper has one first convergence hole and one second convergence hole, and this first pin and this second pin are attached to this first convergence hole and this second convergence hole respectively, and then this second bonding jumper is electrically connected between this first daughter board and this second daughter board,
Wherein this second bonding jumper is supported between this first daughter board and this second daughter board, and makes parallel this first daughter board of this second daughter board.
8. circuit board combination as claimed in claim 7, wherein this circuit board combination also comprises one the 3rd bonding jumper, the 3rd bonding jumper secures to this second daughter board and this motherboard of directly pegging graft respectively, and then be electrically connected between this motherboard and this second daughter board, wherein the 3rd bonding jumper is supported between this motherboard and this second daughter board, cause this second daughter board to be positioned at this motherboard top separatedly, and make vertical this motherboard of this second daughter board.
9. circuit board combination as claimed in claim 8, wherein this second daughter board has a connecting hole, and the 3rd bonding jumper has a perforation, and this circuit board combination also comprises:
One rivet has a screw and a holding section, and this holding section is surrounded on the periphery of this screw, and is suitable for being sticked in this connecting hole; And
One locking part passes this perforation and this connecting hole in regular turn and secures in this screw.
10. circuit board combination as claimed in claim 8, wherein the 3rd bonding jumper also comprises:
One Plug Division vertically is plugged on this motherboard;
One the 3rd smooth portion, smooth on this second daughter board;
One the 3rd support portion connects the 3rd smooth portion, and vertical this second daughter board; And
One second kink is connected between this Plug Division and the 3rd support portion.
11. circuit board combination as claimed in claim 10, wherein the radius of curvature of this second kink is greater than 3 millimeters.
12. circuit board combination as claimed in claim 10, wherein the 3rd smooth also comprises at least one claw, in order to insert in this second daughter board.
13. circuit board combination as claimed in claim 8, wherein the thickness of this first bonding jumper, this second bonding jumper and the 3rd bonding jumper is 1.8～1.0 millimeters.
14. circuit board combination as claimed in claim 8, wherein the material of this first bonding jumper, this second bonding jumper and the 3rd bonding jumper all comprises copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210008573.XA CN103209549B (en) | 2012-01-11 | 2012-01-11 | Circuit board composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210008573.XA CN103209549B (en) | 2012-01-11 | 2012-01-11 | Circuit board composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103209549A true CN103209549A (en) | 2013-07-17 |
| CN103209549B CN103209549B (en) | 2016-01-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210008573.XA Active CN103209549B (en) | 2012-01-11 | 2012-01-11 | Circuit board composition |
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| CN (1) | CN103209549B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115023088A (en) * | 2021-03-05 | 2022-09-06 | Abb股份有限公司 | Method for assembling and electrically contacting a first circuit board perpendicular to a second circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07221418A (en) * | 1994-01-31 | 1995-08-18 | Furukawa Electric Co Ltd:The | Three dimensionally assembled compound circuit board |
| CN101631432A (en) * | 2008-07-14 | 2010-01-20 | 富葵精密组件(深圳)有限公司 | Flexible-rigid compound circuit board and method for manufacturing same |
| US20110069457A1 (en) * | 2007-09-26 | 2011-03-24 | Rohm Co., Ltd. | Semiconductor Device |
-
2012
- 2012-01-11 CN CN201210008573.XA patent/CN103209549B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07221418A (en) * | 1994-01-31 | 1995-08-18 | Furukawa Electric Co Ltd:The | Three dimensionally assembled compound circuit board |
| US20110069457A1 (en) * | 2007-09-26 | 2011-03-24 | Rohm Co., Ltd. | Semiconductor Device |
| CN101631432A (en) * | 2008-07-14 | 2010-01-20 | 富葵精密组件(深圳)有限公司 | Flexible-rigid compound circuit board and method for manufacturing same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115023088A (en) * | 2021-03-05 | 2022-09-06 | Abb股份有限公司 | Method for assembling and electrically contacting a first circuit board perpendicular to a second circuit board |
| CN115023088B (en) * | 2021-03-05 | 2023-12-29 | Abb股份有限公司 | Method for assembling and electrically contacting a first circuit board perpendicular to a second circuit board |
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| Publication number | Publication date |
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| CN103209549B (en) | 2016-01-20 |
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