CN103165376A - 一种等离子体浸没注入装置 - Google Patents
一种等离子体浸没注入装置 Download PDFInfo
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- CN103165376A CN103165376A CN2011104124404A CN201110412440A CN103165376A CN 103165376 A CN103165376 A CN 103165376A CN 2011104124404 A CN2011104124404 A CN 2011104124404A CN 201110412440 A CN201110412440 A CN 201110412440A CN 103165376 A CN103165376 A CN 103165376A
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- injecting
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- injection
- injecting chamber
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- 238000002347 injection Methods 0.000 title claims abstract description 28
- 239000007924 injection Substances 0.000 title claims abstract description 28
- 238000007654 immersion Methods 0.000 title claims abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims description 36
- 238000002513 implantation Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 16
- 239000007789 gas Substances 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- 230000005284 excitation Effects 0.000 claims description 3
- 239000001307 helium Substances 0.000 claims description 3
- 229910052734 helium Inorganic materials 0.000 claims description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical group [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 22
- 230000000694 effects Effects 0.000 abstract description 14
- 238000005516 engineering process Methods 0.000 abstract description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- 239000001301 oxygen Substances 0.000 abstract description 4
- 229910052760 oxygen Inorganic materials 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 230000006378 damage Effects 0.000 abstract description 2
- 238000004891 communication Methods 0.000 abstract 1
- 238000005086 pumping Methods 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 238000004904 shortening Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 3
- 238000010884 ion-beam technique Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
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Priority Applications (1)
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CN201110412440.4A CN103165376B (zh) | 2011-12-12 | 2011-12-12 | 一种等离子体浸没注入装置 |
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CN201110412440.4A CN103165376B (zh) | 2011-12-12 | 2011-12-12 | 一种等离子体浸没注入装置 |
Publications (2)
Publication Number | Publication Date |
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CN103165376A true CN103165376A (zh) | 2013-06-19 |
CN103165376B CN103165376B (zh) | 2016-09-14 |
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CN201110412440.4A Active CN103165376B (zh) | 2011-12-12 | 2011-12-12 | 一种等离子体浸没注入装置 |
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CN (1) | CN103165376B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110581048A (zh) * | 2018-06-07 | 2019-12-17 | 长鑫存储技术有限公司 | 提高等离子体离子注入机机台产能的方法及设备 |
CN111063458A (zh) * | 2019-12-25 | 2020-04-24 | 中国科学院合肥物质科学研究院 | 一种精确标定等离子体注入杂质的装置及方法 |
CN113832442A (zh) * | 2021-09-23 | 2021-12-24 | 哈尔滨工业大学 | 带准备室直线或交叉传递工件等离子体源离子注入机 |
Citations (10)
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EP0559360A1 (en) * | 1992-03-05 | 1993-09-08 | Eaton Corporation | End station for a parallel beam ion implanter |
CN1881532A (zh) * | 1993-11-05 | 2006-12-20 | 株式会社半导体能源研究所 | 一种制造薄膜晶体管和电子器件的方法 |
CN1900359A (zh) * | 2005-07-19 | 2007-01-24 | 应用材料股份有限公司 | Pvd-cvd混合系统 |
CN2867585Y (zh) * | 2005-12-05 | 2007-02-07 | 北京中科信电子装备有限公司 | 离子注入机晶圆传送控制系统 |
CN101463471A (zh) * | 2009-01-12 | 2009-06-24 | 浙江嘉远格隆能源股份有限公司 | 一种连续化薄膜真空沉积方法及装置 |
CN101469414A (zh) * | 2007-12-26 | 2009-07-01 | 中国科学院微电子研究所 | 平板式等离子体增强化学汽相淀积设备的反应室结构 |
CN101922046A (zh) * | 2010-09-01 | 2010-12-22 | 中国科学院微电子研究所 | 一种等离子体浸没注入装置 |
CN101964319A (zh) * | 2010-08-04 | 2011-02-02 | 清华大学 | 离子注入机晶圆传送系统及晶圆传送方法 |
CN201785482U (zh) * | 2010-06-25 | 2011-04-06 | 中国科学院微电子研究所 | 等离子体浸没离子注入设备 |
CN201785483U (zh) * | 2010-07-05 | 2011-04-06 | 中国科学院微电子研究所 | 一种等离子体浸没离子注入系统 |
-
2011
- 2011-12-12 CN CN201110412440.4A patent/CN103165376B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0559360A1 (en) * | 1992-03-05 | 1993-09-08 | Eaton Corporation | End station for a parallel beam ion implanter |
CN1881532A (zh) * | 1993-11-05 | 2006-12-20 | 株式会社半导体能源研究所 | 一种制造薄膜晶体管和电子器件的方法 |
CN1900359A (zh) * | 2005-07-19 | 2007-01-24 | 应用材料股份有限公司 | Pvd-cvd混合系统 |
CN2867585Y (zh) * | 2005-12-05 | 2007-02-07 | 北京中科信电子装备有限公司 | 离子注入机晶圆传送控制系统 |
CN101469414A (zh) * | 2007-12-26 | 2009-07-01 | 中国科学院微电子研究所 | 平板式等离子体增强化学汽相淀积设备的反应室结构 |
CN101463471A (zh) * | 2009-01-12 | 2009-06-24 | 浙江嘉远格隆能源股份有限公司 | 一种连续化薄膜真空沉积方法及装置 |
CN201785482U (zh) * | 2010-06-25 | 2011-04-06 | 中国科学院微电子研究所 | 等离子体浸没离子注入设备 |
CN201785483U (zh) * | 2010-07-05 | 2011-04-06 | 中国科学院微电子研究所 | 一种等离子体浸没离子注入系统 |
CN101964319A (zh) * | 2010-08-04 | 2011-02-02 | 清华大学 | 离子注入机晶圆传送系统及晶圆传送方法 |
CN101922046A (zh) * | 2010-09-01 | 2010-12-22 | 中国科学院微电子研究所 | 一种等离子体浸没注入装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110581048A (zh) * | 2018-06-07 | 2019-12-17 | 长鑫存储技术有限公司 | 提高等离子体离子注入机机台产能的方法及设备 |
CN110581048B (zh) * | 2018-06-07 | 2024-05-14 | 长鑫存储技术有限公司 | 提高等离子体离子注入机机台产能的方法及设备 |
CN111063458A (zh) * | 2019-12-25 | 2020-04-24 | 中国科学院合肥物质科学研究院 | 一种精确标定等离子体注入杂质的装置及方法 |
CN111063458B (zh) * | 2019-12-25 | 2022-08-16 | 中国科学院合肥物质科学研究院 | 一种精确标定等离子体注入杂质的装置及方法 |
CN113832442A (zh) * | 2021-09-23 | 2021-12-24 | 哈尔滨工业大学 | 带准备室直线或交叉传递工件等离子体源离子注入机 |
Also Published As
Publication number | Publication date |
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CN103165376B (zh) | 2016-09-14 |
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Effective date of registration: 20190529 Address after: Room 820, 8th Floor, Building 1, 13 Guocheng Road, Shunqing District, Nanchong City, Sichuan Province Patentee after: Zhongke Jiuwei Technology Co.,Ltd. Address before: No. 3, North Tu Cheng West Road, Chaoyang District, Beijing Patentee before: Institute of Microelectronics, Chinese Academy of Sciences |
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Denomination of invention: A plasma immersion injection device Effective date of registration: 20210129 Granted publication date: 20160914 Pledgee: Sichuan Xichong rural commercial bank Limited by Share Ltd. Pledgor: Zhongke Jiuwei Technology Co.,Ltd. Registration number: Y2021980000875 |
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Date of cancellation: 20231227 Granted publication date: 20160914 Pledgee: Sichuan Xichong rural commercial bank Limited by Share Ltd. Pledgor: Zhongke Jiuwei Technology Co.,Ltd. Registration number: Y2021980000875 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A plasma immersion injection device Effective date of registration: 20231229 Granted publication date: 20160914 Pledgee: Sichuan Xichong rural commercial bank Limited by Share Ltd. Pledgor: Zhongke Jiuwei Technology Co.,Ltd. Registration number: Y2023980075671 |
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