CN103160889A - Preplating copper electroplating solution - Google Patents
Preplating copper electroplating solution Download PDFInfo
- Publication number
- CN103160889A CN103160889A CN 201110423949 CN201110423949A CN103160889A CN 103160889 A CN103160889 A CN 103160889A CN 201110423949 CN201110423949 CN 201110423949 CN 201110423949 A CN201110423949 A CN 201110423949A CN 103160889 A CN103160889 A CN 103160889A
- Authority
- CN
- China
- Prior art keywords
- electroplating solution
- copper electroplating
- preplating copper
- copper facing
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a preplating copper electroplating solution which is characterized by comprising the components, by weight, of CuCN 20%-30%, NaCN 25%-40%, sodium potassium tartrate tetrahydrate 20%-30%, brightening agents 1%-1.5%, and binding agents 0.5%-1%. The brightening agents are SNR-5A, and the binding agents are propargyl alcohol. The preplating copper electroplating solution is reasonable in formula, does not have harmful gases separated out in the production, and is environment-friendly through adoption of a cyanide-free formula, and stable in performance.
Description
Technical field
The invention belongs to fine chemical technology field, metallic surface, be specifically related to a kind of pre-copper facing electroplating solution.
Background technology
Metalwork needs pre-copper facing to improve bonding strength and the surface smoothness of copper plate before copper facing, and pre-copper plating solution directly affects the quality and performance of product, present pre-copper plating solution poor stability wastewater treatment difficulty.
Summary of the invention
The object of the present invention is to provide a kind of formula reasonable, the simple environmental protection of wastewater treatment, the pre-copper facing electroplating solution that plating solution performance is stable.
Technical solution of the present invention is:
A kind of pre-copper facing electroplating solution is characterized in that each composition is by weight percentage: CuCN20-30%, NaCN25-40%, Na
2CO
315-25%, Seignette salt 20-30%, brightening agent 1-1.5%, wedding agent 0.5-1%.
Described brightening agent is: SNR-5A, wedding agent is: propargyl alcohol.
The present invention fills a prescription rationally, separates out without obnoxious flavour in production, adopts without the environment friendly and pollution-free stable performance of cyanogen formula.
Embodiment:
Embodiment 1
Be used for the pre-copper facing electroplating solution of electronic pure aluminum steel, each composition is by weight percentage: CuCN20-30%, NaCN25-40%, Na
2CO
315-25%, Seignette salt 20-30%, brightening agent 1-1.5%, wedding agent 0.5-1%.Processing condition are: the copper plating bath temperature is controlled at 50-60 ° of C, current density 1.5-2A/dm2, time 30S.
Claims (2)
1. a pre-copper facing electroplating solution, is characterized in that each composition is by weight percentage: CuCN20-30%, NaCN25-40%, Na
2CO
315-25%, Seignette salt 20-30%, brightening agent 1-1.5%, wedding agent 0.5-1%.
2. a kind of pre-copper facing electroplating solution according to claim 1, it is characterized in that described brightening agent is: SNR-5A, wedding agent is: propargyl alcohol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110423949 CN103160889A (en) | 2011-12-19 | 2011-12-19 | Preplating copper electroplating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110423949 CN103160889A (en) | 2011-12-19 | 2011-12-19 | Preplating copper electroplating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103160889A true CN103160889A (en) | 2013-06-19 |
Family
ID=48584409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110423949 Pending CN103160889A (en) | 2011-12-19 | 2011-12-19 | Preplating copper electroplating solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103160889A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103882486A (en) * | 2014-03-10 | 2014-06-25 | 苏州捷德瑞精密机械有限公司 | Archaistic bronze electroplating solution as well as preparation method and application thereof |
-
2011
- 2011-12-19 CN CN 201110423949 patent/CN103160889A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103882486A (en) * | 2014-03-10 | 2014-06-25 | 苏州捷德瑞精密机械有限公司 | Archaistic bronze electroplating solution as well as preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102817056B (en) | Electroplating process for lead wire frame palladium-nickel alloy plating layer | |
| TWI475134B (en) | Pd and pd-ni electrolyte baths | |
| MX2013001838A (en) | Process for the electroless copper plating of metallic substrates | |
| MY153418A (en) | Tin electrolytic plating solution for electronic parts, tin electroplated electronic parts and circuit board comprising tin electroplated electronic parts | |
| CN101275255A (en) | Maintenance method for alkaline non-cyanide plating copper | |
| CN106498467B (en) | A kind of preparation method of ultra-thin carrier copper foil that stablizing stripping | |
| EP2626449A3 (en) | Plating bath and method | |
| JP2007536725A5 (en) | ||
| CN104195603A (en) | Surface gold plating method of diamond and copper composite material | |
| CN101724845A (en) | Method for electroplating zinc-nickel alloy on sintered neodymium-iron-boron material | |
| CN106757195A (en) | A kind of process for protecting surface of high activity concrete dynamic modulus class material | |
| JP2016518530A5 (en) | ||
| CN103160889A (en) | Preplating copper electroplating solution | |
| CN103726051A (en) | Plating technology for surface treatment of engineering plastic | |
| CN100362141C (en) | Propanetriol non-cyanide bright copper plating liquid | |
| CN103173818A (en) | Environment-friendly silver electroplating technique | |
| CN103173817A (en) | Environmental-friendly electrosilvering solution | |
| CN103173750A (en) | Chemical copper plating solution | |
| CN104911653A (en) | Alloy electroplating liquid | |
| JP4561149B2 (en) | Alloy electrode for hydrogen generation and method for producing the same | |
| JP2015168844A (en) | Method for manufacturing non-cyanide gold salt for gold plating | |
| CN103806050A (en) | Cyanide-free copper electroplating method for reducing porosity of copper plating layer | |
| CN103160870A (en) | Tinning solution stabilizer | |
| CN103160817A (en) | Chemical copper plating solution | |
| CN105455321B (en) | A kind of Zinc alloy slide fastener sprocket |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130619 |