CN103158177B - The typography of Far infrared electric heating air conditioner heater - Google Patents
The typography of Far infrared electric heating air conditioner heater Download PDFInfo
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- CN103158177B CN103158177B CN201110413823.3A CN201110413823A CN103158177B CN 103158177 B CN103158177 B CN 103158177B CN 201110413823 A CN201110413823 A CN 201110413823A CN 103158177 B CN103158177 B CN 103158177B
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Abstract
The present invention relates to a kind of typography of Far infrared electric heating air conditioner heater, described processing step is: cut out the wafer body (1) that size is greater than actual demand size; And process locating hole (1.1) and conductive hole (1.2) respectively at the two ends of wafer body (1), and locating hole (1.1) is positioned at the outer end of conductive hole (1.2); Then silk screen is covered on wafer body (1), silk screen and wafer body (1) close contact, silk screen is carved with required pattern, the mesh of silk screen is not more than 300 orders, subsequently electrically conductive ink is poured on silk screen, utilize scraper to carry out reciprocal blade coating operation, form heater (2) by the pattern transfer on silk screen to wafer body (1).The typography of Far infrared electric heating air conditioner heater of the present invention, electrically conductive ink printing effect is good and substrate working (machining) efficiency is high, presentation quality good.
Description
Technical field
The present invention relates to a kind of typography of Far infrared electric heating air conditioner heater, belong to air-conditioning processing technique field.
Background technology
At present, people generally need using air-condition to carry out heating to heating in room in winter, especially at northern area, every household needs to pass into heating installation with resisting cold, and the expense of annual each household flower in heating is just up to thousands of unit, and heating installation uses coal heating produces steam in addition, use fossil fuel not only contaminated environment, be unfavorable for energy-conserving and environment-protective, and in the transmitting procedure of heating installation, easily produce more loss.Be developed miscellaneous heating mode, wherein, Far-infrared Heating mode not only has heating function because of it for this reason, and has physical therapy efficacy and receive the extensive concern of people; Conventional Far-infrared Heating structure forms euthermic chip (simply painting brush often to apply) for being simply coated on substrate by electrically conductive ink, and be applied to individual physiotherapy more and be not implanted to field of air conditioning, Far-infrared Heating structure in the fabrication process more simultaneously adopts manual operation, especially cut in process at the substrate for coated with conductive ink, mostly be manual chopper crush-cutting, thus making production efficiency low, product yields is low and uniformity is poor; And in common artificial technique, in order to enhance productivity as much as possible, always the size of substrate be cut into required size, and on substrate, only process necessary conductive hole, thus make follow-uply to carry out cutting shaping to substrate circumferential side frame, thus the presentation quality of product can be affected.
Summary of the invention
The object of the invention is to overcome above-mentioned deficiency, provide that a kind of electrically conductive ink printing effect is good and the typography of the Far infrared electric heating air conditioner heater that substrate working (machining) efficiency is high, presentation quality is good.
The object of the present invention is achieved like this: a kind of typography of Far infrared electric heating air conditioner heater, and described processing step is:
Cut out the wafer body that size is greater than actual demand size; And process locating hole and conductive hole respectively at the two ends of wafer body, and locating hole is positioned at the outer end of conductive hole; Then silk screen is covered on wafer body, silk screen and wafer body close contact, silk screen is carved with required pattern, the mesh of silk screen is not more than 300 orders, subsequently electrically conductive ink is poured on silk screen, utilize scraper to carry out reciprocal blade coating operation, form heater by the pattern transfer on silk screen to wafer body;
Above-mentioned steps adopts cutting mould once to cut shaping, described cutting mould includes cutting mould counterdie and cutting mould patrix, described cutting mould counterdie includes cutting mould lower mould bottom plate, described cutting mould lower mould bottom plate is provided with cutting mould counterdie guide pillar and cutting mould counterdie template, the template face of described cutting mould counterdie template is the step surface be made up of cutting mould bottom punch tangent plane and cutting mould counterdie joint face, described cutting mould bottom punch tangent plane is lower than cutting mould counterdie joint face, the two ends, left and right of described cutting mould bottom punch tangent plane are respectively arranged with the punching of two cutting mould counterdies, described cutting mould lower mould bottom plate is provided with cutting mould counterdie limited block, described cutting mould counterdie limited block is positioned at by cutting mould bottom punch tangent plane, described cutting mould patrix includes baffle plate on cutting mould, described cutting mould baffle plate is provided with the cutting mould upper die guide sleeve corresponding with cutting mould counterdie guide pillar, baffle plate is provided with described cutting mould the cutting mould patrix template corresponding with cutting mould counterdie template, and cutting mould patrix template to be arranged on cutting mould on baffle plate by cutting mould patrix elastic supporting member for supporting optical member, the template face of described cutting mould patrix template is the step surface be made up of cutting mould upper punch tangent plane and cutting mould patrix joint face, described cutting mould upper punch tangent plane is higher than cutting mould patrix joint face, two ends and the cutting mould counterdie punching opposite position place of described cutting mould upper punch tangent plane are provided with cutting mould patrix drift.
Compared with prior art, the invention has the beneficial effects as follows:
Owing to adopting Screen-printed conductive ink, thus print more even (more saving the consumption of electrically conductive ink), and according to the actual requirements electrically conductive ink can be printed as the heater of difformity size, the present invention is due to the size of the size actual demand of wafer body, thus finally unnecessary rim charge can be cut off, make the substrate's appearance of the actual size obtained clean and tidy; And utilize cutting mould one-shot forming, working (machining) efficiency is higher.
Accompanying drawing explanation
Fig. 1 is the structural representation of the substrate in the typography of Far infrared electric heating air conditioner heater of the present invention.
Fig. 2 is the structural representation (in way, dash area is the heater printed) after printing heater in the typography of Far infrared electric heating air conditioner heater of the present invention on substrate.
Fig. 3 is the structural representation of cutting mould counterdie in the typography of Far infrared electric heating air conditioner heater of the present invention.
Fig. 4 is the structural representation of cutting mould patrix in the typography of Far infrared electric heating air conditioner heater of the present invention.
Fig. 5 is that the A of Fig. 4 in the typography of Far infrared electric heating air conditioner heater of the present invention is to schematic diagram.
Wherein:
Wafer body 1, heater 2;
Locating hole 1.1, conductive hole 1.2;
Cutting mould counterdie 1011, cutting mould patrix 1012;
Cutting mould lower mould bottom plate 1011.1, cutting mould counterdie guide pillar 1011.2, cutting mould counterdie template 1011.3, cutting mould counterdie limited block 1011.4, cutting mould counterdie punching 1011.5;
Cutting mould bottom punch tangent plane 1011.3.1, cutting mould counterdie joint face 1011.3.2;
Baffle plate 1012.1, cutting mould upper die guide sleeve 1012.2, cutting mould patrix template 1012.3, cutting mould patrix elastic supporting member for supporting optical member 1012.4, cutting mould patrix drift 1012.5 on cutting mould;
Cutting mould upper punch tangent plane 1012.3.1, cutting mould patrix joint face 1012.3.2.
Detailed description of the invention
See Fig. 1 ~ 5, the typography of a kind of Far infrared electric heating air conditioner heater that the present invention relates to, described processing step is:
Cut out the wafer body 1 that size is greater than actual demand size, and process locating hole 1.1 and conductive hole 1.2 respectively at the two ends of wafer body 1, and locating hole 1.1 is positioned at the outer end (as shown in Figure 1) of conductive hole 1.2, due to the size of the size actual demand of wafer body 1, thus finally unnecessary rim charge can be cut off, make the substrate's appearance of the actual size obtained clean and tidy, then silk screen is covered on wafer body 1, silk screen and wafer body 1 close contact, silk screen is carved with required pattern, the mesh of silk screen is not more than 300 orders, subsequently electrically conductive ink is poured on silk screen, utilizes scraper to carry out reciprocal blade coating operation, form heater 2 by the pattern transfer on silk screen to wafer body 1, described heater 2 can be wire or planar structure, under linear structure is applied to small-power situation, under planar structure is applied to high-power situation, above-mentionedly cut process that cutting mould can be adopted once to cut is shaping, see Fig. 3 ~ 5, described cutting mould includes cutting mould counterdie 1011 and cutting mould patrix 1012, described cutting mould counterdie 1011 includes cutting mould lower mould bottom plate 1011.1, described cutting mould lower mould bottom plate 1011.1 is provided with cutting mould counterdie guide pillar 1011.2 and cutting mould counterdie template 1011.3, the template face of described cutting mould counterdie template 1011.3 is the step surface be made up of cutting mould bottom punch tangent plane 1011.3.1 and cutting mould counterdie joint face 1011.3.2, described cutting mould bottom punch tangent plane 1011.3.1 is lower than cutting mould counterdie joint face 1011.3.2, the two ends, left and right of described cutting mould bottom punch tangent plane 1011.3.1 are respectively arranged with two cutting mould counterdies punching 1011.5, described cutting mould lower mould bottom plate 1011.1 is provided with cutting mould counterdie limited block 1011.4, described cutting mould counterdie limited block 1011.4 is positioned at by cutting mould bottom punch tangent plane 1011.3.1, described cutting mould patrix 1012 includes baffle plate 1012.1 on cutting mould, described cutting mould baffle plate 1012.1 is provided with the cutting mould upper die guide sleeve 1012.2 corresponding with cutting mould counterdie guide pillar 1011.2, baffle plate 1012.1 is provided with described cutting mould the cutting mould patrix template 1012.3 corresponding with cutting mould counterdie template 1011.3, and cutting mould patrix template 1012.3 to be arranged on cutting mould on baffle plate 1012.1 by cutting mould patrix elastic supporting member for supporting optical member 1012.4, the template face of described cutting mould patrix template 1012.3 is the step surface be made up of cutting mould upper punch tangent plane 1012.3.1 and cutting mould patrix joint face 1012.3.2, described cutting mould upper punch tangent plane 1012.3.1 is higher than cutting mould patrix joint face 1012.3.2, two ends and the cutting mould counterdie punching 1011.5 opposite position place of described cutting mould upper punch tangent plane 1012.3.1 are provided with cutting mould patrix drift 1012.5, when cutting, cutting mould counterdie 1011 is contained on press after being located by connecting mutually with cutting mould upper die guide sleeve 1012.2 by cutting mould counterdie guide pillar 1011.2 with cutting mould patrix 1012, glass-fiber-plate is entered cutting mould bottom punch tangent plane 1011.3.1 via cutting mould counterdie joint face 1011.3.2, start press subsequently, cutting mould patrix 1012 presses down, step surface is utilized to be cut off by glass-fiber-plate, and go out locating hole 1.1 and conductive hole 1.2 on the substrate 1 by cutting mould patrix drift 1012.5 simultaneously, finally, cutting mould patrix 1012 under the drive of press on move, now, cutting mould patrix template 1012.3 unloads sweeping away the defective material come time die-cut under the elastic force effect of cutting mould patrix elastic supporting member for supporting optical member 1012.4.
Claims (1)
1. a typography for Far infrared electric heating air conditioner heater, is characterized by: described processing step is:
Cut out the wafer body (1) that size is greater than actual demand size; And process locating hole (1.1) and conductive hole (1.2) respectively at the two ends of wafer body (1), and locating hole (1.1) is positioned at the outer end of conductive hole (1.2); Then silk screen is covered on wafer body (1), silk screen and wafer body (1) close contact, silk screen is carved with required pattern, the mesh of silk screen is not more than 300 orders, subsequently electrically conductive ink is poured on silk screen, utilize scraper to carry out reciprocal blade coating operation, form heater (2) by the pattern transfer on silk screen to wafer body (1);
Above-mentioned steps adopts cutting mould once to cut shaping, described cutting mould includes cutting mould counterdie (1011) and cutting mould patrix (1012), described cutting mould counterdie (1011) includes cutting mould lower mould bottom plate (1011.1), described cutting mould lower mould bottom plate (1011.1) is provided with cutting mould counterdie guide pillar (1011.2) and cutting mould counterdie template (1011.3), the template face of described cutting mould counterdie template (1011.3) is the step surface be made up of cutting mould bottom punch tangent plane (1011.3.1) and cutting mould counterdie joint face (1011.3.2), described cutting mould bottom punch tangent plane (1011.3.1) is lower than cutting mould counterdie joint face (1011.3.2), the two ends, left and right of described cutting mould bottom punch tangent plane (1011.3.1) are respectively arranged with two cutting mould counterdies punching (1011.5), described cutting mould lower mould bottom plate (1011.1) is provided with cutting mould counterdie limited block (1011.4), it is other that described cutting mould counterdie limited block (1011.4) is positioned at cutting mould bottom punch tangent plane (1011.3.1), described cutting mould patrix (1012) includes baffle plate on cutting mould (1012.1), described cutting mould baffle plate (1012.1) is provided with the cutting mould upper die guide sleeve (1012.2) corresponding with cutting mould counterdie guide pillar (1011.2), described cutting mould baffle plate (1012.1) is provided with the cutting mould patrix template (1012.3) corresponding with cutting mould counterdie template (1011.3), and cutting mould patrix template (1012.3) is arranged on baffle plate on cutting mould (1012.1) by cutting mould patrix elastic supporting member for supporting optical member (1012.4), the template face of described cutting mould patrix template (1012.3) is the step surface be made up of cutting mould upper punch tangent plane (1012.3.1) and cutting mould patrix joint face (1012.3.2), described cutting mould upper punch tangent plane (1012.3.1) is higher than cutting mould patrix joint face (1012.3.2), two ends and cutting mould counterdie punching (1011.5) the opposite position place of described cutting mould upper punch tangent plane (1012.3.1) are provided with cutting mould patrix drift (1012.5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110413823.3A CN103158177B (en) | 2011-12-10 | 2011-12-10 | The typography of Far infrared electric heating air conditioner heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110413823.3A CN103158177B (en) | 2011-12-10 | 2011-12-10 | The typography of Far infrared electric heating air conditioner heater |
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| Publication Number | Publication Date |
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| CN103158177A CN103158177A (en) | 2013-06-19 |
| CN103158177B true CN103158177B (en) | 2015-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110413823.3A Active CN103158177B (en) | 2011-12-10 | 2011-12-10 | The typography of Far infrared electric heating air conditioner heater |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1317921A (en) * | 2000-04-11 | 2001-10-17 | 北京寰海智业科技发展有限公司 | Insulative material and electrothermal plate made of it |
| CN1440219A (en) * | 2003-01-22 | 2003-09-03 | 尹惠来 | Electrothermal film manufacture |
| CN102104999A (en) * | 2011-02-18 | 2011-06-22 | 合肥博谐电子科技有限公司 | Far infrared heating plate and manufacturing method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1069964A (en) * | 1996-08-28 | 1998-03-10 | Fujitsu Ltd | Heater |
| JP3418124B2 (en) * | 1998-07-08 | 2003-06-16 | 東商開発株式会社 | Manufacturing method of planar electric heater by thin film printing to prevent dust adhesion |
| JP2009181732A (en) * | 2008-01-29 | 2009-08-13 | Panasonic Corp | Sheet heating element |
-
2011
- 2011-12-10 CN CN201110413823.3A patent/CN103158177B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1317921A (en) * | 2000-04-11 | 2001-10-17 | 北京寰海智业科技发展有限公司 | Insulative material and electrothermal plate made of it |
| CN1440219A (en) * | 2003-01-22 | 2003-09-03 | 尹惠来 | Electrothermal film manufacture |
| CN102104999A (en) * | 2011-02-18 | 2011-06-22 | 合肥博谐电子科技有限公司 | Far infrared heating plate and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103158177A (en) | 2013-06-19 |
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Effective date of registration: 20160531 Address after: Zhu Tang Zhen Zhu Huang Lu 98 No. 214415 Jiangsu city of Jiangyin Province Patentee after: Jiangyin Wenchang Intelligent Electromechanical Research Institution Co.,Ltd. Address before: Zhu Tang Zhen Zhu Huang Lu 98 No. 214415 Jiangsu city of Wuxi province Jiangyin City Patentee before: Jiangyin Linken Technology Co.,Ltd. |
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Effective date of registration: 20230626 Address after: No. 997, Huicheng Avenue, Huishan District, Wuxi City, Jiangsu Province, 214181 Patentee after: Yilufa Intelligent Technology (Jiangsu) Co.,Ltd. Address before: No. 98, Zhuhuang Road, Zhutang Town, Jiangyin City, Jiangsu Province, 214415 Patentee before: Jiangyin Wenchang Intelligent Electromechanical Research Institution Co.,Ltd. |
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