CN103208445A - Machining technology for tray for light emitting diode (LED) etching machine - Google Patents
Machining technology for tray for light emitting diode (LED) etching machine Download PDFInfo
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- CN103208445A CN103208445A CN2012100130078A CN201210013007A CN103208445A CN 103208445 A CN103208445 A CN 103208445A CN 2012100130078 A CN2012100130078 A CN 2012100130078A CN 201210013007 A CN201210013007 A CN 201210013007A CN 103208445 A CN103208445 A CN 103208445A
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- etching machine
- pallet
- machining
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- led etching
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- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a machining technology for a tray for an LED etching machine. The machining technology comprises the steps of A, designing and machining a chassis (1) of a vacuum fixture and a sucker (2) of a matched adsorption part, and machining a groove for gas circulation, a pin hole for positioning, a bolt hole for fixing the sucker and a gas pipe port for being connected with a vacuum pump; and B, machining a working surface of the tray (3) for the LED etching machine, machining a surface of a material on a machining center, guaranteeing the flatness of the surface to meet requirements, connecting and fixing the machined surface of the material and a workbench plate of the machining center through a double sided adhesive tape with the even thickness, and operating programs to machine the working surface of the tray for the LED etching machine. By means of the machining technology, the defect of uneven pressure when a press plate is used for fixing parts under normal conditions is overcome due to the method that the double sided adhesive tape with the even thickness is used for pasting during material fixing.
Description
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Technical field
The present invention relates to lithographic technique and precision optical machinery manufacture field in the semiconductor equipment, particularly a kind of LED etching machine processing technology of pallet.
Background technology
LED etching machine pallet is one of LED etching machine core component, is used for loading sapphire substrate or GaN epitaxial wafer.Be that sapphire substrate transmits the carrier that enters vacuum reaction chamber from atmospheric environment, in company with the etching reaction of sapphire substrate fellowship sapphire substrate.The a large amount of heat that produces when taking away the sapphire substrate reaction in reaction is responsible for will cooling off with He gas being assigned on the sapphire substrate of each reprinting simultaneously.And be responsible for the bottom electrode radio frequency source is introduced.Can realize unit multi-disc work (separate unit LED etching machine can load 20 above sapphire substrates simultaneously by pallet) by this pallet.Based on its operation principle with use intention, LED etching machine has the requirement of the big resemblance of thin thickness, area and form and position tolerances such as harsh flatness and the depth of parallelism in design with pallet.The existence of this this factor allows LED etching machine increase greatly with the difficulty of processing of pallet.
Summary of the invention
The purpose of this invention is to provide solve LED etching machine with pallet add man-hour flatness and form and position tolerance such as the depth of parallelism cannot say for sure that a kind of LED etching machine of the problem demonstrate,proved is with the processing technology of pallet.
The objective of the invention is to realize as follows: a kind of LED etching machine processing technology of pallet may further comprise the steps:
The sucker of the chassis of A, design and processing vacuum fixture and the adsorbent parts that matches, and process the bolt hole of the groove of gas communication, the pin-and-hole that is used for the location, fixing sucking disk and be used for being connected the air pipe interface of vacuum pump;
B, machining LED etching machine pallet working face, work in-process processes a face of material in the heart, guarantee that its flatness reaches requirement, the working plate of face of the material that processes and machining center is connected with the uniform double faced adhesive tape of thickness and fixing, working procedure processes LED etching machine with the working face of pallet;
C, utilize vacuum fixture processing LED etching machine pallet installed surface, vacuum fixture is fixed on the machining center working plate, with breather pipe vacuum fixture is connected with vacuum pump, locate with the pin-and-hole on the material, open vacuum pump, utilize air suction adsorption material on vacuum fixture, all features of working procedure rapidoprint installed surface;
D, true qualities anodic oxidation or hard anodizing are carried out in the surface of workpiece handle.
Further, in the described steps A, described chassis is provided with connecting hole and communicates with breather pipe with vacuum pump, and absorption affinity distributes by air channel, and the air vent hole on the described sucker is connected with adsorption tank on the sucker (2) by the air channel on the chassis.
Further, among the described step B, the datum level flatness of described pallet (3) is 0.05, and the depth of parallelism is 0.05.
Advantage of the present invention: in mechanical processing process, exist because of rapidoprint itself or the course of processing in the stress that produces of the cutting of cutter all component shaping and some form and position tolerance produce uncertain influence.The method that the uniform double faced adhesive tape of used thickness is pasted during immobilization material has avoided normal conditions lower platen retaining element to produce the inhomogeneous shortcoming of pressure.And paste not exclusively fixing characteristics by double faced adhesive tape, can allow to be operated in Free Transform in the course of processing, discharge the stress that Tool in Cutting produces.The use of vacuum fixture is simultaneously effectively kept the flatness of work and can be guaranteed to machine the back work depth of parallelism on two surfaces up and down.
Description of drawings
Content of the present invention is easier to be expressly understood in order to make, and according to specific embodiment also by reference to the accompanying drawings, the present invention is further detailed explanation, wherein below
Accompanying drawing is structural representation of the present invention.
Embodiment:
See accompanying drawing, a kind of LED etching machine processing technology of pallet, may further comprise the steps: the sucker 2 of the chassis 1 of A, design and processing vacuum fixture and the adsorbent parts that matches, and process the bolt hole of the groove of gas communication, the pin-and-hole that is used for the location, fixing sucking disk and be used for being connected the air pipe interface of vacuum pump; B, machining LED etching machine pallet 3 working faces, work in-process processes a face of material in the heart, guarantee that its flatness reaches requirement, the working plate of face of the material that processes and machining center is connected with the uniform double faced adhesive tape of thickness and fixing, working procedure processes LED etching machine with the working face of pallet; C, utilize vacuum fixture processing LED etching machine with pallet 3 installed surfaces, vacuum fixture is fixed on the machining center working plate, with breather pipe vacuum fixture is connected with vacuum pump, locate with the pin-and-hole on the material, open vacuum pump, utilize air suction adsorption material on vacuum fixture, all features of working procedure rapidoprint installed surface;
D, true qualities anodic oxidation or hard anodizing are carried out in the surface of workpiece handle.In the described steps A, described chassis is provided with connecting hole 1-1 and communicates with breather pipe with vacuum pump, and absorption affinity distributes by air channel 1-2, and the air vent hole 2-1 on the described sucker is connected with adsorption tank 4 on the sucker 2 by the air channel 1-2 on the chassis.Among the described step B, the datum level flatness of described pallet 3 is 0.05, and the depth of parallelism is 0.05
Above-described specific embodiment; purpose of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the above only is specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (3)
1. a LED etching machine may further comprise the steps with the processing technology of pallet:
The sucker (2) of the chassis (1) of A, design and processing vacuum fixture and the adsorbent parts that matches, and process the bolt hole of the groove of gas communication, the pin-and-hole that is used for the location, fixing sucking disk and be used for being connected the air pipe interface of vacuum pump;
B, machining LED etching machine pallet (3) working face, work in-process processes a face of material in the heart, guarantee that its flatness reaches requirement, the working plate of face of the material that processes and machining center is connected with the uniform double faced adhesive tape of thickness and fixing, working procedure processes LED etching machine with the working face of pallet;
C, utilize vacuum fixture processing LED etching machine with pallet (3) installed surface, vacuum fixture is fixed on the machining center working plate, with breather pipe vacuum fixture is connected with vacuum pump, locate with the pin-and-hole on the material, open vacuum pump, utilize air suction adsorption material on vacuum fixture, all features of working procedure rapidoprint installed surface;
D, true qualities anodic oxidation or hard anodizing are carried out in the surface of workpiece handle.
2. according to the processing technology of a kind of LED etching machine described in the claim 1 with pallet, it is characterized in that: in the described steps A, described chassis is provided with connecting hole (1-1) and communicates with breather pipe with vacuum pump, absorption affinity distributes by air channel (1-2), and the air vent hole on the described sucker (2-1) is connected with adsorption tank (4) on the sucker (2) by the air channel on the chassis (1-2).
3. according to the processing technology of a kind of LED etching machine described in the claim 1 with pallet, it is characterized in that: among the described step B, the datum level flatness of described pallet (3) is 0.05, and the depth of parallelism is 0.05.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210013007.8A CN103208445B (en) | 2012-01-17 | 2012-01-17 | A kind of processing technology of LED etching machine pallet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210013007.8A CN103208445B (en) | 2012-01-17 | 2012-01-17 | A kind of processing technology of LED etching machine pallet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103208445A true CN103208445A (en) | 2013-07-17 |
| CN103208445B CN103208445B (en) | 2016-05-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210013007.8A Active CN103208445B (en) | 2012-01-17 | 2012-01-17 | A kind of processing technology of LED etching machine pallet |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105448776A (en) * | 2014-10-16 | 2016-03-30 | 东莞市中镓半导体科技有限公司 | Pallet system used for plasma dry etching |
| CN106915023A (en) * | 2015-12-24 | 2017-07-04 | 中国科学院理化技术研究所 | The vacuum pumping board that degasification is fixed in a kind of molding process for Liquid Injection |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201893315U (en) * | 2010-11-11 | 2011-07-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Coil connecting component, upper electrode device and LED etcher |
-
2012
- 2012-01-17 CN CN201210013007.8A patent/CN103208445B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201893315U (en) * | 2010-11-11 | 2011-07-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Coil connecting component, upper electrode device and LED etcher |
Non-Patent Citations (1)
| Title |
|---|
| 王庆兵、杜小东: "解决薄板类零件的加工装夹问题 – 双面胶法", 《中国高新技术企业》, no. 10, 31 December 2008 (2008-12-31), pages 98 - 99 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105448776A (en) * | 2014-10-16 | 2016-03-30 | 东莞市中镓半导体科技有限公司 | Pallet system used for plasma dry etching |
| CN106915023A (en) * | 2015-12-24 | 2017-07-04 | 中国科学院理化技术研究所 | The vacuum pumping board that degasification is fixed in a kind of molding process for Liquid Injection |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103208445B (en) | 2016-05-04 |
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Application publication date: 20130717 Assignee: JINGJIANG XIANFENG SEMICONDUCTOR TECHNOLOGY CO.,LTD. Assignor: You Li Contract record no.: 2013320000055 Denomination of invention: Machining technology for tray for light emitting diode (LED) etching machine License type: Exclusive License Record date: 20130304 |
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Effective date of registration: 20180409 Address after: 214500 de Yu Road, Chengnan Park, Jingjiang City, Jiangsu Province, No. 8 Patentee after: JINGJIANG XIANFENG SEMICONDUCTOR TECHNOLOGY CO.,LTD. Address before: 214500 North six polder of Chengnan Industrial Park, Jingjiang Economic Development Zone, Taizhou, Jiangsu Patentee before: You Li |
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Address after: 214500 No. 195, Xingang Avenue, Jingjiang Economic Development Zone, Taizhou City, Jiangsu Province Patentee after: Jiangsu Xianfeng Precision Technology Co.,Ltd. Address before: No. 8, Deyu Road, Chengnan Park, Jingjiang City, Jiangsu Province, 214500 Patentee before: JINGJIANG XIANFENG SEMICONDUCTOR TECHNOLOGY CO.,LTD. |