CN103171092A - Die - Google Patents

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Publication number
CN103171092A
CN103171092A CN201310126533XA CN201310126533A CN103171092A CN 103171092 A CN103171092 A CN 103171092A CN 201310126533X A CN201310126533X A CN 201310126533XA CN 201310126533 A CN201310126533 A CN 201310126533A CN 103171092 A CN103171092 A CN 103171092A
Authority
CN
China
Prior art keywords
thermal insulation
insulation board
slide block
cope match
match plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310126533XA
Other languages
Chinese (zh)
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Tengyuxin Metal Products Co Ltd
Original Assignee
Kunshan Tengyuxin Metal Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Tengyuxin Metal Products Co Ltd filed Critical Kunshan Tengyuxin Metal Products Co Ltd
Priority to CN201310126533XA priority Critical patent/CN103171092A/en
Publication of CN103171092A publication Critical patent/CN103171092A/en
Pending legal-status Critical Current

Links

Abstract

The invention discloses a die. The die comprises a top plate, an upper thermal baffle, an upper shaping plate, a lower shaping plate, a lower thermal baffle, a bottom plate and a sliding block, wherein the upper thermal baffle is arranged on the lower surface of the top plate; the upper shaping plate is arranged on the lower surface of the upper thermal baffle; the lower shaping plate is arranged on the lower surface of the upper shaping plate, a cavity communicated with a hot runner is defined between the upper shaping plate and the lower shaping plate, and a runner communicated with the cavity is formed in the upper shaping plate; the lower thermal baffle is arranged on the lower surface of the lower shaping plate; the bottom plate is arranged on the lower surface of the lower thermal baffle; and the sliding block is arranged between the upper thermal baffle and the lower thermal baffle. Due to the utilization of the die provided by the embodiment of the invention, the yield of the die is increased.

Description

Mould
Technical field
The present invention relates to a kind of mould.
Background technology
Injection mold is the important process equipment of producing various industrial products, along with plastic mould design industry developing rapidly and plasthetics aviation, boat too, the applying of the industrial departments such as electronics, machinery, boats and ships and automobile, product is more and more higher to the requirement of mould, and traditional plastic mould method for designing can't adapt to model change and propose high-quality requirement.The computer aided engineering technology has become the most effective approach of these weak links in plastic cement products exploitation, Design of Dies and product processing.
Summary of the invention
The invention provides a kind of mould, described mould comprises: top board; Upper thermal insulation board, described upper thermal insulation board is located on the lower surface of described top board; Cope match plate, described cope match plate are located on the lower surface of described upper thermal insulation board; Lower template, described lower template is located on the lower surface of described cope match plate, limits the die cavity that is communicated with described hot flow path between wherein said cope match plate and described lower template, and described cope match plate is provided with the runner that is communicated with described die cavity; Lower thermal insulation board, described lower thermal insulation board is located on the lower surface of described lower template; Base plate, described base plate are located on the lower surface of described lower thermal insulation board; And slide block, described slide block is located between described upper thermal insulation board and described lower thermal insulation board.
Pass through the runner that is communicated with described die cavity is set on described cope match plate according to the mould of the embodiment of the present invention, thereby can avoid described runner and described slide block mutually to interfere.Not only can make product advance glue thus smooth and easy, and can avoid stub bar is broken when die sinking, cause product to be pulled by described slide block.Therefore, by utilizing the mould according to the embodiment of the present invention, thereby can improve the yield of product.
Preferably, the stroke of described slide block is greater than 22 millimeters.
Preferably, the stroke of described slide block is greater than 24 millimeters.
Preferably, the stroke of described slide block is 24.5 millimeters.
Preferably, described slide block is located on the upper surface of described lower thermal insulation board slidably.
Preferably, described top board, described upper thermal insulation board, described cope match plate, described lower template, described lower thermal insulation board and described base plate removably link together by bolt.
Preferably, described top board, described upper thermal insulation board, described cope match plate, described lower template, described lower thermal insulation board and described base plate removably link together by a plurality of described bolts.
Preferably, a plurality of described bolts are positioned on the first circumference.
Preferably, a plurality of described bolts are distributed on described the first circumference equally spacedly.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously and easily understanding becoming the description of embodiment in conjunction with following accompanying drawing, wherein:
Fig. 1 is the structural representation according to the mould of the embodiment of the present invention.
Mould 1, top board 20, slide block 30, upper thermal insulation board 40, cope match plate 50, runner 51, lower template 60, lower thermal insulation board 70, base plate 80.
The specific embodiment
The below describes embodiments of the invention in detail, and the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or the element with identical or similar functions from start to finish.Be exemplary below by the embodiment that is described with reference to the drawings, only be used for explaining the present invention, and can not be interpreted as limitation of the present invention.
Below with reference to the mould 1 of Fig. 1 description according to the embodiment of the present invention.As shown in Figure 1, the mould 1 according to the embodiment of the present invention comprises top board 20, upper thermal insulation board 40, cope match plate 50, lower template 60, lower thermal insulation board 70, base plate 80 and slide block 30.
Upper thermal insulation board 40 is located on the lower surface of top board 20, and cope match plate 50 is located on the lower surface of thermal insulation board 40.Lower template 60 is located on the lower surface of cope match plate 50, wherein limits the die cavity that is communicated with hot flow path between cope match plate 50 and lower template 60, and cope match plate 50 is provided with the runner 51 that is communicated with described die cavity.Lower thermal insulation board 70 is located on the lower surface of lower template 60, and base plate 80 is located on the lower surface of lower thermal insulation board 70.Slide block 30 is located between thermal insulation board 40 and lower thermal insulation board 70.
Pass through the runner 51 that is communicated with described die cavity is set on cope match plate 50 according to the mould 1 of the embodiment of the present invention, thereby can avoid runner 51 and slide block 30 mutually to interfere.Not only can make product advance glue thus smooth and easy, and can avoid stub bar is broken when die sinking, cause product to be pulled by slide block 30.Therefore, by utilizing the mould 1 according to the embodiment of the present invention, thereby can improve the yield of product.
Preferably, the stroke of slide block 30 is greater than 22 millimeters.Can further increase the safe distance of slide block 30 thus, further increase the distance between slide block 30 and product, thereby can make product stripping more smooth and easy, product can not pulled by slide block 30, has further improved the yield of product.
Further preferably, the stroke of slide block 30 is greater than 24 millimeters.Can further increase the safe distance of slide block 30 thus, further increase the distance between slide block 30 and product, thereby can make product stripping more smooth and easy, product can not pulled by slide block 30, has further improved the yield of product.
Most preferably, the stroke of described slide block is 24.5 millimeters.Can further increase the safe distance of slide block 30 thus, further increase the distance between slide block 30 and product, thereby can make product stripping more smooth and easy, product can not pulled by slide block 30, has further improved the yield of product.But also can avoid the oversize of mould 1, and then avoid increasing manufacturing cost and the manufacture difficulty of mould 1.
Particularly, slide block 30 is located on the upper surface of lower thermal insulation board 70 slidably.
Top board 20, upper thermal insulation board 40, cope match plate 50, lower template 60, lower thermal insulation board 70 and base plate 80 can removably link together by bolt.Particularly, top board 20, upper thermal insulation board 40, cope match plate 50, lower template 60, lower thermal insulation board 70 and base plate 80 can removably link together by a plurality of bolts.
Advantageously, a plurality of described bolts are positioned on the first circumference.Preferably, a plurality of described bolts are distributed on described the first circumference equally spacedly.Can improve the assembly precision of mould 1 thus.
In the description of this specification, the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means to be contained at least one embodiment of the present invention or example in conjunction with specific features, structure, material or the characteristics of this embodiment or example description.In this manual, the schematic statement of above-mentioned term not necessarily referred to identical embodiment or example.And the specific features of description, structure, material or characteristics can be with suitable mode combinations in any one or more embodiment or example.
Although illustrated and described embodiments of the invention, those having ordinary skill in the art will appreciate that: in the situation that do not break away from principle of the present invention and aim can be carried out multiple variation, modification, replacement and modification to these embodiment, scope of the present invention is limited by claim and equivalent thereof.

Claims (9)

1. a mould, is characterized in that, comprising:
Top board;
Upper thermal insulation board, described upper thermal insulation board is located on the lower surface of described top board;
Cope match plate, described cope match plate are located on the lower surface of described upper thermal insulation board;
Lower template, described lower template is located on the lower surface of described cope match plate, limits the die cavity that is communicated with described hot flow path between wherein said cope match plate and described lower template, and described cope match plate is provided with the runner that is communicated with described die cavity;
Lower thermal insulation board, described lower thermal insulation board is located on the lower surface of described lower template;
Base plate, described base plate are located on the lower surface of described lower thermal insulation board; With
Slide block, described slide block are located between described upper thermal insulation board and described lower thermal insulation board.
2. mould according to claim 1, is characterized in that, the stroke of described slide block is greater than 22 millimeters.
3. mould according to claim 2, is characterized in that, the stroke of described slide block is greater than 24 millimeters.
4. mould according to claim 3, is characterized in that, the stroke of described slide block is 24.5 millimeters.
5. mould according to claim 1, is characterized in that, described slide block is located on the upper surface of described lower thermal insulation board slidably.
6. mould according to claim 1, is characterized in that, described top board, described upper thermal insulation board, described cope match plate, described lower template, described lower thermal insulation board and described base plate removably link together by bolt.
7. mould according to claim 6, is characterized in that, described top board, described upper thermal insulation board, described cope match plate, described lower template, described lower thermal insulation board and described base plate removably link together by a plurality of described bolts.
8. mould according to claim 7, is characterized in that, a plurality of described bolts are positioned on the first circumference.
9. mould according to claim 8, is characterized in that, a plurality of described bolts are distributed on described the first circumference equally spacedly.
CN201310126533XA 2013-04-12 2013-04-12 Die Pending CN103171092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310126533XA CN103171092A (en) 2013-04-12 2013-04-12 Die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310126533XA CN103171092A (en) 2013-04-12 2013-04-12 Die

Publications (1)

Publication Number Publication Date
CN103171092A true CN103171092A (en) 2013-06-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310126533XA Pending CN103171092A (en) 2013-04-12 2013-04-12 Die

Country Status (1)

Country Link
CN (1) CN103171092A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103358479A (en) * 2013-08-03 2013-10-23 昆山市浩坤机械有限公司 Mould for upper cover of ignition switch
CN103358476A (en) * 2013-08-03 2013-10-23 昆山市浩坤机械有限公司 Rubber frame mould

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2931057Y (en) * 2006-07-28 2007-08-08 佛山市顺德区汉达精密电子科技有限公司 Inclined pin structure
CN202742642U (en) * 2012-07-27 2013-02-20 圣美精密工业(昆山)有限公司 Ejection mechanism of running strike tube in slide block
CN203185595U (en) * 2013-04-12 2013-09-11 昆山腾宇鑫金属制品有限公司 Die

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2931057Y (en) * 2006-07-28 2007-08-08 佛山市顺德区汉达精密电子科技有限公司 Inclined pin structure
CN202742642U (en) * 2012-07-27 2013-02-20 圣美精密工业(昆山)有限公司 Ejection mechanism of running strike tube in slide block
CN203185595U (en) * 2013-04-12 2013-09-11 昆山腾宇鑫金属制品有限公司 Die

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103358479A (en) * 2013-08-03 2013-10-23 昆山市浩坤机械有限公司 Mould for upper cover of ignition switch
CN103358476A (en) * 2013-08-03 2013-10-23 昆山市浩坤机械有限公司 Rubber frame mould

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130626