CN103137437B - 制造掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层的方法与包含其的太阳能电池 - Google Patents
制造掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层的方法与包含其的太阳能电池 Download PDFInfo
- Publication number
- CN103137437B CN103137437B CN201210477835.7A CN201210477835A CN103137437B CN 103137437 B CN103137437 B CN 103137437B CN 201210477835 A CN201210477835 A CN 201210477835A CN 103137437 B CN103137437 B CN 103137437B
- Authority
- CN
- China
- Prior art keywords
- iiia
- compound
- light absorbing
- doping
- absorbing zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 150000001875 compounds Chemical class 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 230000031700 light absorption Effects 0.000 title abstract description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 230000000737 periodic effect Effects 0.000 claims abstract description 3
- 239000011669 selenium Substances 0.000 claims description 35
- 239000010949 copper Substances 0.000 claims description 28
- 239000002243 precursor Substances 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 19
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 18
- 229910052738 indium Inorganic materials 0.000 claims description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 15
- 239000013078 crystal Substances 0.000 claims description 15
- 229910052733 gallium Inorganic materials 0.000 claims description 15
- 229910052711 selenium Inorganic materials 0.000 claims description 15
- 239000001257 hydrogen Substances 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 6
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 6
- 229910000058 selane Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 229910052717 sulfur Inorganic materials 0.000 claims description 6
- 239000011593 sulfur Substances 0.000 claims description 6
- 229910052714 tellurium Inorganic materials 0.000 claims description 6
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 238000001704 evaporation Methods 0.000 claims description 5
- 230000008020 evaporation Effects 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- 238000007766 curtain coating Methods 0.000 claims description 4
- 238000005137 deposition process Methods 0.000 claims description 4
- 229910052716 thallium Inorganic materials 0.000 claims description 4
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims description 4
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 3
- SPVXKVOXSXTJOY-UHFFFAOYSA-N selane Chemical compound [SeH2] SPVXKVOXSXTJOY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052699 polonium Inorganic materials 0.000 claims description 2
- HZEBHPIOVYHPMT-UHFFFAOYSA-N polonium atom Chemical compound [Po] HZEBHPIOVYHPMT-UHFFFAOYSA-N 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 20
- 229910052797 bismuth Inorganic materials 0.000 abstract description 5
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract description 5
- 238000002360 preparation method Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 50
- 229910002651 NO3 Inorganic materials 0.000 description 26
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 26
- 239000000203 mixture Substances 0.000 description 23
- 238000004458 analytical method Methods 0.000 description 21
- 239000010409 thin film Substances 0.000 description 21
- 239000011521 glass Substances 0.000 description 16
- 238000005520 cutting process Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- 238000002441 X-ray diffraction Methods 0.000 description 12
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 12
- 238000010586 diagram Methods 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000001228 spectrum Methods 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 8
- 239000011787 zinc oxide Substances 0.000 description 8
- 239000000956 alloy Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 238000000151 deposition Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 238000004528 spin coating Methods 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- -1 alloy Chemical class 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 4
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- CHPZKNULDCNCBW-UHFFFAOYSA-N gallium nitrate Inorganic materials [Ga+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O CHPZKNULDCNCBW-UHFFFAOYSA-N 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 150000003891 oxalate salts Chemical class 0.000 description 4
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 4
- 230000009466 transformation Effects 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- QNWMNMIVDYETIG-UHFFFAOYSA-N gallium(ii) selenide Chemical compound [Se]=[Ga] QNWMNMIVDYETIG-UHFFFAOYSA-N 0.000 description 3
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 3
- 150000002611 lead compounds Chemical class 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- QYHFIVBSNOWOCQ-UHFFFAOYSA-N selenic acid Chemical compound O[Se](O)(=O)=O QYHFIVBSNOWOCQ-UHFFFAOYSA-N 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- XHGGEBRKUWZHEK-UHFFFAOYSA-N telluric acid Chemical compound O[Te](O)(=O)=O XHGGEBRKUWZHEK-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 230000005622 photoelectricity Effects 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- VTQZBGAODFEJOW-UHFFFAOYSA-N selenium tetrabromide Chemical compound Br[Se](Br)(Br)Br VTQZBGAODFEJOW-UHFFFAOYSA-N 0.000 description 2
- IYKVLICPFCEZOF-UHFFFAOYSA-N selenourea Chemical compound NC(N)=[Se] IYKVLICPFCEZOF-UHFFFAOYSA-N 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 235000011149 sulphuric acid Nutrition 0.000 description 2
- 239000001117 sulphuric acid Substances 0.000 description 2
- PTYIPBNVDTYPIO-UHFFFAOYSA-N tellurium tetrabromide Chemical compound Br[Te](Br)(Br)Br PTYIPBNVDTYPIO-UHFFFAOYSA-N 0.000 description 2
- SWLJJEFSPJCUBD-UHFFFAOYSA-N tellurium tetrachloride Chemical compound Cl[Te](Cl)(Cl)Cl SWLJJEFSPJCUBD-UHFFFAOYSA-N 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- GGUVWUSYRTXJML-UHFFFAOYSA-N Cl.Cl.[SeH2] Chemical compound Cl.Cl.[SeH2] GGUVWUSYRTXJML-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-N Formic acid Chemical compound OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 1
- 229910003597 H2SeO3 Inorganic materials 0.000 description 1
- 229910003599 H2SeO4 Inorganic materials 0.000 description 1
- PSCMQHVBLHHWTO-UHFFFAOYSA-K Indium trichloride Inorganic materials Cl[In](Cl)Cl PSCMQHVBLHHWTO-UHFFFAOYSA-K 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical class O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- XURCIPRUUASYLR-UHFFFAOYSA-N Omeprazole sulfide Chemical compound N=1C2=CC(OC)=CC=C2NC=1SCC1=NC=C(C)C(OC)=C1C XURCIPRUUASYLR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229910003069 TeO2 Inorganic materials 0.000 description 1
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium chloride Substances Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 1
- JLDSOYXADOWAKB-UHFFFAOYSA-N aluminium nitrate Chemical compound [Al+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O JLDSOYXADOWAKB-UHFFFAOYSA-N 0.000 description 1
- JYMITAMFTJDTAE-UHFFFAOYSA-N aluminum zinc oxygen(2-) Chemical compound [O-2].[Al+3].[Zn+2] JYMITAMFTJDTAE-UHFFFAOYSA-N 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- MNBLRJWKVLRTKV-UHFFFAOYSA-N bromo selenohypobromite Chemical compound Br[Se]Br MNBLRJWKVLRTKV-UHFFFAOYSA-N 0.000 description 1
- APFVSLFMSQCQFA-UHFFFAOYSA-N bromo tellurohypobromite Chemical compound Br[Te]Br APFVSLFMSQCQFA-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical group [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 description 1
- VXLPBEHPTWIBJR-UHFFFAOYSA-N chloro tellurohypochlorite Chemical compound Cl[Te]Cl VXLPBEHPTWIBJR-UHFFFAOYSA-N 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- XNEQAVYOCNWYNZ-UHFFFAOYSA-L copper;dinitrite Chemical compound [Cu+2].[O-]N=O.[O-]N=O XNEQAVYOCNWYNZ-UHFFFAOYSA-L 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- RCJVRSBWZCNNQT-UHFFFAOYSA-N dichloridooxygen Chemical compound ClOCl RCJVRSBWZCNNQT-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 238000003682 fluorination reaction Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- QZQVBEXLDFYHSR-UHFFFAOYSA-N gallium(III) oxide Inorganic materials O=[Ga]O[Ga]=O QZQVBEXLDFYHSR-UHFFFAOYSA-N 0.000 description 1
- NTVYFDOMBHOLGP-UHFFFAOYSA-N gold nitric acid Chemical compound [Au].O[N+]([O-])=O NTVYFDOMBHOLGP-UHFFFAOYSA-N 0.000 description 1
- RXPAJWPEYBDXOG-UHFFFAOYSA-N hydron;methyl 4-methoxypyridine-2-carboxylate;chloride Chemical compound Cl.COC(=O)C1=CC(OC)=CC=N1 RXPAJWPEYBDXOG-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 150000003342 selenium Chemical class 0.000 description 1
- JPJALAQPGMAKDF-UHFFFAOYSA-N selenium dioxide Chemical compound O=[Se]=O JPJALAQPGMAKDF-UHFFFAOYSA-N 0.000 description 1
- JNMWHTHYDQTDQZ-UHFFFAOYSA-N selenium sulfide Chemical compound S=[Se]=S JNMWHTHYDQTDQZ-UHFFFAOYSA-N 0.000 description 1
- 150000003346 selenoethers Chemical class 0.000 description 1
- NLKSSCOPUYXQPS-UHFFFAOYSA-N selenonyl dichloride Chemical compound Cl[Se](Cl)(=O)=O NLKSSCOPUYXQPS-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 238000007767 slide coating Methods 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005118 spray pyrolysis Methods 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- LAJZODKXOMJMPK-UHFFFAOYSA-N tellurium dioxide Chemical compound O=[Te]=O LAJZODKXOMJMPK-UHFFFAOYSA-N 0.000 description 1
- SITVSCPRJNYAGV-UHFFFAOYSA-N tellurous acid Chemical compound O[Te](O)=O SITVSCPRJNYAGV-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0321—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 characterised by the doping material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5846—Reactive treatment
- C23C14/5866—Treatment with sulfur, selenium or tellurium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1279—Process of deposition of the inorganic material performed under reactive atmosphere, e.g. oxidising or reducing atmospheres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02568—Chalcogenide semiconducting materials not being oxides, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02614—Transformation of metal, e.g. oxidation, nitridation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02628—Liquid deposition using solutions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
- H01L31/0323—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2 characterised by the doping material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
- H01L31/0749—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type including a AIBIIICVI compound, e.g. CdS/CulnSe2 [CIS] heterojunction solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Electromagnetism (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
Abstract
本发明提供一种制造掺杂Bi的IB‑IIIA‑ⅥA化合物的光吸收层的方法与包含其的太阳能电池。光吸收层的制备方法包括:将含有元素周期表IB族、ⅢA族和铋(Bi,Bismuth)的化合物置于包括ⅥA族化合物的气氛中进行热处理,使该化合物形成掺杂Bi(bismuth‑doped)的IB‑ⅢA‑ⅥA化合物。另外,本发明亦提供一种制作掺杂Bi的光吸收层的太阳能电池,该光吸收层是由上述方法制备而得,可进一步应用于制作光电材料。
Description
技术领域
本发明涉及一种制造IB-IIIA-VIA化合物的方法,特别是一种制造用以作为光电材料元件的掺杂Bi的IB-IIIA-VIA化合物的方法。
背景技术
近年来由于受到全球气候变迁、环境污染问题以及资源日趋短缺的影响,在环保意识高涨与能源危机的警讯下刺激了太阳光电产业的蓬勃发展。于各种太阳能电池中,由于硒化铜铟镓太阳电池(Cu(In,Ga)Se2,CIGS)具备高转换效率、稳定性佳、材料成本低、可制成薄膜等优点,因此受到极大的重视。
CIGS化合物属于黄铜矿(chalcopyrite)结构,其主要由IB-IIIA-VIA2族化合物所组成,其为一种直接能隙(direct bandgap)半导体材料,可通过调控组成而改变半导体的能隙(band gap),是目前常用以作为太阳电池光吸收层的主要材料。目前制作CIGS太阳能电池的光吸收层技术中,常通过掺杂(incorporate)不同离子提高光吸收层的品质,进而增进电池的光电转换效率,其中,US20090320916公开了一种添加锑(antimony,Sb)元素以得到增进光电特性的方法。然而,上述光吸收层中的Sb可掺杂量(the doping amounts ofantimony)有限,且其于光吸收层的浓度不易控制,间接影响光吸收层的特性。综上所述,若有一种新的掺杂元素且能有效控制其掺杂浓度(the dopingconcentration),将有助于改善光吸收层的晶粒大小(the grain size)和晶相成长(the grain growth),进而增加元件的光电转换效率。
发明内容
为达成上述及其他目的,本发明提供一种制造掺杂Bi的IB-IIIA-VIA化合物光吸收层的方法,其特征在于包括:(A)沉积含有元素周期表IB族、IIIA族和Bi的化合物的先驱薄膜,(B)再于含有VIA族化合物的气氛下对该先驱薄膜进行热处理,进一步形成掺杂Bi的IB-IIIA-VIA化合物的光吸收层。
根据本发明的实施方式,该IB族元素为选自铜、银、金及上述组合所构成的组群;该IIIA族元素为选自硼、铝、镓、铟、铊及上述组合所构成的组群;该VIA族元素为选自氧、硫、硒、碲、钋及上述组合所构成的组群;该IB-IIIA-ⅥA与Bi的摩尔数比为10:1至2000:1。
根据本发明的实施方式,上述步骤(A)还包括将IA族及/或ⅥA族化合物加入该先驱薄膜中;上述步骤(A)的沉积方法包括真空、非真空的镀膜制程或上述的组合;上述步骤(A)的沉积方法包含涂布、溅镀、蒸镀或上述的组合;涂布方法包括旋转涂布、狭缝涂布、挤压涂布、淋幕涂布、斜板涂布、浸镀、刮刀涂布或上述方法的组合;上述步骤(B)的气氛包括真空或非真空;该气氛包括氧气(O2)、氮气(N2)、氢气(H2)、氩气(Ar)、硒化氢(H2Se)、硫化氢(H2S)、硒(Se)蒸气、硫(S)蒸气、碲(Te)蒸气或上述的组合。
根据本发明的实施方式,上述步骤(A)还包括将先驱薄膜进行热处理,其中热处理温度为50℃-650℃,热处理时间为15分钟至12小时。其热处理可改善薄膜品质及表面型态,可干燥薄膜,或去除残碳,或增加致密性。热处理气氛包括氧气(O2)、氮气(N2)、氩气(Ar),或上述的组合。
本发明还提供一种采用掺杂Bi的IB-IIIA-VIA化合物的光吸收层制作的太阳能电池,是由上述掺杂Bi的IB-IIIA-VIA化合物的光吸收层制备方法所制得。
根据本发明所合成掺杂Bi的IB-IIIA-VIA化合物的光吸收层,其可应用作为光电材料元件。掺杂Bi的IB-IIIA-VIA化合物的光吸收层不仅有助于IB-IIIA-VIA化合物的晶粒粒径(grain size)和晶相的成长(the grain growth),同时可以改善IB-IIIA-VIA化合物的电性特性,进而能够增加光电元件的特性的优点。
根据本发明的实施方式,光吸收层的掺杂Bi的IB-IIIA-ⅥA化合物的晶粒的平均粒径大于或等于0.6μm,较佳平均粒径大于或等于0.8μm,最佳平均粒径大于或等于1.0μm。
为让本发明的上述和其他目的、特征和优点能更明显易懂,下文特举出较佳实施例,并配合附图,作详细说明如下。
附图说明
图1为根据本发明一实施方式的太阳能电池的示意图;
图2为实施例1的薄膜样品1的X-ray绕射图谱;
图3为实施例1的薄膜样品1的扫描式电子显微镜(SEM)图;
图4为实施例1的铜铟镓硒薄膜太阳电池1的电流密度-电压图;
图5为比较实施例1的薄膜样品2的扫描式电子显微镜(SEM)图;
图6为比较实施例1的铜铟镓硒薄膜太阳电池2的电流密度-电压图。
【主要元件符号说明】
100太阳能电池,110基板,120接触层,130光吸收层,140缓冲层,150窗层,152透明窗层,154透明导电层。
具体实施方式
以下通过特定的具体实例说明实施方式,这些实施例仅为本发明的示例,不应据以局限本发明的范围,本领域普通技术人员均可由说明书及本申请的权利要求所公开的内容,根据需要加以适当的变化,而这些变化均含于本发明的范畴。
本发明提供制造掺杂Bi的IB-IIIA-ⅥA化合物的方法,将IB族、IIIA族及Bi的化合物置于包括ⅥA族化合物的气氛中进行热处理,以形成掺杂Bi的IB-IIIA-ⅥA化合物。进一步言之,本发明方法为先将分别含有IB族、IIIA族及Bi的化合物或上述组合的原料均匀混合或分别以涂布、溅镀或蒸镀的方式沉积于基材形成前驱化合物(the precursors),再于含有ⅥA族化合物的气氛中进行热处理的反应。
本发明方法所使用的IB族、IIIA族及Bi或上述组合的原料是指含有IB族及/或IIIA族及/或Bi及/或上述组合的合金及/或化合物,包括合金、氧化物、硝酸盐、醋酸盐、硫酸盐、草酸盐或碳酸盐。该含有IB族元素的原料实例包括铜、银、金或上述组合的合金、氟化物、氯化物、溴化物、碘化物、硝酸盐、醋酸盐、硫酸盐、草酸盐或碳酸盐;较佳为铜、银、金或上述组合的合金或硝酸盐。例如铜(Cu)、银(Ag)、金(Au)、硝酸铜(Cu(NO3)2)、亚硝酸铜(CuNO3)、硝酸银(Ag(NO3)2)、硝酸金(Au(NO3)2)。该含有IIIA族元素的原料实例包括硼、铝、镓、铟、铊或上述组合的合金、氟化物、氯化物、溴化物、碘化物、硝酸盐、醋酸盐、硫酸盐、草酸盐或碳酸盐;较佳为硼、铝、镓、铟、铊或上述组合的合金或硝酸盐。例如铝(Al)、镓(Ga)、铟(In)、硝酸铝(Al(NO3)3)、硝酸镓(Ga(NO3)3)、硝酸铟(In(NO3)3)。该含有Bi元素的原料实例包括合金、氟化物、氯化物、溴化物、碘化物、硝酸盐、醋酸盐、硫酸盐、草酸盐或碳酸盐;较佳为Bi的金属或硝酸盐。例如铋(Bi)、硝酸铋(Bi(NO3)3)。该含有ⅥA族包括硫(S)、硒(Se)、锑(Te)或上述的组合的氧化物、卤化物、卤氧化物、硫化物、硒化物、胺化物、脲化物、硒酸物、硫酸物或碲酸物,例如氧化硒(SeO2)、氧化碲(TeO2)、硫酸(H2SO4)、硒酸(H2SeO4)、碲酸(H2TeO4)、亚硫酸(H2SO3)、亚硒酸(H2SeO3)、亚碲酸(H2TeO3)、硫脲(thiourea,CS(NH2)2)、硒脲(selenourea,CSe(NH2)2)、二氯化硒(SeCl2)、四氯化硒(SeCl4)、二氯化碲(TeCl2)、四氯化碲(TeCl4)、二溴化硒(SeBr2)、四溴化硒(SeBr4)、二溴化碲(TeBr2)、四溴化碲(TeBr4)、氯氧化硒(SeOCl2)或硫化硒(SeS2)。而上述化合物的选择,并不限于上述提及的化合物,只要是能含IB族、IIIA族、Bi元素、ⅥA族的化合物皆可。
而其中IB-IIIA-ⅥA族化合物与Bi的摩尔数比为约(10~2000):1,较佳为约(20~1000):1,最佳为约(40~500):1。
本发明方法为先将上述提及的IB族、IIIA族及Bi的化合物原料沉积于基材上,沉积的厚度为约0.1-20μm,较佳厚度为0.2-15μm,最佳厚度为0.5-10μm。而选择的沉积方式包括真空制程技术、非真空制程技术或上述的组合的制程技术,例如共蒸镀(Co-evaporation)、溅镀(Sputtering)、涂布制程(CoatingProcess)、化学喷洒热解法(Chemical spray Pyrolysis)或电沉积(Electrodeposition)。涂布制程包括旋转涂布(spin coating)、狭缝涂布(slotcoating)、挤压涂布(extrusion coating)、淋幕涂布(curtain coating)、斜板式涂布(slide coating)、浸镀(dipping)、刮刀涂布(doctor blade cotaing)或上述方法的组合。
上述提及的基板包括玻璃、高分子基板、金属基板或透明导电层(transparent conducting oxide,TCO),其中高分子基板例如为聚亚酰胺(polyimide,PI)、聚对苯二甲酸乙二酯(poly(ethylene terephthalate),PET)、聚碳酸酯(poly carbonate,PC)或聚甲基丙烯酸甲酯(poly(methyl methacrylate),PMMA),而该透明导电层(TCO)例如为氧化锌:铝(ZnO:Al)、氧化铟:锡(In2O3:Sn)、二氧化锡:氟(SnO2:F)或上述的组合。
另外,上述IB族、IIIA族及Bi的化合物可反复沉积于基板上,以增加前驱化合物的厚度,再经一气氛(atmosphere)中的热处理。或者是进行热处理后,重复沉积(deposition)与热处理步骤,以控制掺杂Bi的IB-IIIA-ⅥA化合物厚度及特性。另外,重复沉积步骤中,前驱化合物的成分可予调整。
接着,将基板置于包括该气氛(atmosphere)中进行一热处理,使该基板之上形成掺杂Bi的IB-IIIA-ⅥA化合物。上述气氛包括真空或非真空,而该气体包括氧气(O2)、氮气(N2)、氢气(H2)、氩气(Ar)或上述的组合。上述热处理的温度为约350℃~650℃,较佳为约400℃~600℃,而热处理的时间为约0.1小时~8小时,较佳为约0.3小时~6小时,最佳为0.5小时~4小时,热处理之后即可得到本发明的掺杂Bi的IB-IIIA-ⅥA化合物,其能应用于光电元件。为促进反应进行,上述气体还包括ⅥA族的气体,例如硒化氢(H2Se)、硫化氢(H2S)、硒(Se)蒸气、硫(S)蒸气、碲(Te)蒸气或上述的组合。
相较于以往使用制造IB-IIIA-VIA化合物的方法,本发明方法以掺杂Bi方式得到大晶粒且具高结晶性的IB-IIIA-VIA化合物。另一方面,本发明方法其特征在于通过掺杂Bi元素,使得IB-IIIA-VIA化合物的电性特性增加,进而提升光电元件的光电特性。
图1为依照本发明的一实施方式的太阳能电池100的示意图。太阳能电池100包含基板110、接触层120、光吸收层130、缓冲层140以及透明导电堆迭结构150。但本发明本领域普通技术人员应知,太阳能电池结构不以图1所示为限。
基板110包含玻璃、高分子基板、金属基板或透明导电层。接触层120可为包含钼的金属层,以作为太阳能电池的背电极。可利用溅镀方式形成包含钼的金属层于基板110上。
光吸收层130包含以上述实施方式制造的掺杂Bi的IB-IIIA-ⅥA化合物。举例来说,可先制备Bi、IB、IIIA的前驱物的混合物,然后以非真空浆料涂布、溅镀、蒸镀或上述的组合的方式,形成前驱物块材或薄膜于基板110上。然后,进行包含VIA族元素的气氛(atmosphere)的热处理,而形成掺杂Bi的IB-IIIA-ⅥA化合物。
缓冲层140的材质例如为CdS、ZnS或In2S3薄膜。窗层150例如包含一层透明窗层152与透明导电层154。透明窗层152的材料例如为未掺杂的氧化锌(ZnO)。透明导电层154的材料例如为氧化铟锌(ITO)、氧化锌铝(AZO)或其组合。在另一实施方式中,可省略152透明窗层,以简化电池结构。本发明的实施方式形成的包含掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层130能够帮助提升太阳能电池100的光电性能,请参考下述实施例。
实施例
实施例1
将Cu(NO3)2、Ga(NO3)3和In(NO3)3依Cu(In,Ga)Se2成分溶于乙醇中配制成溶液,并加入Bi(NO3)3作为改质剂,其中Bi(NO3)3与Cu(In,Ga)Se2摩尔数比为1:100;混合均匀后,成为前驱物溶液,利用旋转涂布法将前驱物溶液涂布于玻璃基材上,先以250℃加热30分钟排除有机物,再于高纯度氮氢混合气中,以550℃加热0.5小时,并通入硒蒸气,即可获得薄膜样品1。
经X-ray绕射图谱分析,其结果如图2所示,显示薄膜样品样品1具有(112)、(211)、(220)、(204)、(312)与(116)等主要绕射锋,符合ICDD卡编号35-1101图谱,确认薄膜样品1为黄铜矿相晶体单相结构。
另外以扫描式电子显微镜(SEM)及原子力显微镜(AFM)分析化合物样品1,实验结果显示化合物样品1的表面型态致密且分布均匀。平均粒径大小约为0.7μm,其结果如图3所示;表面粗糙度约为60nm。以霍尔量测仪(Hallmeasurement)分析化合物样品1的载子浓度为8.6*1016cm-3。
再者,以能量散射光谱仪(Energy Dispersive Spectrometer,EDS)与X光光电子能谱仪(XPS,X-ray Photoelectron Spectroscopy)分析化合物样品1,其中XPS分析结果于156.9eV和162.2eV处有Bi 4f7/2和Bi 4f5/2的特性锋,实验结果证明掺杂Bi的薄膜样品1中确实存在有Bi元素。
以glass/Mo/薄膜样品1/CdS/i-ZnO/ITO的结构制作铜铟镓硒薄膜太阳电池1;再者,以太阳能标准光源模拟器分析铜铟镓硒薄膜太阳电池1,实验结果如图4所示,显示铜铟镓硒薄膜太阳电池1的Voc(开路电压)为0.4V,Isc(短路电流密度)为33.7mA/cm2,光电转化效率为6.3%。
比较实施例1
将Cu(NO3)2、Ga(NO3)3和In(NO3)3依Cu(In,Ga)Se2成分溶于乙醇中配制成溶液,混合均匀后,成为前驱物溶液,利用旋转涂布法将前驱物溶液涂布于玻璃基材上,先以250℃加热30分钟排除有机物,再于高纯度氮氢混合气中,以550℃加热0.5小时,并通入硒蒸气,即可获得薄膜样品2。
经X-ray绕射图谱分析,显示薄膜样品2具有(112)、(211)、(220)、(204)、(312)与(116)等主要绕射锋,符合ICDD卡编号35-1101图谱,确认为黄铜矿相晶体单相结构。
以扫描式电子显微镜及原子力显微镜分析,粒径为0.3-0.6μm,平均粒径约为0.45μm,其结果如图5所示;表面粗糙度约为150nm。以霍尔量测仪分析化合物样品2的载子浓度为3.5*1016cm-3。与含Bi的样品1比较,发现不含铋(Bi-free)的样品2晶粒较小且薄膜表面较粗糙;载子浓度亦较低。再以EDS与XPS分析发现并无任何Bi的讯号,由此可知,Bi的添加确实可增加黄铜矿相的晶粒大小和致密性并增进其载子浓度。
以glass/Mo/薄膜样品2/CdS/i-ZnO/ITO的结构制作铜铟镓硒薄膜太阳电池2;再者,以太阳能标准光源模拟器分析铜铟镓硒薄膜太阳电池2,实验结果如图6所示,Voc(开路电压)为0.36V,Isc(短路电流密度)为31.2mA/cm2,显示铜铟镓硒薄膜太阳电池2的转化效率为4.4%。由此可知,加Bi(实施例1)的铜铟镓硒薄膜太阳电池1的转换效率(6.3%)确实大于未添加Bi(比较实施例1)的铜铟镓硒薄膜太阳电池2的转换效率。
实施例2
将CuCl2和InCl3依Cu0.8In1.2Se2.2成分溶于甲醇中配制成溶液,以旋转涂布法将溶液涂布于溅镀Mo的玻璃基材上,接着,配置BiCl3溶液作为改质剂,将BiCl3溶液以旋转涂布法涂布于前述溶液的涂布前驱薄膜上,其中BiCl3与Cu0.8In1.2Se2.2摩尔数比为1:50;最后,于含有硒蒸气的氢气(H2)气氛下,以600℃的温度条件进行煅烧,历时0.1小时,获得薄膜样品3。
经X-ray绕射图谱分析,其结果显示薄膜样品3具有(111)、(204)、(220)、(116)与(312)主要绕射锋,确定为黄铜矿相晶体单相结构。
另外,以扫描式电子显微镜及原子力显微镜分析化合物样品3,其平均粒径为3μm且表面粗糙度为43nm;以霍尔量测仪分析薄膜样品3的载子浓度为1.2*1018cm-3。此外,由表一、表二可得知,加Bi(实施例1)或添加Bi(实施例2)的薄膜样品1或3的粒径确实大于未添加Bi(比较实施例1)的化合物样品2,且薄膜样品1或3的粗糙度确实小于化合物样品2。载子浓度确实可以有效提升。
表一
平均粒径 | |
实施例1 | 0.7μm |
比较实施例1 | 0.45μm |
实施例2 | 3μm |
表二
平均粗糙度 | |
实施例1 | 60nm |
比较实施例1 | 150nm |
实施例2 | 43nm |
实施例3
将CuO、Ga2O3、和Se粉依CuGa0.8Se1.7成分以球磨法均匀混合,并加入(CH3CO2)3Bi作为改质剂,其中(CH3CO2)3Bi与CuGa0.8Se1.7摩尔数比为1:300。所得的粉体经干燥后,将其配制成浆料,以doctor-blading法涂布于玻璃基板,再于含有硒蒸气的氢气(H2)气氛下,以180℃的温度条件进行反应,历时20小时,即可获得薄膜样品4。
经X-ray绕射图谱分析,其结果显示薄膜样品4具有(112)、(220)、(204)、(312)与(116)/(303)等主要绕射锋,其中(116)与(303)为同位置的绕射锋,确定为黄铜矿相晶体单相结构。
实施例4
将Ag和Al依AgAlS2成分利用溅镀法沉积于已沉积Bi的TCO玻璃基材上,其中Bi与AgAlS2摩尔数比为1:60。再将其置于H2S气氛下在300℃下历时10小时进行反应,获得薄膜样品5。
经X-ray绕射图谱分析,其结果显示薄膜样品5具有(112)、(103)、(211)、(220)与(204)等主要绕射锋,确定为黄铜矿相晶体单相结构。
实施例5
将Ag(NO3)2和In(NO3)3依AgIn0.8Te1.7成分配制成电镀溶液。并加入Bi(NO3)3作为改质剂,其中Bi(NO3)3与AgIn0.8Te1.7摩尔数比为1:50。以电镀法将电镀溶液沉积于玻璃基材上,再将其置于Te蒸汽300℃下进行反应,获得薄膜样品6。
经X-ray绕射图谱分析,其结果显示薄膜样品6具有(112)、(220)、(204)、(312)、(303)/(116)等主要绕射锋,其中(303)与(116)为同位置的绕射锋,确定为黄铜矿相晶体单相结构。
实施例6
将CuCl2、AlCl3和SeCl4依CuAlSe2成分溶于去离子水中配制成溶液。并加入Bi(CH3COO)3作为改质剂,其中,Bi(CH3COO)3与CuAlSe2摩尔数比为1:1000混合均匀后,成为前驱物溶液,利用喷镀法将前驱物溶液涂布于高分子基板上,再于含真空环境中,以400℃加热10小时,即可获得薄膜样品7。
经X-ray绕射图谱分析,其结果显示薄膜样品7具有(112)、(220)、(204)、(312)与(116)等主要绕射锋,确定为黄铜矿相晶体单相结构。
实施例7-10
将Cu(NO3)2、Ga(NO3)3和In(NO3)3依Cu(In,Ga)Se2成分溶于乙醇中配制成溶液,并加入Bi(NO3)3作为改质剂,其中Bi(NO3)3与Cu(In,Ga)Se2摩尔数比为1.5:100;混合均匀后,成为前驱物溶液,利用旋转涂布法将前驱物溶液涂布于玻璃基材上,先以250℃加热30分钟排除有机物,再于高纯度氮氢混合气中,并通入硒蒸气,升温至350℃、400℃、450℃和500℃不持温即取出并获得薄膜样品8(实施例7)、9(实施例8)、10(实施例9)和11(实施例10)。
经X-ray绕射图谱分析,显示薄膜样品8和9的组成为黄铜矿相和Cu2-xSe相共存;薄膜样品10和11具有(112)、(211)、(220)、(204)、(312)与(116)等主要绕射锋,符合ICDD卡编号35-1101图谱,确认为黄铜矿相晶体单相结构形成。
比较实施例2-5
将Cu(NO3)2、Ga(NO3)3和In(NO3)3依Cu(In,Ga)Se2成分溶于乙醇中配制成溶液,混合均匀后,成为前驱物溶液,利用旋转涂布法将前驱物溶液涂布于玻璃基材上,先以250℃加热30分钟排除有机物,再于高纯度氮氢混合气中,并通入硒蒸气,升温至350℃、400℃、450℃和500℃不持温即取出并获得薄膜样品12(比较实施例2)、13(比较实施例3)、14(比较实施例4)和15(比较实施例5)。
经X-ray绕射图谱分析,显示薄膜样品12和13的组成属于Cu2-xSe相;薄膜样品14的组成为黄铜矿相和Cu2-xSe相共存;薄膜样品15具有(112)、(211)、(220)、(204)、(312)与(116)等主要绕射锋,符合ICDD卡编号35-1101图谱,确认为黄铜矿相晶体单相结构形成。
由此可知,加Bi(实施例9)的薄膜样品10的黄铜矿相单相生成温度(450℃)确实低于未添加Bi(比较实施例5)的薄膜样品15的黄铜矿相单相生成温度(500℃)。
实施例11
将CuGa金属与In金属依Cu(In,Ga)Se2成分以溅镀法沈积于基材上,再以溅镀沈积加入Bi金属作为改质剂,分别堆迭后做为前驱膜,在高纯度氮氢混合气中,以550℃加热0.5小时,并通入硒蒸气,即可获得薄膜样品16。
以X-ray绕射图谱进行分析,其薄膜样品显示具有(112)、(211)、(220)、(204)、(312)与(116)等主要绕射锋,符合ICDD卡编号35-1101图谱,确认薄膜样品16符合黄铜矿相晶体单相结构。另以扫描式电子显微镜(SEM)及分析化合物样品16,实验结果显示化合物样品16的表面型均匀且致密,其平均粒径约为2-2.5μm。以霍尔量测仪(Hall measurement)分析化合物样品16的载子浓度为1.2*1017cm-3。再者,以能量散射光谱仪(Energy Dispersive Spectrometer,EDS)分析化合物样品16,实验结果证明掺杂Bi的薄膜样品16中确实存在有Bi元素。
以glass基材/Mo薄膜/薄膜样品16/CdS/i-ZnO/ITO的结构结合制作铜铟镓硒薄膜太阳电池16;并以太阳能标准光源模拟器分析铜铟镓硒薄膜太阳电池16,显示铜铟镓硒薄膜太阳电池16的光电转化效率为8.55%。
比较实施例6
将CuGa金属与In金属依Cu(In,Ga)Se2成分以溅镀法沉积于基材上,分别堆迭后形成前驱膜。再于高纯度氮氢混合气中,以550℃加热0.5小时,并通入硒蒸气,即可获得薄膜样品17。
由X-ray绕射图谱分析,显示其薄膜样品17具有(112)、(211)、(220)、(204)、(312)与(116)等主要绕射锋,符合ICDD卡编号35-1101图谱,其分析结果确认为黄铜矿相晶体单相结构。
以霍尔量测仪分析薄膜样品17的载子浓度为8.6*1016cm-3。并与含Bi的样品16比较,可知不含铋(Bi-free)的样品17的载子浓度较低。再以EDS分析发现并无任何Bi的讯号,由以上结果可知,Bi的添加确实可以提高其载子浓度。
以glass基材/Mo薄膜/薄膜样品17/CdS/i-ZnO/ITO的结构结合制作铜铟镓硒薄膜太阳电池17;并以太阳能标准光源模拟器分析铜铟镓硒薄膜太阳电池17,显示铜铟镓硒薄膜太阳电池17的转化效率为7.57%。由此可知,加Bi(实施例11)的铜铟镓硒薄膜太阳电池16的转换效率(8.55%)确实大于未添加Bi(比较实施例6)的铜铟镓硒薄膜太阳电池17的转换效率。
因此,根据本发明的实施方式,光吸收层的掺杂Bi的IB-IIIA-ⅥA化合物的晶粒的平均粒径大于或等于0.6μm,较佳平均粒径大于或等于0.8μm,最佳平均粒径大于或等于1.0μm。
并由上述实施例可知,以本发明的实施方式的制程掺杂Bi至原本光吸收层材料(IB-IIIA-ⅥA化合物)中,确实明显提升光吸收层的载子浓度、提高结晶性,增加晶粒尺寸以及降低粗糙度,而能够有效提升太阳能电池的转换效率。
Claims (13)
1.一种制造掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层的方法,其特征在于包括下列步骤:
(A)沉积含有元素周期表IB族、IIIA族及Bi化合物的先驱薄膜(theprecursor films),其中,沉积方法包含溶液涂布、溅镀、蒸镀或上述的组合;以及
(B)在含有ⅥA族化合物的气氛下对该先驱薄膜进行热处理,其中,该IB-IIIA-ⅥA与Bi的摩尔数比为10:1至100:1。
2.根据权利要求1所述的制造掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层的方法,其中,该IB族元素为选自铜、银、金及上述组合所构成的组群。
3.根据权利要求1所述的制造掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层的方法,其中,该IIIA族元素为选自硼、铝、镓、铟、铊及上述组合所构成的组群。
4.根据权利要求1所述的制造掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层的方法,其中,该VIA族元素为选自氧、硫、硒、碲、钋及上述组合所构成的组群。
5.根据权利要求1所述的制造掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层的方法,其中,该步骤(A)还包括将IA族及/或ⅥA族化合物加入该先驱薄膜中。
6.根据权利要求1所述的制造掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层的方法,其中,该步骤(A)还包括将先驱薄膜进行热处理。
7.根据权利要求6所述的制造掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层的方法,其中热处理温度为50℃–650℃。
8.根据权利要求1所述的制造掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层的方法,其中,该步骤(A)的沉积方法包括真空、非真空的镀膜制程或上述的组合。
9.根据权利要求1所述的制造掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层的方法,其中该溶液涂布方法包括旋转涂布、狭缝涂布、挤压涂布、淋幕涂布、斜板涂布、浸镀、刮刀涂布或上述方法的组合。
10.根据权利要求1所述的制造掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层的方法,其中该步骤(B)的气氛包括真空或非真空。
11.根据权利要求10所述的制造掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层的方法,其中该气氛包括氧气(O2)、氮气(N2)、氢气(H2)、氩气(Ar)、硒化氢(H2Se)、硫化氢(H2S)、硒(Se)蒸气、硫(S)蒸气、碲(Te)蒸气或上述的组合。
12.一种包含权利要求1-11中任一项所述的掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层的太阳能电池。
13.根据权利要求12所述的太阳能电池,其中该光吸收层的该掺杂Bi的IB-IIIA-ⅥA化合物的晶粒的平均粒径大于或等于0.6μm。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100142833 | 2011-11-22 | ||
TW100142833 | 2011-11-23 | ||
TW101143298 | 2012-11-20 | ||
TW101143298A TWI500170B (zh) | 2011-11-22 | 2012-11-20 | 製造摻雜Bi之IB-IIIA-VIA化合物之光吸收層的方法與包含其之太陽能電池 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103137437A CN103137437A (zh) | 2013-06-05 |
CN103137437B true CN103137437B (zh) | 2016-08-03 |
Family
ID=48425624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210477835.7A Expired - Fee Related CN103137437B (zh) | 2011-11-22 | 2012-11-22 | 制造掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层的方法与包含其的太阳能电池 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130125962A1 (zh) |
CN (1) | CN103137437B (zh) |
TW (1) | TWI500170B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101626933B1 (ko) * | 2013-11-29 | 2016-06-02 | 주식회사 엘지화학 | 신규한 화합물 반도체 및 그 활용 |
CN106784119B (zh) * | 2016-11-29 | 2018-04-03 | 苏州苏纳光电有限公司 | 含Bi化合物光电探测器及其制作方法 |
CN110676351B (zh) * | 2019-10-17 | 2021-06-25 | 中山大学 | 一种化合物薄膜及其制备方法、化合物薄膜太阳电池 |
CN112968067A (zh) * | 2021-02-25 | 2021-06-15 | 电子科技大学 | 一种基于Bi掺杂硫锑银的无机薄膜太阳能电池及其制备方法 |
CN113644146B (zh) * | 2021-08-09 | 2022-10-18 | 重庆文理学院 | 一种用于太阳能电池的薄膜、太阳能电池及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1241804A (zh) * | 1998-07-02 | 2000-01-19 | 国际太阳能电子技术公司 | 制造化合物半导体膜的氧化物基方法和制造有关电子器件 |
CN101589472A (zh) * | 2006-12-08 | 2009-11-25 | 索罗能源公司 | 用于ibiiiavia族化合物层的掺杂技术 |
CN102157580A (zh) * | 2010-12-20 | 2011-08-17 | 友达光电股份有限公司 | 太阳能电池及其制造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5985691A (en) * | 1997-05-16 | 1999-11-16 | International Solar Electric Technology, Inc. | Method of making compound semiconductor films and making related electronic devices |
US7306823B2 (en) * | 2004-09-18 | 2007-12-11 | Nanosolar, Inc. | Coated nanoparticles and quantum dots for solution-based fabrication of photovoltaic cells |
US20090145472A1 (en) * | 2007-12-10 | 2009-06-11 | Terra Solar Global, Inc. | Photovoltaic devices having conductive paths formed through the active photo absorber |
US20100147364A1 (en) * | 2008-12-16 | 2010-06-17 | Solopower, Inc. | Thin film photovoltaic module manufacturing methods and structures |
US8512809B2 (en) * | 2010-03-31 | 2013-08-20 | General Electric Company | Method of processing multilayer film |
US20120214293A1 (en) * | 2011-02-22 | 2012-08-23 | Serdar Aksu | Electrodepositing doped cigs thin films for photovoltaic devices |
-
2012
- 2012-11-20 TW TW101143298A patent/TWI500170B/zh active
- 2012-11-21 US US13/684,128 patent/US20130125962A1/en not_active Abandoned
- 2012-11-22 CN CN201210477835.7A patent/CN103137437B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1241804A (zh) * | 1998-07-02 | 2000-01-19 | 国际太阳能电子技术公司 | 制造化合物半导体膜的氧化物基方法和制造有关电子器件 |
CN101589472A (zh) * | 2006-12-08 | 2009-11-25 | 索罗能源公司 | 用于ibiiiavia族化合物层的掺杂技术 |
CN102157580A (zh) * | 2010-12-20 | 2011-08-17 | 友达光电股份有限公司 | 太阳能电池及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20130125962A1 (en) | 2013-05-23 |
CN103137437A (zh) | 2013-06-05 |
TWI500170B (zh) | 2015-09-11 |
TW201322460A (zh) | 2013-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Ramasamy et al. | Routes to copper zinc tin sulfide Cu 2 ZnSnS 4 a potential material for solar cells | |
Mane et al. | Chemical deposition method for metal chalcogenide thin films | |
Washio et al. | 6% Efficiency Cu 2 ZnSnS 4-based thin film solar cells using oxide precursors by open atmosphere type CVD | |
Lin et al. | Mechanistic aspects of preheating effects of electrodeposited metallic precursors on structural and photovoltaic properties of Cu2ZnSnS4 thin films | |
Han et al. | Hydrazine processed Cu 2 SnS 3 thin film and their application for photovoltaic devices | |
Suryawanshi et al. | Improved photoelectrochemical performance of Cu2ZnSnS4 (CZTS) thin films prepared using modified successive ionic layer adsorption and reaction (SILAR) sequence | |
Lee et al. | Fabrication of CuInS 2 films from electrodeposited Cu/In bilayers: effects of preheat treatment on their structural, photoelectrochemical and solar cell properties | |
Rajesh et al. | Synthesis of Cu 2 ZnSnS 4 thin films by dip-coating method without sulphurization | |
CN103137437B (zh) | 制造掺杂Bi的IB-IIIA-ⅥA化合物的光吸收层的方法与包含其的太阳能电池 | |
Klochko et al. | Development of a new thin film composition for SnS solar cell | |
Paraye et al. | Effect of pH and sulfur precursor concentration on electrochemically deposited CZTS thin films using glycine as the complexing agent | |
Mkawi et al. | Influence of substrate temperature on the properties of electrodeposited kesterite Cu 2 ZnSnS 4 (CZTS) thin films for photovoltaic applications | |
Echendu et al. | Electrochemical deposition and characterization of ZnOS thin films for photovoltaic and photocatalysis applications | |
JP5874645B2 (ja) | 化合物半導体薄膜太陽電池及びその製造方法 | |
CN108461556A (zh) | 制备高效czts太阳能电池的前驱体溶液及其电池制备与应用 | |
Avellaneda et al. | Synthesis of Cu2SnS3, Cu3SnS4, and Cu4SnS4 thin films by sulfurization of SnS-Cu layers at a selected temperature and/or Cu layers thickness | |
Ruan et al. | Effect of potassium doping for ultrasonic sprayed Cu 2 SnS 3 thin films for solar cell application | |
Koskela et al. | Solution processing Cu3BiS3 absorber layers with a thiol–amine solvent mixture | |
Medina-Montes et al. | Physical properties of photoconductive Ag-Sb-S thin films prepared by thermal evaporation | |
Fathy et al. | SnS nanocrystalline thin films for n-CdS/p-SnS solar cell devices | |
Saber et al. | Annealing study of electrodeposited CuInSe 2 and CuInS 2 thin films | |
Ojo et al. | The influence of ZnS crystallinity on all-electroplated ZnS/CdS/CdTe graded bandgap device properties | |
Fernandez et al. | Preparation and photocharacterization of Cu–Sb–Se films by electrodeposition technique | |
Dhaygude et al. | Electrodeposited nanosphere like Cd x Zn 1− x S electrodes for photoelectrochemical cell | |
Schimmel et al. | Anodic formation of binary and ternary compound semiconductor films for photovoltaic cells |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160803 Termination date: 20191122 |
|
CF01 | Termination of patent right due to non-payment of annual fee |