CN103170532A - Scrap bounce prevention mold applied to punching of light-emitting diode (LED) bracket - Google Patents
Scrap bounce prevention mold applied to punching of light-emitting diode (LED) bracket Download PDFInfo
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- CN103170532A CN103170532A CN2013101208943A CN201310120894A CN103170532A CN 103170532 A CN103170532 A CN 103170532A CN 2013101208943 A CN2013101208943 A CN 2013101208943A CN 201310120894 A CN201310120894 A CN 201310120894A CN 103170532 A CN103170532 A CN 103170532A
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Abstract
The invention discloses a scrap bounce prevention mold applied to the punching of light-emitting diode (LED) bracket. The mold comprises a convex mold (1) and a concave mold (2) matched with the convex mold (1), wherein a groove (3) which is recessed into the side wall inwards and is inclined to the central line of the side wall is formed in a side wall on one side of the concave mold (2); a groove which is recessed into the side wall inwards and is inclined to the central line of the side wall is formed in a side wall opposite to the formed groove; and the inclined direction of the groove is opposite to the inclined direction of the groove in the opposite surface. The scrap bounce prevention mold has the beneficial effects of being easy to operate, low in cost, wide in application range and good in scrap bounce prevention effect; as long as the scrap bounce prevention concave mold is arranged in the mold, the function can be realized, retreatment after grinding is not required, a vacuum pump and a scrap collecting device are not required to be mounted, the production cost is reduced, and the labor efficiency is improved.
Description
Technical field
The present invention relates in the LED support die cutting die, especially the die of LED support die cutting die.
Background technology
In the high speed punch cutting mould of LED support, due to die-cut speed fast (per minute reaching more than 350 times), material thin (the thinnest 0.1mm that reaches), waste material and the restraining force between die under die-cut are less, easily cause the scrap-bounce phenomenon in the high speed punch cutting process.Because material is thin, the waste material of rebound is difficult to be detected by sensor, is easy to cause the situation that product is bad and damage mold notch.
The main cause that causes scrap-bounce is the absorption that produces of vacuum, be adsorbed onto punch cutting edge place, the absorption that fluid produces, the magnetic force of punch, the negative pressure that die compressed air causes etc.In addition, in general blade clearance, the waste material size of discharge is less than the aperture of corresponding die, so scrap-bounce easily occurs.
Consider if waste material is adsorbed onto the power of punch, the weight of the frictional force+waste material between waste material and die, just can prevent scrap-bounce, so prevent in high number is die-cut that generally scrap-bounce from mainly adopting following several method: die-cut punch is processed, such as adopting bevelled punch, the liftout punch, band pore punch etc., main purpose is to prevent from producing between waste material and punch vacuum suction; Change the die-cut contour shape of product, reduce the blade clearance, the increasing punch enters the degree of depth of die etc.But in general, mostly adopt at counterdie and adopt the vacuum attraction mode, this is the corresponding vavuum pump of necessary configuration and scrap collecting tank just, begin to consider this structure, installation exercise etc. from designing mould.But the difference in mould of pull of vacuum is difficult to adjust, and sometimes is difficult to guarantee in the position of needs, enough vacuum attractions are arranged, and controls the phenomenon of scrap-bounce.If adopt bevelled punch to prevent that the scrap-bounce effect from not being fine, also cumbersome to the sharpening again of punch; Although the liftout punch can effectively prevent scrap-bounce, but can only use on than relatively large punch, and the liftout punch again during sharpening the processing of ejector beam be also cumbersome, can only use equally on than relatively large punch with the pore punch, inapplicable for the microminiature punch of accurate punching.Therefore, solve scrap-bounce and have larger meaning.
Summary of the invention
Purpose of the present invention solves the LED support mould when die-cut exactly, produces the problem of scrap-bounce, and a kind of anti-scrap-bounce mould is provided.
For achieving the above object, the technical solution used in the present invention is: be applied to the die-cut anti-scrap-bounce mould of LED support, this mould comprises punch and the die adaptive with punch, it is characterized in that the sidewall of described die one side is provided with the groove that enters and favour the sidewall center line to concave side wall.
Adopt technique scheme, blinking scrap can form the corresponding small embossment in groove cross section with the die inclination, along with the decline of punch, if further be pressed into below die, protuberance branch is compressed by the die side, increases with die side friction power, thereby prevents scrap-bounce.
Be further to increase the anti-rebound effect, the described relative die sidewall of sidewall of offering groove is provided with the groove that enters and favour the sidewall center line to concave side wall, and the incline direction of groove is opposite with groove incline direction to the side.The inclined groove of relative direction is not with helical form, but to extending, further increases frictional force in the other direction, so can along with punch rises, not cause rotation and scrap-bounce.
In sum, beneficial effect of the present invention is: simple to operate, cost, applied widely, anti-scrap-bounce are respond well.As long as will prevent that the scrap-bounce die packs in mould, just can play a role, the processing again after not needing to grind does not again need vavuum pump and waste material collection device are installed yet, and has reduced production cost, has improved efficiency.
Description of drawings
Fig. 1 is schematic diagram of the present invention.
The specific embodiment
The invention will be further described below in conjunction with description of drawings.
As shown in Figure 1, be applied to the die-cut anti-scrap-bounce mould of LED support, this mould comprises punch 1 and the die 2 adaptive with punch 1, and the sidewall that punch 2 is relative is provided with the groove 3 that enters and favour the sidewall center line to concave side wall.Also offer the groove that enters and favour the sidewall center line to concave side wall on relative die sidewall, the incline direction of groove is opposite with groove incline direction to the side.Two grooves are close to center line gradually to downward-extension.The degree of depth of groove is greatly about 0.001 millimeter to 0.01 millimeter.The inclination size of groove is for being approximately 3 degree with the center line angulation, and it is excessive that angle is difficult for, and can produce larger frictional force.
The present invention forms the boss adaptive with groove shapes on waste material 4 when die-cut, the frictional force of boss and sidewall stops waste material 4 rebounds.The both sides boss makes the stressed opposite direction of waste material simultaneously, further prevents the rebound of waste material, has reached the effect of better anti-scrap-bounce.
Claims (2)
1. be applied to the die-cut anti-scrap-bounce mould of LED support, this mould comprises punch (1) and the die (2) adaptive with punch (1), it is characterized in that the sidewall of described die (2) one sides is provided with the groove (3) that enters and favour the sidewall center line to concave side wall.
2. the die-cut anti-scrap-bounce mould of LED support that is applied to according to claim 1, it is characterized in that the described relative sidewall of sidewall of offering groove is provided with the groove that enters and favour the sidewall center line to concave side wall, the incline direction of groove is opposite with groove incline direction to the side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101208943A CN103170532A (en) | 2013-04-09 | 2013-04-09 | Scrap bounce prevention mold applied to punching of light-emitting diode (LED) bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101208943A CN103170532A (en) | 2013-04-09 | 2013-04-09 | Scrap bounce prevention mold applied to punching of light-emitting diode (LED) bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103170532A true CN103170532A (en) | 2013-06-26 |
Family
ID=48630966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101208943A Pending CN103170532A (en) | 2013-04-09 | 2013-04-09 | Scrap bounce prevention mold applied to punching of light-emitting diode (LED) bracket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103170532A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105598253A (en) * | 2015-12-30 | 2016-05-25 | 江阴康强电子有限公司 | Lead frame die and working method thereof |
| CN109175070A (en) * | 2018-11-27 | 2019-01-11 | 济南界龙科技有限公司 | It is a kind of to prevent leftover bits and pieces from backfilling or jumping the novel blade of bits in punching press processing procedure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203140543U (en) * | 2013-04-09 | 2013-08-21 | 铜陵三佳山田科技有限公司 | Die used for preventing waste from rebounding and punching LED supporting frame |
-
2013
- 2013-04-09 CN CN2013101208943A patent/CN103170532A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203140543U (en) * | 2013-04-09 | 2013-08-21 | 铜陵三佳山田科技有限公司 | Die used for preventing waste from rebounding and punching LED supporting frame |
Non-Patent Citations (3)
| Title |
|---|
| 张桂侠等: "高速冲压中的废料回跳及预防措施", 《长江大学学报（自然科学版）理工》, vol. 9, no. 12, 31 December 2012 (2012-12-31), pages 153 * |
| 陈传胜等: "高速级进冲压中废料回跳问题的解决方案", 《锻压技术》, vol. 33, no. 2, 25 April 2008 (2008-04-25), pages 92 * |
| 陈炎嗣: "高速冲压废料上浮的原因及防止对策", 《模具制造》, no. 6, 8 June 2010 (2010-06-08), pages 33 - 34 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105598253A (en) * | 2015-12-30 | 2016-05-25 | 江阴康强电子有限公司 | Lead frame die and working method thereof |
| CN109175070A (en) * | 2018-11-27 | 2019-01-11 | 济南界龙科技有限公司 | It is a kind of to prevent leftover bits and pieces from backfilling or jumping the novel blade of bits in punching press processing procedure |
| CN109175070B (en) * | 2018-11-27 | 2024-03-29 | 济南界龙科技有限公司 | Novel cutting edge for preventing leftovers from backfilling or chip jumping in stamping process |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130626 |