CN103134174B - A kind of immersion register of based semiconductor heat pump effect - Google Patents
A kind of immersion register of based semiconductor heat pump effect Download PDFInfo
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- CN103134174B CN103134174B CN201110386177.6A CN201110386177A CN103134174B CN 103134174 B CN103134174 B CN 103134174B CN 201110386177 A CN201110386177 A CN 201110386177A CN 103134174 B CN103134174 B CN 103134174B
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Abstract
The present invention relates to a kind of immersion register of based semiconductor heat pump effect, comprise semiconductor chilling plate and heat exchanger, described semiconductor chilling plate is provided with two heat-exchange surfaces, a heat-exchange surface is close to the top of heat exchanger, another heat-exchange surface contacts with air, described heat exchanger immersed in liquid level, by changing the heat-exchange surface be close to heat exchanger, can heat liquid or freeze.Compared with prior art, the present invention does not have mechanical compressor parts, and can be applicable to some spaces and be restricted, reliability requirement is high, the occasion that cryogen-free pollutes.
Description
Technical field
The present invention relates to field of heat exchange, especially relate to a kind of immersion register of based semiconductor heat pump effect.
Background technology
" immersion heater " is a kind of heater obtaining pole extensive use in daily life.A heat generating body is immersed into by water boil in container by it, provides a kind of mode from liquid internal heating, and structure is simple, save time, water-saving, power saving, laborsaving, and it is inexpensive, convenient and efficient to take into account.
Take immersion heater as the resistance heat production formula mode of heating technology maturation of representative, the external world provides how many electric energy, and it produces how many heats, and remove the heat be lost in environment, heat production efficiency is always less than 1.In the environment that energy resource supply is limited, wish that heat production efficiency has breakthrough, reach the effect of low-carbon environment-friendly.
Heat pump is a kind of heat quantity transfer device, is from one contact medium draw heat, and it is passed to the device of another kind of contact medium.It is a kind of utility unit of inverse Carnot cycle work.
Semiconductor chilling plate is described in detail in internet Baidupedia, it is a kind of heat pump assembly using DC current, its heat-exchange surface is divided into the surface having chill surface and heating surface two relative, not only can refrigeration but also can heat, decide to realize refrigeration or heating on same refrigerator by the polarity changing DC current, its advantage does not have mechanical compressor parts, be applied in some spaces to be restricted, reliability requirement is high, the occasion that cryogen-free pollutes, this effect is exactly famous Peltier effect.
In daily life and research and production, often run into the requirement of refrigeration.The most frequently used mode is exactly Low-temperature Ice water-bath.But and the stable ice water bath environment that is all easy to get under not all environment.The refrigeration of this mode has very large limitation: cannot produce the low temperature lower than zero degree; Not easily be fixed in a certain temperature range; Need ceaselessly to add ice cube; Along with the thawing of ice, the water in system is caused to get more and more.More be not suitable for adopting in this way under some water-less environment.
In aerospace field, system process microgravity weightlessness.In such a case, the convection type of liquid internal self-assembling formation cannot be relied on to carry out heating and cooling to it.Be that the polar molecule liquid of representative can use heating using microwave with water, but nonpolar molecule then cannot use heating using microwave.The efficiency of independent dependence conduction pattern heating, refrigeration is very low.
Summary of the invention
Object of the present invention is exactly provide a kind of immersion register of based semiconductor heat pump effect to overcome defect that above-mentioned prior art exists, this register does not have mechanical compressor parts, can be applicable to some spaces to be restricted, reliability requirement is high, the occasion that cryogen-free pollutes.
Object of the present invention can be achieved through the following technical solutions:
A kind of immersion register of based semiconductor heat pump effect, comprise semiconductor chilling plate and heat exchanger, described semiconductor chilling plate is provided with two heat-exchange surfaces, a heat-exchange surface is close to the top of heat exchanger, another heat-exchange surface contacts with air, described heat exchanger immersed in liquid level, by changing the heat-exchange surface be close to heat exchanger, can heat liquid or freeze.
The material of described heat exchanger is the metal material that heat conductivility is good, and the part of heat exchanger immersed in liquid level is provided with for increasing the raised structures with liquid comes into contact area.
The material of described heat exchanger comprises copper, aluminium or silver, and the raised structures of the part of heat exchanger immersed in liquid level is screw thread.
This register also comprises one or more in fan, temperature control assembly and rotary components.
Described fan is located on the heat-exchange surface that contacts with air, the rotational axis vertical of fan in this heat-exchange surface, the air flowing on the heat-exchange surface of accelerated semiconductor cooling piece, thus accelerate heat exchange.
Described temperature control assembly comprises temperature controller and temperature sensor, described temperature controller connects semiconductor chilling plate and temperature sensor, this temperature sensor is located at tracer liquid temperature in liquid, and this temperature is sent to temperature controller, temperature controller controls semiconductor chilling plate work according to temperature.
Described rotary components controls heat exchanger and rotates along the rotating shaft perpendicular to liquid level, makes liquid turbulization.
Compared with prior art, the present invention has the following advantages:
1, owing to have employed semiconductor chilling plate, do not have mechanical compressor parts, can be applicable to some spaces and be restricted, reliability requirement is high, the occasion that cryogen-free pollutes.
2, heat exchanger is provided with the raised structures such as screw thread, increases the contact area with liquid, makes heat exchanger effectiveness higher.
3, by arranging the temperature that temperature control assembly controls to heat and freeze automatically, temperature automatically controlled effect is reached.
4, fan can accelerated semiconductor cooling piece surface air flowing, thus improve heat exchanger effectiveness.
5, rotating along the rotating shaft perpendicular to liquid level by arranging rotary components control heat exchanger, making liquid turbulization, making the present invention be applicable to the microgravitys such as Aero-Space or weightlessness.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
Embodiment 1
As shown in Figure 1, a kind of immersion register of based semiconductor heat pump effect, this register comprises semiconductor chilling plate 1, heat exchanger 2 and fan 3.Semiconductor chilling plate 1 is provided with two heat-exchange surfaces, be respectively heating surface and chill surface, heating surface is close to the top of heat exchanger 2, fan 3 is set above chill surface, the rotational axis vertical of this fan 3 is in heat-exchange surface, air flowing on the heat-exchange surface of accelerated semiconductor cooling piece 1, thus accelerate heat exchange.
Heat exchanger 2 heats under immersing the liquid level of liquid 4, if desired carries out freezing to liquid 4, only needs two of semiconductor chilling plate 1 heat-exchange surfaces to exchange to arrange.The material of heat exchanger 2 adopts the metal material that heat conductivility is good, and comprise copper, aluminium or silver etc., the part of heat exchanger 2 immersed in liquid level is provided with for increasing the raised structures with liquid comes into contact area, specifically adopts helicitic texture in the present embodiment.
Embodiment 2
A kind of immersion register of based semiconductor heat pump effect, this register also includes the temperature control assembly of temperature controller and temperature sensor composition, temperature controller connects temperature sensor and semiconductor chilling plate, temperature sensor is located at tracer liquid temperature in liquid, and this temperature is sent to temperature controller, whether temperature controller controls semiconductor chilling plate according to temperature and works, and reach temperature automatically controlled effect, remainder is with embodiment 1.
Embodiment 3
A kind of immersion register of based semiconductor heat pump effect, this register also comprises rotary components, the controlled permutoid that heats of this rotary components rotates along the rotating shaft perpendicular to liquid level, make liquid turbulization, strong liquid flow, make the present invention be applicable to the microgravitys such as Aero-Space or weightlessness, remainder is with embodiment 2.
The present invention is not limited to above-mentioned detailed description of the invention, and fan, temperature control assembly and rotary components are selectable unit (SU), and one or more combination in any selection fan, temperature control assembly and rotary components, all drops in protection scope of the present invention.
Claims (6)
1. the immersion register of a based semiconductor heat pump effect, it is characterized in that, comprise semiconductor chilling plate and heat exchanger, described semiconductor chilling plate is provided with two heat-exchange surfaces, a heat-exchange surface is close to the top of heat exchanger, another heat-exchange surface contacts with air, and described heat exchanger immersed in liquid level, to heating liquid or refrigeration; The material of described heat exchanger is the metal material that heat conductivility is good, and the part of heat exchanger immersed in liquid level is provided with for increasing the raised structures with liquid comes into contact area.
2. the immersion register of a kind of based semiconductor heat pump effect according to claim 1, it is characterized in that, the material of described heat exchanger comprises copper, aluminium or silver, and the raised structures of the part of heat exchanger immersed in liquid level is screw thread.
3. the immersion register of a kind of based semiconductor heat pump effect according to any one of claim 1 ~ 2, it is characterized in that, this register also comprises one or more in fan, temperature control assembly and rotary components.
4. the immersion register of a kind of based semiconductor heat pump effect according to claim 3, it is characterized in that, described fan is located on the heat-exchange surface that contacts with air, the rotational axis vertical of fan is in this heat-exchange surface, air flowing on the heat-exchange surface of accelerated semiconductor cooling piece, thus accelerate heat exchange.
5. the immersion register of a kind of based semiconductor heat pump effect according to claim 3, it is characterized in that, described temperature control assembly comprises temperature controller and temperature sensor, described temperature controller connects semiconductor chilling plate and temperature sensor, this temperature sensor is located at tracer liquid temperature in liquid, and this temperature is sent to temperature controller, temperature controller controls semiconductor chilling plate work according to temperature.
6. the immersion register of a kind of based semiconductor heat pump effect according to claim 3, is characterized in that, described rotary components controls heat exchanger and rotates along the rotating shaft perpendicular to liquid level, makes liquid turbulization.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110386177.6A CN103134174B (en) | 2011-11-28 | 2011-11-28 | A kind of immersion register of based semiconductor heat pump effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110386177.6A CN103134174B (en) | 2011-11-28 | 2011-11-28 | A kind of immersion register of based semiconductor heat pump effect |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103134174A CN103134174A (en) | 2013-06-05 |
| CN103134174B true CN103134174B (en) | 2015-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110386177.6A Expired - Fee Related CN103134174B (en) | 2011-11-28 | 2011-11-28 | A kind of immersion register of based semiconductor heat pump effect |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108143309B (en) * | 2018-01-22 | 2021-05-07 | 崔梓华 | Feeding bottle shaking device and feeding bottle shaking method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1442222A (en) * | 2003-04-10 | 2003-09-17 | 上海交通大学 | Small scale freezing concentration equipment |
| CN2702244Y (en) * | 2004-02-12 | 2005-05-25 | 董向阳 | Electronic refrigerating cover |
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2011
- 2011-11-28 CN CN201110386177.6A patent/CN103134174B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1442222A (en) * | 2003-04-10 | 2003-09-17 | 上海交通大学 | Small scale freezing concentration equipment |
| CN2702244Y (en) * | 2004-02-12 | 2005-05-25 | 董向阳 | Electronic refrigerating cover |
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| CN103134174A (en) | 2013-06-05 |
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