CN103192495A - LED (light-emitting diode) die - Google Patents
LED (light-emitting diode) die Download PDFInfo
- Publication number
- CN103192495A CN103192495A CN2013101263230A CN201310126323A CN103192495A CN 103192495 A CN103192495 A CN 103192495A CN 2013101263230 A CN2013101263230 A CN 2013101263230A CN 201310126323 A CN201310126323 A CN 201310126323A CN 103192495 A CN103192495 A CN 103192495A
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- Prior art keywords
- guidance tape
- keeper
- thermal insulation
- insulation board
- plate
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Abstract
The invention discloses an LED (light-emitting diode) die. The LED die comprises an upper runner plate, a lower runner plate, an upper heat insulation plate, a first locating piece, an upper shaping plate, a lower shaping plate, a lower heat insulation plate and a bottom plate, wherein the lower runner plate is arranged on the lower surface of the upper runner plate; a hot runner is defined between the lower runner plate and the upper runner plate; the upper heat insulation plate is arranged on the lower surface of the lower runner plate; the first locating piece is used for locating the lower runner plate, is arranged on the upper surface of the upper heat insulation plate and is matched with the lower runner plate; the upper shaping plate is arranged on the lower surface of the upper heat insulation plate; the lower shaping plate is arranged on the lower surface of the upper shaping plate; a cavity communicated with the hot runner is defined between the upper shaping plate and the lower shaping plate; the lower heat insulation plate is arranged on the lower surface of the lower shaping plate; and the bottom plate is arranged on the lower surface of the lower heat insulation plate. The LED die disclosed by the invention has the beneficial effect that the lower runner plate can be installed accurately.
Description
Technical field
The present invention relates to a kind of led die.
Background technology
Injection mold is the important process equipment of producing various industrial products, along with plastic mould design industry developing rapidly and plasthetics aviation, boat too, the applying of industrial departments such as electronics, machinery, boats and ships and automobile, product is more and more higher to the requirement of mould, the requirement that traditional plastic mould method for designing can't adapt to model change and improve the quality.The computer aided engineering technology has become the valid approach of these weak links in plastic cement products exploitation, mould design and the product processing.
Summary of the invention
The invention provides a kind of led die, described led die comprises: the upper reaches guidance tape; Dirty guidance tape, described dirty guidance tape is located on the lower surface of described upper reaches guidance tape, limits hot flow path between wherein said dirty guidance tape and the described upper reaches guidance tape; Last thermal insulation board, the described thermal insulation board of going up is located on the lower surface of described dirty guidance tape; Be used for first keeper to described dirty guidance tape location, described first keeper is located on the described upper surface of going up thermal insulation board and with described dirty guidance tape and cooperates; Cope match plate, described cope match plate are located on the lower surface of described upward thermal insulation board; Following template, described following template is located on the lower surface of described cope match plate, limits the die cavity that is communicated with described hot flow path between wherein said cope match plate and the described following template; Following thermal insulation board, described thermal insulation board down are located on the lower surface of described template down; And base plate, described base plate is located on the lower surface of described thermal insulation board down.
First keeper that cooperates with dirty guidance tape by the upper surface setting at last thermal insulation board according to the led die of the embodiment of the invention, thus can position dirty guidance tape.When the assembled LED mould, can accurately install dirty guidance tape thus, thereby can protect nozzle and hot flow path.
Preferably, the lower surface of described dirty guidance tape is provided with first locating hole, and the part of described first keeper is engaged in described first locating hole.
Preferably, be provided with internal thread in described first locating hole, the part of described first keeper is provided with external screw thread, and a part of threaded engagement of described first keeper is in described first locating hole.
Preferably, described first keeper is with respect to the center line symmetry of described dirty guidance tape.
Preferably, the cross section of described first keeper is circular, and the center of described dirty guidance tape is relative on above-below direction with the center of circle of described cross section.
Preferably, described led die also comprises a plurality of second keepers, a plurality of described second keepers are turned up the soil at interval and are located on the described upper surface of going up thermal insulation board and each described second keeper cooperates with described dirty guidance tape, and wherein a plurality of described second keepers are around the described first keeper setting.
Preferably, the lower surface of described dirty guidance tape is provided with a plurality of second locating holes, and the part of a plurality of described second keepers is engaged in respectively in a plurality of described second locating holes accordingly.
Preferably, be provided with internal thread in described second locating hole, the part of described second keeper is provided with external screw thread, and a part of threaded engagement of described second keeper is in described second locating hole.
Preferably, a plurality of described second keepers are positioned on the same circumference, and the center of circle of described circumference is relative on above-below direction with the center of circle of described cross section.
Preferably, described upper reaches guidance tape, described dirty guidance tape, described thermal insulation board, described cope match plate, described template down, described thermal insulation board down and the described base plate gone up removably link together by bolt.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously and easily understanding becoming the description of embodiment in conjunction with following accompanying drawing, wherein:
Fig. 1 is the structural representation according to the led die of the embodiment of the invention.
Led die 1, upper reaches guidance tape 20, dirty guidance tape 30, hot flow path 31, last thermal insulation board 40, cope match plate 50, following template 60, following thermal insulation board 70, base plate 80, first keeper 90.
The specific embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein identical or similar label is represented identical or similar elements or the element with identical or similar functions from start to finish.Be exemplary below by the embodiment that is described with reference to the drawings, only be used for explaining the present invention, and can not be interpreted as limitation of the present invention.
Below with reference to the led die 1 of Fig. 1 description according to the embodiment of the invention.As shown in Figure 1, the led die 1 according to the embodiment of the invention comprises upper reaches guidance tape 20, dirty guidance tape 30, goes up thermal insulation board 40, is used for first keeper 90, cope match plate 50, following template 60, following thermal insulation board 70 and base plate 80 to dirty guidance tape 30 location.
The lower surface of dirty guidance tape 30 is provided with first locating hole, and the part of first keeper 90 is engaged in described first locating hole.Thus can be more easily, exactly dirty guidance tape 30 is positioned.
Preferably, be provided with internal thread in described first locating hole, the part of first keeper 90 is provided with external screw thread, and a part of threaded engagement of first keeper 90 is in described first locating hole.Can position dirty guidance tape 30 more easily thus.
Led die 1 also comprises a plurality of second keepers, and a plurality of described second keepers are turned up the soil on the upper surface that is located at thermal insulation board 40 at interval and each described second keeper cooperates with dirty guidance tape 30, and wherein a plurality of described second keepers arrange around first keeper 90.Can position dirty guidance tape 30 more exactly thus.
Preferably, the lower surface of dirty guidance tape 30 is provided with a plurality of second locating holes, and the part of a plurality of described second keepers is engaged in respectively in a plurality of described second locating holes accordingly.That is to say that the quantity of described second keeper equates with the quantity of described second locating hole, and the part of described second keeper is engaged in described second locating hole.
Particularly, be provided with internal thread in described second locating hole, the part of described second keeper is provided with external screw thread, and a part of threaded engagement of described second keeper is in described second locating hole.Can position dirty guidance tape 30 more easily thus.A plurality of described second keepers are positioned on the same circumference, and the center of circle of described circumference is relative on above-below direction with the center of circle of described cross section.Can more accurately position dirty guidance tape 30 thus.
Upper reaches guidance tape 20, dirty guidance tape 30, last thermal insulation board 40, cope match plate 50, following template 60, following thermal insulation board 70 and base plate 80 can removably link together by bolt.Particularly, upper reaches guidance tape 20, dirty guidance tape 30, last thermal insulation board 40, cope match plate 50, following template 60, following thermal insulation board 70 and base plate 80 can removably link together by a plurality of bolts.Advantageously, a plurality of bolts distribute equally spacedly.
In the description of this specification, concrete feature, structure, material or characteristics that the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means in conjunction with this embodiment or example description are contained at least one embodiment of the present invention or the example.In this manual, the schematic statement to above-mentioned term not necessarily refers to identical embodiment or example.And concrete feature, structure, material or the characteristics of description can be with the suitable manner combination in any one or more embodiment or example.
Although illustrated and described embodiments of the invention, those having ordinary skill in the art will appreciate that: can carry out multiple variation, modification, replacement and modification to these embodiment under the situation that does not break away from principle of the present invention and aim, scope of the present invention is limited by claim and equivalent thereof.
Claims (10)
1. a led die is characterized in that, comprising:
The upper reaches guidance tape;
Dirty guidance tape, described dirty guidance tape is located on the lower surface of described upper reaches guidance tape, limits hot flow path between wherein said dirty guidance tape and the described upper reaches guidance tape;
Last thermal insulation board, the described thermal insulation board of going up is located on the lower surface of described dirty guidance tape;
Be used for first keeper to described dirty guidance tape location, described first keeper is located on the described upper surface of going up thermal insulation board and with described dirty guidance tape and cooperates;
Cope match plate, described cope match plate are located on the lower surface of described upward thermal insulation board;
Following template, described following template is located on the lower surface of described cope match plate, limits the die cavity that is communicated with described hot flow path between wherein said cope match plate and the described following template;
Following thermal insulation board, described thermal insulation board down are located on the lower surface of described template down; With
Base plate, described base plate are located on the lower surface of described thermal insulation board down.
2. led die according to claim 1 is characterized in that, the lower surface of described dirty guidance tape is provided with first locating hole, and the part of described first keeper is engaged in described first locating hole.
3. led die according to claim 2 is characterized in that, is provided with internal thread in described first locating hole, and the part of described first keeper is provided with external screw thread, and a part of threaded engagement of described first keeper is in described first locating hole.
4. led die according to claim 1 is characterized in that, described first keeper is with respect to the center line symmetry of described dirty guidance tape.
5. led die according to claim 4 is characterized in that, the cross section of described first keeper is circular, and the center of described dirty guidance tape is relative on above-below direction with the center of circle of described cross section.
6. led die according to claim 5, it is characterized in that, also comprise a plurality of second keepers, a plurality of described second keepers are turned up the soil at interval and are located on the described upper surface of going up thermal insulation board and each described second keeper cooperates with described dirty guidance tape, and wherein a plurality of described second keepers are around the described first keeper setting.
7. led die according to claim 6 is characterized in that, the lower surface of described dirty guidance tape is provided with a plurality of second locating holes, and the part of a plurality of described second keepers is engaged in respectively in a plurality of described second locating holes accordingly.
8. led die according to claim 7 is characterized in that, is provided with internal thread in described second locating hole, and the part of described second keeper is provided with external screw thread, and a part of threaded engagement of described second keeper is in described second locating hole.
9. led die according to claim 6 is characterized in that, a plurality of described second keepers are positioned on the same circumference, and the center of circle of described circumference is relative on above-below direction with the center of circle of described cross section.
10. led die according to claim 1 is characterized in that, described upper reaches guidance tape, described dirty guidance tape, described thermal insulation board, described cope match plate, described template down, described thermal insulation board down and the described base plate gone up removably link together by bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101263230A CN103192495A (en) | 2013-04-12 | 2013-04-12 | LED (light-emitting diode) die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101263230A CN103192495A (en) | 2013-04-12 | 2013-04-12 | LED (light-emitting diode) die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103192495A true CN103192495A (en) | 2013-07-10 |
Family
ID=48715396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101263230A Pending CN103192495A (en) | 2013-04-12 | 2013-04-12 | LED (light-emitting diode) die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103192495A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103934967A (en) * | 2014-04-09 | 2014-07-23 | 昆山金九亿精密金属有限公司 | Television side cover die |
| CN103934975A (en) * | 2014-03-28 | 2014-07-23 | 昆山市硕强信息咨询有限公司 | Light guide plate mold |
| CN103978637A (en) * | 2014-05-12 | 2014-08-13 | 昆山腾宇鑫金属制品有限公司 | Side cover mold |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1058494A (en) * | 1996-08-23 | 1998-03-03 | Seiko Precision Kk | Cassette type injection molding device |
| CN201784144U (en) * | 2010-07-29 | 2011-04-06 | 深圳市精控机电有限公司 | Balance flowing passage plate structure |
| CN202137905U (en) * | 2011-08-04 | 2012-02-08 | 苏州腾行精密模具有限公司 | Injection mold for producing sealing rings |
| CN202137904U (en) * | 2011-08-04 | 2012-02-08 | 苏州腾行精密模具有限公司 | Mold used for producing special-shaped thin-walled injection products |
| CN102371654A (en) * | 2010-08-17 | 2012-03-14 | 於岩君 | Valve needle sealing device for needle valve type hot runner mold |
| CN102689412A (en) * | 2012-06-14 | 2012-09-26 | 苏州腾行精密模具有限公司 | Mould runner structure and rubber mould with same |
| CN203185591U (en) * | 2013-04-12 | 2013-09-11 | 昆山腾宇鑫金属制品有限公司 | LED (light emitting diode) die |
-
2013
- 2013-04-12 CN CN2013101263230A patent/CN103192495A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1058494A (en) * | 1996-08-23 | 1998-03-03 | Seiko Precision Kk | Cassette type injection molding device |
| CN201784144U (en) * | 2010-07-29 | 2011-04-06 | 深圳市精控机电有限公司 | Balance flowing passage plate structure |
| CN102371654A (en) * | 2010-08-17 | 2012-03-14 | 於岩君 | Valve needle sealing device for needle valve type hot runner mold |
| CN202137905U (en) * | 2011-08-04 | 2012-02-08 | 苏州腾行精密模具有限公司 | Injection mold for producing sealing rings |
| CN202137904U (en) * | 2011-08-04 | 2012-02-08 | 苏州腾行精密模具有限公司 | Mold used for producing special-shaped thin-walled injection products |
| CN102689412A (en) * | 2012-06-14 | 2012-09-26 | 苏州腾行精密模具有限公司 | Mould runner structure and rubber mould with same |
| CN203185591U (en) * | 2013-04-12 | 2013-09-11 | 昆山腾宇鑫金属制品有限公司 | LED (light emitting diode) die |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103934975A (en) * | 2014-03-28 | 2014-07-23 | 昆山市硕强信息咨询有限公司 | Light guide plate mold |
| CN103934967A (en) * | 2014-04-09 | 2014-07-23 | 昆山金九亿精密金属有限公司 | Television side cover die |
| CN103978637A (en) * | 2014-05-12 | 2014-08-13 | 昆山腾宇鑫金属制品有限公司 | Side cover mold |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130710 |