CN103134951A - Three-dimensional microcomputer electric transducer - Google Patents
Three-dimensional microcomputer electric transducer Download PDFInfo
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- CN103134951A CN103134951A CN2011103968881A CN201110396888A CN103134951A CN 103134951 A CN103134951 A CN 103134951A CN 2011103968881 A CN2011103968881 A CN 2011103968881A CN 201110396888 A CN201110396888 A CN 201110396888A CN 103134951 A CN103134951 A CN 103134951A
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Abstract
The invention provides a three-dimensional microcomputer electric transducer. The three-dimensional microcomputer electric transducer comprises a plurality of movable first electrodes, a plurality of movable second electrodes, a plurality of fixed third electrodes, and a plurality of fixed fourth electrodes, wherein the first electrodes and the adjacent third electrodes form at least one first capacitor and at least one second capacitor, and the second electrodes and the adjacent fourth electrodes form at least one third capacitor. The capacitance of the first capacitor changes displacement of a mass block, the displacement is reflected in a first axis direction, the capacitance of the second capacitor changes displacement of the mass block, the displacement is reflected in a second axis direction, and the capacitance of the third capacitor changes displacement of the mass block, and the displacement is reflected in a third axis direction. The first axis, the second axis and the third axis define a three-dimensional coordinate system.
Description
Technical field
The present invention relates to a kind of three axis microelectromechanicdevice sensors, refer to especially a kind of micro-electro-mechanical sensors of integrating isoplanar induction electrode and out-of-plane induction electrode in vertical direction.
Background technology
Microcomputer electric component has various application, and a kind of making capacitance type sensor that is applied as wherein is as accelerometer, microphone etc.The capacitance type sensor of prior art has isoplanar (in-plane sensor) and out-of-plane (out-of-plane) sensor two classes, the former is the capacitance variations on sensing horizontal direction (x-y plane), and the latter is the capacitance variations on sensing vertical direction (z axle).The prior art of relevant same plane sensor or its method for making for example can be consulted United States Patent (USP) the 5th, 326, and No. 726, the 5th, 847, No. 280, the 5th, 880, No. 369, the 6th, 877, No. 374, the 6th, 892, No. 576, No. 2007/0180912.The prior art of relevant out-of-plane sensor or its method for making for example can be consulted United States Patent (USP) the 6th, 402, and No. 968, the 6th, 792, No. 804, the 6th, 845, No. 670, the 7th, 138, No. 694, the 7th, 258, No. 011.So these patent documentations there is no the sensor of capacitance variations on method while sensing three direction of principal axis.
In view of this, the present invention is namely for above-mentioned the deficiencies in the prior art, propose a kind of three axis microelectromechanicdevice sensors, can integrate isoplanar induction electrode and out-of-plane induction electrode in vertical direction, with the sensing function of promoting sensor and the area that reduces microcomputer electric component.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art and defective, propose a kind of three axis microelectromechanicdevice sensors of integrating isoplanar induction electrode and out-of-plane induction electrode in vertical direction, to reduce the area of plane of sensor.
For reaching above-mentioned purpose, with regard to one of them viewpoint speech, the invention provides a kind of three axis microelectromechanicdevice sensors, comprise: a substrate; One fixed frame section is fixed on this substrate; One mass; At least one spring part connects this fixed frame section and this mass; A plurality of the first electrodes and a plurality of the second electrode extend towards this fixed frame section from this mass respectively; And a plurality of third electrodes and a plurality of the 4th electrode, extend towards this mass from this fixed frame section respectively, wherein this first electrode is adjacent this third electrode at least one the first electric capacity of formation and at least one the second electric capacity, and this second electrode is adjacent the 4th at least one the 3rd electric capacity of electrode formation; Wherein the capacitance of this first electric capacity changes this mass of reaction in one first axial displacement, the capacitance of this second electric capacity changes this mass of reaction in one second axial displacement, the capacitance of the 3rd electric capacity changes this mass of reaction in one the 3rd axial displacement, and this first, second and third axle definition, one three-dimensional coordinate system.
In a kind of enforcement kenel, be provided with this third electrode in the middle of adjacent two these the first electrodes therein.
In a kind of enforcement kenel, be provided with two these third electrodes in the middle of adjacent two these the first electrodes therein.
In a kind of enforcement kenel, these a plurality of first electrodes and this a plurality of third electrodes extend along the direction of this first axle or this second axle therein.
In aforementioned a kind of enforcement kenel, these a plurality of second electrodes comprise a plurality of upper the second electrodes and a plurality of lower the second electrodes, again should upper second electrode and this time the second electrode be located at alternately the side of this mass and underlapped on the direction of the 3rd axle.
In aforementioned a kind of enforcement kenel, the 4th electrode comprises a plurality of upper the 4th electrodes and a plurality of lower the 4th electrodes, again should upper the 4th electrode and this time the 4th electrode be located at alternately the inboard of this fixed frame section and underlapped on the direction of the 3rd axle.
In aforementioned a kind of enforcement kenel, should upper second electrode and this time the 4th electrode have on the direction of the 3rd axle overlapping forming one the 3rd electric capacity, this time the second electrode and on this 4th electrode have overlapping to form another the 3rd electric capacity on the direction of the 3rd axle.
In a kind of enforcement kenel, separately comprise a whole differential acceleration sensing circuit therein, the differential signal of its acquisition four adjacent these first electric capacity, four adjacent these second electrodes or four adjacent these third electrodes, and amplify this differential signal.
In a kind of enforcement kenel, separately comprise a differential type acceleration sensing circuit therein, the differential signal of its acquisition two adjacent these first electric capacity, two adjacent these second electrodes or two adjacent these third electrodes, and amplify this differential signal.
In aforementioned a kind of enforcement kenel, these a plurality of second electrodes comprise a plurality of upper the second electrodes and a plurality of lower the second electrode, two adjacently have two this time the second electrodes between should upper second electrodes, and this upper second electrode and this time the second electrode are located at the side of this mass and underlapped on the direction of the 3rd axle again.
In aforementioned a kind of enforcement kenel, these a plurality of the 4th electrodes comprise a plurality of upper the 4th electrodes and a plurality of lower the 4th electrode, two adjacently have two this time the 4th electrodes between should upper the 4th electrodes, and this upper the 4th electrode and this time the 4th electrode are located at the inboard of this fixed frame section and underlapped on the direction of the 3rd axle again.
In a kind of enforcement kenel, the 4th electrode is between this first electrode and this substrate therein.
In a kind of enforcement kenel, the 4th electrode is between this third electrode and this substrate therein.
In aforementioned a kind of enforcement kenel, this second electrode is between this first electrode and this substrate.
In a kind of enforcement kenel, this third electrode is between the 4th electrode and this substrate therein.
In aforementioned a kind of enforcement kenel, this first electrode is between this second electrode and this substrate.
In a kind of enforcement kenel, the quantity of this spring part is four therein, and connects symmetrically this mass to this fixed frame section.
Therein in a kind of enforcement kenel, this fixed frame section is enclosure wall, a plurality of cylinder or a plurality of body of wall of sealing.
In a kind of enforcement kenel, this mass has isoplanar displacement and out-of-plane displacement with respect to the plane of this first axle and the definition of this second axle therein.
Illustrate in detail below by specific embodiment, when the effect that is easier to understand purpose of the present invention, technology contents, characteristics and reaches.
Description of drawings
Fig. 1 shows the top view of the three axis microelectromechanicdevice sensors of one embodiment of the invention;
Fig. 2 A is the cut-open view along I-I profile line in Fig. 1;
Fig. 2 B is the cut-open view along II-II profile line in Fig. 1;
Fig. 3 A is the cut-open view along III-III profile line in Fig. 1;
Fig. 3 B is the cut-open view along IV-IV profile line in Fig. 1;
Fig. 3 C is the cut-open view along III-III profile line in Fig. 1;
Fig. 3 D shows one embodiment of the invention differential (fully differential) formula acceleration sensing circuit entirely;
Fig. 4 A shows the cut-open view of the three axis microelectromechanicdevice sensors of another embodiment of the present invention;
Fig. 4 B shows the cut-open view of three axis microelectromechanicdevice sensors in Fig. 4 A;
Fig. 4 C shows a differential type acceleration sensing circuit;
Fig. 5 A shows the cut-open view of the three axis microelectromechanicdevice sensors of another embodiment of the present invention;
Fig. 5 B shows another cut-open view of three axis microelectromechanicdevice sensors in Fig. 5 A.
Symbol description in figure
10,40,50 3 axis microelectromechanicdevice sensors
11 substrates
12,12 ' fixed frame section
The upper fixed electorde of 12a, 12a ' section
The lower fixed electorde of 12b, 12b ' section
123 third electrodes
The 4th electrode on 124
124 ' time the 4th electrode
127 metal levels
128 vertical conducting posts
13,13 ' mass
The upper traveling electrode of 13a, 13a ' section
The lower traveling electrode of 13b, 13b ' section
131 first electrodes
The second electrode on 132
132 ' time the second electrode
135 insulation courses
136 metal levels
138 vertical conducting posts
14 spring parts
A, B, C, D node
C1, C1 ' the first electric capacity
C2 the second electric capacity
C3, C3 ' the 3rd electric capacity
The OP operational amplifier
Vm+, Vm-voltage
Vout
+, Vout
-Output signal
Embodiment
Fig. 1 shows the top view of the three axis microelectromechanicdevice sensors of one embodiment of the invention.Three axis microelectromechanicdevice sensors 10 comprise a substrate 11 (referring to Fig. 2 A), a fixed frame section 12, a mass 13 and a plurality of spring part 14.Fixed frame section 12 is fixed on this substrate 11, and around mass 13, but is not limited to the enclosure wall shape of graphic middle sealing, also a plurality of cylinders or a plurality of body of wall.A plurality of spring parts 14 connect the fixed frame section 12 in the outside and the mass 13 of central authorities, and make mass 13 to produce isoplanar (in plane) motion and out-of-plane (out of plane) motion with respect to substrate 11 by its elasticity.Isoplanar motion herein refers to the motion on XY plane (parallel substrate 11), and the Property of Anti-plane Movement motion means the component motion on Z axis again.
Fig. 2 A is the cut-open view along I-I profile line in Fig. 1, and Fig. 2 B is the cut-open view along II-II profile line in Fig. 1 again.A plurality of upper traveling electrode 13a of section and the lower traveling electrode 13b of section extend towards fixed frame section 12 from mass 13, wherein go up the traveling electrode 13a of section and are connected with mass 13 with the lower traveling electrode 13b of section, therefore can move together along with mass 13.In the present embodiment, the upper traveling electrode 13a of section and the lower traveling electrode 13b of section are to be illustrated in staggered mode by top view, wherein go up the traveling electrode 13a of section and lay respectively at different rank, position height from the lower traveling electrode 13b of section with respect to substrate 11.particularly, on each, the traveling electrode 13a of section comprises a plurality of the first electrodes 131 and at least one upper the second electrode 132, the lower traveling electrode 13b of section comprises that (on the present embodiment, the second electrode 132 and lower the second electrode 132 ' only are illustration at least one lower the second electrode 132 ', position both can be exchanged in subsequent embodiment, therefore do not limit the application's protection domain), again the first electrode 131 and upper the second electrode 132 in the vertical direction (Z axis) have overlapping, it is not vertically superposed but upper the second electrode 132 and lower the second electrode 132 ' are located at the side of mass 13 alternately.
Moreover a plurality of upper fixed electorde 12a of section and the lower fixed electorde 12b of section self-retaining frame section 12 extend towards mass 13, wherein go up the fixed electorde 12a of section and the lower fixed electorde 12b of section and are connected with fixed frame section 12, therefore can be along with mass 13 moves together.In the present embodiment, the upper fixed electorde 12a of section and the lower fixed electorde 12b of section are to be configured in staggered mode by top view, wherein go up the fixed electorde 12a of section and lay respectively at different rank, position height from the lower fixed electorde 12b of section with respect to substrate 11.Particularly, the upper fixed electorde 12a of section comprises a plurality of third electrodes 123 and a plurality of upper the 4th electrode 124, the lower fixed electorde 12b of section comprises a plurality of lower the 4th electrodes 124 ', again third electrode 123 and upper the 4th electrode 124 in the vertical direction (Z axis) have overlapping, not vertically superposed but upper the 4th electrode 124 and lower the 4th electrode 124 ' are located at the inboard of fixed frame section 12 alternately.
Referring to Fig. 2 A and Fig. 2 B, it is (another that lower the 4th electrode 124 ' of movably going up the second electrode 132 and fixing consists of one the 3rd capacitor C 3, the first capacitor C 1 and the second capacitor C 2 will be in hereinafter explanations), movably lower the second electrode 132 ' and fixing upper the 4th electrode 124 consist of another the 3rd capacitor C 3 again.Lower the second electrode 132 ' can be insulated layer 135 coating, and lower the 4th electrode 124 ' also can be insulated layer 135 coating again.The first electrode 131 comprises a plurality of metal levels 136, and third electrode 123 comprises a plurality of metal levels 127 again, and some of metal levels 136 and metal level 127 are embedded in insulation course 135.In addition, also can be learnt by Fig. 1, Fig. 2 A and Fig. 2 B, the upper traveling electrode 13a of section that is extended by mass 13 is positioned at the top of the lower fixed electorde 12b of section that extends of fixed frame section 12 accordingly, as shown in Fig. 1 and Fig. 2 A, and the upper fixed electorde 12a of section that extends of fixed frame section 12 is positioned at the top of the lower traveling electrode 13b of section that is extended by mass 13 accordingly, as shown in Fig. 1 and Fig. 2 B.
Fig. 3 A shows the cut-open view along III-III profile line in Fig. 1.Be provided with a upper traveling electrode 13a of section that is extended by mass 13 between the two adjacent upper fixed electorde 12a of section that extended by fixed frame section 12, wherein go up the traveling electrode 13a of section the first electrode 131 can and third electrode 123 formation the first capacitor C 1 of the adjacent upper fixed electorde 12a of section.In Fig. 1 and Fig. 3 A, if mass 13 moves and when the upper traveling electrode 13a of section is moved right as shown in Figure 3A along X-axis, the capacitance of two the first capacitor C 1 can increase (in figure with
The expression), and the capacitance of another two the first capacitor C 1 can reduce (in figure with
Expression).
Fig. 3 B is that wherein the bearing of trend of IV-IV profile line is vertical with the bearing of trend of III-III profile line along the cut-open view of IV-IV profile line in Fig. 1.Similarly, be provided with the upper traveling electrode 13a of section that is extended by mass 13 between the two adjacent upper fixed electorde 12a of section that extended by fixed frame section 12, wherein go up the traveling electrode 13a of section the first electrode 131 can and third electrode 123 formation the second capacitor C 2 of the adjacent upper fixed electorde 12a of section.Similarly, if mass 13 moves and when making the upper traveling electrode 13a of section moving right as shown in Fig. 3 B along Y-axis, the capacitance of two the second capacitor C 2 can increase (in figure with
The expression), the capacitance of another two the second capacitor C 2 can reduce (in figure with
Expression).Based on as can be known above-mentioned, the capacitance variation of the first capacitor C 1 can be used to the acceleration of representation quality piece 13 on X-direction, and the capacitance variation of the second capacitor C 2 can be used to the acceleration of representation quality piece 13 on Y direction.In the present embodiment, optionally make a plurality of metal levels 136 interconnect by vertical conducting post 138, and can make a plurality of metal levels 127 interconnect by vertical conducting post 128.
Fig. 3 C shows the cut-open view along III-III profile line in Fig. 1, wherein differently from Fig. 3 A is, Fig. 3 C represents the enforcement state that the capacitance of the 3rd capacitor C 3 changes, and Fig. 3 A represents the enforcement state that the capacitance of the first capacitor C 1 changes.Please refer to Fig. 1 and Fig. 3 C, be provided with the traveling electrode 13b of section between two adjacent lower fixed electorde 12b of section, go up again the second electrode 132 and lower the 4th electrode 124 ' formation the 3rd capacitor C 3, upper the 4th electrode 124 and lower the second electrode 132 ' also consist of the 3rd capacitor C 3.When mass 13 moves and when making the upper traveling electrode 13a of section and the lower traveling electrode 13b of section moving down as shown in Figure 3 C along Z axis, the capacitance of two the 3rd capacitor C 3 can increase (in figure with
Expression), and another two the 3rd capacitor C 3 can reduce (in figure with
Expression).
Fig. 3 D shows one embodiment of the invention differential (fully differential) formula acceleration sensing circuit entirely.For illustrating, the principle of this part can also be used for the enforcement kenel that aforesaid the first capacitor C 1 and the second capacitor C 2 illustrate to the present embodiment with the 3rd capacitor C 3 in Fig. 3 C.Please also refer to Fig. 3 C and Fig. 3 D, when the top that is provided with the upper traveling electrode 13a of section and the lower traveling electrode 13b of section by the top with the lower fixed electorde 12b of section is provided with the upper fixed electorde 12a of section, the design of coupled circuit just can form the whole differential capacitance sensing framework with 4 the 3rd capacitor C 3, that is move and make when moving up and down electrode part 13a, 13b moving down as shown in Figure 3 C along Z axis when mass 13, the capacitance of two the 3rd capacitor C 3 can increase (in figure with
Expression), and another two the 3rd capacitor C 3 can reduce (in figure with
Expression).
In Fig. 3 D, node C and D couple respectively high frequency but the voltage Vm of phase phasic difference 180 degree
-And Vm
+When mass 13 was motionless, the capacitance of C3 remained unchanged, therefore operational amplifier OP only can export Vm
+With Vm
-Voltage signal after subtracting each other.When if mass 13 produces the acceleration of low frequency to the base material direction motion, the capacitance of four the 3rd capacitor C 3 is direction and changing as shown by arrows, the voltage of four groups of capacitance variations generations can mix also with the voltage of input, therefore operational amplifier OP has the amplification signal output of High-frequency and low-frequency simultaneously.This output signal (Vout
+, Vout
-) high-frequency signals of input and low frequency capacitance variations signal that acceleration causes can be arranged simultaneously.This kind whole differential circuit can improve element sensitivity, reduce the noise on the 3rd capacitor C 3, and reduction or counteracting and C1, the coupling (cross talk) to each other of C2 electrode.
Fig. 4 A shows the cut-open view of the three axis microelectromechanicdevice sensors of another embodiment of the present invention.Referring to the fixed electorde 12a of section on two is set between the traveling electrode 13a of section on three axis microelectromechanicdevice sensors 40, two shown in figure, reaches between twice fixed electorde 12b of section the traveling electrode 13b of section is set twice.When three axis microelectromechanicdevice sensors 40 move and when the upper traveling electrode 13a of section can be moved right as Fig. 4 A along X-axis, the capacitance of two the first capacitor C 1 ' can increase (in figure with
Expression), and another two the first capacitor C 1 ' can reduce (in figure with
Expression).Increase but the first adjacent capacitor C 1 ' of central authorities is a capacitance, another capacitance reduces.
Fig. 4 B shows the cut-open view of three axis microelectromechanicdevice sensors in Fig. 4 A, wherein differently from Fig. 4 A be: Fig. 4 B represents the enforcement state that three axis microelectromechanicdevice sensors 40 move along Z-direction, and Fig. 4 A means the enforcement state that three axis microelectromechanicdevice sensors 40 move along X-direction.Referring to three axis microelectromechanicdevice sensors 40 shown in Fig. 4 B, when three axis microelectromechanicdevice sensors 40 move along Z axis, these twice traveling electrode 13b of section between twice fixed electorde 12b of section can move down, and on two on this between the fixed electorde 12a of section two the traveling electrode 13a of section also can move down, therefore just can make the capacitance of the 3rd capacitor C 3 ' change.Specifically, when lower the second electrode 132 ' of the traveling electrode 13b of section moves down instantly, just can with the 4th electrode 124 of the upper fixed electorde 12a of section away from, the capacitance of the 3rd capacitor C 3 ' between so lower the second electrode 132 ' and lower the 4th electrode 124 just can reduce; Similarly, when upper the second electrode 132 of the upper traveling electrode 13a of section moves down, just can so descend the capacitance of the 3rd capacitor C 3 ' between the second electrode 132 and lower the 4th electrode 124 ' to increase near lower the 4th electrode 124 ' of the lower fixed electorde 12b of section.
Compared to the whole differential acceleration sensing circuit of Fig. 3 D, Fig. 4 C shows a differential type acceleration sensing circuit.Operational amplifier OP can amplify voltage that the low frequency capacitance variations of two first capacitor C 1 ' (or the 3rd capacitor C 3 ' etc.) produces and the HF voltage of input, and output signal.The low-frequency voltage signal of this output can represent the acceleration on X-axis.
Fig. 5 A shows the cut-open view of the three axis microelectromechanicdevice sensors of another embodiment of the present invention, and Fig. 5 B shows another cut-open view of three axis microelectromechanicdevice sensors in Fig. 5 A again.Referring to three axis microelectromechanicdevice sensors 50 shown in figure, a plurality of upper traveling electrode 13a ' of section and the lower traveling electrode 13b ' of section extend towards fixed frame section 12 ' from mass 13 ', and it is connected with mass 13 ', therefore can move together along with mass 13 '.The lower traveling electrode 13b ' of section comprises a plurality of the first electrodes 131 and a plurality of lower the second electrode 132 ', the upper traveling electrode 13a ' of section comprises a plurality of upper the second electrodes 132, again the first electrode 131 and lower the second electrode 132 in the vertical direction (Z axis) have overlapping, not vertically superposed but upper the second electrode 132 and lower the second electrode 132 ' are located at the side of mass 13 ' alternately.
Moreover a plurality of upper fixed electorde 12a ' of section and the lower fixed electorde 12b ' of section self-retaining frame section 12 ' extend towards mass 13 ', and it is connected with fixed frame section 12 ', therefore can be along with mass 13 ' moves together.The lower fixed electorde 12b ' of section comprises a plurality of third electrodes 123 and a plurality of lower the 4th electrode 124 ', the upper fixed electorde 12a ' of section comprises a plurality of upper the 4th electrodes 124, again third electrode 123 and upper the 4th electrode 124 in the vertical direction (Z axis) have overlapping, not vertically superposed but upper the 4th electrode 124 and lower the 4th electrode 124 ' are located at the inboard of fixed frame section 12 ' alternately.
Below for preferred embodiment, the present invention is described, just the above, for making those skilled in the art be easy to understand content of the present invention, be not only to limit interest field of the present invention.Under same spirit of the present invention, those skilled in the art can think and various equivalence changes.For example, the arrangement of fixed electorde section and traveling electrode section can be different from the illustration of previous embodiment, and for example: two move and can be provided with two fixed electorde sections or more fixed electordes section between fixed electrode section.The shape of fixed electorde and traveling electrode, and the relative position of formation electric capacity are not subjected to above-mentioned illustrative restriction.Scope of the present invention should contain above-mentioned and other all equivalences change.
Claims (22)
1. an axis microelectromechanicdevice sensor, is characterized in that, comprises:
One substrate;
One fixed frame section is fixed on this substrate;
One mass;
At least one spring part connects this fixed frame section and this mass;
A plurality of the first electrodes and a plurality of the second electrode extend towards this fixed frame section from this mass respectively; And
A plurality of third electrodes and a plurality of the 4th electrode, extend towards this mass from this fixed frame section respectively, wherein this first electrode is adjacent this third electrode at least one the first electric capacity of formation and at least one the second electric capacity, and this second electrode is adjacent the 4th at least one the 3rd electric capacity of electrode formation;
Wherein the capacitance of this first electric capacity changes this mass of reaction in one first axial displacement, the capacitance of this second electric capacity changes this mass of reaction in one second axial displacement, the capacitance of the 3rd electric capacity changes this mass of reaction in one the 3rd axial displacement, and this first, second and third axle definition, one three-dimensional coordinate system.
2. three axis microelectromechanicdevice sensors as claimed in claim 1, wherein, be provided with this third electrode between adjacent two these the first electrodes.
3. three axis microelectromechanicdevice sensors as claimed in claim 2, wherein, these a plurality of second electrodes comprise a plurality of upper the second electrodes and a plurality of lower the second electrodes, again should upper second electrode and this time the second electrode be located at alternately the side of this mass and underlapped on the direction of the 3rd axle.
4. three axis microelectromechanicdevice sensors as claimed in claim 3, wherein, the 4th electrode comprises a plurality of upper the 4th electrodes and a plurality of lower the 4th electrodes, again should upper the 4th electrode and this time the 4th electrode be located at alternately the inboard of this fixed frame section and underlapped on the direction of the 3rd axle.
5. three axis microelectromechanicdevice sensors as claimed in claim 4, wherein, should upper second electrode and this time the 4th electrode on the direction of the 3rd axle overlapping part forming one the 3rd electric capacity, this time the second electrode and on this 4th electrode have overlapping to form another the 3rd electric capacity on the direction of the 3rd axle.
6. three axis microelectromechanicdevice sensors as claimed in claim 1, wherein, be provided with two these third electrodes between adjacent two these the first electrodes.
7. three axis microelectromechanicdevice sensors as claimed in claim 6, wherein, these a plurality of second electrodes comprise a plurality of upper the second electrodes and a plurality of lower the second electrode, two adjacently have two this time the second electrodes between should upper second electrodes, and this upper second electrode and this time the second electrode are located at the side of this mass and underlapped on the direction of the 3rd axle again.
8. three axis microelectromechanicdevice sensors as claimed in claim 7, wherein, these a plurality of the 4th electrodes comprise a plurality of upper the 4th electrodes and a plurality of lower the 4th electrode, two adjacently have two this time the 4th electrodes between should upper the 4th electrodes, and this upper the 4th electrode and this time the 4th electrode are located at the inboard of this fixed frame section and underlapped on the direction of the 3rd axle again.
9. three axis microelectromechanicdevice sensors as claimed in claim 8, wherein, should upper second electrode and this time the 4th electrode on the direction of the 3rd axle overlapping part forming one the 3rd electric capacity, this time the second electrode and on this 4th electrode on the direction of the 3rd axle overlapping part to form another the 3rd electric capacity.
10. three axis microelectromechanicdevice sensors as claimed in claim 1, wherein, these a plurality of first electrodes and this a plurality of third electrodes extend along the direction of this first axle or this second axle.
11. three axis microelectromechanicdevice sensors as claimed in claim 1, wherein, separately comprise a whole differential acceleration sensing circuit, the differential signal of its acquisition four adjacent these first electric capacity, four adjacent these second electrodes or four adjacent these third electrodes, and amplify this differential signal.
12. three axis microelectromechanicdevice sensors as claimed in claim 1, wherein, separately comprise a differential type acceleration sensing circuit, the differential signal of its acquisition two adjacent these first electric capacity, two adjacent these second electrodes or two adjacent these third electrodes, and amplify this differential signal.
13. three axis microelectromechanicdevice sensors as claimed in claim 1, wherein, the 4th electrode is between this first electrode and this substrate.
14. three axis microelectromechanicdevice sensors as claimed in claim 13, wherein, this second electrode is between this first electrode and this substrate.
15. three axis microelectromechanicdevice sensors as claimed in claim 1, wherein, the 4th electrode is between this third electrode and this substrate.
16. three axis microelectromechanicdevice sensors as claimed in claim 15, wherein, this third electrode is between the 4th electrode and this substrate.
17. three axis microelectromechanicdevice sensors as claimed in claim 16, wherein, this first electrode is between this second electrode and this substrate.
18. three axis microelectromechanicdevice sensors as claimed in claim 1, wherein, the quantity of this spring part is four, and connects symmetrically this mass to this fixed frame section.
19. three axis microelectromechanicdevice sensors as claimed in claim 1, wherein, this fixed frame section enclosure wall, a plurality of cylinder or a plurality of body of wall for sealing.
20. three axis microelectromechanicdevice sensors as claimed in claim 1, wherein, this mass has isoplanar displacement and out-of-plane displacement with respect to the plane of this first axle and the definition of this second axle.
21. an axis microelectromechanicdevice sensor is characterized in that, comprises:
One substrate;
One fixed frame section is fixed on this substrate;
One mass;
At least one spring part connects this fixed frame section and this mass;
A plurality of the first electrodes and a plurality of the second electrode extend towards this fixed frame section from this mass respectively; And
A plurality of third electrodes and a plurality of the 4th electrode, extend towards this mass from this fixed frame section respectively, this first electrode of wherein arranging along one first direction of principal axis is adjacent this third electrode and consists of at least one the first electric capacity, this first electrode of arranging along one second direction of principal axis is adjacent at least one the second electric capacity of this third electrode formation, this second electrode is adjacent the 4th electrode overlapping part on one the 3rd direction of principal axis and consists of at least one the 3rd electric capacity, and this first axle, the second axle and the 3rd axle are mutually vertical.
22. three axis microelectromechanicdevice sensors as claimed in claim 21, wherein, the capacitance of this first electric capacity changes this mass of reaction in this first axial displacement, the capacitance of this second electric capacity changes this mass of reaction in this second axial displacement, the capacitance of the 3rd electric capacity changes this mass of reaction in the 3rd axial displacement, and this first, second and third axle definition, one three-dimensional coordinate system.
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| CN201110396888.1A CN103134951B (en) | 2011-12-02 | 2011-12-02 | Three-dimensional microcomputer electric transducer |
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|---|---|---|---|
| CN201110396888.1A CN103134951B (en) | 2011-12-02 | 2011-12-02 | Three-dimensional microcomputer electric transducer |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107782913A (en) * | 2016-08-26 | 2018-03-09 | 深迪半导体(上海)有限公司 | A kind of three axle capacitive accelerometers |
| CN109205545A (en) * | 2017-06-29 | 2019-01-15 | 英飞凌技术德累斯顿有限责任公司 | Micro mechanical sensor and method for manufacturing micro mechanical sensor |
| CN110127591A (en) * | 2018-02-08 | 2019-08-16 | 原相科技股份有限公司 | Sensor package and preparation method thereof |
Citations (3)
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| CN1598597A (en) * | 2004-07-19 | 2005-03-23 | 西北工业大学 | Single mass plate triaxial micro-mechanical accelerometer |
| US20050274185A1 (en) * | 2004-06-10 | 2005-12-15 | Yuan Lo | Micro accelermoter |
| CN101382564A (en) * | 2007-09-07 | 2009-03-11 | 原相科技股份有限公司 | Micromachined sensors |
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- 2011-12-02 CN CN201110396888.1A patent/CN103134951B/en not_active Expired - Fee Related
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| US20050274185A1 (en) * | 2004-06-10 | 2005-12-15 | Yuan Lo | Micro accelermoter |
| CN1598597A (en) * | 2004-07-19 | 2005-03-23 | 西北工业大学 | Single mass plate triaxial micro-mechanical accelerometer |
| CN101382564A (en) * | 2007-09-07 | 2009-03-11 | 原相科技股份有限公司 | Micromachined sensors |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107782913A (en) * | 2016-08-26 | 2018-03-09 | 深迪半导体(上海)有限公司 | A kind of three axle capacitive accelerometers |
| CN107782913B (en) * | 2016-08-26 | 2022-02-22 | 深迪半导体(绍兴)有限公司 | Triaxial capacitive accelerometer |
| CN109205545A (en) * | 2017-06-29 | 2019-01-15 | 英飞凌技术德累斯顿有限责任公司 | Micro mechanical sensor and method for manufacturing micro mechanical sensor |
| CN110127591A (en) * | 2018-02-08 | 2019-08-16 | 原相科技股份有限公司 | Sensor package and preparation method thereof |
| CN110127591B (en) * | 2018-02-08 | 2022-04-19 | 原相科技股份有限公司 | Manufacturing method of sensor package |
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| Publication number | Publication date |
|---|---|
| CN103134951B (en) | 2015-03-11 |
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