CN103144362A - Electrically-conductive and/or thermally-conductive composite material with three-dimensional structure and production method thereof - Google Patents
Electrically-conductive and/or thermally-conductive composite material with three-dimensional structure and production method thereof Download PDFInfo
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Abstract
The invention relates to an electrically-conductive and/or thermally-conductive composite material with a three-dimensional structure. The electrically-conductive and/or thermally-conductive composite material comprises at least one composite unit layer, wherein each composite unit layer includes upper and lower surface layers arranged horizontally, and an intermediate layer arranged between the two surface layers; each surface layer is a film, a board or a sheet made of an electrically-conductive and/or thermally-conductive material; the intermediate layer includes a conductor and a packing material which are arranged alternately; and the conductor is made of a material with properties identical to that of the surface layers. The electrically-conductive and/or thermally-conductive composite material with the three-dimensional structure provided by the invention has the advantages of novel conception and easiness in manufacturing, and can save materials by 50% in comparison with the existing thermally-conductive or thermally-conductive material; the cost is lowered greatly by using a plastic material as the base material; and the final product has a firm structure, long service life, and large conduction area, and can realize three-dimensional conduction.
Description
Technical field
The present invention relates to conduction or Heat Conduction Material technical field, especially a kind of conduction and/or heat-conductive composite material with stereochemical structure.
Background technology
At electronic technology field, because the integrated level of electronic circuit is more and more higher, gathering of heat is more and more.Gathering of heat causes the electronic devices and components temperature to raise, and job stability reduces.Therefore, have high thermal conductivity for the treatment of the material requirements of device, so that heat conducts rapidly, reach the purpose of cooling.For highly integrated chip, to such an extent as to its design heat energy is that so high common heat abstractor is difficult to guarantee efficiently radiates heat, be mostly to bear as aluminium nitride, boron nitride etc. by high heat-conducting ceramic for the electronic devices and components that need heat conduction.General Heat Conduction Material has certain thickness, existing Heat Conduction Material can only two-dimentional heat conduction, in surperficial heat conduction, conduct up and down as the need Heat Conduction Material and need all heat conduction of integral body, cause material cost high, and because the difficulty of processing of ceramic product is high, easily break, bad mechanical property, people begin to seek to prepare Heat Conduction Material by easy processing, impact-resistant plastics.
Also there is defects in the same Heat Conduction Material of the principle of conductive material.
Summary of the invention
The technical problem to be solved in the present invention is: overcome conduction and/or the high technical barrier of Heat Conduction Material cost in prior art, a kind of conduction and/or heat-conductive composite material with stereochemical structure is provided, can effectively reduce material cost.
The technical solution adopted for the present invention to solve the technical problems is: a kind of conduction and/or heat-conductive composite material with stereochemical structure, comprise one deck recombiner unit layer at least, each recombiner unit layer comprises the two-layer horizontally disposed superficial layer in up and down and is arranged on intermediate layer between two superficial layers, superficial layer serve as reasons conduction and/or Heat Conduction Material film or sheet material or the sheet material made, the intermediate layer comprises conductor and packing material, described conductor and packing material arrange separately, and described conductor and superficial layer are the material of character of the same race.
A kind of embodiment: described recombiner unit layer is one deck.
Another kind of embodiment: described recombiner unit layer is two-layer at least for what stack up and down, the parallel or vertical setting in the intermediate layer of every layer of recombiner unit layer.
Further, share the layer of surface layer between described neighbouring two-layer composite bed.
Further, described packing material is synthetic resin and/or thermoplastic plastic alloy.
Concrete, described synthetic resin is at least a in polyethylene (PE), polypropylene (PP), polystyrene (PS), Merlon (PC), ethene one acetate ethylene copolymer (EVA), acrylonitrile one butadiene one styrol copolymer (ABS), nylon (PA), PETG (PET), polyphenylene oxide (PPO), polythiaether (PPS).
A kind of embodiment: described superficial layer and conductor are conductive material, and described conductive material is at least a in metallic fiber, metal sheet, metal alloy, conductive carbon fibre, electrically conductive graphite, conductive black, CNT.
Another kind of embodiment: described superficial layer and conductor are Heat Conduction Material, and described Heat Conduction Material is at least a in metal powder filler, metal oxide, metal nitride and inorganic non-metallic.
As preferably, described metal powder filler is copper powder, aluminium powder, bronze, silver powder; Metal oxide is aluminium oxide, bismuth oxide, beryllium oxide, magnesia, zinc oxide; Metal nitride is aluminium nitride, boron nitride; Inorganic non-metallic is graphite, carborundum.
a kind ofly produce above-mentioned the have conduction of stereochemical structure and/or the equipment of heat-conductive composite material, comprise two extruders at least, the junction station that the material that extruder is extruded confluxes and tiles and extrude simultaneously, at least one generates the composite bed multiplying assembly of laminated construction melt, whirligig and two hot overlay film extruders with laminated construction melt half-twist, the extrusion of every extruder connects the import of junction station, each composite bed multiplying assembly series connection is arranged on the outlet of junction station, whirligig is arranged on the exit of last composite bed multiplying assembly, the upper and lower in the exit of whirligig respectively is provided with a hot overlay film extruder.
A kind ofly produce above-mentioned the have conduction of stereochemical structure and/or the method for heat-conductive composite material, have following steps:
1. conductor and packing material packing ratio are on demand extruded simultaneously by extruder and junction station tiling N layer;
2. adopt and have the composite bed multiplying assembly that L series connection arranges, each composite bed multiplying assembly is slit into the M decile to conductor and packing material average mark along conductor and packing material width, each decile stacks be extruded broadening when continuing to move forward in each composite bed multiplier after up and down successively, and in the end conflux in the exit of a composite bed multiplying assembly becomes the laminated construction melt of N * M * L layer;
3. be provided with whirligig after last composite bed multiplying assembly and make laminated construction melt half-twist gradually, make the faying face of conductor and packing material be vertical state placement;
4. before the laminated construction melt after half-twist solidified, two hot overlay film extruders were at each hot compound layer of surface layer of upper and lower surface of laminated construction melt.
The invention has the beneficial effects as follows, conduction and/or the heat-conductive composite material with stereochemical structure of the present invention is novel, is easy to make, and can save near half of materials than existing conduction or Heat Conduction Material, and the employing plastic material is as base material, and cost reduces greatly; The finished product mechanical performance is better, sound construction, long service life.Can realize three-dimensional conduction, conduction surface is large.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the structural representation of first embodiment of the conduction with stereochemical structure of the present invention and/or heat-conductive composite material;
Fig. 2 is the stereogram of first embodiment of the conduction with stereochemical structure of the present invention and/or heat-conductive composite material;
Fig. 3 is the stereogram of second embodiment of the conduction with stereochemical structure of the present invention and/or heat-conductive composite material;
Fig. 4 is the have conduction of stereochemical structure and/or the 3rd stereogram that selects embodiment of heat-conductive composite material of the present invention.
Fig. 5 is the structural representation of preferred embodiment of the production equipment of the conduction with stereochemical structure of the present invention and/or heat-conductive composite material.
In figure: 1. superficial layer, 2. intermediate layer, 21. conductors, 22. packing materials.
3. extruder, 4. junction station, 5. composite bed multiplying assembly, 6. whirligig, 7. hot overlay film extruder.
The specific embodiment
In conjunction with the accompanying drawings, the present invention is further detailed explanation.These accompanying drawings are the schematic diagram of simplification, basic structure of the present invention only is described in a schematic way, so it only show the formation relevant with the present invention.
Conduction and/or the heat-conductive composite material with stereochemical structure of the present invention as illustrated in fig. 1 and 2, comprise one deck recombiner unit layer at least, each recombiner unit layer comprises the two-layer horizontally disposed superficial layer 1 in up and down and is arranged on intermediate layer 2 between two superficial layers 1, superficial layer 1 serve as reasons conduction and/or Heat Conduction Material film or sheet material or the sheet material made, intermediate layer 2 comprises conductor 21 and packing material 22, conductor 21 arranges separately with packing material 22, and conductor 21 is the material of character of the same race with superficial layer 1.
First embodiment as shown in Figure 2: the recombiner unit layer is one deck.
Second embodiment as shown in Figure 3: the recombiner unit layer is two-layer at least for what stack up and down, and the intermediate layer 2 of every layer of recombiner unit layer be arranged in parallel.
The 3rd embodiment as shown in Figure 4: the recombiner unit layer is two-layer at least for what stack up and down, and the intermediate layer 2 of every layer of recombiner unit layer vertically arranges.
Further, share the layer of surface layer between neighbouring two-layer composite bed.
Concrete, packing material 22 is synthetic resin and/or thermoplastic plastic alloy.Synthetic resin is at least a in polyethylene (PE), polypropylene (PP), polystyrene (PS), Merlon (PC), ethene one acetate ethylene copolymer (EVA), acrylonitrile one butadiene one styrol copolymer (ABS), nylon (PA), PETG (PET), polyphenylene oxide (PPO), polythiaether (PPS).
A kind of embodiment: superficial layer 1 and conductor 21 are conductive material, and conductive material is at least a in metallic fiber, metal sheet, metal alloy, conductive carbon fibre, electrically conductive graphite, conductive black, CNT.
Another kind of embodiment: superficial layer 1 and conductor 21 are Heat Conduction Material, and Heat Conduction Material is at least a in metal powder filler, metal oxide, metal nitride and inorganic non-metallic.Metal powder filler is copper powder, aluminium powder, bronze, silver powder; Metal oxide is aluminium oxide, bismuth oxide, beryllium oxide, magnesia, zinc oxide; Metal nitride is aluminium nitride, boron nitride; Inorganic non-metallic is graphite, carborundum.
as shown in Figure 5, a kind ofly produce above-mentioned the have conduction of stereochemical structure and/or the equipment of heat-conductive composite material, comprise two extruders 3 at least, the junction station 4 that the material that extruder 3 is extruded confluxes and tiles and extrude simultaneously, at least one generates the composite bed multiplying assembly 5 of laminated construction melt, whirligig 6 and two hot overlay film extruders 7 with laminated construction melt half-twist, the extrusion of every extruder 3 connects the import of junction station 4, each composite bed multiplying assembly 5 series connection is arranged on the outlet of junction station 4, whirligig 6 is arranged on the exit of last composite bed multiplying assembly 5, the upper and lower in the exit of whirligig 6 respectively is provided with a hot overlay film extruder 7.
A kind of the said equipment that adopts is produced above-mentioned the have conduction of stereochemical structure and/or the method for heat-conductive composite material, has following steps:
1. conductor 21 and packing material 22 packing ratio are on demand extruded simultaneously by extruder 3 and junction station 4 tiling N layers;
2. adopt and have the composite bed multiplying assembly 5 that L series connection arranges, each composite bed multiplying assembly 5 is slit into the M decile to conductor 21 and packing material 22 average marks along conductor 21 and packing material 22 widths, each decile stacks be extruded broadening when continuing to move forward in each composite bed multiplier 5 after up and down successively, and in the end conflux in the exit of a composite bed multiplying assembly 5 becomes the laminated construction melt of N * M * L layer;
3. be provided with whirligig 6 after last composite bed multiplying assembly 5 and make laminated construction melt half-twist gradually, make the faying face of conductor 21 and packing material 22 be vertical state placement;
4. before the laminated construction melt after half-twist solidified, two hot overlay film extruders 7 were at each hot compound layer of surface layer 1 of upper and lower surface of laminated construction melt.
The numerical value of N, M and L can be set according to concrete need of production, and General N is got 2～5, M and got 2～10, L and get 1～8.
Take above-mentioned foundation desirable embodiment of the present invention as enlightenment, by above-mentioned description, the relevant staff can in the scope that does not depart from this invention technological thought, carry out various change and modification fully.The technical scope of this invention is not limited to the content on specification, must determine its technical scope according to the claim scope.
Claims (11)
1. conduction and/or heat-conductive composite material with stereochemical structure, it is characterized in that: comprise one deck recombiner unit layer at least, each recombiner unit layer comprises up and down two-layer horizontally disposed superficial layer (1) and is arranged on intermediate layer (2) between two superficial layers (1), superficial layer (1) serve as reasons conduction and/or Heat Conduction Material film or sheet material or the sheet material made, intermediate layer (2) comprises conductor (21) and packing material (22), described conductor (21) arranges separately with packing material (22), described conductor (21) is the material of character of the same race with superficial layer (1).
2. conduction and/or the heat-conductive composite material with stereochemical structure as claimed in claim 1, it is characterized in that: described recombiner unit layer is one deck.
3. conduction and/or the heat-conductive composite material with stereochemical structure as claimed in claim 1 is characterized in that: described recombiner unit layer is two-layer at least for what stack up and down, the intermediate layer of every layer of recombiner unit layer (2) parallel or vertical setting.
4. conduction and/or the heat-conductive composite material with stereochemical structure as claimed in claim 3, is characterized in that: share the layer of surface layer between the neighbouring two-layer composite bed that described intermediate layer (2) be arranged in parallel.
5. have as claimed in claim 2 or claim 3 conduction and/or the heat-conductive composite material of stereochemical structure, it is characterized in that: described packing material (22) is synthetic resin and/or thermoplastic plastic alloy.
6. conduction and/or the heat-conductive composite material with stereochemical structure as claimed in claim 5 is characterized in that: described synthetic resin is at least a in polyethylene, polypropylene, polystyrene, Merlon, ethene one acetate ethylene copolymer, acrylonitrile one butadiene one styrol copolymer, nylon, PETG, polyphenylene oxide, polythiaether.
7. the conduction and/or the heat-conductive composite material that have as claimed in claim 2 or claim 3 stereochemical structure, it is characterized in that: described superficial layer (1) and conductor (21) are conductive material, and described conductive material is at least a in metallic fiber, metal sheet, metal alloy, conductive carbon fibre, electrically conductive graphite, conductive black, CNT.
8. the conduction and/or the heat-conductive composite material that have as claimed in claim 2 or claim 3 stereochemical structure, it is characterized in that: described superficial layer (1) and conductor (21) are Heat Conduction Material, and described Heat Conduction Material is at least a in metal powder filler, metal oxide, metal nitride and inorganic non-metallic.
9. conduction and/or the heat-conductive composite material with stereochemical structure as claimed in claim 8, it is characterized in that: described metal powder filler is copper powder, aluminium powder, bronze, silver powder; Metal oxide is aluminium oxide, bismuth oxide, beryllium oxide, magnesia, zinc oxide; Metal nitride is aluminium nitride, boron nitride; Inorganic non-metallic is graphite, carborundum.
10. produce that claim 1 to 9 any one is described has the conduction of stereochemical structure and/or the equipment of heat-conductive composite material for one kind, it is characterized in that: comprise two extruders (3) at least, the junction station (4) that the material that extruder (3) is extruded confluxes and tiles and extrude simultaneously, at least one generates the composite bed multiplying assembly (5) of laminated construction melt, whirligig (6) and two hot overlay film extruders (7) with laminated construction melt half-twist, the extrusion of every extruder (3) connects the import of junction station (4), each composite bed multiplying assembly (5) series connection is arranged on the outlet of junction station (4), whirligig (6) is arranged on the exit of last composite bed multiplying assembly (5), the upper and lower in the exit of whirligig (6) respectively is provided with a hot overlay film extruder (7).
11. one kind is adopted, and device fabrication claim 1 to 9 any one claimed in claim 10 is described has the conduction of stereochemical structure and/or a method of heat-conductive composite material, has following steps:
1. conductor (21) and packing material (22) packing ratio are on demand extruded simultaneously by extruder (3) and junction station (4) tiling N layer;
2. adopt and have the composite bed multiplying assembly (5) that L series connection arranges, each composite bed multiplying assembly (5) is slit into the M decile to conductor (21) and packing material (22) average mark along conductor (21) and packing material (22) width, each decile stacks be extruded broadening when continuing to move forward in each composite bed multiplier (5) after up and down successively, and in the end conflux in the exit of a composite bed multiplying assembly (5) becomes the laminated construction melt of N * M * L layer;
3. be provided with whirligig (6) after last composite bed multiplying assembly (5) and make laminated construction melt half-twist gradually, make the faying face of conductor (21) and packing material (22) be vertical state placement;
4. before the laminated construction melt after half-twist solidified, two hot overlay film extruders (7) were at each hot compound layer of surface layer (1) of upper and lower surface of laminated construction melt.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310060785.7A CN103144362B (en) | 2013-02-26 | 2013-02-26 | There is the conduction of stereochemical structure and/or heat-conductive composite material and production method thereof |
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| CN201310060785.7A CN103144362B (en) | 2013-02-26 | 2013-02-26 | There is the conduction of stereochemical structure and/or heat-conductive composite material and production method thereof |
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| CN103144362A true CN103144362A (en) | 2013-06-12 |
| CN103144362B CN103144362B (en) | 2015-11-18 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024090364A1 (en) * | 2022-10-28 | 2024-05-02 | 帝人株式会社 | Multilayer body and method for producing same |
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| CN101768427A (en) * | 2009-01-07 | 2010-07-07 | 清华大学 | Thermal interface material and preparation method thereof |
| CN102275313A (en) * | 2011-07-11 | 2011-12-14 | 北京化工大学 | Preparation process for organic-inorganic hybrid composite material |
| US20120060826A1 (en) * | 2008-04-25 | 2012-03-15 | Weisenberger Matthew C | Thermal interface material |
| CN102391647A (en) * | 2011-09-06 | 2012-03-28 | 四川瑞安特电子技术有限公司 | Manufacturing method of polyphenylene sulfide composite heat conduction material for light-emitting diode (LED) |
| CN203141912U (en) * | 2013-02-26 | 2013-08-21 | 常州丰盛光电科技股份有限公司 | Electrically-conductive and/or heat conducting composite material with three-dimensional structure and device |
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- 2013-02-26 CN CN201310060785.7A patent/CN103144362B/en active Active
Patent Citations (5)
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| US20120060826A1 (en) * | 2008-04-25 | 2012-03-15 | Weisenberger Matthew C | Thermal interface material |
| CN101768427A (en) * | 2009-01-07 | 2010-07-07 | 清华大学 | Thermal interface material and preparation method thereof |
| CN102275313A (en) * | 2011-07-11 | 2011-12-14 | 北京化工大学 | Preparation process for organic-inorganic hybrid composite material |
| CN102391647A (en) * | 2011-09-06 | 2012-03-28 | 四川瑞安特电子技术有限公司 | Manufacturing method of polyphenylene sulfide composite heat conduction material for light-emitting diode (LED) |
| CN203141912U (en) * | 2013-02-26 | 2013-08-21 | 常州丰盛光电科技股份有限公司 | Electrically-conductive and/or heat conducting composite material with three-dimensional structure and device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024090364A1 (en) * | 2022-10-28 | 2024-05-02 | 帝人株式会社 | Multilayer body and method for producing same |
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