CN103158204A - Improved ultrasonic multi-wire cutting method and special equipment - Google Patents
Improved ultrasonic multi-wire cutting method and special equipment Download PDFInfo
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Abstract
The invention relates to an improved ultrasonic wire cutting method special for multi-wire cutting and special equipment for implementing the method. Although the existing ultrasonic wire cutting method and equipment have remarkable advantages in cutting efficiency, cutting accuracy, cutting quality and the like, due to the fact that an ultrasonic transducer is arranged through a workbench for fixing a to-be-cut object, the ultrasonic transmission path is complicated, transmission efficiency is low, actual cutting effects are nowhere near the expectations, and installation and adjustment are complex. According to the improved ultrasonic multi-wire cutting method and the special equipment, an ultrasound emission surface is directly installed on the surface of a to-be-cut object, ultrasonic wave is enabled to be directly transmitted to the to-be-cut object, and the effect of ultrasonic transmission is significantly improved. The improved ultrasonic multi-wire cutting method and the special equipment are used for suspension slurry wire cutting and fixed abrasive wire cutting, and are capable of remarkably improving the efficiency of ultrasonic cutting, reducing the roughness of cut surfaces, reducing cutting loss and increasing the rate of finished products.
Description
Technical field
The present invention relates to for solid material particularly crystalline material improved ultrasonic wave multi-line cutting method and implement the special equipment of the method.
Background technology
the existing solid material that is exclusively used in, such as but not limited to comprising silicon, carborundum, aluminium oxide, the line cutting of the hard and brittle crystal materials such as diamond and the method for multi-wire saw, generally include step: use single or many undercuts secant is arranged in the cutting gauze that includes at least 2 lines of cut by wiring system, when making line of cut do cutting movement, solid material to be cut is contacted with cutting side cutting gauze, dissection by line of cut itself, or the cutting of being carried by line of cut or the dissection of grinding mortar, realize the cutting of solid material to be cut, comprise for example side of cuing open of crystal ingot, or section, etc..Wherein, the cutting movement of line of cut comprise that for example one-way movement, bidirectional reciprocating move, rotatablely move, vibration and compound motion thereof etc.
When using existing wire cutting method cutting hard brittle material, cutting efficiency is lower usually, cutting accuracy is not high, and cost is high, and cutting at the end cut material easily produce the outlet edge and collapse the limit equivalent damage.For this reason, Chinese patent specification ZL03133682.5 has introduced the ultrasound line cast-cutting saw that adopts ultrasonic vibration apparatus, utilizes the auxiliary diamond fretsaw cutting of ultrasonic energy, has realized high efficiency, high accuracy, wire saw process cheaply.But this scroll saw need to be fixedly connected with ultrasonic variable amplitude bar with an end of diamond wire, and the short-term sawing that can only be applicable to reciprocal cabling is cut, and can't be used for unidirectional cabling cutting, more can't realize continuously two-way or unidirectional cabling cutting.
Chinese patent ZL200610044360.7 discloses a kind of ultrasonic scroll saw cutting process for non-conductive hard fragile material, by on the workbench of fixing non-conductive hard brittle material to be cut, ultrasonic transducer being installed, make workbench produce ultrasonic vibration when cutting, the material generation attached supersonic vibration to be cut that drive is fixed thereon, and realize the cutting of ultrasonic vibration scroll saw, reach the purpose of high efficiency cutting.But, the ultrasonic wave that produces due to ultrasonic transducer need to first penetrate work plate and the tack coat thereof of fixing material to be cut on workbench and workbench and just can reach material to be cut, in the reality cutting, the thickness that penetrates due to needs is larger, has nonadjustable acoustic impedance with respect to material to be cut with workbench, work plate, tack coat etc., degree decay to the utmost when ultrasonic wave arrives material to be cut, its ultrasonic cut effect is difficult to reach expection, and needs the Vltrasonic device of relatively high power.And, this inventive method only is used for non-conductive hard brittle material, account for the hard brittle material than the conduction of great share during sawing is cut for actual line, for example silicon crystal, the carborundum crystals of the electrical doping of semiconductor, electronics, optoelectronics industry use, can't determine whether to use the method from this patent.
Chinese patent application CN201010565214 discloses a kind of ultrasonic saw-cutting machine tool from structural, and it is provided with the vibration head that is connected with the ultrasonic transformer of ultrasonic generator, makes vibration head and diamond cutting secant keep pressure contact to realize the ultrasonic vibration of diamond cutting secant.Although this lathe has been realized the continuous cutting of diamond fretsaw, but, contacting with the diamond cutting secant of high-speed motion due to vibration head can be cut, not only fly-cutting consumes vibration head, also makes diamond wire that invalid cutting wearing and tearing occur, and has reduced the effective rate of utilization of scroll saw, and, owing to being difficult to realize the synchronous transmission of ultrasonic wave on many undercuts secant in rigid contact, can only be used for the single line cutting, can not be used for multi-wire saw.
Summary of the invention
Defective and deficiency in view of above prior art exists the purpose of this invention is to provide improved ultrasonic wave multi-line cutting method, in more effective, energy-conservation and economic mode, realize comprising the ultrasound line cutting method of conduction and non-conducting material; A further object of the present invention is, the industrial siding cutting equipment of implementing this improved ultrasonic wave multi-line cutting method is provided, thereby provides the equipment basis for the industrialization of the method.Ultrasonic wave multi-line cutting method of the present invention is equally applicable to the single line cutting.
For this reason, the invention provides a kind of multi-line cutting method of solid objects, comprising:
(1) multi-wire saw gauze and object to be cut are set, wherein, object to be cut is fixed on the loading fixture as loading the contact-making surface loading take its at least part of surface;
(2) at least one ultrasonic generator include the ultrasound emission surface is set, and the ultrasound emission surface is installed at least part of surface of remaining surface of described object to be cut;
(3) start line of cut cutting object to be cut, start ultrasonic generator, make the ultrasonic wave of ultrasound emission surface emitting be delivered to object to be cut through its body surface to be cut of installing;
(4) keep line of cut cutting object to be cut until complete cutting; Choose wantonly before cutting is completed from described body surface to be cut and remove described ultrasound emission surface, to avoid the described ultrasound emission of line of cut cutting surface.
Wherein, the remaining surface of the described object to be cut that is installed on it of described ultrasound emission surface refers to the surface outside the loading contact-making surface of object to be cut;
Wherein, described ultrasound emission surface can be the ultrasound emission surface of the ultrasonic transducer of ultrasonic generator, it can be also the ultrasound emission surface of ultrasonic amplitude transformer, or the ultrasound emission of ultrasonic vibrating plate is surperficial, or the ultrasound emission of ultrasonic vibrator is surperficial, or the ultrasound emission of focusing or the hyperacoustic ultrasonic lens of divergence is surperficial;
Wherein, described ultrasound emission surface preferably has the shape that the contact surface with object to be cut fits, for example plane or circular arc camber;
wherein, described ultrasound emission surface is installed at least part of surface of remaining surface of described object to be cut, can take the mode of directly contact to install, namely, make the ultrasound emission surface directly fit in the part surface of object to be cut, can be also the described part surface that ultrasonic transmission medium is connected and installed in object to be cut by ultrasonic coupling agent, at this moment, arrange between this part surface of described ultrasound emission surface and described object to be cut or include ultrasonic transmission medium, to get rid of the air between both contact-making surfaces and good ultrasonic transmission effect be provided.
The method according to this invention, described ultrasonic transmission medium can be liquid, solid, semi-solid medium arbitrarily, but preferably have the medium that has good acoustic impedance coupling with described object to be cut.Be applicable to different objects to be cut, the example that can be used as some materials of ultrasonic transmission medium of the present invention comprises: gel, colloid, paste, pastel, liquid film, grease, waterglass, liquid metal, liquid alloy, timber, rubber, fluorubber, silica gel, binding agent, wax, nylon, plastics, fluoroplastics, metal, alloy, resin, lucite, glass, quartz, silicon (sheet), graphite, mica, pottery, polytetrafluoroethylene (PTFE), paper, film, it can be alone or in combination as ultrasonic transmission medium of the present invention.
The method according to this invention, the ultrasonic wave of described ultrasound emission surface emitting can be both compressional waves, can be also the transversal wave ultrasonic ripples, or included the composite ultraphonic ripple of shear wave, or reversed ultrasonic wave.
The method according to this invention, the ultrasonic frequency of preferred described ultrasonic generator continues to adjust with the cutting progress in cutting process, so that ultrasonic frequency equals or near the intrinsic frequency of object to be cut and ultrasonic generator formed system (or eigenfrequency, resonant frequency), the cutting forward position of object to be cut is in or is the antinode place near the peak swing place of ultrasonic formed standing wave.
The method according to this invention preferably is arranged on more than one described ultrasound emission surface respectively on two relative surfaces of object to be cut, for example, is installed on respectively in the incision and the side that cuts out of the unidirectional cabling of line of cut of object to be cut.
The method according to this invention, preferably described ultrasound emission is surface mounted on the side at loading contact-making surface place of object to be cut, at this moment, use the compressional wave ultrasonic wave cutting the ultrasonic vibration of forward position formation along cut direction, use the transversal wave ultrasonic ripple cutting the ultrasonic vibration of forward position formation perpendicular to cut direction, and use compressional wave and the compound ultrasonic wave of shear wave to form simultaneously along the ultrasonic vibration of cut direction and perpendicular cuts direction in the cutting forward position, can improve cutting efficiency in these three kinds of situations.
The method according to this invention, preferred described ultrasound emission surface has and essentially identical at least one size of object to be cut, for example, described ultrasound emission surface covers the part surface of object to be cut along the major diameter direction of object to be cut, the size that perhaps has the width that distributes more than or equal to multi-wire cutting secant arranged side by side on object to be cut is to guarantee every good ultrasonic vibration effect of cutting forward position place's acquisition that line of cut is corresponding.
The method according to this invention, the cut direction of described line of cut can be from the cutting upward of object to be cut below, also can be from the cutting downwards of object to be cut top, perhaps cut to the right or cut to the left from the right side of object to be cut from the left side of object to be cut; Wherein, for the situation of concretion abrasive line of cut, preferably cut to the right or cut to the left from the right side of object to be cut from the left side of object to be cut.
The method according to this invention, described line of cut, can be for example steel wire or plated film, the steel wire of filming, steel strand wires of Metal Cutting line, perhaps for example cotton thread, nylon wire, carbon fiber line, carbon fiber bunch wire of nonmetal line of cut, perhaps concretion abrasive line of cut, for example diamond abrasive coating line or cubic boron nitride abrasive materials coating line or boron carbide abrasive material coating line, and the line of cut of other suitable cuttings arbitrarily.Wherein, described abrasive material coating line refers to adopt in baseline surface that the modes such as plating, bonding, hot pressing, soldering apply, heeling-in, fixes the abrasive grain that some play ablation, superabrasive particles such as diamond, cubic boron nitride, boron carbide abrasive material.Described cutting gauze refers to by gauze single or that many undercuts secant forms.
The method according to this invention, the setting of described ultrasonic generator and frequency thereof and power, can select to make it to form the ultrasonic wave of any amplitude in the cutting forward position, but be preferably formed the ultrasonic wave that amplitude is 0.1～200 micron vibration, and further be preferably formed the ultrasonic wave that amplitude is 1～20 micron vibration, for example form amplitude in the cutting forward position of object to be cut and be the vibration of 1.5～5 microns, or the vibration of 3～10 microns.Less ultrasonic amplitude can improve the precision of ultrasound line cutting, obtains cutting surfaces Paint Gloss, and is more suitable for the cutting of hard brittle material; Larger ultrasonic amplitude can improve the ability of ultrasound line cutting, is more suitable for the fly-cutting under low required precision.
The method according to this invention, described ultrasonic generator and setting thereof, can select to form hyperacoustic ultrasonic generator and the setting thereof of optional frequency, but be preferably formed the ultrasonic wave of frequency 10～5000kHz, and further be preferably formed the ultrasonic wave of frequency 20～100kHz, higher frequency can obtain cutting efficiency preferably, but ultrasonic energy transmission decay increases.
the present invention also provides the ultrasonic wave multi-wire saw of implementing ultrasound line cutting method of the present invention equipment, include the loading and the line of cut motion driving system that cut gauze, the Load System of object to be cut, and the mobile system that cutting gauze and object to be cut are moved in opposite directions, also include at least one ultrasonic generator and ultrasound emission thereof surperficial, wherein, described ultrasound emission surface can be arranged at least part of unsettled lip-deep position of object to be cut when being arranged on its work, namely be arranged on the unsettled surface near object to be cut, and allow the ultrasound emission surface that an operating position that is different from this position is set, described ultrasound emission surface directly or through ultrasonic transmission medium is arranged at least part of unsettled surface of object to be cut in the operating position, fixture or hold down gag with optional ultrasound emission surface utilize this fixture or hold down gag described ultrasound emission can be surface mounted at least part of surface of described object to be cut.
The described ultrasound emission surface of ultrasonic wave multi-wire saw equipment of the present invention can be to launch the hyperacoustic plane ultrasonic head of compressional wave, can be also inclined-plane ultrasonic head or the inclined-plane ultrasound emission surface that can launch the transversal wave ultrasonic ripple.Wherein, the preferred employing in ultrasound emission surface that is installed on the side surface that is parallel to cut direction of object to be cut can be launched inclined-plane ultrasonic head or the ultrasound emission surface of transversal wave ultrasonic ripple.
The described ultrasound emission surface of ultrasonic wave multi-wire saw equipment of the present invention can have size arbitrarily, but preferably have at least one size substantially the same with object to be cut, for example, described ultrasound emission surface has the length identical with object to be cut.
Method of the present invention, by the ultrasound emission surface directly being installed on the surface of object to be cut, make ultrasonic wave be directly delivered to object to be cut, and reach the cutting forward position, for example work plate and binding agent just can be delivered to the extreme decay that the indirect transfer of object to be cut causes to have avoided fixed system that ultrasonic wave in the prior art need to see through workbench and object to be cut, conveniently, realized at low cost efficient ultrasound line cutting, have applied widely, easy and simple to handle, cost is low, the advantage that efficient is high.The special equipment of enforcement provided by the invention ultrasound lines cutting method of the present invention, simple in structure, cost is low, suitable especially on existing linear cutting equipment arbitrarily directly simple transformation obtain, for the rapid industrialization of ultrasound line cutting method of the present invention provides good examples.
Description of drawings
Accompanying drawing is only schematic diagram, and does not mean that concrete or accurate shape, size and actual ratio thereof.
Fig. 1 is a kind of schematic diagram of embodiment of the ultrasonic wave multi-line cutting method of the steel wire section that is applied to silicon ingot of the present invention.
Fig. 2 is the schematic diagram of another embodiment of ultrasonic wave multi-line cutting method of the present invention.
Fig. 3 is the schematic diagram of another embodiment of ultrasonic wave multi-line cutting method of the present invention.
Fig. 4 is the schematic diagram of another embodiment of ultrasonic wave multi-line cutting method of the present invention.
Fig. 5 is the schematic diagram of a kind of embodiment of the special equipment of enforcement ultrasonic wave multi-line cutting method of the present invention.
The specific embodiment
Further illustrate the present invention below in conjunction with the specific embodiment.
A kind of embodiment of the ultrasonic wave multi-line cutting method that the steel wire suspension mortar that is applied to silicon ingot of the present invention is cut into slices referring to Fig. 1, comprises step:
(1) multi-wire saw gauze 2 and silicon ingot to be cut 1 are set, wherein, it is square on the net that silicon ingot to be cut is arranged on line of cut, is fixed on loading fixture 4 as loading contact-making surface inversion loading take its upper surface;
(2) at least one ultrasonic generator 3 include ultrasound emission surface 31 is set, and the ultrasound emission surface is installed on the top, side of described silicon ingot to be cut;
(3) start line of cut cutting silicon ingot to be cut, start ultrasonic generator, make the ultrasonic wave of ultrasound emission surface emitting be delivered to silicon ingot to be cut;
(4) keep line of cut cutting object to be cut until complete cutting; Before completing, cutting removes described ultrasound emission from described body surface to be cut surperficial, to avoid the described ultrasound emission of line of cut cutting surperficial.
In Fig. 1, the direction of motion of silicon ingot when arrow represents to cut.
Wherein, described silicon ingot to be cut is P type or the N-type crystalline silicon ingot of electrically doping, namely is mixed with the crystalline silicon of III family or V group element impurity, has electric conductivity;
Wherein, described ultrasound emission surface has suitable width and the length of choosing arbitrarily, covers the part on the top, side of described silicon ingot, preferably covers for example 1/10 the height of the side of described silicon ingot, and for example 95～100% length.
According to the present invention, preferably between the side of described ultrasound emission surface and described silicon ingot to be cut, ultrasonic transmission medium is set, to reduce the ultrasonic impedance of two the air gaps between the surface, improve the ultrasonic conducting effect.Can adopt gel, colloid, paste, pastel, liquid film, grease, waterglass, silica gel or glue or water or polyethylene glycol or cutting liquid as the ultrasonic transmission medium of present embodiment; For example gallium or liquid alloy for example contain bismuth alloy also can to adopt liquid metal; Or adopt veneer, thin teflon plate, TR thin rubber sheet as the ultrasonic transmission medium of present embodiment.The dielectric layer that described ultrasonic transmission medium consists of, desirable any suitable thickness, 0.01～10mm for example, preferred 0.1～1mm, perhaps liquid is got for example 0.01～0.3mm, and solid is got for example 1～5mm, and semisolid is got for example 0.5～2mm, etc.
According to this embodiment of the inventive method, preferred employing can be launched the described ultrasound emission surface that includes the transversal wave ultrasonic ripple, and for example, employing can be launched inclined-plane ultrasonic head or the inclined-plane ultrasound emission surface of transversal wave ultrasonic ripple.
This embodiment according to the inventive method, when adopting the hyperacoustic described ultrasound emission of emission compressional wave surface, the compressional wave ultrasonic wave is propagated in silicon ingot along the direction vertical with contact-making surface, at this moment, in order to ensure with the effect that improves ultrasonic cut, preferred line of cut is with the angle that tilts, the angle cutting silicon ingot that namely is non-zero included angle with the transonic direction.
According to the present invention, the ultrasonic frequency of the ultrasound emission surface emitting in present embodiment, preferably continue to adjust with the cutting progress in cutting process, make described ultrasonic frequency remain at the resonant frequency of silicon ingot system or near on resonant frequency; Perhaps, make the cutting forward position of silicon ingot be in all the time the peak swing place of the ultrasonic wave standing wave that forms in silicon ingot, i.e. standing wave antinode place.According to the present invention, the lasting adjustment of described ultrasonic frequency, can adopt the mode of automatic frequency tracking automatically to adjust ultrasonic frequency, also can adopt according to the cutting progress and automatically adjust ultrasonic frequency according to the mode that predefined algorithm (making frequency become the function of depth of cut) continues to adjust frequency.Rear a kind of mode operates and realizes easylier, and can repeat to realize by the periodicity of frequency in a certain band limits the maintenance of resonant frequency or standing wave antinode, has simplified the electric-control system of ultrasonic generator.
According to the present invention, present embodiment also can be cut the solid objects of other any materials, for example, crystalline material, amorphous material, metal or alloy material, ceramic material, hard brittle material, tough material, conductive material, non-conducting material, etc., preferred crystal silicon and crystal aluminium oxide (sapphire, white stone, ruby, etc.), crystal carborundum.
According to the present invention, cutting gauze described in present embodiment is that the wiring system by Multi-wire cutting device for example is furnished with the gauze that includes at least 2 lines of cut that the guide wheel of wire casing is arranged in by single or many undercuts secant, line of cut, cutting gauze with the contacted side of solid to be cut for cutting side; Line of cut comprises unidirectional cabling, bidirectional reciprocating cabling, rotation, vibrations along cutting path by cutting movement, or any compound motion of these several motion modes is realized cutting; At this moment, cutting liquid is sprayed the cutting forward position of described silicon ingot to be cut, play cooling cutting forward position and take away the effect of smear metal, and in the situation that the cutting of free abrasive line, the abrasive material that has carried dissection enters and cuts the forward position.
The method according to this invention, the ultrasonic generator described in present embodiment preferably have long and narrow ultrasound emission surface, and preferably its length direction is consistent with the length of the side of silicon ingot, can make like this ultrasonic energy Transmit evenly to silicon ingot.
Another embodiment of the ultrasonic wave multi-line cutting method that the steel wire suspension mortar that is applied to silicon ingot of the present invention is cut into slices, referring to Fig. 2, wherein, with the difference of embodiment shown in Figure 1 be, described ultrasound emission surface 31 has two or two groups, is separately positioned on the top of two relative sides of silicon ingot 1.
Another embodiment of the ultrasonic wave multi-line cutting method that the steel wire suspension mortar that is applied to silicon ingot of the present invention is cut into slices, referring to Fig. 3 (not shown cutting gauze), wherein, that described ultrasound emission surface 31 is arranged on the different piece with the loading contact-making surface same surface of silicon ingot 1 with the difference of embodiment shown in Figure 1.
A kind of embodiment of the ultrasonic wave multi-line cutting method of the steel wire suspension mortar side of cuing open that is applied to silicon ingot of the present invention, referring to Fig. 4, wherein, silicon ingot 1 is arranged on plummer 4, be positioned at the below of cutting gauze 2, gap at cutting gauze line of cut arranges at least one ultrasonic generator 3, make its at least one ultrasound emission surface 31 be arranged on the upper surface of silicon ingot 11 downwards from the top, for improving the ultrasonic transmission effect, reduce the ultrasonic impedance of contact-making surface, ultrasonic transmission medium 32 is arranged between the upper surface of ultrasound emission surface and its silicon ingot of installing.During cutting, line of cut is cut silicon ingot downwards in horizontal reciprocating movement.In present embodiment, for example the binding agent of thin layer or sheet rubber or teflon plate can be used as described ultrasonic transmission medium.
implement a kind of embodiment of ultrasonic wave multi-wire saw equipment of the ultrasonic wave multi-line cutting method of the steel wire suspension mortar section that is applied to silicon ingot of the present invention, referring to Fig. 5, include the loading and the line of cut motion driving system 5 that cut gauze 2, the Load System 4 of silicon ingot 1 to be cut, and the mobile system 4 that cutting gauze and silicon ingot to be cut are moved in opposite directions, also include at least one ultrasonic generator 3 and ultrasound emission surface 31 thereof, wherein, described ultrasound emission surface can be arranged on when being arranged on its work silicon ingot to be cut at least part of surperficial 11 on the position, with fixture or the hold down gag 6 on optional ultrasound emission surface, utilize this fixture or hold down gag described ultrasound emission surface 31 can be arranged on described object to be cut at least part of surperficial 11 on.
In above-mentioned embodiment according to ultrasonic wave multi-wire saw equipment of the present invention, described ultrasound emission surface can be the plane, it can be also curved surface, the surface that for example has the cylinder side view, so that it can fit tightly with the described surface of silicon ingot to be cut or silicon rod, and preferred described ultrasound emission surface has at least one size substantially the same with object to be cut, so that it can cover the part surface of described silicon ingot to be cut or silicon rod at least one yardstick, with the Transmit evenly ultrasonic wave to silicon ingot or silicon rod.
in above-mentioned embodiment according to ultrasonic wave multi-wire saw equipment of the present invention, be applicable to the surface that described ultrasound emission surface is installed on silicon ingot or object diverse location to be cut, the compressional wave ultrasonic wave can be launched in described ultrasound emission surface, the compound compressional wave ultrasonic wave of shear wave, the transversal wave ultrasonic ripple, compound torsion ultrasonic wave of compressional wave etc., for example, be installed on the ultrasound emission surface of silicon ingot or the object to be cut side surface parallel with cut direction, preferred employing can be launched the ultrasound emission surface that includes the transversal wave ultrasonic ripple, for example, employing can be launched the inclined-plane ultrasonic head of transversal wave ultrasonic ripple or inclined-plane ultrasound emission surface.
According to the present invention, above-mentioned ultrasonic wave multi-wire saw equipment can be free abrasive multi-wire saw equipment such as steel wire or plated film, the steel wire of filming, can be also such as diamond abrasive coating line (being the concretion abrasive diamond saw wires) or the concretion abrasive multi-wire saw equipment such as cubic boron nitride abrasive materials coating line or boron carbide abrasive material coating line.
Above-mentioned ultrasonic wave multi-wire saw equipment of the present invention directly is installed on the ultrasound emission surface surface of " free time " in other words of " unsettled " of object to be cut, not only than more flexible on the fixed station that in prior art, ultrasonic generator is installed on object to be cut, use reliable and be convenient to and safeguard, the more important thing is, owing to can freely selecting flexibly different ultrasonic transmission medium, same equipment can be suitable for the various material of hand cutting, and the efficient that ultrasonic energy transmits is higher, can obtain better ultrasonic cut effect.
because the quality or the shape that are cut object in cutting process continue to change, intrinsic frequency (or the eigenfrequency of cut object, resonant frequency) also along with continuing change: simultaneously, the cutting forward position of cut object also continues to change (reduction) to the size on ultrasound emission surface, the present invention adopts ultrasonic frequency to continue the mode of adjustment with the cutting progress in cutting process, ultrasonic frequency is equaled all the time or near the resonant frequency of object to be cut and ultrasonic generator formed system, the cutting forward position of object to be cut is in all the time or is the antinode place near ultrasonic wave peak swing place of formed standing wave in object to be cut, so greatly improved the efficient of ultrasonic cut.
According to the present invention, above-mentioned silicon chip cutting special equipment, the preferred utilization has business-like common multi-wire saw special equipment transformation acquisition now, for example, utilize the multi-wire saw equipment such as daily output NTC PV800, Swiss MB264, MB271, HCT/B5 to transform, ultrasonic generator only need be set and its ultrasonic vibrating plate or ultrasound emission surface be arranged on a certain unsettled of object to be cut or the surface that exposes gets final product.Such reforming mode is extremely simple, with low cost, and can utilize a large amount of existing linear cutting equipments of the crystal silicon photovoltaic industry that come into operation and LED wafer industry, reduces investment and cost, improves industrial competition.
Wire cutting method of the present invention and special equipment thereof, not only has higher cutting power, and has a wider scope of application, be not limited to single line or the multi-wire saw of crystalline material, for example, also can be used for the line cutting of the solid materials such as metal, alloy, vitreum alloy, pottery, or be used for single line or the multi-wire saw of other hard brittle material, and be suitable for the line cutting of the line of cut of all kinds and material.
Test shows, has adopted ultrasonic wave cutting method of the present invention, is used for the diamond wire saw sapphire, and cutting speed does not use hyperacoustic common diamond wire saw to improve more than 1.5 times, the highlyest improves 2.5 times; Be used for suspension mortar line cutting silicon ingot, cutting speed can improve more than 60%, and 1.8 times of the highest raisings have greatly improved production efficiency; No matter find simultaneously, be diamond wire saw, the mortar line that still suspends cutting, adopted ultrasound line cutting method of the present invention, the roughness of cutting surfaces significantly descends, and surface roughness value can reduce by more than 50 at most, thereby obtains cutting surfaces Paint Gloss and that the damage layer is more shallow.
Test shows, adopt ultrasound line cutting method of the present invention, no matter be to adopt the line of concretion abrasive to cut for example diamond wire saw, still the line of mortar of suspending cuts for example suspension mortar line cutting of steel wire, cutting at the end cut object the incisxal edge edge collapse the limit, the bright border equivalent damage all obviously descends than the ordinary lines cutting method, when comprising for the single line of the hard brittle materials such as crystalline silicon and sapphire or multi-thread section, collapse limit, fragment, unfilled corner and obviously descend, qualified piece rate improves.
Test shows, adopt ultrasound line cutting method of the present invention, no matter be to adopt the line of concretion abrasive to cut for example diamond wire saw, still the line of mortar of suspending cuts for example suspension mortar line cutting of steel wire, its width of slit all more corresponding ordinary lines cutting method obviously reduces, and the difference in thickness of section also obviously reduces, the slice thickness that obtains is more even, wherein, during cutting silicon wafer, the TTV of silicon chip (the thickness extreme difference of full sheet) is minimum is reduced to 5～8 microns, has improved quality and the piece rate of silicon chip.
Those skilled in the art is apparent, in the situation that do not depart from scope of the present invention or design, can make various modifications and variations to disclosed method and apparatus scheme, comprises the modifications and variations of the index of some aspect that reduces and improve cutting.
Specification of the present invention and embodiment are exemplary, consider the invention spirit that specification and practice disclose herein, and those skilled in the art is other embodiments of the present invention obviously.
Claims (10)
1. ultrasonic wave multi-line cutting method comprises:
(1) multi-wire saw gauze and object to be cut are set, wherein, object to be cut is fixed on the loading fixture as loading the contact-making surface loading take its at least part of surface;
(2) at least one ultrasonic generator include the ultrasound emission surface is set, and the ultrasound emission surface is installed at least part of surface of remaining surface of described object to be cut;
(3) start line of cut cutting object to be cut, start ultrasonic generator, make the ultrasonic wave of ultrasound emission surface generation be delivered to object to be cut;
(4) keep line of cut cutting object to be cut until complete cutting; Choose wantonly before cutting is completed from described body surface to be cut and remove described ultrasound emission surface.
2. ultrasonic wave multi-line cutting method according to claim 1, wherein, between described ultrasound emission surface and its body surface to be cut of installing, also be provided with ultrasonic transmission medium.
3. ultrasonic wave multi-line cutting method according to claim 2, wherein, described ultrasonic transmission medium includes optional at least a from in next group medium: gel, colloid, paste, pastel, liquid film, grease, waterglass, liquid metal, liquid alloy, timber, rubber, fluorubber, silica gel, binding agent, wax, nylon, plastics, fluoroplastics, metal, alloy, resin, lucite, glass, quartz, graphite, mica, pottery, polytetrafluoroethylene (PTFE), paper, film.
4. according to claim 1～3 described ultrasonic wave multi-line cutting methods, wherein, the ultrasound wave packages that described ultrasound emission surface produces contains the transversal wave ultrasonic ripple.
5. according to claim 1～3 described ultrasonic wave multi-line cutting methods, wherein, the ultrasonic frequency of described ultrasonic generator continues to adjust with the cutting progress in cutting process.
6. according to claim 1～3 described ultrasonic wave multi-line cutting methods, wherein, described ultrasound emission surface is arranged on respectively on two relative surfaces of object to be cut.
7. according to claim 1～3 described ultrasonic wave multi-line cutting methods, wherein, described ultrasound emission is surface mounted on the side at loading contact-making surface place of object to be cut.
8. according to claim 1～3 described ultrasonic wave multi-line cutting methods, wherein, described ultrasound emission surface has and essentially identical at least one size of object to be cut.
9. ultrasonic wave multi-wire saw equipment, the Load System that includes the loading that cuts gauze and line of cut motion driving system, object to be cut, and the mobile system that cutting gauze and object to be cut are moved in opposite directions, it is characterized in that, also include at least one ultrasonic generator and ultrasound emission thereof surperficial, can be arranged at least part of lip-deep position of object to be cut when wherein, described ultrasound emission surface is arranged on its work; Fixture or hold down gag with optional ultrasound emission surface utilize this fixture or hold down gag described ultrasound emission can be surface mounted at least part of surface of described object to be cut.
10. ultrasonic wave multi-wire saw equipment according to claim 9, is characterized in that, described ultrasound emission surface is the inclined-plane ultrasonic head that can launch the transversal wave ultrasonic ripple.
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| CN 201110432021 CN103158204A (en) | 2011-12-11 | 2011-12-11 | Improved ultrasonic multi-wire cutting method and special equipment |
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| CN 201110432021 Pending CN103158204A (en) | 2011-12-11 | 2011-12-11 | Improved ultrasonic multi-wire cutting method and special equipment |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104339463A (en) * | 2013-07-26 | 2015-02-11 | 韩国赛橌纳米技术株式会社 | Ingot tilting device having vibration install |
| CN104802325A (en) * | 2015-05-14 | 2015-07-29 | 宝鸡文理学院 | Ultrasonic vibration elastic loading device for wire saw cutting |
| CN106042201A (en) * | 2016-06-08 | 2016-10-26 | 上海理工大学 | Ring type consolidated diamond scroll saw cutting device and workpiece cutting method |
| CN109664424A (en) * | 2019-01-23 | 2019-04-23 | 福建北电新材料科技有限公司 | Multi-line cutting method, Multi-wire cutting device and application thereof, semiconductor material and power device |
| CN110281408A (en) * | 2019-07-02 | 2019-09-27 | 西安奕斯伟硅片技术有限公司 | A kind of multi-line cutting method and device of silicon rod |
| CN113681738A (en) * | 2021-09-24 | 2021-11-23 | 燕山大学 | A vibration platform cutting auxiliary device for multi-wire saw |
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2011
- 2011-12-11 CN CN 201110432021 patent/CN103158204A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104339463A (en) * | 2013-07-26 | 2015-02-11 | 韩国赛橌纳米技术株式会社 | Ingot tilting device having vibration install |
| CN104802325A (en) * | 2015-05-14 | 2015-07-29 | 宝鸡文理学院 | Ultrasonic vibration elastic loading device for wire saw cutting |
| CN106042201A (en) * | 2016-06-08 | 2016-10-26 | 上海理工大学 | Ring type consolidated diamond scroll saw cutting device and workpiece cutting method |
| CN109664424A (en) * | 2019-01-23 | 2019-04-23 | 福建北电新材料科技有限公司 | Multi-line cutting method, Multi-wire cutting device and application thereof, semiconductor material and power device |
| WO2020151262A1 (en) * | 2019-01-23 | 2020-07-30 | 福建北电新材料科技有限公司 | Multi-line cutting method, multi-line cutting apparatus and use thereof, semiconductor material and power device |
| CN110281408A (en) * | 2019-07-02 | 2019-09-27 | 西安奕斯伟硅片技术有限公司 | A kind of multi-line cutting method and device of silicon rod |
| CN113681738A (en) * | 2021-09-24 | 2021-11-23 | 燕山大学 | A vibration platform cutting auxiliary device for multi-wire saw |
| CN113681738B (en) * | 2021-09-24 | 2022-07-19 | 燕山大学 | A vibration platform cutting auxiliary device for multi-wire saw |
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