CN103173750A - Chemical copper plating solution - Google Patents
Chemical copper plating solution Download PDFInfo
- Publication number
- CN103173750A CN103173750A CN 201110438346 CN201110438346A CN103173750A CN 103173750 A CN103173750 A CN 103173750A CN 201110438346 CN201110438346 CN 201110438346 CN 201110438346 A CN201110438346 A CN 201110438346A CN 103173750 A CN103173750 A CN 103173750A
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- China
- Prior art keywords
- plating solution
- copper plating
- sodium
- chemical copper
- sulfate
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Abstract
The invention discloses a chemical copper plating solution which comprises 10-20 g/L copper sulfate, 5-10 g/L potassium nitrate, 5-30 g/L potassium sodium tartrate, 5-30 g/L sodium ethylene diamine tetracetate, 5-50 g/L sodium hydroxide, 5-20 g/L sodium carbonate, 0.5-2 g/L ferrous sulfate, 5-50 g/L formaldehyde, 5-50 g/L methanol and the balance of deionized water. The invention has the advantages of reasonable formula, high stability, fewer impurities, high speed and high efficiency; and the coating thickness can reach higher than 20 mu m.
Description
Technical field
The invention belongs to the electroless copper technical field, be specifically related to a kind of chemical copper plating solution.
Background technology
Electro-coppering is a kind of copper electroplating method that we commonly use at present, be applicable to wire rod, sheet material, tubing and fly metallic surface, electroless copper has energy-conservation, can plate micro devices and particularly use at present increasing circuit card, but bath stability is poor, the even void that even exists of uneven coating is plated, and is difficult to satisfy production requirement.
Summary of the invention
The object of the present invention is to provide a kind of formula reasonable, bath stability is long duration of service, the uniform chemical copper plating solution of coating.
Technical solution of the present invention is:
A kind of chemical copper plating solution, it is characterized in that: by following composition be by weight ratio copper sulfate 10-20g/L, saltpetre 5-10g/L, Seignette salt 5-30g/L, sodium ethylene diamine tetracetate 5-30g/L, sodium hydroxide 5-50g/L, sodium carbonate 5-20g/L, ferrous sulfate 0.5-2g/L, formaldehyde 5-50g/L, methyl alcohol 5-50g/L, surplus deionized water.
The present invention fills a prescription rationally, and the good impurity of bath stability is few, and more than thickness of coating can reach 20 μ m, the fast efficient of speed was high.
Embodiment:
Embodiment 1
A kind of chemical copper plating solution by following composition is copper sulfate 10g/L by weight ratio, saltpetre 5g/L, Seignette salt 10g/L, sodium ethylene diamine tetracetate 10g/L, sodium hydroxide 20g/L, sodium carbonate 5g/L, ferrous sulfate 1g/L, formaldehyde 10g/L, methyl alcohol 20g/L, fully mix with the deionized water of surplus, bath temperature is controlled at 40 ° of C.
Claims (1)
1. chemical copper plating solution, it is characterized in that: by following composition be by weight ratio copper sulfate 10-20g/L, saltpetre 5-10g/L, Seignette salt 5-30g/L, sodium ethylene diamine tetracetate 5-30g/L, sodium hydroxide 5-50g/L, sodium carbonate 5-20g/L, ferrous sulfate 0.5-2g/L, formaldehyde 5-50g/L, methyl alcohol 5-50g/L, surplus deionized water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110438346 CN103173750A (en) | 2011-12-24 | 2011-12-24 | Chemical copper plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110438346 CN103173750A (en) | 2011-12-24 | 2011-12-24 | Chemical copper plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103173750A true CN103173750A (en) | 2013-06-26 |
Family
ID=48633925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110438346 Pending CN103173750A (en) | 2011-12-24 | 2011-12-24 | Chemical copper plating solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103173750A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103694951A (en) * | 2013-11-29 | 2014-04-02 | 中国人民武装警察部队工程大学 | CuO/Ni/carbon fiber composite absorbing material and preparation method thereof |
| CN103849914A (en) * | 2014-03-26 | 2014-06-11 | 西安石油大学 | Method for plating copper on titanium alloy coupling |
| CN107287888A (en) * | 2017-08-01 | 2017-10-24 | 浙江理工大学 | A kind of method for the polyester filament copper coating being used in solar cell |
-
2011
- 2011-12-24 CN CN 201110438346 patent/CN103173750A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103694951A (en) * | 2013-11-29 | 2014-04-02 | 中国人民武装警察部队工程大学 | CuO/Ni/carbon fiber composite absorbing material and preparation method thereof |
| CN103694951B (en) * | 2013-11-29 | 2015-07-08 | 中国人民武装警察部队工程大学 | CuO/Ni/carbon fiber composite absorbing material and preparation method thereof |
| CN103849914A (en) * | 2014-03-26 | 2014-06-11 | 西安石油大学 | Method for plating copper on titanium alloy coupling |
| CN103849914B (en) * | 2014-03-26 | 2015-04-22 | 西安石油大学 | Method for plating copper on titanium alloy coupling |
| CN107287888A (en) * | 2017-08-01 | 2017-10-24 | 浙江理工大学 | A kind of method for the polyester filament copper coating being used in solar cell |
| CN107287888B (en) * | 2017-08-01 | 2019-05-31 | 浙江理工大学 | A method of for the polyester filament copper coating in solar battery |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130626 |