CN103140611B - Going in electrochemistry electroplanting device plates contact - Google Patents
Going in electrochemistry electroplanting device plates contact Download PDFInfo
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- CN103140611B CN103140611B CN201180048003.7A CN201180048003A CN103140611B CN 103140611 B CN103140611 B CN 103140611B CN 201180048003 A CN201180048003 A CN 201180048003A CN 103140611 B CN103140611 B CN 103140611B
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- plating
- head
- contact
- electroplanting device
- contact ring
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- 230000005518 electrochemistry Effects 0.000 title description 6
- 238000007747 plating Methods 0.000 claims abstract description 109
- 238000009713 electroplating Methods 0.000 claims abstract description 29
- 238000013507 mapping Methods 0.000 claims abstract description 3
- 239000007788 liquid Substances 0.000 claims description 16
- 238000007142 ring opening reaction Methods 0.000 claims description 16
- 230000029142 excretion Effects 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 8
- 238000004377 microelectronic Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 13
- 238000000151 deposition Methods 0.000 abstract description 6
- 239000012530 fluid Substances 0.000 description 21
- 238000004140 cleaning Methods 0.000 description 12
- 238000012423 maintenance Methods 0.000 description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002594 fluoroscopy Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to a kind of electroplanting device, described electroplanting device has the contact of improvement and goes plating feature structure, described electroplanting device includes groove pond assembly (26), and groove pond assembly (26) has groove pond (30), and groove pond (30) are used for holding electroplating solution。During electroplating operations, head (22) and the assembly cooperation of groove pond, head (22) has rotor (34) and head motor (36), rotor (34) includes contact ring (40), and head motor (36) is for rotating said rotor。Lifting/revolving actuator (24) may be used to moving-head, with by the contact loop mapping of a section in going in the plating annular groove (54) of module or opening。Due to go plating module in rather than in the assembly of groove pond perform go plating, so the electroplating solution in the assembly of groove pond is not gone depositing process to affect。
Description
Technical field
The present invention relates to electrochemistry electroplanting device, particularly relate to going in electrochemistry electroplanting device and plate contact。
Background technology
Generally, microprocessor, memory device, Field Emission Display, read/write head and other microelectronic component have integrated circuit, and described integrated circuit has microelectronic component。Generally, semiconductor wafer, glass substrate or another type microelectronic workpiece form a large amount of individual microelectronic device。In typical manufacturing process, in the various stages manufacturing microelectronic component, workpiece forms one or more thin metal layer, to provide material to carry out the interconnection between the various parts of construction。
Generally, in associated with electroplating reactors or machine, metal level is coated on workpiece via electrochemistry plating。Typical case's associated with electroplating reactors includes: container, described container is used for holding electroplating solution；Anode, described anode is arranged in described container to contact described electroplating solution；And supporting mechanism, described supporting mechanism has contact assembly, and described contact assembly has multiple electric contacts of engagement kind crystal layer。Electric contact is coupled to power supply unit, to apply voltage to workpiece。In operation, workpiece front surface impregnated in electroplating solution, so that electric field set up by anode and workpiece, described electric field makes the metal ion in electroplating solution precipitate out to workpiece。
In so-called " wet contact " reactor, during plating cycle, electric contact is exposed to electroplating solution。Therefore, the metal ion in electroplating solution also precipitates out to contact。But, contact can be electroplated by different rates, and result is, owing in plating, metal accumulates on contact in time, so some contacts can have the relatively large or less surface area for contacting workpiece。This measure reduces the uniformity of the metal level being plated on workpiece。Via sticking together poor metallic and contact separation and being deposited on workpiece, workpiece so also can be polluted。For avoiding this result, plating regularly " must be gone " in contact, to remove the metal being plated on contact during plating cycle, as the part carrying out reactor maintenance。
Generally, electroplating solution makes reverse current flow through contact by being impregnated in by contact assembly simultaneously, and carry out plating contact。Reverse current makes plating cycle reverse, thus moving metal leaves contact and is back in solution。However, it is necessary to restriction reverse current, to avoid making electroplating solution degrade。Meanwhile, by the amount of agitation of the electroplating solution near contacts can be provided, limit plating speed。Therefore, the plenty of time to be spent to complete contact and to go plating operation。This way reduces yield or the service efficiency of associated with electroplating reactors。Accordingly, it would be desirable to the design of plating contact is gone in improvement。
Summary of the invention
Device includes groove pond assembly, and described groove pond assembly has groove pond, and described groove pond is used for holding electroplating solution。During electroplating operations, head and the assembly cooperation of groove pond, described head has rotor and head motor, and described rotor includes contact ring, and described head motor is used for rotating said rotor。Lifting/revolving actuator may be used to moving-head, with by the contact loop mapping of a section in going in the plating annular groove of module or opening。Due to go plating module in rather than in the assembly of groove pond perform go plating, so the existing defect removing coating technology can greatly be overcome。
In being used for the method going to plate contact, the head of lifting electroplanting device or reactor, and make described head inclination subsequently, so that a part of contact ring on head is directed at removing plating opening。Contact ring may extend out from head and extends in plating opening。Running contact ring, passes in succession through plating opening with the contact on current collector ring。When plating liquor is removed in existence, by contact is exposed to reverse current, in removing plating opening, go to plating contact。Also can work as contact when being moved through plating opening, clean and dry described contact。
The present invention exists in the sub-portfolio of described device and method。
Brief Description Of Drawings
In the drawings, similar elements symbol indicates the similar elements in each view。
Fig. 1 is the perspective view of this electrochemistry associated with electroplating reactors, and wherein head engages with groove pond assembly。
Fig. 2 is the cross section of reactor as shown in Figure 1。
Fig. 3 is the elevational perspective view of the groove pond assembly including plating module。
Fig. 4 is the rear perspective of groove pond assembly。
Fig. 5 is the perspective view being located to the head for going plating。
Fig. 6 is head as shown in Figure 5 and the sectional view going plating module。
Fig. 7 is the perspective view being located to the head for going plating as shown in Figure 5, and wherein contact ring now extends to outside head and extends in plating module。
Fig. 8 is head as shown in Figure 7 and the sectional view going plating module。
Fig. 9 is the exploded front perspective view of plating module。
Figure 10 is the decomposition rear perspective of plating module。
Figure 11 is the enlarged partial sectional view running through the electrode in plating module。
Figure 12 runs through the enlarged partial sectional view cleaning fluid issuing in plating module。
Figure 13 is the enlarged partial sectional view running through the drying fluid outlet in plating module。
Figure 14 is the substituting magnification fluoroscopy sectional view going plated electrode to design。
Detailed description of the invention
Now consult figure, Fig. 1 and Fig. 2 in detail and the head 22 of associated with electroplating reactors or device 20 is shown, and Fig. 3 to Fig. 4 illustrates the groove pond assembly 26 of associated with electroplating reactors or device 20。Head is supported on lifting/rotary device 24, for instance as described in U.S. Patent No. 6,623,609。Lifting/rotary device 24 and groove pond assembly 26 are attached to deck flat board 28 or similar structures。The groove pond assembly as described in U.S. Patent No. 7,665,398B2 can be used。Groove pond 30 in the assembly of groove pond holds electro-plating liquid。As shown in Figures 2 to 4, groove pond assembly 26 can include excretion ring 42 and excretory duct 44, and described excretion ring 42 has one or more excretion liquid level (level) 49。In modular design, multiple reactors 20 can provide in column in electroplating system, and wherein process machinery people can move to each reactor from station for assembling/disassembling work-pieces, as described in U.S. Patent No. 7,351,314 and U.S. Patent No. 7,371,306。
As shown in Figure 2, head 22 includes rotor 34, and rotor 34 is connected to rotation motor 36 by axle 47。Rotor 34 generally includes contact ring 40 and backboard 38。Contact ring 40 is generally of multiple spaced apart independent contact 41, as shown in figure 11。No. 2006/0289302 described contact of Patent Application Publication can be used。Contact ring actuator 46 in head 22 is attached to contact ring 40, and contact ring actuator 46 along the rotating shaft of rotor, can be moved linearly by contact ring 40 to backboard 38 and be moved linearly by contact ring 40 and leave backboard 38。Contact ring 40 Self-loading-unloading position can be moved to process station by contact ring actuator 46, spaced apart at contact, place, described loading position ring and backboard 38, at process station place contact ring adjacent to backboard 38。Bellows (bellow) 48 may be provided near axle 47, to help parts in seal header joints 22 and isolation technology chemicals。In fig. 2, when rotor is positioned at process station, actuator 46 is retracted and bellows extension。In fig. 8, actuator 46 extends and bellows 48 compress。
Consulting Fig. 9 to Figure 13, contact maintenance module 50 has chassis or pedestal 52, chassis or pedestal 52 for going to plating contact 41 to provide space or position。This space or position can be annular groove or groove 54, the size of annular groove or groove 54 and shape the contact ring 40 to hold a part or a section。Manifold 70 attaches on the top of pedestal 52。The manifold 70 with port and flow channel attaches on the top of pedestal 52。Electrode assemblie 62 is provided in manifold 70, and electrode assemblie 62 has at least one electrode 72 and removes plating fluid supply machine。Hole in electrode block 74 can form multiple plating liquid stream that goes, electrode block 74 be connected to plating fluid supply machine, described in go plating liquid stream to be spaced apart to be directed at adjacent contacts。As it is shown in figure 9, electrode assemblie 62 can include adapter 56 and electrode block 74, electrode block 74 has multiple electrode 72, and wherein electrode block 74 is fixed in manifold 70 by fixing flat board 76。
Going plating fluid supply machine can be formed on fluid distribution block 68 via one or more fluid accessories 58, fluid distribution block 68 is attached to manifold 70。Contact maintenance module 50 also can possess cleaning port 78 and dry port 80, clean port 78 and be arranged in manifold, described cleaning port 78 is connected to clean fluid source, dry port 80 is connected to drying fluid source (such as via accessory 66, the nitrogen of heating), as shown in Fig. 9, Figure 10, Figure 12 and Figure 13。Can providing one or more drainage port 64, to remove plating fluid from annular groove 54, one or more drainage port 64 described leads to discharge line 44。
As shown in Fig. 1, Fig. 9 and Figure 11, at the top end of groove pond assembly 26, the pedestal 52 of contact maintenance module 50 can be attached to excretion ring 42。A part for excretion ring can be cut off, think that pedestal 52 provides attachment location。As shown in Figure 3, annular groove 54 is positioned at above the inner space of groove pond assembly 26 and separates with the inner space of groove pond assembly 26, and described space generally holds electroplating solution, performs to go plating in annular groove 54。
Consulting Fig. 5 and Fig. 6, for going to plating contact 41, head 22 is lifted and leaves groove pond assembly 26 by lifting/rotary device 24, and lifting/rotary device 24 rotatable head 22 subsequently, so that contact ring 40 is directed at contact maintenance module 50。Head is lifted sufficiently high, so that head removes excretion ring 42 during rotary motion。Depend on the specific dimensions of parts, use single lifting and single rotary motion, or use multiple up/down and rotary motion, head 22 can be reached and enter this motion of position shown in Fig. 5 and Fig. 6 from position shown in Fig. 1 and Fig. 2, if as shown in Figure 6, annular groove 54 rough alignment of contact ring 40 and contact maintenance module 50。
Referring now to Fig. 7 and Fig. 8, contact ring 40 stretches out via contact ring actuator 46 from head。The low portion of contact ring 40 is moved in annular groove 54 by this measure。Specifically, the contact ring of a section moves laterally in annular groove 54, and the contact ring of described section is to the arc of about 10 ° to about 45 °。Contact 41 is adjacent to electrode 72, as shown in figure 11。Go plating fluid to flow through accessory 58 enter one or more hole in manifold 70 and electrode block 74 and flow on contact 41。Meanwhile, reverse current self-electrode 72 flows through plating fluid and contact 41。Electrode can be applied the backward voltage of about 10VDC to 20VDC。Do so formed remove depositing process, described in go depositing process to remove the accumulation metal being electroplated on contact 41。As shown in figure 11, plating fluid is gone can to flow out on contact 41 via the central opening 75 in electrode 72。As it is shown in figure 9, multiple electrodes 72 may be provided in electrode block 74, wherein electrode 72 is arranged as the camber of substantially matching contact ring 40。In this type of design, can go to plate multiple contact 41 simultaneously。
The slow rotor 34 of rotation motor 36 in head, so that contact ring 40 is given either continuously or intermittently moved through annular groove 54。Therefore, all contacts 41 on plating contact ring 40 can be gone to。As shown in figure 12, along with rotor 34 slowly rotates, contact 41 is moved from the position being directed at electrode 72 to the position being directed at cleaning port 78。Cleaning liquid (such as, water) cleans port 78 from one or more and flows or be ejected on contact 41。Cleaning liquid used and spent plating fluid collection in the bottom place of annular groove 54, and cleaning liquid used and spent and plate fluid and can discharge via the Drain channels 64 shown in Figure 11。Drain channels 64 leads to discharge line 44, and Drain channels 64 leads to facility discharge line subsequently。
Plating fluid and cleaning liquid is gone to be introduced into groove pond assembly 26。Therefore, the electroplating solution in groove pond assembly 26 is not gone depositing process to affect。Optionally, annular groove 54 can possess the separation Drain channels of plating fluid and cleaning liquid。Subsequently, can recirculation and re-use plating fluid。Go the electroplating solution that plating fluid can be contained with groove pond assembly 26 identical, or go plating fluid can from specific preparation go plating liquid different。
Figure 13 illustrates that after being positioned cleaning port 78, the optional of (in the direction of rotation of contact ring 40) dries port 80。When contact 41 is below dry port 80, can by dry gas stream (such as, the clean dry air of heating or nitrogen), dry contact 41。
During removing depositing process, motor 36 can slowly and continuously ceaselessly movable rotor 34 and contact ring 40, until depositing process one or repeatedly by annular groove 54 and is stood in all contacts 41 on contact ring 40。Or, motor 36 can little by little or in a stepwise manner current collector ring 40 by annular groove 54, each contact 41 moves through plating position, cleaning positions and dry place gradually and in succession simultaneously, or one group 2 to about 20 contacts move through these three positions together。
Depend on contact and the design of contact ring, it may be advantageous that make all contacts by going plating module 50, wherein contact is in the primary importance relative to electrode, such as, the position (closer to contact attachment to the position of contact ring) being more suitable for plating the pedestal of each contact it is in。Subsequently, contact also can in the second position relative to electrode, for instance, the second position in the main body and/or tip that are more suitable for plating contact carries out second time by going plating module 50。In this way, in first time by after going plating module (that is, rotor is fully rotating), contact ring is return or retracts, and electrode 72 such as about 1mm, 2mm or 3mm slightly away。
Therefore, in this way, pivoting the head of associated with electroplating reactors, to be directed at removing the ring opening in plating module by contact ring, described contact ring is arranged on the rotor of head。The contact ring of one section moves from head or stretches out, with at least partially into ring opening。One or more in going plating module of conducting liquid go plated electrode to flow above, through or flow through in plating module one or more remove plated electrode, and electric current flows through contact ring, contact, conducting liquid and removes plated electrode。Rotor rotates, so that each contact on the ring of contact to be moved through plating module。Contact ring can rotate once by going plating module relative to the primary importance removing plated electrode, and moves to relative to the second position removing plated electrode with back contact ring, to reach second time by going plating module。
Although Fig. 7 and Fig. 8 illustrates that contact ring 40 extends out from head 22, but contact maintenance module 50 also can work in principle, and to go to the contact on plating contact ring 40, contact ring 40 has more limited motion or or even without motion relative to head。This motion can be realized via the lifting/rotary device 24 improved, lifting/the rotary device 24 of described improvement also can transverse shifting head 22, to be positioned by contact ring 40 to the annular groove 54 going plating, and head 22 is made to turn away from annular groove 54 and make head 22 be back to the process station shown in Fig. 1 and Fig. 2。Or, contact maintenance module 50 can move relative to head, so that annular groove moves at contact ring, rather than makes contact ring move at annular groove。It is used as the movement combination of head and contact maintenance module。
Go to plating contact can tend to form spuious metallic and sulfuric acid particle, thus can pollute。Therefore, can be advantageously, it is provided that one or more suction port is in adjacent in the manifold of contact。In manifold 70, described suction port can between cleaning between port and dry port。Suction port (such as, the port 88 in Figure 11) can be positioned, to flow to the position air-breathing on contact at liquid。In the design using multiple electrodes 72, suction port can be associated with each electrode。Dry port (if yes) can separate with suction port or be locally isolated, to control to remove the air-flow in plating module, thus avoiding effusion particle better。
Various go plated electrode design can be used in contact maintenance module。Figure 14 illustrates plated electrode design 82, goes plated electrode design 82 to have central electrode 84, and central electrode 84 is surrounded by flow path。Going plating liquid to enter manifold 70 from side ports, flow through the annular space around central electrode 84, and then flow out manifold and flow on contact 41, contact 41 is positioned below electrode 84。In alternative designs, central electrode 84 can be omitted, and accessory 88 can be used as electrode。In this alternative designs, the annular lower loop of electrode is around flow path。
Claims (15)
1. an electroplanting device, described electroplanting device comprises:
Groove pond assembly, described groove pond assembly includes groove pond, and described groove pond is used for holding electroplating solution；
Head, described head includes rotor and head motor, and described rotor has contact ring, and described head motor is used for rotating said rotor；
Lifting/revolving actuator, described lifting/revolving actuator is attached to described head；
Go plating module, described in go plating module to be attached to described groove pond, and described in go plating module to have ring opening, described ring opening is suitable for holding the described contact ring of a section；
Wherein said lifting/revolving actuator is removable to be engaged with described groove pond by described head during electroplating operations, and described lifting/revolving actuator removable with the described contact ring of a section is positioned at least in part to described in go in the described ring opening of plating module, to go to plate described contact ring。
2. electroplanting device as claimed in claim 1, wherein said head comprises contact ring further and extends actuator, and described contact ring extends actuator for being moved linearly by described contact ring on the direction of Plane of rotation being perpendicular to described rotor。
3. electroplanting device as claimed in claim 1, wherein said ring opening forms arciform groove。
4. electroplanting device as claimed in claim 1, described electroplanting device comprises one or more further and removes plated electrode and suction port, described one or more goes plated electrode to be arranged in this and goes plating module, described one or more goes plated electrode adjacent to described ring opening, and described suction port goes plated electrode to be associated with described。
5. electroplanting device as claimed in claim 4, described electroplanting device comprise further be arranged in described in go plating module go to plating liquor hole, described in go to plating liquor hole to be associated with each going in plated electrode described。
6. electroplanting device as claimed in claim 1, described electroplanting device comprises groove pond excretion part further and removes plating module excretion part, described groove pond excretion part is arranged in described groove pond assembly, described go plating module excretion part be arranged in described in go plating module, and described in go to plating module excretion part and described groove pond to drain part to separate。
7. electroplanting device as claimed in claim 2, described electroplanting device comprises controller further, described controller and described lifting/revolving actuator, described head motor, described ring extend actuator and described in go plating module to be connected, wherein said controller is suitable for: be directed at the described described ring opening going to plate module by the described contact ring of described head；Extend described contact ring, so that the described contact ring of a section is at least partially into described ring opening；And rotate described contact ring and pass in succession through described ring opening with the described contact ring substantially moving all sections, to go to plate described contact ring。
8. electroplanting device as claimed in claim 1, the wherein said upper edge appropriate location going plating module to be fixed on described groove pond assembly, and wherein said go plating module to be positioned outside the assembly of described groove pond, it is engaged on the assembly of described groove pond avoiding interference described head。
9. electroplanting device as claimed in claim 4, described electroplanting device comprise further be arranged in described in go plating the one or more of module go plating liquor export, and wherein said suction port be positioned in plating liquid flow out described outlet and stream arrive described contact position air-breathing。
10. an electroplanting device, described electroplanting device comprises:
Groove pond assembly；
Head, described head includes rotor and head motor, and described head motor is used for rotating said rotor；
Contact ring, described contact ring is attached to described rotor；
Lifting/revolving actuator, described lifting/revolving actuator supports described head；
Go plating module, described in go plating module be positioned at outside described groove pond, and described in go plating module be attached to described groove pond, described in go plating module there is arciform annular groove；
Wherein said head can move to the second position from primary importance via described lifting/revolving actuator, rotor described in described primary importance is positioned at described groove pond assembly, in the described second position part described contact ring be at least partially situated at described in go plating module described arciform annular groove in。
11. electroplanting device as claimed in claim 10, described electroplanting device comprises the actuator being arranged in described head further, for linear mobile described contact ring on the direction of rotating shaft being parallel to described rotor。
12. electroplanting device as claimed in claim 10, described electroplanting device comprises plated electrode further and goes plating liquor export, described in go plated electrode to be positioned at arciform annular groove place, described in go plating liquor to export adjacent to described each of plated electrode of going。
13. for by the plating machine on metal plating to circular microelectronic die substrate, described plating machine comprises:
Groove pond assembly, described groove pond assembly includes groove pond, and described groove pond is used for holding electroplating solution；
One or more anode, one or more anode described is arranged in described groove pond；
Head, described head includes rotor and head motor, and described head motor is used for rotating said rotor；
Backboard, described backboard is positioned on described rotor；
Contact ring, described contact ring is positioned on described rotor；
Multiple independently spaced contacts, described spaced apart contact is positioned on the ring of described contact；
Contact ring actuator, described contact ring actuator is arranged in described head, for being moved linearly by described contact ring to described backboard and being moved linearly by described contact ring and leave described backboard；
Current source, described current source is connected to described contact ring and described current source is connected to described anode；
Lifting/revolving actuator, described lifting/revolving actuator is attached to described head；
Go plating module, described in go plating module attach to described groove pond；
Ring opening, described ring opening be arranged in described in go plating module；
One or more go plated electrode, described one or more go plated electrode be arranged in described in go plating module, described one or more goes plated electrode adjacent to described ring opening；
Go plating liquor to export, described in go plating liquor outlet remove plated electrode adjacent to described；
At least one suction port, at least one suction port described is arranged in described ring opening；
Wherein said lifting/revolving actuator is removable to be positioned in described groove pond by the described head with described rotor, and described lifting/revolving actuator removable with by the described contact loop mapping of a part to described in go in the described ring opening of plating module。
14. electroplate machine as claimed in claim 13, wherein said suction port is positioned in plating liquid and flows out described outlet and the stream position air-breathing to described contact。
15. electroplate machine as claimed in claim 13, described plating machine comprises the multiple plated electrodes that go being arranged in described ring opening further, and wherein said suction port goes each of plated electrode to be associated with described。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/856,357 US8500968B2 (en) | 2010-08-13 | 2010-08-13 | Deplating contacts in an electrochemical plating apparatus |
| US12/856,357 | 2010-08-13 | ||
| PCT/US2011/047406 WO2012021695A2 (en) | 2010-08-13 | 2011-08-11 | Deplating contacts in an electrochemical plating apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103140611A CN103140611A (en) | 2013-06-05 |
| CN103140611B true CN103140611B (en) | 2016-06-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180048003.7A Expired - Fee Related CN103140611B (en) | 2010-08-13 | 2011-08-11 | Going in electrochemistry electroplanting device plates contact |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8500968B2 (en) |
| KR (1) | KR101812199B1 (en) |
| CN (1) | CN103140611B (en) |
| SG (1) | SG187823A1 (en) |
| TW (1) | TWI438308B (en) |
| WO (1) | WO2012021695A2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9598788B2 (en) | 2012-09-27 | 2017-03-21 | Applied Materials, Inc. | Electroplating apparatus with contact ring deplating |
| US20140262795A1 (en) * | 2013-03-14 | 2014-09-18 | Applied Materials, Inc. | Electroplating processor with vacuum rotor |
| US9399827B2 (en) * | 2013-04-29 | 2016-07-26 | Applied Materials, Inc. | Microelectronic substrate electro processing system |
| US10174437B2 (en) | 2015-07-09 | 2019-01-08 | Applied Materials, Inc. | Wafer electroplating chuck assembly |
| GB201701166D0 (en) | 2017-01-24 | 2017-03-08 | Picofluidics Ltd | An apparatus for electrochemically processing semiconductor substrates |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6548411B2 (en) | 1999-01-22 | 2003-04-15 | Semitool, Inc. | Apparatus and methods for processing a workpiece |
| US6492284B2 (en) | 1999-01-22 | 2002-12-10 | Semitool, Inc. | Reactor for processing a workpiece using sonic energy |
| US7351314B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7585398B2 (en) | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US6623609B2 (en) | 1999-07-12 | 2003-09-23 | Semitool, Inc. | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| AU2002322587A1 (en) * | 2001-07-16 | 2003-03-03 | Semitool, Inc. | Apparatus for processing a workpiece |
| US20040222101A1 (en) | 2003-04-18 | 2004-11-11 | Applied Materials, Inc. | Contact ring spin during idle time and deplate for defect reduction |
| US7313462B2 (en) | 2003-06-06 | 2007-12-25 | Semitool, Inc. | Integrated tool with automated calibration system and interchangeable wet processing components for processing microfeature workpieces |
| US20060289302A1 (en) | 2005-06-28 | 2006-12-28 | Semitool, Inc. | Electroprocessing workpiece contact assemblies, and apparatus with contact assemblies for electroprocessing workpieces |
-
2010
- 2010-08-13 US US12/856,357 patent/US8500968B2/en not_active Expired - Fee Related
-
2011
- 2011-08-11 WO PCT/US2011/047406 patent/WO2012021695A2/en active Application Filing
- 2011-08-11 CN CN201180048003.7A patent/CN103140611B/en not_active Expired - Fee Related
- 2011-08-11 SG SG2013010491A patent/SG187823A1/en unknown
- 2011-08-11 KR KR1020137006295A patent/KR101812199B1/en active IP Right Grant
- 2011-08-15 TW TW100129099A patent/TWI438308B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US20120037495A1 (en) | 2012-02-16 |
| WO2012021695A3 (en) | 2012-05-03 |
| TWI438308B (en) | 2014-05-21 |
| TW201229324A (en) | 2012-07-16 |
| KR20130138199A (en) | 2013-12-18 |
| SG187823A1 (en) | 2013-03-28 |
| US8500968B2 (en) | 2013-08-06 |
| WO2012021695A2 (en) | 2012-02-16 |
| CN103140611A (en) | 2013-06-05 |
| KR101812199B1 (en) | 2017-12-26 |
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