CN103196070A - Light emitting diode (LED) candle lamp - Google Patents

Light emitting diode (LED) candle lamp Download PDF

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Publication number
CN103196070A
CN103196070A CN2013101499027A CN201310149902A CN103196070A CN 103196070 A CN103196070 A CN 103196070A CN 2013101499027 A CN2013101499027 A CN 2013101499027A CN 201310149902 A CN201310149902 A CN 201310149902A CN 103196070 A CN103196070 A CN 103196070A
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CN
China
Prior art keywords
led
power supply
radiator
heating column
reflection shield
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Granted
Application number
CN2013101499027A
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Chinese (zh)
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CN103196070B (en
Inventor
庾健航
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DONGGUAN KAMTATLIGHTING Co Ltd
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DONGGUAN KAMTATLIGHTING Co Ltd
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Application filed by DONGGUAN KAMTATLIGHTING Co Ltd filed Critical DONGGUAN KAMTATLIGHTING Co Ltd
Priority to CN201310149902.7A priority Critical patent/CN103196070B/en
Publication of CN103196070A publication Critical patent/CN103196070A/en
Application granted granted Critical
Publication of CN103196070B publication Critical patent/CN103196070B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The invention relates to the technical field of a light emitting diode (LED) lamp, and in particular relates to an LED candle lamp. An LED module substrate of the LED candle lamp is provided with a crease area, the crease area is not provided with an aluminum substrate and only comprises a flexible insulation layer and a flexible circuit layer which has bending properties, an angle between an LED substrate area and a power connection area can be flexibly adjusted by bending the crease area, a planar LED module substrate can be changed to a three-dimensional module substrate which can be perfectly bonded with a heat conduction column; and when in assembling, the heat conduction column can be directly nested in the three-dimensional module substrate to be fixed. Compared with the prior art, the LED module substrate is simple to assemble and can be installed in place in one step after being bent; and moreover, the bending angle is adjustable, the LED module substrate can be effectively perfectly bonded with the heat conduction column, and the firmness and the heat radiation performance of the LED module substrate after being fixed can be improved.

Description

A kind of LED candle lamp
Technical field
The application relates to the LED technical field of lamps, particularly a kind of LED candle lamp.
Background technology
The LED candle lamp refers to that illuminating source is the light fixture of LED lamp and profile and candle flame appearance similar, this fitting structure requires the LED candle lamp must have 360 ° of luminous angles just can obtain the better illumination effect, and the lighting angle of LED lamp is limited, therefore general employing of LED candle lamp is provided with heating column and around the heating column side a plurality of LED lamps is set, thereby makes that 360 ° of light fixture energy are luminous.In existing LED light fixture, many light fixtures are in order to obtain 360 ° light angle, as candle lamp, generally all adopt heating column is set, and around the heating column side a plurality of LED substrates are set, at the LED substrate LED lamp is set simultaneously, thereby makes light fixture can 360 ° luminous.
Yet but there is following a plurality of problem in this method: (1) needs respectively each LED substrate to be installed on the heating column when assembling LED lamp, and the duplication of labour is many, and efficiency of assembling is low; Also need to beat through wires hole to each LED substrate when (2) assembling, connecting line is set, complicated operation is made mistakes easily; (3) because each LED substrate all independently draws connecting line to the power supply module of power supply, so wiring is complicated in the LED light fixture, breaks down easily, is unfavorable for maintenance after the fault; (4) parts are many, the cost height.
For this reason, a kind of LED substrate of solid has been proposed in the industry, because the aluminum base layer rigidity in the LED substrate is stronger, be difficult to bending, therefore need to adopt special installation that aluminum base layer is bent, and also need aluminum base layer is processed into different angles at different light fixtures, this makes that not only processing is cumbersome, and the bending angle of aluminum base layer is unadjustable after the processing, therefore because factors such as mismachining tolerances, three-dimensional LED substrate often is difficult to the heating column of perfectly fitting, thus the LED substrate can occur fixing not firm, problems such as poor heat radiation.
Therefore, for solving weak point of the prior art, provide a kind of simple in structure, be easy to assembling and wiring, can effectively guarantee that the perfect LED candle lamp of fitting of LED module group substrates and heating column seems particularly important simultaneously.
Summary of the invention
The application's purpose is to avoid above-mentioned weak point of the prior art and provides a kind of simple in structure, is easy to assembling and wiring, can effectively guarantee the perfect LED candle lamp of fitting of LED module group substrates and heating column simultaneously.
The application's purpose is achieved through the following technical solutions:
A kind of LED candle lamp is provided, comprise base, described base inside is provided with power supply module, one end of described base is connected with radiator, the other end of described radiator is set with heating column, the sheathed LED module group substrates that is bent the solid that forms by flat sheet on the described heating column, described LED module group substrates comprises the power supply bonding pad and the LED substrate zone that is connected with the power supply bonding pad that is no less than two of positive limit shape, the junction of described power supply bonding pad and LED substrate zone is provided with bent folding line district, described power supply bonding pad and LED substrate zone all comprise aluminum base layer successively, insulating barrier and circuit layer, described folding line district comprises insulating barrier and circuit layer, insulation layer is offered in described power supply bonding pad, insulate and offer through wires hole in described insulation layer bottom surface, the circuit layer at described through wires hole place is provided with electrode pad, be welded with led chip on the circuit layer of described LED substrate zone, described led chip is through the electrode pad power taking, also comprise connecting line, described connecting line one end is connected with power supply module after running through radiator and heating column, and the other end is soldered on the electrode pad after passing through wires hole.
Further, this LED candle lamp comprises that also fixed cover and base diameter are greater than the reflection shield of upper diameter, described reflection shield is one-body molded reflector with the corresponding setting of LED substrate zone, offer the lamp hole corresponding with led chip on each reflector, described reflection shield is sheathed on the LED module group substrates, described fixed cover offers the aperture less than the fixing hole of reflection shield base diameter, described fixed cover is sheathed with the reflection shield bottom and fixedlys connected so that reflection shield is fixed with radiator, and the corresponding reflector of described radiator place offers the through hole that runs through radiator.
Wherein, described reflection shield bottom is provided with the card article of ring reflection shield side, and ring is along being provided with flange in the upper end of described fixed cover.
Wherein, described power supply bonding pad is arranged at the heating column end face, and described LED substrate zone is arranged at the heating column side.
Wherein, described heating column is the heating column of positive terrace with edge shape, and each side of described heating column is provided with board slot, and described LED substrate is arranged in the board slot.
Wherein, described heating column and radiator are one-body molded.
Wherein, also comprise lampshade, described lampshade upper end is provided with air-vent.
Wherein, described base comprises lamp holder and Connection Block, and described lamp holder one end is connected with Connection Block, and the described Connection Block other end is embedded in the radiator and with radiator with radiator fixedlys connected, and described power supply module is arranged in the Connection Block and with lamp holder and is electrically connected.
Wherein, described power supply bonding pad is square, and each equal correspondence in bar limit of the power supply bonding pad of described square is connected with a rectangular LED substrate zone.
The application's beneficial effect: in this LED candle lamp, the folding line district of LED module group substrates does not have aluminum base layer, only comprise insulating barrier and circuit layer with bendable folding endurance, by bending folding line district can flexible modulation LED substrate zone and the power supply bonding pad between angle, the LED module group substrates on plane can be changed to the module group substrates of solid that can perfect applying heating column, directly be inserted in heating column during assembling and fixed and get final product, in addition, owing to also be provided with the power supply bonding pad, this zone is provided with the bottom surface insulation and offers the insulation layer of through wires hole, therefore through wires hole is also passed in bottom surface that can be from this power supply module outconnector to insulation layer, electrode pad welding with the circuit layer of power supply bonding pad, the power supply power supply namely is provided at the electrode pad place, the folding line district includes circuit layer simultaneously, be that LED pad group on the LED substrate can be by circuit layer from the electrode pad power taking, compared with prior art, the LED module group substrates assembling that the application provides is simple, disposable putting in place installed in the bending back, and bending angle can be regulated, the perfection that can effectively guarantee LED module group substrates and heating column is fitted, improve steadiness and heat dispersion after the LED module group substrates is fixed, this LED candle lamp only need arrange a connecting line and is connected with the power supply module in addition, all the other circuit layers by itself connect, both reduced workload in a large number, make that also the interior circuit of final LED product is simple, fault is few.
Description of drawings
Utilize accompanying drawing that the application is described further, but the embodiment in the accompanying drawing does not constitute any restriction to the application, for those of ordinary skill in the art, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to the following drawings.
Fig. 1 is the decomposing schematic representation of the embodiment of a kind of LED candle lamp of the application.
Fig. 2 is that the LED module group substrates of the embodiment of a kind of LED candle lamp of the application is the floor map under the bending state.
The specific embodiment
With the following Examples the application is further described.
The specific embodiment of a kind of LED candle lamp of the application, as depicted in figs. 1 and 2, comprise: base, described base inside is provided with power supply module 3, one end of described base is connected with radiator 4, the other end of described radiator 4 is set with heating column 5, the sheathed LED module group substrates 6 that is bent the solid that forms by flat sheet on the described heating column 5, described LED module group substrates 6 comprises the power supply bonding pad 61 and the LED substrate zone 62 that is connected with power supply bonding pad 61 that is no less than two of positive limit shape, described power supply bonding pad 61 is provided with bent folding line district 63 with the junction of LED substrate zone 62, described power supply bonding pad 61 and LED substrate zone 62 comprise aluminum base layer successively, insulating barrier and circuit layer, described folding line district 63 comprises insulating barrier and circuit layer, insulation layer is offered in described power supply bonding pad 61, insulate and offer through wires hole 612 in described insulation layer bottom surface, the circuit layer at described through wires hole 612 places is provided with electrode pad 611, be welded with led chip 64 on the circuit layer of described LED substrate zone 62, described led chip 64 is through electrode pad 611 power takings, also comprise connecting line 10, described connecting line 10 1 ends run through radiator 4 and are connected with power supply module 3 with heating column 5 backs, are soldered on the electrode pad 611 after described connecting line 10 other ends pass through wires hole 612.
Because the folding line district 63 of LED module group substrates 6 does not have aluminum base layer, only comprise insulating barrier and circuit layer with bendable folding endurance, by bending the angle that folding line district 63 gets final product between flexible modulation LED substrate zone 62 and the power supply bonding pad 61, the LED module group substrates 6 on plane can be changed to the module group substrates of solid that can perfect applying heating column 5, directly be inserted in heating column 5 during assembling and fixed and get final product, fixed form can adopt and be spirally connected or mode such as clamping.In addition, owing to also be provided with power supply bonding pad 61, this zone is provided with the bottom surface insulation and offers the insulation layer of through wires hole 612, therefore through wires hole 612 is also passed in bottom surface that can be from this power supply module outconnector 10 to insulation layer, electrode pad 611 welding with the circuit layer of power supply bonding pad 61, the power supply power supply namely is provided at electrode pad 611 places, folding line district 63 includes circuit layer simultaneously, be that LED pad group on the LED substrate can be by circuit layer from electrode pad 611 power takings, compared with prior art, LED module group substrates 6 assemblings that the application provides are simple, disposable putting in place installed in bending back, and bending angle can regulate, and can guarantee effectively that LED module group substrates 6 and the perfection of heating column 5 fit, improve steadiness and heat dispersion after LED module group substrates 6 is fixed, this LED candle lamp only need arrange a connecting line 10 and is connected with the power supply module in addition, and all the other circuit layers by itself connect, and have both reduced workload in a large number, make that also the interior circuit of final LED product is simple, fault is few.
In the present embodiment, adopt at original substrate that includes aluminum base layer, insulating barrier and circuit layer and by erosion carver skill the aluminum base layer in folding line district 63 is removed, can realize that folding line district 63 only keeps insulating barrier and circuit layer, thereby realize bent.Wherein, the insulation layer that bottom surface insulation is set be for guarantee connecting line 10 can only by electrode pad 611 discharge and not can with other partially conductives of LED module group substrates 6, guarantee the reliability of LED substrate module, and the big I of this insulation layer is according to the actual conditions settings such as shape of connecting line 10, can be that a circle insulation layer only is set around through wires hole 612, also whole power supply bonding pad 61 can also be set to insulation layer certainly.In addition, the insulation of realization insulation layer also can be adopted several different methods, and present embodiment adopts the way realization insulation of aluminum base layer erosion carving being fallen to expose insulating barrier, can also adopt methods such as resetting a layer insulating certainly, as long as realize insulation, do not repeat them here.
This LED candle lamp comprises that also fixed cover 8 and base diameter are greater than the reflection shield 7 of upper diameter, described reflection shield 7 is one-body molded reflector 71 with the 62 corresponding settings of LED substrate zone, offer the lamp hole 72 corresponding with led chip 64 on each reflector 71, described reflection shield 7 is sheathed on the LED module group substrates 6, described fixed cover 8 offers the aperture less than the fixing hole of reflection shield 7 base diameters, described fixed cover 8 is sheathed with reflection shield 7 bottoms and fixedlys connected so that reflection shield 7 is fixing with radiator 4, and described radiator 4 corresponding reflectors 71 places offer the through hole 41 that runs through radiator 4.
For the luminous intensity that strengthens light fixture reduces caloric value simultaneously, general LED light fixture can set reflection shield 7 to the LED lamp.Because the led chip 64 of heating column 5 sides has certain outstanding, if undermine led chip 64 so reflection shield 7 directly overlaps affiliation from the top down, to this, the reflection shield 7 of existing LED candle lamp generally comprises reflection shield 7 skeletons and a plurality of reflectors that separate 71 that are inserted in from the top down, offer on the reflector 71 and led chip 64 lamp holes 72 of the same size, can respectively the lamp hole 72 of each lamp plate be aimed at led chip 64 and be assembled to heating column 5 sides during assembling, thereby avoid being inserted in from the top down the problem of bringing.Existing this Technology Need assembles reflector 71 separately to each led chip 64, also need for each reflector 71 corresponding fixed structure to be set, therefore structure is comparatively complicated, and light fixture generally has a plurality of led chips 64, need repeatedly repeat to assemble reflector 71 when therefore assembling, efficiency of assembling is low, the production cost height, and assembling process is made mistakes easily and is caused product to produce.Reflection shield 7 structure steadiness are poor simultaneously.
And the one-body molded reflector 71 that has with the corresponding setting of LED substrate on the reflection shield 7 in the present embodiment, radiator 4 corresponding reflectors 71 places offer the through hole 41 that vertically runs through radiator 4 simultaneously, during assembling, in the through hole 41 of radiator 4, column is set, reflection shield 7 is inserted in from top to bottom, it is the support that each reflector 71 all is subjected to column, because each reflector 71 itself has certain elasticity and base diameter greater than upper diameter, therefore each reflector 71 can outwards flick under the support of column, being a plurality of columns struts the cover mouth of reflection shield 7, thereby make reflection shield 7 be inserted in the process downwards and can not touch led chip 64, reflection shield 7 move down put in place after, column is extracted out from radiator 4 belows, resilience conformed on the LED substrate after reflection shield 7 lost and supports, led chip 64 protrudes from the lamp hole 72 of LGP, then fixed cover 8 is overlapped from top to bottom to reflection shield 7 bottoms and fixing with radiator 4, because the fixing hole aperture of fixed cover 8 is less than reflection shield 7 base diameters, so reflection shield 7 is fixed.Compared with prior art, the application's structure is greatly simplified, and reflection shield 7 one-time-reach-places during assembling need not repeated independent installation reflector 71, and efficiency of assembling greatly improves, and effectively reduces enterprise's production cost, and reflection shield 7 is one-body molded simultaneously, and steadiness is good.
Described reflection shield 7 bottoms are provided with the card article of ring reflection shield 7 sides, and ring is along being provided with flange in the upper end of described fixed cover 8.Fixed cover 8 is card article and flange butt when fixing reflection shield 7, has more effectively guaranteed the spacing of 8 pairs of reflection shields 7 of fixed cover, guarantees that reflection shield 7 can be fixedly secured.
Described power supply bonding pad 61 is arranged at heating column 5 end faces, and described LED substrate zone 62 is arranged at heating column 5 sides.This arranges and can satisfy 360 ° of luminous demands of general candle lamp, and power supply bonding pad 61 is arranged at heating column 5 end faces and can guarantees that connecting line 10 directly connects from top to bottom, makes structure simpler simultaneously.Certainly, according to the needs such as lighting angle of reality, also can LED substrate zone 62 be set at heating column 5 end faces, and in heating column 5 a certain sides power supply bonding pad 61 be set.Be electrically connected in the district simultaneously and also led chip 64 can be set.
Described heating column 5 is the heating column 5 of positive terrace with edge shape, and each side of described heating column 5 is provided with board slot 51, and described LED substrate zone 62 is arranged in the board slot 51.Adopt the heating column 5 of terrace with edge shape and board slot 51 is set, can make the more firm applying heating column 5 of LED substrate zone 62, both can avoid LED module group substrates 6 in assembling or use because phenomenons such as fixing not firm generation sidesways, be convenient to fixedly installing of LED module group substrates 6, also can increase the contact area of LED module group substrates 6 with heating column 5, improve heat conductivility between the two, the positive terrace with edge shape heating column of LED module group substrates 6 couplings is obliquely installed for 5 one-tenth simultaneously, upwards emission of part light when luminous, thus make the distribution of light of light fixture emission more even.
Described heating column 5 and radiator 4 are one-body molded.So both convenient processing also can improve heating column 5 and radiator 4 thermal conduction effects simultaneously, had guaranteed the heat radiation quality of lamp main body.
Also comprise lampshade 9, described lampshade 9 upper ends are provided with air-vent 91.Transparent housing not only can be protected the internal structure of light fixture, also can play certain refraction/reflection effect to light simultaneously, makes distribution of light more even.And by air-vent 91, the thermal current of miniature LED bulb inside can with extraneous convection current, the outside conduction that the heat of LED bulb inside can be begun improves heat dispersion.
Described base comprises lamp holder 1 and Connection Block 2, described lamp holder 1 one ends are connected with Connection Block 2, described Connection Block 2 other ends are embedded in the radiator 4 and with radiator 4 with radiator 4 fixedlys connected, and described power supply module 3 is arranged in the Connection Block 2 and with lamp holder 1 and is electrically connected.Be connected power taking by lamp holder 1 with power supply during use, can mate different lamp holder 1 according to the actual requirements.
Described power supply bonding pad 61 is square, and each equal correspondence in bar limit of the power supply bonding pad 61 of described square is connected with a rectangular LED substrate zone 62.This structure both had been convenient to processing, can guarantee that also four direction is luminous, had guaranteed the luminous angle of LED light fixture substantially.Certainly, according to concrete needs, power supply bonding pad 61 can be set to pentagon, and hexagon or other polygonal power supply bonding pads 61 can arrange more LED substrate zone 62 accordingly, thereby make that the LED lamp luminescence is more even.
Should be noted that at last; above embodiment is only in order to illustrate the application's technical scheme; but not to the restriction of the application's protection domain; although with reference to preferred embodiment the application has been done to explain; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement the application's technical scheme, and not break away from essence and the scope of present techniques scheme.

Claims (9)

1. LED candle lamp, comprise base, described base inside is provided with power supply module, one end of described base is connected with radiator, the other end of described radiator is set with heating column, it is characterized in that: the sheathed LED module group substrates that is bent the solid that forms by flat sheet on the described heating column, described LED module group substrates comprises the power supply bonding pad and the LED substrate zone that is connected with the power supply bonding pad that is no less than two of positive limit shape, the junction of described power supply bonding pad and LED substrate zone is provided with bent folding line district, described power supply bonding pad and LED substrate zone all comprise aluminum base layer successively, insulating barrier and circuit layer, described folding line district comprises insulating barrier and circuit layer, insulation layer is offered in described power supply bonding pad, insulate and offer through wires hole in described insulation layer bottom surface, the circuit layer at described through wires hole place is provided with electrode pad, be welded with led chip on the circuit layer of described LED substrate zone, described led chip is through the electrode pad power taking, also comprise connecting line, described connecting line one end is connected with power supply module after running through radiator and heating column, and the other end is soldered on the electrode pad after passing through wires hole.
2. a kind of LED candle lamp as claimed in claim 1, it is characterized in that: comprise that also fixed cover and base diameter are greater than the reflection shield of upper diameter, described reflection shield is one-body molded reflector with the corresponding setting of LED substrate zone, offer the lamp hole corresponding with led chip on each reflector, described reflection shield is sheathed on the LED module, described fixed cover offers the aperture less than the fixing hole of reflection shield base diameter, described fixed cover is sheathed with the reflection shield bottom and fixedlys connected so that reflection shield is fixed with radiator, and the corresponding reflector of described radiator place offers the through hole that runs through radiator.
3. a kind of LED candle lamp as claimed in claim 2 is characterized in that: described reflection shield bottom is provided with the card article of ring reflection shield side, and the ring edge is provided with flange the upper end of described fixed cover in.
4. a kind of LED candle lamp as claimed in claim 1, it is characterized in that: described power supply bonding pad is arranged at the heating column end face, and described LED substrate zone is arranged at the heating column side.
5. a kind of LED candle lamp as claimed in claim 1, it is characterized in that: described heating column is the heating column of positive terrace with edge shape, and each side of described heating column is provided with board slot, and described LED substrate zone is arranged in the board slot.
6. a kind of LED candle lamp as claimed in claim 1, it is characterized in that: described heating column and radiator are one-body molded.
7. a kind of LED candle lamp as claimed in claim 1 is characterized in that: also comprise lampshade, be provided with air-vent on the described lampshade.
8. a kind of LED candle lamp as claimed in claim 1, it is characterized in that: described base comprises lamp holder and Connection Block, described lamp holder one end is connected with Connection Block, the described Connection Block other end is embedded in the radiator and with radiator with radiator fixedlys connected, and described power supply module is arranged in the Connection Block and with lamp holder and is electrically connected.
9. a kind of LED candle lamp as claimed in claim 1, it is characterized in that: described power supply bonding pad is square, each equal correspondence in bar limit of the power supply bonding pad of described square is connected with a rectangular LED substrate zone.
CN201310149902.7A 2013-04-26 2013-04-26 Light emitting diode (LED) candle lamp Expired - Fee Related CN103196070B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310149902.7A CN103196070B (en) 2013-04-26 2013-04-26 Light emitting diode (LED) candle lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310149902.7A CN103196070B (en) 2013-04-26 2013-04-26 Light emitting diode (LED) candle lamp

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CN103196070A true CN103196070A (en) 2013-07-10
CN103196070B CN103196070B (en) 2015-02-18

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104566178A (en) * 2014-12-26 2015-04-29 中山市领航光电科技有限公司 Candle lamp adopting double-layer protection cover
CN106545756A (en) * 2016-10-18 2017-03-29 上海顿格电子贸易有限公司 A kind of Universal LED substrate
CN113768204A (en) * 2021-10-18 2021-12-10 伊森莱芙(广东)医用科技有限公司 Process for wrapping ceramic heating body of atomizer with cotton

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CN202469560U (en) * 2011-12-23 2012-10-03 深圳市泰迪伦光电科技有限公司 Efficient LED (Light-Emitting Diode) candle lamp
US20120287636A1 (en) * 2011-05-12 2012-11-15 Hsing Chen Light emitting diode lamp capability of increasing angle of illumination
CN203322765U (en) * 2013-04-26 2013-12-04 东莞市金达照明有限公司 LED candle lamp

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US20120113606A1 (en) * 2009-07-14 2012-05-10 Thomas Preuschl Bendable Luminous Modules and Method for Producing Bendable Luminous Modules
CN202158382U (en) * 2010-11-12 2012-03-07 旭灿光电股份有限公司 Light-emitting diode (LED) lighting device
CN102032540A (en) * 2010-12-21 2011-04-27 厦门立明光电有限公司 Substrate group connected by flexible connecting bridges
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CN203322765U (en) * 2013-04-26 2013-12-04 东莞市金达照明有限公司 LED candle lamp

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104566178A (en) * 2014-12-26 2015-04-29 中山市领航光电科技有限公司 Candle lamp adopting double-layer protection cover
CN106545756A (en) * 2016-10-18 2017-03-29 上海顿格电子贸易有限公司 A kind of Universal LED substrate
CN113768204A (en) * 2021-10-18 2021-12-10 伊森莱芙(广东)医用科技有限公司 Process for wrapping ceramic heating body of atomizer with cotton

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