CN111818732B - Flexible circuit board shaping device - Google Patents
Flexible circuit board shaping device Download PDFInfo
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- CN111818732B CN111818732B CN202010877292.2A CN202010877292A CN111818732B CN 111818732 B CN111818732 B CN 111818732B CN 202010877292 A CN202010877292 A CN 202010877292A CN 111818732 B CN111818732 B CN 111818732B
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- punching
- die
- cutter head
- cut
- movable cutter
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a flexible circuit board shaping device which comprises a punching platform and a tool bit punching driving device, wherein a plurality of separated movable tool bits arranged at intervals are stacked on the punching platform, the separated movable tool bits are arranged on the punching platform through a lower female die with a female die punching notch, and the separated movable tool bits are slidably arranged in the female die punching notch with a burr polishing component through a tool bit limiting springback component. Multilayer disconnect-type movable cutter head passes through the spacing subassembly of kick-backing of tool bit and realizes the transmission between the adjacent disconnect-type movable cutter head, it is spacing and reset, and every layer of base plate all cooperates each other through independent activity cutter and lower die and carries out die-cut, avoided the die-cut drawback that leads to the burr length of stack, and the subassembly of polishing of burr in the die-cut mouth of die resets the in-process and polishes the flexible circuit flange reason at disconnect-type movable cutter head, be favorable to simplifying of flexible circuit board production flow, thereby be favorable to further improving production efficiency.
Description
Technical Field
The invention relates to the technical field of flexible circuit board processing, in particular to a flexible circuit board shaping device.
Background
The flexible circuit board with excellent bending resistance is widely applied to various electronic products with relative movement between parts in work, such as folding mobile phones, printing heads and hard disk reading heads, so as to provide power/signal transmission.
Flexible circuit board generally includes the flexible copper-clad laminate as the base plate, and set up conducting wire and multiple electronic components on the base plate, when production processing flexible circuit board, need cut apart into the base plate of a plurality of flexible circuit board sizes with the monoblock base plate, because base plate thickness is very little, consequently, when cutting apart the monoblock base plate at present, all die-cut a plurality of fritter base plates of separating from the monoblock base plate through die-cut mode, the accessible is die-cut multilayer monoblock base plate simultaneously when die-cut mode is cut apart the monoblock base plate, thereby reply and improve die-cut machining efficiency.
However, during punching processing, burrs exist on the edges of the substrates separated by punching, and the height of the burrs is about 1-5% of the thickness of the blank, so that longer burrs are generated on the edges of the flexible circuit board when the multilayer substrates are stacked for punching, and the edges of the flexible circuit board need to be polished after punching to reduce the production and processing efficiency of the flexible circuit board in order to avoid negative influences of the burrs on product performance, attractiveness and stability.
Disclosure of Invention
The invention aims to provide a flexible circuit board shaping device, which aims to solve the technical problem that in the prior art, the production and processing efficiency of a flexible circuit board is reduced because the edge of the flexible circuit board is required to be polished due to longer burrs generated by superposition punching.
In order to solve the technical problems, the invention specifically provides the following technical scheme:
a flexible circuit board shaping device comprises a punching platform with a mounting opening penetrating through the punching platform, and a cutter head punching driving device arranged on the punching platform, wherein a plurality of overlapped separated movable cutter heads are arranged at intervals in the penetrating direction of the mounting opening, the separated movable cutter heads are arranged in the mounting opening through lower female dies, and punching channels for workpieces to be punched to pass through are formed between every two adjacent separated movable cutter heads and between every two adjacent lower female dies;
a female die punching opening matched with the separated movable tool bit on the upper layer is formed in the lower female die in a penetrating mode, a tool bit limiting and rebounding assembly used for resetting and limiting the separated movable tool bit is arranged in the female die punching opening, and the separated movable tool bit is slidably mounted in the female die punching opening through the tool bit limiting and rebounding assembly;
and a burr polishing component is arranged on the inner wall of one end of the die cutting opening of the female die, which faces the tool bit punching driving device, and the burr polishing component polishes the edge burrs of the punched workpiece on the back of the separated movable tool bit in the process that the separated movable tool bit is reset by the tool bit limiting springback component correspondingly.
As a preferable scheme of the invention, the tool bit limiting and rebounding assembly comprises a convex edge supporting part arranged on the side wall of the separated movable tool bit, a plurality of push-pull connecting rods with one ends facing to the lower female die on the same layer are arranged on the convex edge supporting part, a cavity penetrating towards the direction of the push-pull connecting rods is arranged in the lower female die, a return spring is arranged in the cavity, one end of the push-pull connecting rod penetrating through the return spring is connected with a limiting sliding block slidably arranged in the cavity, and a damping gasket sleeved on the push-pull connecting rods is arranged on the convex edge supporting part.
As a preferable mode of the invention, the burr grinding assembly comprises a profiling mounting sleeve and a grinding sheet arranged on the profiling mounting sleeve, the punched workpiece is rubbed with the grinding sheet by the separated movable cutter head which is driven to reset by the cutter head limiting and rebounding assembly to grind the edge with burrs, the profiling mounting sleeve is embedded and mounted on the inner wall of one end of the female die cutting opening opposite to the convex edge supporting part relative to the outer side of the polishing sheet, an embedded groove for installing the polishing plate is formed in the inner side of the profiling installation sleeve, the depth of the embedded groove is smaller than the thickness of the polishing plate, and a chip removal cavity is arranged in the profiling installation sleeve, a chip inlet communicated with the chip removal cavity is arranged at one side of the embedded groove in the reset direction of the separated movable tool bit, and a scrap discharging port penetrating through the lower female die and far away from one side of the cutter head punching driving device is formed in the lower female die.
As a preferable aspect of the present invention, the separated movable tool bit is partitioned by the convex edge supporting portion in the sliding direction thereof to form a back sliding portion and a blade punching portion, the back sliding portion is located at one end of the blade punching portion facing the tool bit punching drive device, the stroke lengths of the plurality of separated movable tool bits, the stroke lengths of the plurality of limit sliders, the thicknesses of the plurality of blade punching portions, and the depths of the plurality of concave die punching cuts are all increased in an arithmetic progression in a direction facing the tool bit punching drive device, and the difference of the arithmetic progression is the stroke length of the separated movable tool bit farthest from the bottom layer of the tool bit punching drive device.
As a preferable scheme of the present invention, a hemispherical pit is formed in an inner wall of a die cut of the female die, a vibration stopping spring plunger matched with the hemispherical pit is installed on an outer wall of the split type movable cutter head, a top bead at an end of the vibration stopping spring plunger slides out of the hemispherical pit along with the split type movable cutter head driven by the cutter head punching driving device, and the top bead at the end of the vibration stopping spring plunger resets into the hemispherical pit along with the split type movable cutter head reset by the cutter head limiting and rebounding assembly.
As a preferable scheme of the present invention, both ends of the punching platform are provided with substrate conveying channels communicated with the punching channels, a leading-out channel for leading out a punched workpiece from the substrate conveying channels is obliquely arranged in the punching platform, an inner wall of one side of the substrate conveying channel for supporting a workpiece to be punched is provided with an inlet communicated with the leading-out channel, and an inner contour and a size of the inlet are adapted to an outer shape of the punched workpiece.
As a preferable scheme of the present invention, a plurality of substrate conveying rollers corresponding one to one are rotatably mounted on inner walls of two opposite ends of the substrate conveying channel, a mounting sinking groove for mounting the substrate conveying roller is formed on the inner wall of the substrate conveying channel, and one side of the substrate conveying roller extends into the substrate conveying channel.
As a preferable mode of the present invention, an auxiliary separating device is installed in the lead-out channel, and a punched workpiece moving in the substrate conveying channel along with the workpiece to be punched is driven by the auxiliary separating device to be rapidly separated from the workpiece to be punched and enter the lead-out channel when passing through the lead-in opening, the auxiliary separating device includes an air blowing device installed on the punching platform, a blowing opening connected with an air outlet of the air blowing device and facing the output direction of the lead-out channel is installed in the lead-out channel, and the blowing opening is located on the side of the lead-in opening away from the outlet of the lead-out channel.
Compared with the prior art, the invention has the following beneficial effects:
according to the multi-layer separated movable cutter head, transmission, limiting and resetting between adjacent separated movable cutter heads are achieved through the cutter head limiting and rebounding assembly, each layer of separated movable cutter head is installed on the punching platform through the lower female die with the female die punching notch, the purpose that the production efficiency is improved by punching multiple layers of substrates at the same time is achieved, each layer of substrate is punched through the mutual matching of the independent movable cutter and the lower female die, and the defect that burrs are long due to overlapping punching is avoided; and the burr polishing assembly in the die-cut opening of the female die rubs the edge of the flexible circuit board punched from the separated movable tool bit in the reset process of the separated movable tool bit, so that the purpose of polishing the edge of the flexible circuit board is realized, the simplification of the production flow of the flexible circuit board is facilitated, and the production efficiency is further improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present invention;
fig. 2 is a schematic structural view of a cutter head limiting rebound assembly according to an embodiment of the invention.
The reference numerals in the drawings denote the following, respectively:
1-punching a platform; 2-a separate movable tool bit; 3-lower concave die; 4-punching a channel; 5-a bit limit rebound assembly; 6-a burr grinding component; 7-hemispherical pits; 8-stop spring plunger; 9-a substrate transport path; 10-a lead-out channel; 11-an introduction port; 12-a substrate transport roller; 13-a blower device; 14-a blowing opening;
101-a bit punching drive;
201-a blade back sliding part; 202-blade blanking;
301-die punching a cut;
501-convex edge supporting part; 502-push-pull connecting rod; 503-a return spring; 504-limit slide block; 505-damping shim;
601-profiling mounting sleeve; 602-polishing the sheet; 603-chip removal cavity; 604-a chip inlet; 605-chip removal port.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 and 2, the invention provides a flexible circuit board shaping device, which comprises a punching platform 1 with a through mounting hole, and a cutter head punching driving device 101 installed on the punching platform 1, wherein a plurality of overlapped separated movable cutter heads 2 are installed at intervals in the through direction of the mounting hole, the separated movable cutter heads 2 are installed in the mounting hole through lower female dies 3, and punching channels 4 for allowing workpieces to be punched to pass through are formed between the adjacent separated movable cutter heads 2 and the adjacent lower female dies 3;
the lower die 3 is provided with a die cutting opening 301 matched with the upper layer separated movable tool bit 2 in a penetrating manner, the die cutting opening 301 is provided with a tool bit limiting springback component 5 for resetting and limiting the separated movable tool bit 2, and the separated movable tool bit 2 is slidably mounted in the die cutting opening 301 through the tool bit limiting springback component 5.
The specific implementation mode is that a plurality of integral substrates to be punched are respectively inserted into corresponding punching channels 4, and the substrates are driven to move in the punching channels 4 in a unidirectional intermittent manner in a manual or external device driving manner, when the substrates stop each time, the blade punching part 202 of the blade punching driving device 101 located right above the separated movable blade 2 is driven to move downwards, the top layer separated movable blade 2 moves towards the bottom layer separated movable blade 2 under the driving of the blade punching driving device 101, in the process, the top layer separated movable blade 2 and the bottom die punching opening 301 are matched to punch the substrates located between the two, namely, the separated movable blade 2 punches flexible circuit boards with the same cross section as the separated movable blade 2 and the die punching opening 301 from the substrates.
And, as the blade punching part 202 of the blade punching driving device 101 continues to move downwards, the flexible circuit boards are punched one by one in the order from top to bottom by the transmission between the multiple layers of separated movable blades 2 and the cooperation with the corresponding female die punching cut 301, so that the substrates respectively positioned between the adjacent separated movable blades 2, i.e. in the punching channel 4. Then, the blade punching part 202 of the cutter head punching driving device 101 is driven to reset, so that the multilayer separated movable cutter head 2 is driven to reset by the corresponding cutter head limiting and rebounding assembly 5. At the moment, the flexible circuit board is jacked to an original punching channel 4 by a lower separated movable cutter head 2 which supports the flexible circuit board and moves upwards in a resetting manner, the flexible circuit board is filled into a corresponding notch on the substrate, then the substrate is driven to move again and drives the flexible circuit board filled into the notch to move together, and the flexible circuit board is separated from the substrate again under the action of gravity and the like when moving to the lower part without a support, so that the multilayer substrate is stacked and punched, and the flexible circuit board is led out.
Further optimized to the above embodiment, a burr polishing component 6 is installed on an inner wall of one end of the die cutting opening 301 facing the tool bit cutting driving device 101, and the burr polishing component 6 polishes edge burrs of the flexible circuit board placed on the back of the separated movable tool bit 2 in the process that the corresponding separated movable tool bit 2 is reset by the tool bit limiting springback component 5.
The separation type movable cutter head 2 moves downwards and is driven by the cutter head limiting springback component 5 to reset after punching is completed, at the moment, a punched flexible circuit board is arranged at the top of the lower separation type movable cutter head 2, namely the position of a cutter back, and is jacked to a punching channel 4 where a corresponding substrate is located along with the resetting of the lower separation type movable cutter head 2, the burr polishing component 6 installed on the inner wall of the concave die punching notch 301 utilizes the movement of the flexible circuit board in the concave die punching notch 301, and rubs the edge of the flexible circuit board at the top of the separation type movable cutter head 2 to be reset, so that the purpose of polishing the edge of the flexible circuit board is achieved, and the subsequent process of polishing the edge of the flexible circuit board is reduced.
According to the multi-layer movable cutter head punching device, the transmission, the limiting and the resetting of the adjacent separated movable cutter heads 2 are realized by the aid of the cutter head limiting and rebounding assembly 5, each layer of separated movable cutter head 2 is installed on the punching platform 1 through the lower concave die 3 with the concave die punching notch 301, when the adjacent separated movable cutter heads 2 are driven by the cutter head punching driving device 101 to move downwards together, the upper layer movable cutter and the lower layer concave die punching notch 301 are matched with each other to punch a substrate between the upper layer movable cutter and the lower layer concave die punching notch 301, namely, the purpose of punching multiple layers of substrates simultaneously to improve production efficiency is realized, each layer of substrates are punched through the cooperation of the independent movable cutter and the lower concave die 3 with the concave die punching notch 301, and the defect that the edges of the substrates are more and larger burrs are generated after the multiple layers of substrates are directly overlapped is avoided.
And, burr grinding component 6 takes place the friction with the flexible circuit board edge that the die-cut got off on disconnect-type activity tool bit 2 in the die-cut mouth 301 of die resets in-process with disconnect-type activity tool bit 2 to the realization is polished the purpose to flexible circuit board edge, has further reduced the burr at the flexible circuit board edge of die-cut production, is favorable to simplifying of flexible circuit board production procedure, thereby is favorable to further improving production efficiency.
The tool bit limiting resilience assembly 5 comprises a convex edge supporting part 501 arranged on the side wall of the separated movable tool bit 2, a plurality of push-pull connecting rods 502 with one ends facing to the lower female die 3 on the same layer are arranged on the convex edge supporting part 501, a cavity penetrating towards the direction of the push-pull connecting rods 502 is formed in the lower female die 3, a reset spring 503 is arranged in the cavity, one end, penetrating through the reset spring 503, of each push-pull connecting rod 502 is connected with a limiting sliding block 504 slidably arranged in the cavity, and a damping gasket 505 sleeved on the push-pull connecting rods 502 is arranged on the convex edge.
When the separated movable tool bit 2 is driven to move towards the lower female die 3, the separated movable tool bit 2 sequentially passes through the convex edge supporting part 501 and the push-pull connecting rod 502 to drive the limiting slide block 504 in the cavity of the lower female die 3 on the same layer to move downwards and compress the reset spring 503, after the stamping part of the stamping device is reset, the stamping device stops pressing the plurality of separated movable tool bits 2, the compressed reset spring 503 sequentially passes through the limiting slide block 504, the push-pull connecting rod 502 and the convex edge supporting part 501 to push the movable cutter on the same layer to move upwards until the damping gasket 505 at the top of the convex edge supporting part 501 abuts against the bottom of the lower female die 3 on the same layer to stop the movable cutter, so that the movable cutter is reset and stopped to prepare for next stamping.
The convex edge supporting portion 501 is a convex edge protruding from the side wall of the separate movable tool bit 2 and integrally formed with the separate movable tool bit 2, the contour of the convex edge supporting portion 501 is set according to the cross section contour of the separate movable tool bit 2, namely, the flexible circuit board, that is, the push-pull connecting rods 502 are uniformly arranged along the contour of the separate movable tool bit 2, which is beneficial to balancing the thrust of the reset springs 503 on the edge of the separate movable tool bit 2 when the separate movable tool bit 2 is reset, so that the phenomenon that the separate movable tool bit 2 is jammed or even stuck in the die cutting opening 301 during the reset process of the female die is avoided.
Wherein, burr grinding assembly 6 includes profile modeling installation cover 601 and installs the piece of polishing 602 on profile modeling installation cover 601, the flexible line way board is through being rubbed with the piece of polishing 602 by the spacing disconnect-type activity tool bit 2 that kick-backs subassembly 5 drive resets and is polished in order to having the edge of burr, profile modeling installation cover 601 is installed on the inner wall of die cutting mouth 301 for chimb supporting part 501 one end for the outside embedding of piece of polishing 602, the embedded groove that is used for installing piece of polishing 602 is seted up to profile modeling installation cover 601's inboard, the degree of depth of embedded groove is less than the thickness of piece of polishing 602, and seted up chip removal chamber 603 in the profile modeling installation cover 601, the embedded groove is located one side that disconnect-type activity tool bit 2 reset direction and is provided with the entering bits mouth 604 that is linked together with chip removal chamber 603, set up on the lower die 3 and run through its chip removal mouth 605 of keeping.
The profiling mounting sleeve 601 is embedded in the inner wall of the die cutting opening 301 of the female die, the profile of the profiling mounting sleeve 601 is matched with the profile of the punching knife and the profile of the flexible circuit board, the rough polishing surface of the polishing piece 602 faces to one side of the separated movable tool bit 2, the polishing piece 602 and the profiling mounting sleeve 601 are arranged in the top end of the die cutting opening 301 of the female die, when the edge of the punched flexible circuit board passes through the polishing piece 602, the edge of the flexible circuit board rubs against the polishing piece 602, and therefore the purpose of automatically polishing burrs on the edge of the flexible circuit board after punching is completed is achieved. And the chips generated at the edge of the flexible circuit board during the polishing process enter the chip removal cavity 603 which is obliquely and downwardly arranged from the chip inlet 604 when the flexible circuit board passes through the chip inlet 604 and are discharged from the chip removal port 605 at the bottom of the chip removal cavity 603, the specific position of the chip removal port 605 is adjusted according to actual requirements, and in order to promote the chips to rapidly enter the chip removal cavity 603, a negative pressure suction device such as a negative pressure fan and the like can be arranged at the chip removal cavity 603 or the chip removal port 605, so that the chips are discharged, the chips are prevented from entering the gap between the separating movable cutter head 2 and the die cutting port 301 of the female die, and the service life and the performance of the separating movable cutter head 2 are prolonged.
When punching, because need step by step contact and transmission between disconnect-type movable tool bit 2, upper strata disconnect-type movable tool bit 2 need promote lower floor disconnect-type movable tool bit 2 and slide downwards in lower floor die punching cut 301 promptly, thereby make upper strata disconnect-type movable tool bit 2 promote lower floor disconnect-type movable tool bit 2 and punch at the in-process of punching, consequently, realize that multilayer disconnect-type movable tool bit 2 all can realize die-cut function, and make the thickness of 2 thickness of disconnect-type movable tool bit and multilayer die-cutting minimum, it is to further optimize above-mentioned embodiment:
the separated movable tool bit 2 is provided with a back sliding part 201 and a blade punching part 202 in a separating manner through a convex edge supporting part 501 in the sliding direction, the back sliding part 201 is positioned at one end of the blade punching part 202 facing the tool bit punching driving device 101, the stroke lengths of the plurality of separated movable tool bits 2, the stroke lengths of the plurality of limit sliders 504, the thicknesses of the plurality of blade punching parts 202 and the depths of the plurality of concave die punching cuts 301 in the direction facing the tool bit punching driving device 101 are all increased in an arithmetic progression, and the difference of the arithmetic progression is the stroke length of the bottom layer separated movable tool bit 2 farthest from the tool bit punching driving device 101.
And, for making quick reciprocating motion's disconnect-type movable cutter head 2 can stabilize a little fast after reseing, hemispherical pit 7 has been seted up on die-cut mouthful 301 inner wall of die, install on the disconnect-type movable cutter head 2 outer wall with hemispherical pit 7 matched with end spring plunger 8 that shakes, the ball-ejecting of end spring plunger 8 that ends that stops shakes is along with the disconnect-type movable cutter head 2 that is driven through by the die-cut drive arrangement 101 of tool bit from hemispherical pit 7 roll-off, and the ball-ejecting of end spring plunger 8 that stops shakes is along with the disconnect-type movable cutter head 2 that is reseed by the spacing resilience subassembly 5 of tool bit and resets to hemispherical pit 7 in.
After the separated movable tool bit 2 is reset, the top ball at the end of the vibration stopping spring plunger 8 is clamped into the corresponding hemispherical pit 7 on the inner wall of the concave die punching cut 301 under the pushing of the spring inside the separated movable tool bit, so that the separated movable tool bit 2 is quickly stopped, and the phenomenon that the punching effect is reduced and the service life and the stability of the device are negatively influenced due to severe shaking of the separated movable tool bit 2 in the quick reciprocating motion process is avoided. And the top ball clamped in the hemispherical pit 7 slides out of the hemispherical pit 7 against resistance under the action of the thrust of the ball-pushing device and moves downwards.
In addition, in order to lead out the flexible circuit board punched and separated in the multilayer punching channel 4, the invention also has the following embodiment:
the two ends of the punching platform 1 are respectively provided with a substrate conveying channel 9 communicated with the punching channel 4, a leading-out channel 10 used for leading the flexible circuit board out of the substrate conveying channel 9 is obliquely arranged in the punching platform 1, the substrate conveying channel 9 is used for supporting an inner wall of one side of the substrate and is provided with a leading-in port 11 communicated with the leading-out channel 10, and the inner contour and the size of the leading-in port 11 are adapted to the appearance of the flexible circuit board.
When the punched and separated flexible circuit boards are filled into gaps left on the substrate after punching along with the reset separated movable cutter head 2, the substrate is conveyed and drives the flexible circuit boards to move towards the substrate conveying channel 9 together, and when the flexible circuit boards move to the position above the introducing port 11, the flexible circuit boards fall into the leading-out channel 10 from the introducing port 11 due to the fact that the support of the inner wall of the bottom of the substrate conveying channel 9 is lost, the leading-out channel 10 is obliquely and downwards arranged relative to the outlet end of the introducing port 11, so that the flexible circuit boards in the leading-out channel 10 slide out along the leading-out channel 10 with the smooth inner wall under the action of self gravity, the flexible circuit boards punched and separated by each layer of substrates are respectively led out from the leading-out channel 10, and the flexible circuit boards are.
It is further optimized in the above embodiment that the two ends of the adjacent lower female dies 3 are both provided with the driven substrate conveying rollers 12, the substrate conveying rollers 12 on the adjacent lower female dies 3 are in one-to-one correspondence and are arranged in a positive opposite manner, and the mounting sinking grooves for the substrate conveying rollers 12 to rotate and be loaded are formed in the positive opposite sides of the adjacent lower female dies 3.
The gaps between the plurality of substrate conveying rollers 12 which are just opposite on the adjacent lower female die 3 are not larger than the thickness of the substrate, so that the substrate can move in the substrate conveying channel 9 and the punching channel 4 in a single direction under the conveying of the plurality of substrate conveying rollers 12, and the substrate conveying rollers 12 are driven intermittently, namely, the substrate conveying rollers 12 stop when the separated movable cutter head 2 performs punching, and rotate again after the movable cutter is reset until the notch on the substrate and the flexible circuit board in the notch leave the position above the female die punching notch 301, and then the substrate conveying rollers 12 stop again to match the punching action of the separated movable cutter head 2.
It is further optimized in the above embodiment that an auxiliary separating device is installed in the guiding-out channel 10, the flexible circuit board moving along with the substrate in the substrate conveying channel 9 is driven by the auxiliary separating device to be rapidly separated from the substrate when passing through the guiding-in opening 11 and enters the guiding-out channel 10, the auxiliary separating device comprises an air blowing device 13 installed on the punching platform 1, a blowing opening 14 connected with an air outlet of the air blowing device 13 and facing the output direction of the guiding-out channel 10 is installed in the guiding-out channel 10, and the blowing opening 14 is located on the side of the guiding-in opening 11 far away from the outlet of the guiding-out channel 10.
The blowing opening 14 is located below the introducing opening 11 and is far away from one side of the outlet of the guiding-out channel 10, after the air blowing device 13 blows air out through the blowing opening 14, negative pressure is generated in the guiding-out channel 10 due to rapid air flow, so that the flexible circuit board passing through the upper portion of the introducing opening 11 is sucked into the guiding-out channel 10 under the action of the negative pressure and moves towards the outlet of the guiding-out channel 10 along with the air flow in the guiding-out channel 10, the flexible circuit board passing through the introducing opening 11 can successfully and rapidly fall into the guiding-out channel 10, the conveying speed of the substrate is favorably improved, the production efficiency is further improved, and the problem that the flexible circuit board cannot be smoothly guided out due to the fact that the light and thin flexible circuit board is adsorbed on the inner wall of the guiding-out channel 10 under the.
The above embodiments are only exemplary embodiments of the present application, and are not intended to limit the present application, and the protection scope of the present application is defined by the claims. Various modifications and equivalents may be made by those skilled in the art within the spirit and scope of the present application and such modifications and equivalents should also be considered to be within the scope of the present application.
Claims (8)
1. The utility model provides a flexible line way board shaping device which characterized in that: the punching device comprises a punching platform (1) with a through mounting opening and a cutter head punching driving device (101) arranged on the punching platform (1), wherein a plurality of overlapped separated movable cutter heads (2) are arranged at intervals in the through direction of the mounting opening, the separated movable cutter heads (2) are arranged in the mounting opening through lower female dies (3), and punching channels (4) for allowing workpieces to be punched to pass through are formed between every two adjacent separated movable cutter heads (2) and every two adjacent lower female dies (3);
a concave die punching cut (301) matched with the separated movable cutter head (2) on the upper layer is formed in the lower concave die (3) in a penetrating mode, a cutter head limiting and rebounding assembly (5) used for resetting and limiting the separated movable cutter head (2) is arranged in the concave die punching cut (301), and the separated movable cutter head (2) is installed in the concave die punching cut (301) in a sliding mode through the cutter head limiting and rebounding assembly (5);
the concave die punching cut (301) faces towards a burr grinding component (6) is installed on the inner wall of one end of the cutter head punching driving device (101), and the burr grinding component (6) corresponds to the process that the separated movable cutter head (2) is reset by the cutter head limiting rebound component (5) and is opposite to the punched workpiece on the back of the separated movable cutter head (2) to grind edge burrs.
2. The flexible wiring board shaping device of claim 1, wherein: the tool bit limiting resilience assembly (5) comprises a convex edge supporting part (501) arranged on the side wall of the separated movable tool bit (2), one end of the convex edge supporting part (501) faces to the same layer, a plurality of push-pull connecting rods (502) of the lower female die (3) are arranged in the lower female die (3), the direction of the concave edge supporting part is towards a cavity penetrating through the push-pull connecting rods (502), a reset spring (503) is arranged in the cavity, the push-pull connecting rods (502) penetrate through one end of the reset spring (503) and is connected with a limiting sliding block (504) arranged in the cavity in a sliding mode, and the supporting part convex edge (501) is provided with a damping gasket (505) arranged on the push-pull connecting rods.
3. The flexible wiring board shaping device of claim 2, wherein: burr subassembly (6) of polishing are including profile modeling installation cover (601) and install polishing blade (602) on profile modeling installation cover (601), die-cut work piece has been through quilt the spacing resilience subassembly of tool bit (5) drive resets disconnect-type activity tool bit (2) with polishing blade (602) are rubbed and are polished in order to having the edge of burr, profile modeling installation cover (601) for the outside embedding of polishing blade (602) is installed die-cut (301) for on the inner wall of chimb supporting part (501) one end, the embedded groove that is used for the installation has been seted up to the inboard of profile modeling installation cover (601) the embedded groove of polishing blade (602), the degree of depth of embedded groove is less than the thickness of polishing blade (602), just seted up chip removal chamber (603) in profile modeling installation cover (601), the embedded groove is located one side of disconnect-type activity tool bit (2) direction of resetting is provided with the chip removal chamber (603) is linked together into The lower female die (3) is provided with a chip removal port (605) which penetrates through the lower female die and is far away from one side of the cutter head punching driving device (101).
4. The flexible wiring board shaping device of claim 2, wherein: the utility model discloses a die-cut structure of a knife edge, including cutting edge support portion (501), separated movable cutter head (2) passes through in its sliding direction chimb support portion (501) separation is formed with back of a knife sliding portion (201) and the die-cut portion of cutting edge (202), back of a knife sliding portion (201) is located the die-cut portion of cutting edge (202) orientation the die-cut drive arrangement's of cutter head (101) one end, the orientation die-cut drive arrangement of cutter head (101) is upwards a plurality of the stroke length of separated movable cutter head (2), a plurality of the stroke length of spacing slider (504), a plurality of the die-cut portion of cutting edge (202) thickness and a plurality of the degree of depth of die-cut (301) all is the arithmetic progression, just the difference of arithmetic progression is for keeping away from die-cut drive arrangement (101) bottom the stroke length of separated movable cutter head (2).
5. The flexible wiring board shaping device of claim 4, wherein: hemispherical pits (7) are formed in the inner wall of the concave die punching notch (301), the outer wall of the separated movable cutter head (2) is provided with a vibration stopping spring plunger (8) matched with the hemispherical pits (7), the top ball at the end part of the vibration stopping spring plunger (8) passes through the cutter head punching driving device (101) to drive the separated movable cutter head (2) to slide out of the hemispherical pits (7), and the top ball at the end part of the vibration stopping spring plunger (8) is reset by the cutter head limiting springback component (5) to reset the separated movable cutter head (2) into the hemispherical pits (7).
6. The flexible wiring board shaping device of claim 1, wherein: the base plate conveying channel (9) communicated with the punching channel (4) is formed in each of two ends of the punching platform (1), a leading-out channel (10) used for leading out punched workpieces from the base plate conveying channel (9) is obliquely arranged in the punching platform (1), the base plate conveying channel (9) is used for supporting an introducing port (11) communicated with the leading-out channel (10) and formed in the inner wall of one side of each workpiece to be punched, and the inner contour and the size of the introducing port (11) are adapted to the appearance of the punched workpieces.
7. The flexible wiring board shaping device of claim 6, wherein: the substrate conveying device is characterized in that a plurality of one-to-one corresponding substrate conveying rollers (12) are rotatably mounted on the inner walls of the two opposite ends of the substrate conveying channel (9), mounting sinking grooves for mounting the substrate conveying rollers (12) are formed in the inner wall of the substrate conveying channel (9), and one side of each substrate conveying roller (12) extends into the substrate conveying channel (9).
8. The flexible wiring board shaping device of claim 6, wherein: the auxiliary separation device is installed in the guide-out channel (10), punched workpieces moving in the substrate conveying channel (9) along with the to-be-punched workpieces are driven by the auxiliary separation device to be rapidly separated from the to-be-punched workpieces and enter the guide-out channel (10) when passing through the guide-in opening (11), the auxiliary separation device comprises a blowing device (13) installed on the punching platform (1), a blowing opening (14) connected with an air outlet of the blowing device (13) and facing the output direction of the guide-out channel (10) is installed in the guide-out channel (10), and the blowing opening (14) is located on one side, far away from the outlet of the guide-out channel (10), of the guide-in opening (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010877292.2A CN111818732B (en) | 2020-08-27 | 2020-08-27 | Flexible circuit board shaping device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010877292.2A CN111818732B (en) | 2020-08-27 | 2020-08-27 | Flexible circuit board shaping device |
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| CN111818732A CN111818732A (en) | 2020-10-23 |
| CN111818732B true CN111818732B (en) | 2021-03-23 |
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| CN202010877292.2A Expired - Fee Related CN111818732B (en) | 2020-08-27 | 2020-08-27 | Flexible circuit board shaping device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114986188B (en) * | 2022-07-29 | 2022-10-25 | 福建盈浩文化创意股份有限公司 | Raw material metal plate cutting equipment for frame production |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0423651A1 (en) * | 1989-10-20 | 1991-04-24 | Kobe Properties Limited | Method for manufacturing a circuit configuration, and circuit configuration on a carrier foil |
| CN207612473U (en) * | 2017-12-21 | 2018-07-13 | 惠州大亚湾双益达电路板科技有限公司 | A kind of numerical control gong machine made for pcb board |
| CN210878951U (en) * | 2019-10-12 | 2020-06-30 | 河北科成电路板有限公司 | Deburring device for machining of LED flexible circuit board |
-
2020
- 2020-08-27 CN CN202010877292.2A patent/CN111818732B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0423651A1 (en) * | 1989-10-20 | 1991-04-24 | Kobe Properties Limited | Method for manufacturing a circuit configuration, and circuit configuration on a carrier foil |
| CN207612473U (en) * | 2017-12-21 | 2018-07-13 | 惠州大亚湾双益达电路板科技有限公司 | A kind of numerical control gong machine made for pcb board |
| CN210878951U (en) * | 2019-10-12 | 2020-06-30 | 河北科成电路板有限公司 | Deburring device for machining of LED flexible circuit board |
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| CN111818732A (en) | 2020-10-23 |
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