CN103209549B - Circuit board composition - Google Patents
Circuit board composition Download PDFInfo
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- CN103209549B CN103209549B CN201210008573.XA CN201210008573A CN103209549B CN 103209549 B CN103209549 B CN 103209549B CN 201210008573 A CN201210008573 A CN 201210008573A CN 103209549 B CN103209549 B CN 103209549B
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- bonding jumper
- daughter board
- circuit board
- motherboard
- composition
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Abstract
A kind of circuit board composition comprises motherboard, the first daughter board and the first bonding jumper.First bonding jumper secures to motherboard and the first daughter board respectively, and then is electrically connected between motherboard and the first daughter board.First bonding jumper is supported between motherboard and the first daughter board, causes the first daughter board to be positioned at above motherboard separatedly, and makes the generallyperpendicular motherboard of the first daughter board.Circuit board composition of the present invention, its mainly using bonding jumper as circuit board between need away the current delivery medium of larger current.Compared to the known circuit board composition adopting wire rod as current delivery medium, new construction design of the present invention is due to wireless penetration, therefore do not have twisted wire or reason line problem occurs, so can be reduced in a large number circuit board group of the present invention be combined in group vertical on difficulty, and can promote attractive in appearance.Further, compared to the energy loss of wire rod, the present invention adopts bonding jumper can have lower energy loss as current delivery medium.
Description
Technical field
The present invention relates to a kind of circuit board composition.
Background technology
At present, electronic product structure function is day by day complicated, and involve technological layer more and more wider, independent tradesman also cannot process all technological layers.Therefore, electronic product tends to modularization future development gradually.Every profession and trade personnel only may be absorbed in a certain technical field face development & production the corresponding function module, such as wireless communication module, GPS module etc.And these functional modules combine and can provide high degree of integration, multi-functional electronic product to user by downstream industry personnel.
These functional modules are packaged in circuit daughter board usually.In circuit daughter board, there is multiple pin, for being connected with motherboard.These functional modules and circuit daughter board are fitted together by various encapsulation technology when assembling, such as modal surface mounting technology (SurfaceMountTechnology, SMT).The side of circuit daughter board is in early days formed with the pin of sawtooth hole (or claiming stamp hole).This kind of pin side can be formed with scolding tin and be connected, and adhesion is strong therefore and between scolding tin.Because this pin is distributed in around circuit substrate, take the wiring area of circuit substrate, be therefore unfavorable for reducing circuit substrate area.
In addition, with power supply unit, (powersupply), it 110V or the 220V AC power that external cable line (cable) is conveyed into is changed into 12V required for the computer hardwares such as motherboard, hard disk, CD-ROM drive or ± 5V DC power supply.The motherboard of power supply unit directly plugs on it with for most electronic component, and the electronic component (such as, capacitor) of especially high electric current need consider the demand that big current passes through and heat dissipation problem.
But, the connection between circuit board is used as at present containing use wire rod normal in the power supply unit of cable management system (cablemanagement), this connection wire often selects many or comparatively thick line footpath because walking larger current, but often cause following problems.(1) difficulty of line and space utilization is found, managed to group; (2) degree of difficulty in processing procedure processing; (3) wire rod line loss affects efficiency; And (4) aesthetic problem.
Summary of the invention
The object of the present invention is to provide a kind of circuit board composition, to separate existing circuit board composition, owing to adopting, the group that exists as current delivery medium of wire rod is vertical, reason line is difficult with space utilization, wire rod line loss affects efficiency, affects the problems such as attractive in appearance.
According to an embodiment of the present invention, a kind of circuit board composition comprises motherboard, the first daughter board and the first bonding jumper.First bonding jumper secures to motherboard and the first daughter board respectively, and then is electrically connected between motherboard and the first daughter board.First bonding jumper is supported between motherboard and the first daughter board, causes the first daughter board to be positioned at above motherboard separatedly, and makes the generallyperpendicular motherboard of the first daughter board.
In one embodiment of the invention, above-mentioned motherboard has connecting hole.First bonding jumper has perforation.Circuit board composition comprises rivet and locking part further.Rivet has screw and holding section.Holding section is surrounded on the periphery of screw, and is suitable for being sticked in connecting hole.Locking part sequentially secures in screw through perforation and connecting hole.
In one embodiment of the invention, the first above-mentioned daughter board has connecting hole.First bonding jumper has perforation.Circuit board composition comprises rivet and locking part further.Rivet has screw and holding section.Holding section is surrounded on the periphery of screw, and is suitable for being sticked in connecting hole.Locking part sequentially secures in screw through perforation and connecting hole.
In one embodiment of the invention, the first above-mentioned bonding jumper comprises the first smooth portion, the second smooth portion, the first support portion, the second support portion and the first kink further.First smooth portion is smooth on motherboard.Second smooth portion is smooth on the first daughter board.First support portion connects the first smooth portion, and generallyperpendicular motherboard.Second support portion connects the second smooth portion, and generallyperpendicular first daughter board.First kink is connected between the first support portion and the second support portion.
In one embodiment of the invention, the radius of curvature of the first above-mentioned kink is greater than 3 millimeters.
In one embodiment of the invention, the above-mentioned second smooth portion comprises at least one claw further, in order to insert in the first daughter board.
In one embodiment of the invention, the side of the first above-mentioned daughter board comprises the first pin.Circuit board composition comprises the second daughter board and the second bonding jumper further.The side of the second daughter board comprises the second pin.Second bonding jumper has the first convergence hole and the second convergence hole.First pin and the second pin are attached to the first convergence hole and the second convergence hole respectively, and then the second bonding jumper is electrically connected between the first daughter board and the second daughter board.Second bonding jumper is supported between the first daughter board and the second daughter board, and makes substantial parallel first daughter board of the second daughter board.
In one embodiment of the invention, above-mentioned circuit board composition comprises the 3rd bonding jumper further.3rd bonding jumper secures to the second daughter board and direct grafting motherboard respectively, and then be electrically connected between motherboard and the second daughter board, wherein the 3rd bonding jumper is supported between motherboard and this second daughter board, causes the second daughter board to be positioned at above motherboard separatedly, and makes the generallyperpendicular motherboard of the second daughter board.
In one embodiment of the invention, the second above-mentioned daughter board has connecting hole.3rd bonding jumper has perforation.Circuit board composition comprises rivet and locking part further.Rivet has screw and holding section.Holding section is surrounded on the periphery of screw, and is suitable for being sticked in connecting hole.Locking part sequentially secures in screw through perforation and connecting hole.
In one embodiment of the invention, the 3rd above-mentioned bonding jumper comprises Plug Division, the 3rd smooth portion, the 3rd support portion and the second kink further.Plug Division is plugged on motherboard generallyperpendicularly.3rd smooth portion is smooth on the second daughter board.3rd support portion connects the 3rd smooth portion, and generallyperpendicular second daughter board.Second kink is connected between Plug Division and the 3rd support portion.
In one embodiment of the invention, the radius of curvature of the second above-mentioned kink is greater than 3 millimeters.
In one embodiment of the invention, the 3rd above-mentioned smooth portion comprises at least one claw further, in order to insert in the second daughter board.
In one embodiment of the invention, the thickness of the first above-mentioned bonding jumper, the second bonding jumper and the 3rd bonding jumper is 1.8 ~ 1.0 millimeters.
In one embodiment of the invention, the material of the first above-mentioned bonding jumper, the second bonding jumper and the 3rd bonding jumper all comprises copper.
Circuit board composition of the present invention, its mainly using bonding jumper as circuit board between need away the current delivery medium of larger current.Compared to the known circuit board composition adopting wire rod as current delivery medium, new construction design of the present invention is due to wireless penetration, therefore do not have twisted wire or reason line problem occurs, so can be reduced in a large number circuit board group of the present invention be combined in group vertical on difficulty, and can promote attractive in appearance.Further, compared to the energy loss of wire rod, the present invention adopts bonding jumper can have lower energy loss as current delivery medium.In addition, bonding jumper of the present invention is fixed on circuit board in the mode of screw locking, replace known after be welded journey, therefore can reduce processing procedure processing difficulties.
Accompanying drawing explanation
Fig. 1 is the three-dimensional combination figure of the circuit board composition according to one embodiment of the invention, and wherein circuit board composition is assembled on casing.
Fig. 2 is another three-dimensional combination figure of the circuit board composition in Fig. 1.
Fig. 3 is the three-dimensional exploded view of the circuit board composition in Fig. 1.
Fig. 4 is the end view of the circuit board composition in Fig. 1.
Fig. 5 is the exploded view of the circuit board composition in Fig. 4.
Fig. 6 A is the partial sectional view of the circuit board composition in Fig. 1, and wherein the first bonding jumper not yet locks with motherboard.
Fig. 6 B is the partial sectional view of the circuit board composition in Fig. 1, and wherein the first bonding jumper locks with motherboard.
Fig. 7 A is the partial sectional view of the circuit board composition in Fig. 1, and wherein the first bonding jumper not yet locks with the first daughter board.
Fig. 7 B is the partial sectional view of the circuit board composition in Fig. 1, and wherein the first bonding jumper locks with the first daughter board.
Fig. 8 A is the partial sectional view of the circuit board composition in Fig. 2, and wherein the 3rd bonding jumper not yet locks with the second daughter board.
Fig. 8 B is the partial sectional view of the circuit board composition in Fig. 2, and wherein the 3rd bonding jumper locks with the second daughter board.
Wherein, description of reference numerals is as follows:
1: circuit board composition
100,122,142: connecting hole
120: the first pins
140: the second pins
16: the first bonding jumpers
160a, 164a, 202a: perforation
164: the second smooth portions
166: the second support portions
18: the second bonding jumpers
182: the second convergence holes
200: Plug Division
204: the three support portions
22: rivet
222: holding section
3: casing 10: motherboard
12: the first daughter boards
14: the second daughter boards
144: pawl hole
160: the first smooth portions
162: the first support portions
164b, 202b: claw
168: the first kinks
180: the first convergence holes
20: the three bonding jumpers
202: the three smooth portions
206: the second kinks
220: screw
24: locking part
Embodiment
Below will disclose multiple execution mode of the present invention with accompanying drawing, as clearly stated, the details in many practices will be explained in the following description.But should be appreciated that, the details in these practices is not applied to limit the present invention.That is, in some embodiments of the present invention, the details in these practices is non-essential.In addition, for the purpose of simplicity of illustration, some known usual structures and element illustrate in the mode simply illustrated in the accompanying drawings.
A technology type of the present invention is a kind of circuit board composition.More particularly, its mainly using bonding jumper as circuit board between need away the current delivery medium of larger current.Compared to the known circuit board composition adopting wire rod as current delivery medium, new construction design of the present invention is due to wireless penetration, therefore do not have twisted wire or reason line problem occurs, so can be reduced in a large number circuit board group of the present invention be combined in group vertical on difficulty, and can promote attractive in appearance.Further, compared to the energy loss of wire rod, the present invention adopts bonding jumper can have lower energy loss as current delivery medium.In addition, bonding jumper of the present invention is fixed on circuit board in the mode of screw locking, replaces existing rear Welding, therefore can reduce processing procedure processing difficulties.
Please refer to Fig. 1, Fig. 2, Fig. 3, Fig. 4 and Fig. 5.Fig. 1 is the three-dimensional combination figure of the circuit board composition 1 according to one embodiment of the invention, and wherein circuit board composition 1 is assembled on casing 3.Fig. 2 is another three-dimensional combination figure of the circuit board composition 1 in Fig. 1.Fig. 3 is the three-dimensional exploded view of the circuit board composition 1 in Fig. 1.Fig. 4 is the end view of the circuit board composition 1 in Fig. 1.Fig. 5 is the exploded view of the circuit board composition 1 in Fig. 4.
As shown in Figures 1 to 5, in the present embodiment, circuit board composition 1 of the present invention can be applied to power supply unit, and is assembled in the casing 3 of power supply unit, but not as limit.In other words, circuit board composition 1 of the present invention can be applied to and anyly have multiple circuit board to need to carry out the electronic product that combines.
As shown in Figures 1 and 3, in the present embodiment, circuit board composition 1 comprises motherboard 10, first daughter board 12 and the first bonding jumper 16.The two ends of the first bonding jumper 16 of circuit board composition 1 secure to motherboard 10 and the first daughter board 12 respectively, and therefore the first bonding jumper 16 can be electrically connected between motherboard 10 and the first daughter board 12.First bonding jumper 16 of circuit board composition 1 can be supported between motherboard 10 and the first daughter board 12, causes the first daughter board 12 to be positioned at separatedly above motherboard 10, and make the first daughter board 12 substantially relatively motherboard 10 maintain vertical state.
As shown in Figures 1 and 3, in the present embodiment, the first bonding jumper 16 of circuit board composition 1 comprises the first smooth portion 160, second support portion, support portion 162, second, smooth portion 164, first 166 and the first kink 168 further.First smooth portion 160 of the first bonding jumper 16 is smooth on motherboard 10.Second smooth portion 164 of the first bonding jumper 16 is smooth on the first daughter board 12.First support portion 162 of the first bonding jumper 16 connects the first smooth portion 160, and generallyperpendicular motherboard 10.Second support portion 166 of the first bonding jumper 16 connects the second smooth portion 164, and generallyperpendicular first daughter board 12.First kink 168 of the first bonding jumper 16 is connected between the first support portion 162 and the second support portion 166.In other words, interconnective first smooth portion 160 and the first support portion 162, interconnective second smooth portion 164 and the second support portion 166 and interconnective first support portion 162, first kink 168 and the second support portion 166 are substantially all in L font.Because the first bonding jumper 16 of circuit board composition 1 itself has enough structural strengths, therefore can reach support first daughter board 12 and be positioned at object above motherboard 10 separatedly.In other words, first bonding jumper 16 of circuit board composition 1 is except can be used as the current delivery medium between motherboard 10 and the first daughter board 12, first bonding jumper 16 more can be supported in motherboard 10 and the first daughter board 12, make the space between motherboard 10 and the first daughter board 12 can do effective utilization further (such as, space under first daughter board 12 additionally can be plugged on motherboard 10 for other electron component), and then increase the space utilization rate in casing 3.
Please refer to Fig. 6 A and Fig. 6 B.Fig. 6 A is the partial sectional view of the circuit board composition 1 in Fig. 1, and wherein the first bonding jumper 16 not yet locks with motherboard 10.Fig. 6 B is the partial sectional view of the circuit board composition 1 in Fig. 1, and wherein the first bonding jumper 16 locks with motherboard 10.
As shown in figs. 6 a and 6b, in the present embodiment, the motherboard 10 of circuit board composition 1 has connecting hole 100.First bonding jumper 16 of circuit board composition 1 has perforation 160a.Special, the perforation 160a of the first bonding jumper 16 is positioned in the first smooth portion 160.Circuit board composition 1 comprises rivet 22 and locking part 24 (such as, screw) further.The rivet 22 of circuit board composition 1 has screw 220 and holding section 222.The holding section 222 of rivet 22 is surrounded on the periphery of screw 220, and is suitable for being fastened on (that is the connecting hole 100 making the holding section 222 of rivet 22 and motherboard 10 is interference engagement) in the connecting hole 100 of motherboard 10.The locking part 24 of circuit board composition 1 sequentially secures in the screw 220 of rivet 22 through the perforation 160a of the first bonding jumper 16 and the connecting hole 100 of motherboard 10.With this, assembler, when the first bonding jumper 16 is secured to motherboard 10, only need be locked and can complete easily from front by locking part 24.
Please refer to Fig. 7 A and Fig. 7 B.Fig. 7 A is the partial sectional view of the circuit board composition 1 in Fig. 1, and wherein the first bonding jumper 16 not yet locks with the first daughter board 12.Fig. 7 B is the partial sectional view of the circuit board composition 1 in Fig. 1, and wherein the first bonding jumper 16 locks with the first daughter board 12.
As shown in Fig. 7 A and Fig. 7 B, in the present embodiment, the first daughter board 12 of circuit board composition 1 has connecting hole 122.First bonding jumper 16 of circuit board composition 1 has perforation 164a.Special, the perforation 164a of the first bonding jumper 16 is positioned in the second smooth portion 164.Circuit board composition 1 comprises rivet 22 and locking part 24 (such as, screw) further.The rivet 22 of circuit board composition 1 has screw 220 and holding section 222.The holding section 222 of rivet 22 is surrounded on the periphery of screw 220, and is suitable for being sticked in (that is the connecting hole 122 making the holding section 222 of rivet 22 and the first daughter board 12 is interference engagement) in the connecting hole 122 of the first daughter board 12.The locking part 24 of circuit board composition 1 sequentially secures in the screw 220 of rivet 22 through the perforation 164a of the first bonding jumper 16 and the connecting hole 122 of the first daughter board 12.With this, assembler, when the first bonding jumper 16 is secured to the first daughter board 12, only need be locked and can complete easily from front by locking part 24.
In addition, as shown in Fig. 1, Fig. 3 and Fig. 5, in order to increase the constant intensity between the first bonding jumper 16 and the first daughter board 12, in the present embodiment, the second smooth portion 164 of the first bonding jumper 16 comprises at least one claw 164b further.The claw 164b in the second smooth portion 164 is extended by the edge in the second smooth portion 164, and in order to insert in the pawl hole (not shown) of the first daughter board 12, and then can reach effect of constant intensity between enhancing first bonding jumper 16 and the first daughter board 12.The quantity of the claw 164b that the second smooth portion 164 comprises flexibly can adjust according to demand.
In the present embodiment, the quantity of the first bonding jumper 16 that circuit board composition 1 comprises is 2, but not as limit, flexibly can adjust according to needed for reality.
In an embodiment, the problem that stress is concentrated is there is in the first bonding jumper 16 in order to avoid circuit board composition 1 in the process manufactured, can design and make the radius of curvature of the first kink 168 be connected between the first support portion 162 and the second support portion 166 be greater than 3 millimeters, but not as limit.
In an embodiment, the first bonding jumper 16 of circuit board composition 1 can also be fixed to motherboard 10 and the first daughter board 12 with the second smooth portion 164 by the mode of welding in the first smooth portion 160 respectively.
As shown in Figures 1 and 3, in the present embodiment, the side of the first daughter board 12 of circuit board composition 1 comprises the first pin 120.Circuit board composition 1 comprises the second daughter board 14 and the second bonding jumper 18 further.The side of the second daughter board 14 of circuit board composition 1 comprises the second pin 140.Second bonding jumper 18 of circuit board composition 1 has the first convergence hole 180 and the second convergence hole 182.First pin 120 of the first daughter board 12 and the second pin 140 of the second daughter board 14 are attached to the first convergence hole 180 and the second convergence hole 182 of the second bonding jumper 18 respectively, and then the second bonding jumper 18 is electrically connected between the first daughter board 12 and the second daughter board 14.Second bonding jumper 18 of circuit board composition 1 is supported between the first daughter board 12 and the second daughter board 14 (that is, make the first daughter board 12 and the second daughter board 14 side by side), and make substantial parallel first daughter board 12 of the second daughter board 14.In other words, second bonding jumper 18 of circuit board composition 1 is except can be used as the current delivery medium between the first daughter board 12 and the second daughter board 14, second bonding jumper 18 more can be supported between the first daughter board 12 and the second daughter board 14 respectively, make the space between the first daughter board 12 and the second daughter board 14 can do effective utilization further (such as, first daughter board 12 and the second daughter board 14 surface facing each other can supply the extra grafting of other electron component), and then increase the space utilization rate in casing 3.
In the present embodiment, after the first convergence hole 180 being attached to the second bonding jumper 18 respectively at the first pin 120 of the first daughter board 12 and the second pin 140 of the second daughter board 14 and the second convergence hole 182, can carry out again welding to strengthen the constant intensity between the first daughter board 12, second bonding jumper 18 and the second daughter board 14.
In the present embodiment, the quantity of the second bonding jumper 18 that circuit board composition 1 comprises is 3, but not as limit, flexibly can adjust according to needed for reality.Similarly, the first convergence hole 180 the second bonding jumper 18 comprised and the quantity of the second convergence hole 182 also flexibly can adjust needed for the quantity of the second pin 140 of the first pin 120 of the first daughter board 12 and the second daughter board 14.
As shown in Figure 2 and Figure 3, in the present embodiment, circuit board composition 1 comprises the 3rd bonding jumper 20 further.3rd bonding jumper 20 of circuit board composition 1 secures to the second daughter board 14 and direct grafting motherboard 10 respectively, and then is electrically connected between motherboard 10 and the second daughter board 14.3rd bonding jumper 20 of circuit board composition 1 is supported between motherboard 10 and the second daughter board 14, causes the second daughter board 14 to be positioned at separatedly above motherboard 10, and make the second daughter board 14 substantially relatively motherboard 10 maintain vertical state.
As shown in Figure 2 and Figure 3, in the present embodiment, the 3rd bonding jumper 20 of circuit board composition 1 comprises Plug Division 200, the 3rd smooth portion 202, the 3rd support portion 204 and the second kink 206 further.The Plug Division 200 of the 3rd bonding jumper 20 is plugged on motherboard 10 generallyperpendicularly.3rd smooth portion 202 of the 3rd bonding jumper 20 is smooth on the second daughter board 14.3rd support portion 204 of the 3rd bonding jumper 20 connects the 3rd smooth portion 202, and generallyperpendicular second daughter board 14.Second kink 206 of the 3rd bonding jumper 20 is connected between Plug Division 200 and the 3rd support portion 204.In other words, interconnective 3rd smooth portion 202 and the 3rd support portion 204 and interconnective Plug Division 200, second kink 206 and the 3rd support portion 204 are substantially all in L font.Because the 3rd bonding jumper 20 of circuit board composition 1 itself has enough structural strengths, therefore can reach support second daughter board 14 and be positioned at object above motherboard 10 separatedly.In other words, 3rd bonding jumper 20 of circuit board composition 1 is except can be used as the current delivery medium between motherboard 10 and the second daughter board 14, second bonding jumper 18 more can be supported in motherboard 10 and the second daughter board 14, make the space between motherboard 10 and the second daughter board 14 can do effective utilization further (such as, space under second daughter board 14 additionally can be plugged on motherboard 10 for other electron component), and then increase the space utilization rate in casing 3.
Please refer to Fig. 8 A and Fig. 8 B.Fig. 8 A is the partial sectional view of the circuit board composition 1 in Fig. 2, and wherein the 3rd bonding jumper 20 not yet locks with the second daughter board 14.Fig. 8 B is the partial sectional view of the circuit board composition 1 in Fig. 2, and wherein the 3rd bonding jumper 20 locks with the second daughter board 14.
As shown in Figure 8 A and 8 B, in the present embodiment, the second daughter board 14 of circuit board composition 1 has connecting hole 142.3rd bonding jumper 20 of circuit board composition 1 has perforation 202a.Special, the perforation 202a of the 3rd bonding jumper 20 is positioned in the 3rd smooth portion 202.Circuit board composition 1 comprises rivet 22 and locking part 24 further.The rivet 22 of circuit board composition 1 has screw 220 and holding section 222.The holding section 222 of rivet 22 is surrounded on the periphery of screw 220, and is suitable for being sticked in (that is the connecting hole 142 making the holding section 222 of rivet 22 and the second daughter board 14 is interference engagement) in the connecting hole 142 of the second daughter board 14.The locking part 24 of circuit board composition 1 sequentially secures in the screw 220 of rivet 22 through the perforation 202a of the 3rd bonding jumper 20 and the connecting hole 142 of the second daughter board 14.With this, screw, when the 3rd bonding jumper 20 is secured to the second daughter board 14, only need be locked from front and can complete easily by assembler.
In addition, as shown in Fig. 2, Fig. 3 and Fig. 5, in order to increase the constant intensity between the 3rd bonding jumper 20 and the second daughter board 14, in the present embodiment, the 3rd smooth portion 202 of the 3rd bonding jumper 20 comprises at least one claw 202b further.The claw 202b in the 3rd smooth portion 202 is extended by the edge in the 3rd smooth portion 202, and in order to insert in the pawl hole 144 of the second daughter board 14, and then can reach effect of constant intensity between enhancing the 3rd bonding jumper 20 and the second daughter board 14.The quantity of the claw 202b that the 3rd smooth portion 202 comprises flexibly can adjust according to demand.
In the present embodiment, the quantity of the 3rd bonding jumper 20 that circuit board composition 1 comprises is 4, but not as limit, flexibly can adjust according to needed for reality.
In an embodiment, the problem that stress is concentrated is there is in the 3rd bonding jumper 20 in order to avoid circuit board composition 1 in the process manufactured, can design and make the radius of curvature of the second kink 206 be connected between Plug Division 200 and the 3rd support portion 204 be greater than 3 millimeters, but not as limit.
In an embodiment, the 3rd bonding jumper 20 of circuit board composition 1 can also be fixed to the second daughter board 14 by the mode of welding in the 3rd smooth portion 202.
In an embodiment, the first bonding jumper 16, second bonding jumper 18 of circuit board composition 1 and the thickness of the 3rd bonding jumper 20 preferably can be 1.8 ~ 1.0 millimeters, but not as limit.In another embodiment, the first bonding jumper 16, second bonding jumper 18 of circuit board composition 1 and the thickness of the 3rd bonding jumper 20 still can reach the function of transmission current and support in the scope of 0.5 ~ 2.0 millimeter.
In an embodiment, the first bonding jumper 16, second bonding jumper 18 of circuit board composition 1 and the material of the 3rd bonding jumper 20 all comprise copper, but not as limit.For example, the first bonding jumper 16, second bonding jumper 18 of circuit board composition 1 and the surface of the 3rd bonding jumper 20 also can be zinc-plated.
By the above detailed description for specific embodiments of the invention, can find out significantly, circuit board composition of the present invention mainly using bonding jumper as circuit board between need away the current delivery medium of larger current.Combine compared to the available circuit plate adopting wire rod as current delivery medium, new construction design of the present invention is due to wireless penetration, therefore do not have twisted wire or reason line problem occurs, so can be reduced in a large number circuit board group of the present invention be combined in group vertical on difficulty, and can promote attractive in appearance.Further, compared to the energy loss of wire rod, the present invention adopts bonding jumper can have lower energy loss as current delivery medium.In addition, bonding jumper of the present invention is fixed on circuit board in the mode of screw locking, replace existing after be welded journey, therefore can reduce processing procedure processing difficulties.
Although the present invention discloses as above with execution mode; but itself and be not used to limit the present invention; any person skilled in the art; without departing from the spirit and scope of the present invention; can be used for a variety of modifications and variations, the scope that therefore protection scope of the present invention ought define depending on appending claims is as the criterion.
Claims (13)
1. a circuit board composition, comprises:
One motherboard;
One first daughter board; And
One first bonding jumper, secures to this motherboard and this first daughter board respectively, and then is electrically connected between this motherboard and this first daughter board,
Wherein this first bonding jumper is supported between this motherboard and this first daughter board, causes this first daughter board to be positioned at separatedly above this motherboard, and makes this first daughter board this motherboard vertical;
Wherein this motherboard has a connecting hole, and this first bonding jumper has a perforation, and this circuit board composition also comprises:
One rivet, have a screw and a holding section, this holding section is surrounded on the periphery of this screw, and is suitable for being sticked in this connecting hole; And
One locking part, sequentially secures in this screw through this perforation and this connecting hole.
2. circuit board composition as claimed in claim 1, wherein this first daughter board has a connecting hole, and this first bonding jumper has a perforation, and this circuit board composition comprises further:
One rivet, have a screw and a holding section, this holding section is surrounded on the periphery of this screw, and is suitable for being sticked in this connecting hole; And
One locking part, sequentially secures in this screw through this perforation and this connecting hole.
3. circuit board composition as claimed in claim 1, wherein this first bonding jumper also comprises:
One first smooth portion, smooth on this motherboard;
One second smooth portion, smooth on this first daughter board;
One first support portion, connects this first smooth portion, and vertical this motherboard;
One second support portion, connects this second smooth portion, and vertical this first daughter board; And
One first kink, is connected between this first support portion and this second support portion.
4. circuit board composition as claimed in claim 3, wherein the radius of curvature of this first kink is greater than 3 millimeters.
5. circuit board composition as claimed in claim 3, wherein this second smooth portion also comprises at least one claw, in order to insert in this first daughter board.
6. circuit board composition as claimed in claim 1, wherein the side of this first daughter board comprises one first pin, and this circuit board composition comprises further:
One second daughter board, its side comprises one second pin; And
One second bonding jumper, has one first convergence hole and one second convergence hole, and this first pin and this second pin are attached to this first convergence hole and this second convergence hole respectively, and then makes this second bonding jumper be electrically connected between this first daughter board and this second daughter board,
Wherein this second bonding jumper is supported between this first daughter board and this second daughter board, and makes this second daughter board this first daughter board parallel.
7. circuit board composition as claimed in claim 6, wherein this circuit board composition also comprises one the 3rd bonding jumper, 3rd bonding jumper secures to this second daughter board and direct this motherboard of grafting respectively, and then be electrically connected between this motherboard and this second daughter board, wherein the 3rd bonding jumper is supported between this motherboard and this second daughter board, cause this second daughter board to be positioned at separatedly above this motherboard, and make this second daughter board this motherboard vertical.
8. circuit board composition as claimed in claim 7, wherein this second daughter board has a connecting hole, and the 3rd bonding jumper has a perforation, and this circuit board composition also comprises:
One rivet, have a screw and a holding section, this holding section is surrounded on the periphery of this screw, and is suitable for being sticked in this connecting hole; And
One locking part, sequentially secures in this screw through this perforation and this connecting hole.
9. circuit board composition as claimed in claim 7, wherein the 3rd bonding jumper also comprises:
One Plug Division, is vertically plugged on this motherboard;
One the 3rd smooth portion, smooth on this second daughter board;
One the 3rd support portion, connects the 3rd smooth portion, and vertical this second daughter board; And
One second kink, is connected between this Plug Division and the 3rd support portion.
10. circuit board composition as claimed in claim 9, wherein the radius of curvature of this second kink is greater than 3 millimeters.
11. circuit board compositions as claimed in claim 9, wherein the 3rd smooth portion also comprises at least one claw, in order to insert in this second daughter board.
12. circuit board compositions as claimed in claim 7, wherein the thickness of this first bonding jumper, this second bonding jumper and the 3rd bonding jumper is 1.8 ~ 1.0 millimeters.
13. circuit board compositions as claimed in claim 7, wherein the material of this first bonding jumper, this second bonding jumper and the 3rd bonding jumper all comprises copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210008573.XA CN103209549B (en) | 2012-01-11 | 2012-01-11 | Circuit board composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210008573.XA CN103209549B (en) | 2012-01-11 | 2012-01-11 | Circuit board composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103209549A CN103209549A (en) | 2013-07-17 |
| CN103209549B true CN103209549B (en) | 2016-01-20 |
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| CN101631432A (en) * | 2008-07-14 | 2010-01-20 | 富葵精密组件(深圳)有限公司 | Flexible-rigid compound circuit board and method for manufacturing same |
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| JPH07221418A (en) * | 1994-01-31 | 1995-08-18 | Furukawa Electric Co Ltd:The | Three dimensionally assembled compound circuit board |
| US7773381B2 (en) * | 2007-09-26 | 2010-08-10 | Rohm Co., Ltd. | Semiconductor device |
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| CN101631432A (en) * | 2008-07-14 | 2010-01-20 | 富葵精密组件(深圳)有限公司 | Flexible-rigid compound circuit board and method for manufacturing same |
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