CN103188885A - Method for manufacturing of circuit board - Google Patents
Method for manufacturing of circuit board Download PDFInfo
- Publication number
- CN103188885A CN103188885A CN2012105553581A CN201210555358A CN103188885A CN 103188885 A CN103188885 A CN 103188885A CN 2012105553581 A CN2012105553581 A CN 2012105553581A CN 201210555358 A CN201210555358 A CN 201210555358A CN 103188885 A CN103188885 A CN 103188885A
- Authority
- CN
- China
- Prior art keywords
- mask
- connection gasket
- base substrate
- opening
- rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A manufacturing method of a circuit substrate is provided to form a surface processing layer by coating with an OSP(Organic Solderability Preservative) liquid and reducing an organic exhausting volume. A base substrate(100) having a connection pad(101) is prepared. A mask(200) having an opening part(205) on the base substrate is arranged. A surface treatment liquid(300) is charged in the opening part. The surface processing layer is formed on the connection pad with a step of heating. The mask is removed.
Description
The cross reference of related application
The application requires the rights and interests of the korean patent application No.10-2011-0144879 that is entitled as " Method for manufacturingofcircuit board " that submits on December 28th, 2011, and its full content is integrated into the application by reference.
Technical field
The present invention relates to a kind of method of making circuit board.
Background technology
Cumulative along with the trend of the size that reduces electronic product and parts and thickness carrying out deep research to realize the lightening of wafer-level packaging and printed circuit board (PCB) (PCB).
Simultaneously, in connection gasket surface-treated situation, do not use the processing of the cheapness of the used gold (Au) of tradition, silver (Ag) and tin (Sn) to be subjected to an examination.
The function that the surface that the surface treatment of encapsulating products has a connection gasket of protective circuit plate is avoided oxidation and promoted the combination of installing component on connection gasket.
According to various surface treatments and the course of processing thereof, the surface soldered performance may be diversified, and it influences the welded encapsulation reliability.
At present, the connection gasket of circuit board carries out surface treatment by forming the coat of metal or organic film.
Especially, the formation organic film is more cheap than the coat of metal.Although partly utilized at European Ag coating or Sn coating, because whisker (whisker) and wetting (wetting) problem, their actual use is low-down.
On the other hand; because by use Organic Solderability protection (organic solderabilitypreservative) (OSP) organic film that obtains of solution form by chemical reaction, their thickness may change according to time and the variation of temperature of soaking.For example, along with the increase of pH and imidazole concentration, the described thickness of organic film becomes bigger.
This traditional OSP processing is performed to form diaphragm, that is to say that organic film passes through at the copper (Cu) of connection gasket with such as imidazoles, BTA, and the displacement reaction between the organic material of benzimidazole etc. forms.
Traditional OSP processing can be undertaken by substrate (substrate) is immersed in the coating bath that comprises OSP solution usually, and organic film will be formed on the connection gasket on this substrate.
Yet, because this traditional course of processing is by being implemented substrate immersion in OSP solution, OSP solution may be easy to contaminated, and need filter and pump to be used for control OSP solution and to need extra means to be used for replenishing OSP solution, increased the hold facility area inevitably.
In addition, OSP solution should be filtered out decontamination, and therefore organic discharge volume may increase, and has unnecessarily increased disposal cost and has caused environmental problem.
Summary of the invention
Therefore, the present invention has been devoted to problem and an aspect of of the present present invention that this area runs into will provide a kind of method of making circuit board, and it can minimize the consumption of OSP solution.
Another aspect of the present invention will provide a kind of method of making circuit board, and it is eliminated the demand of control OSP solution and does not cause environmental problem.
Another aspect of the present invention provides a kind of method of making circuit board, and it can reduce the hold facility area.
According to the embodiment of the present invention, a kind of method of making circuit board comprises prepares to have the base substrate (base substrate) of connection gasket, arrangement has the mask (mask) for the opening that exposes the connection gasket on the base substrate, use surface processing solution to fill the opening of described mask, carry out and heat to form surface-treated layer at described connection gasket, and remove described mask.
Same, described surface processing solution can be Organic Solderability protection (OSP) solution.
And described surface-treated layer can comprise Organic Solderability protection (OSP) film.
Described mask can comprise first mask and second mask that contacts with first mask, and described first mask and described second mask can be formed by metal and rubber respectively, and arrange mask to be performed so that the upper surface of the rubber of mask contact base substrate.
Same, described rubber can comprise select among urethane, silicones, acryl and the polyethylene glycol any one.
Described metal can comprise one of stainless steel or nickel.
Described mask also can be formed by rubber.
Same, described rubber comprise select among urethane, silicones, acryl and the polyethylene glycol any one.
And, carry out the opening that uses surface processing solution filling mask by silk screen printing, injection, point sample (dispensing), spraying or their combination of using blade coating machine (squeegee).
And, the base substrate that preparation has connection gasket can comprise the substrate of the outer circuit layer (having connection gasket) that preparation has and form the solder mask that has for the opening that exposes the connection gasket on the substrate, and surface processing solution can be loaded into the opening of solder mask and the opening of mask.
And described method also is included in removes described mask after washing and dry-basis substrate.
Description of drawings
Fig. 1-the 5th illustrates the sectional view of the process of manufacturing circuit board according to the embodiment of the present invention continuously.
Embodiment
To more be expressly understood feature of the present invention and advantage from following detailed description and execution mode.In the whole accompanying drawing, identical reference number is used to indicate same or analogous element.In addition, even known technology is related to the present invention, but when they can make feature of the present invention and description not know, their description is regarded as unnecessary and can be omitted.In description, term " first ", " second " etc. are used to distinguish an element and other element, and element is not defined by above term.
In addition, the term of Shi Yonging and word should not be construed as limited to the definition of common implication and dictionary in the present specification and claims, carry out the rule of method of the present invention institute foundation and are interpreted as having implication and the concept relevant with technical scope of the present invention with his or she known being used for of best description and should can suitably define by the concept of described term hint based on the inventor.
Hereinafter, the detailed description of embodiments of the present invention will be presented with reference to the accompanying drawings.
Fig. 1-the 5th illustrates the sectional view according to the process of the manufacturing circuit board of embodiment of the present invention continuously.
In accompanying drawing of the present invention, the main element of corresponding execution mode is schematically described and other elements are omitted, but the present invention is not applied in any board structure of circuit known in the art with can having specific limited, and this will be understood by those skilled in the art apparently.
At first, as shown in Figure 1, the base substrate 100 with connection gasket 101 is prepared.
According to execution mode, prepare base substrate 100 and can comprise that substrate and the formation of preparing to have the outer circuit layer that comprises connection gasket 101 have for the solder mask 110 that exposes the opening 110a of connection gasket 101 on the substrate, but the present invention is not restricted to this especially.
Same, base substrate 100 can comprise but not be limited to printed circuit board (PCB) especially, and semiconductor crystal wafer, ceramic substrate etc. can be by illustrations, and wherein, this base substrate 100 is to comprise insulating barrier and one or more circuit board that comprises the circuit layer of formation connection gasket 101 thereon.
For illustrative purposes, concrete internal circuit layer is omitted, but comprises that thereon the typical circuit board of insulating barrier and one or more circuit layer can be applied to base substrate 100, and it will be understood by those skilled in the art apparently.
Insulating barrier can be resin insulating barrier.This resin insulating barrier can comprise thermosetting resin such as epoxy, such as the thermoplastic resin of polyimides, or for example by the resin that uses such as the resultant preimpregnation material of the above-mentioned resin of dipping of the reinforcing material of glass fibre or inorganic filler, and heat reactive resin and/or light-cured resin can be used, but the present invention is not specially limited in this.
As outside link, in the course of processing subsequently, soldered ball can be formed on the connection gasket 101, and internal circuit can rely on this soldered ball to be electrically connected to semiconductor device or external devices.
And any material that is used for comprising the circuit of connection gasket 101 can use and unrestricted, as long as be used as the conducting metal for circuit in field of circuit boards.As for printed circuit board (PCB), the use of copper (Cu) is typical.
As known in the art, solder mask 110 can be made up of for example solder paste China ink, soldering-resistance layer or encapsulation agent (encapsulating agent), but the present invention is not specially limited in this.
Next step, as shown in Figure 2, the mask 200 that has for the opening 205 that exposes connection gasket 101 is configured in base substrate 100.
In the present embodiment, mask 200 can comprise first mask 201 and second mask 203 that contacts with first mask 201, as shown in Figure 2.
And second mask 203 can be formed by metal, and this metal can comprise one in stainless steel for example or the nickel, but the present invention is not limited to this especially.
When the mask 200(that mentions in the present embodiment namely, comprise the mask 200 of first mask 201 and second mask 203) when being formed on the base substrate 100, first mask of being made by rubber 210 can be arranged to contact the upper surface of base substrate 100.
Because first mask of being made by rubber 201 has elasticity and air-tightness, so the bonding force between mask 200 and the base substrate 100 can be enhanced, in order in the course of processing subsequently, use with surface processing solution filling opening 205, can prevent that surface processing solution from flowing between mask 200 and base substrate 100, and especially prevent between first mask 201 and solder mask 110, flowing.
Alternately, can use the mask of being formed by rubber fully 200.
Next step, as shown in Figure 3, the opening 205 of mask 200 can be filled by surface processing solution 300.Same, surface processing solution 300 not only can be loaded in the opening 205 of mask 200, and can be loaded among the opening 110a of solder mask 110.
Surface processing solution can be Organic Solderability protection (OSP) solution, but the present invention is not specially limited in this.
Although illustrating, Fig. 3 use blade coating machine 400 to fill the silk screen printing processing procedure of the surface processing solution of described opening 205, but the present invention is not specially limited in this, and any known course of processing in this area, for example injection, point sample, spraying or their combination can be applied to filling opening 205.
Use the silk screen printing course of processing of blade coating machine 400 to carry out by using the common equipment that is used for the soldering paste printing, avoid the demand of extras like this.
Have for the mask 200 of the opening 205 that exposes connection gasket 101 by use when in the above described manner OSP solution is only used connection gasket 101, this is compared to being dipped to base substrate 100 in the OSP solution traditionally, and the consumption of OSP solution can be minimized.
In addition, because base substrate 100 is not soaked in the OSP solution, OSP solution can be avoided polluting, and therefore avoids the demand to the extra means that is used for control OSP solution, thereby and reduces total hold facility area for the manufacture of circuit board.
Use at the opening 110a of the opening 205 of mask 200 as mentioned above and solder mask and to state after surface processing solution is filled, carry out heating process to form surface-treated layers 310 at connection gasket 101.
Although heating process is in the accompanying drawings not shown, but it can be carried out in the following manner: thermal resistance wire can be inserted into platform (not shown) for brace foundation substrate 100 so that heating platform, perhaps base substrate 100 can be placed in the stove, but bright being not specially limited in this and any heating process of this law can be employed as long as it is known in this area.
When heating process is performed with such method, organic displacement reaction can be at the connection gasket 101 that is formed by copper and surface processing solution 300(, OSP solution) take place between, therefore form the surface-treated layer 310(Fig. 4 that comprises organic film at connection gasket 101).
Surface-treated layer 310 is formed on the connection gasket 101, thereby prevents the oxidation of connection gasket 101 and strengthen the adhesiveness of the mounting portion in subsequent process.
In the present embodiment, carrying out the required temperature of heating process can be 40 ℃ ~ 60 ℃.If air themperature is lower than 40 ℃, then the displacement reaction between connection gasket 101 and surface processing solution 300 can not effectively take place.In contrast, if air themperature is higher than 60 ℃, then the solvent of OSP solution (deionized water) may evaporate, and has reduced pH undesirablely, can become irregular to such an extent as to be formed on the thickness of the surface-treated layer 310 on the connection gasket 101.
Next step as shown in Figure 4, mask 200 is removed from base substrate 100.
In the present embodiment, after removing mask 200, water-washing process can be carried out with washing surface Treatment Solution 300 in addition with in order to remove it, and wherein washing surface Treatment Solution 300 is not influenced by displacement reaction, is thereafter dry run.
Washing and dry run are known in this area, so their description is omitted.
Washing and dry run are being removed mask 200 back execution, thereby finish the circuit board with the surface-treated layer 310 that is formed on the connection gasket 101, as shown in Figure 5.
As indicated above, the invention provides a kind of method of making circuit board.According to the present invention, OSP solution only is used on the connection gasket therefore to form surface-treated layer, thereby minimizes the consumption of OSP solution.
And according to the present invention, because the substrate that organic film will be formed thereon is not dipped in the OSP solution, can prevent the pollution of OSP solution.
And according to the present invention, because OSP solution is prevented from polluting, so do not need to filter OSP solution, make organic discharge volume reduce and the economic benefit aspect disposal cost and environmental area.
And according to the present invention, the extras that are used for control OSP solution are not used, and therefore reduce total hold facility area.
Although it is disclosed about the embodiments of the present invention of the method for making circuit board for illustrative purposes, but those skilled in the art will understand under situation about not deviating from as the disclosed scope and spirit of the present invention of appended claims, and multiple different modification, interpolation and replacement are fine.
Therefore, revise like this, add and replace and also be construed as within the scope of the invention.
Claims (11)
1. method of making circuit board, this method comprises:
Preparation has the base substrate of connection gasket;
Arrangement has the mask for the opening that exposes the described connection gasket on the described base substrate;
Use surface processing solution to fill the described opening of described mask;
Carry out heating to form surface-treated layer at described connection gasket; And
Remove described mask.
2. method according to claim 1, wherein said surface processing solution are Organic Solderability protection (OSP) solution.
3. method according to claim 1, wherein said surface-treated layer comprise Organic Solderability protection (OSP) film.
4. method according to claim 1, wherein said mask comprises first mask and second mask that contacts with described first mask, and described first mask and described second mask are formed by metal and rubber respectively, and the described mask of described arrangement is performed so that the described rubber of described mask contacts the upper surface of described base substrate.
5. method according to claim 4, wherein said rubber comprise select among urethane, silicones, acryl and the polyethylene glycol any one.
6. method according to claim 4, wherein said metal comprises one in stainless steel or the nickel.
7. method according to claim 1, wherein said mask is formed by rubber.
8. method according to claim 7, wherein said rubber comprise select among urethane, silicones, acryl and the polyethylene glycol any one.
9. method according to claim 1 is wherein carried out by silk screen printing, injection, point sample, spraying or their combination of using blade coating machine and is used described surface processing solution to fill the described opening of described mask.
10. method according to claim 1, the described base substrate that wherein said preparation has described connection gasket comprises:
Preparation has the substrate of the outermost layer circuit layer that comprises described connection gasket; And
Formation has the solder mask for the opening that exposes the described connection gasket on the described base substrate; And
Described surface processing solution is loaded into the described opening of described solder mask and the described opening of described mask.
After 11. method according to claim 1, this method also are included in and remove described mask, washing and dry described base substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2011-0144879 | 2011-12-28 | ||
| KR1020110144879A KR101255958B1 (en) | 2011-12-28 | 2011-12-28 | Method for manufacturing of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103188885A true CN103188885A (en) | 2013-07-03 |
Family
ID=48443382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012105553581A Pending CN103188885A (en) | 2011-12-28 | 2012-12-19 | Method for manufacturing of circuit board |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101255958B1 (en) |
| CN (1) | CN103188885A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107404809A (en) * | 2017-07-21 | 2017-11-28 | 郑州云海信息技术有限公司 | The time management and control method and system of OSP surface treatments are carried out to PCB |
| CN107820362A (en) * | 2016-09-14 | 2018-03-20 | 鹏鼎控股(深圳)股份有限公司 | Hollow out flexible circuit board and preparation method |
| CN110691459A (en) * | 2018-07-05 | 2020-01-14 | 同泰电子科技股份有限公司 | Circuit board structure for forming connecting terminal by limiting opening window through solder mask |
| CN111527593A (en) * | 2017-12-25 | 2020-08-11 | 住友电木株式会社 | Method for manufacturing electronic device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252278B (en) * | 2016-09-14 | 2018-12-07 | 河南大学 | The preparation method of metal oxide thin-film transistor array |
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| US20040087057A1 (en) * | 2002-10-30 | 2004-05-06 | Advanpack Solutions Pte. Ltd. | Method for fabricating a flip chip package with pillar bump and no flow underfill |
| CN101217134A (en) * | 2007-01-05 | 2008-07-09 | 力成科技股份有限公司 | A base plate structure and the corresponding sphere placement method of spheres array sealing |
| US20100132985A1 (en) * | 2008-11-28 | 2010-06-03 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board having metal bump and method of manufacring the same |
| US20100163287A1 (en) * | 2008-12-29 | 2010-07-01 | Lee Chih-Cheng | Substrate structure and manufacturing method thereof |
| US20100288549A1 (en) * | 2009-05-12 | 2010-11-18 | Unimicron Technology Corp. | Coreless packaging substrate and method for manufacturing the same |
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| KR100632596B1 (en) * | 2004-07-06 | 2006-10-11 | 삼성전기주식회사 | BGA package and manufacturing method thereof |
| KR100762961B1 (en) | 2006-06-07 | 2007-10-04 | 충남대학교산학협력단 | Organic solderability preservatives on solder pad for microelectronic package applications and preparation method thereof |
-
2011
- 2011-12-28 KR KR1020110144879A patent/KR101255958B1/en active IP Right Grant
-
2012
- 2012-12-19 CN CN2012105553581A patent/CN103188885A/en active Pending
Patent Citations (5)
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| US20040087057A1 (en) * | 2002-10-30 | 2004-05-06 | Advanpack Solutions Pte. Ltd. | Method for fabricating a flip chip package with pillar bump and no flow underfill |
| CN101217134A (en) * | 2007-01-05 | 2008-07-09 | 力成科技股份有限公司 | A base plate structure and the corresponding sphere placement method of spheres array sealing |
| US20100132985A1 (en) * | 2008-11-28 | 2010-06-03 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board having metal bump and method of manufacring the same |
| US20100163287A1 (en) * | 2008-12-29 | 2010-07-01 | Lee Chih-Cheng | Substrate structure and manufacturing method thereof |
| US20100288549A1 (en) * | 2009-05-12 | 2010-11-18 | Unimicron Technology Corp. | Coreless packaging substrate and method for manufacturing the same |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107820362A (en) * | 2016-09-14 | 2018-03-20 | 鹏鼎控股(深圳)股份有限公司 | Hollow out flexible circuit board and preparation method |
| CN107820362B (en) * | 2016-09-14 | 2020-07-24 | 鹏鼎控股(深圳)股份有限公司 | Hollow flexible circuit board and manufacturing method thereof |
| CN107404809A (en) * | 2017-07-21 | 2017-11-28 | 郑州云海信息技术有限公司 | The time management and control method and system of OSP surface treatments are carried out to PCB |
| CN107404809B (en) * | 2017-07-21 | 2020-03-06 | 郑州云海信息技术有限公司 | Time control method and system for OSP surface treatment of PCB |
| CN111527593A (en) * | 2017-12-25 | 2020-08-11 | 住友电木株式会社 | Method for manufacturing electronic device |
| CN111527593B (en) * | 2017-12-25 | 2021-05-04 | 住友电木株式会社 | Method for manufacturing electronic device |
| CN110691459A (en) * | 2018-07-05 | 2020-01-14 | 同泰电子科技股份有限公司 | Circuit board structure for forming connecting terminal by limiting opening window through solder mask |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101255958B1 (en) | 2013-04-23 |
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Application publication date: 20130703 |