CN103131365A - Single component room temperature curing epoxy construction glue - Google Patents
Single component room temperature curing epoxy construction glue Download PDFInfo
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- CN103131365A CN103131365A CN2011103888919A CN201110388891A CN103131365A CN 103131365 A CN103131365 A CN 103131365A CN 2011103888919 A CN2011103888919 A CN 2011103888919A CN 201110388891 A CN201110388891 A CN 201110388891A CN 103131365 A CN103131365 A CN 103131365A
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- epoxy resin
- room temperature
- temperature cured
- building adhesive
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Abstract
The invention provides single component room temperature curing epoxy construction glue and belongs to the technical field of construction adhesive. The single component room temperature curing epoxy construction glue is formed by the following materials, by weight, 80-100 parts of epoxy resin, 5-25 parts of diluent, 10-20 parts of curing agent, 3.0-5.0 parts of coupling agent, 0.5-2.0 parts of accelerant, and 1.0-8.0 parts of filler. Compared with two-component epoxy adhesive in the prior art, the single component room temperature curing epoxy construction glue has the advantages that raw materials are wide in source and low in price; convenience is achieved in the process of construction and use, the phenomenon of waste like the two-component epoxy adhesive can not happen; and the single component room temperature curing epoxy construction glue can be cured at room temperature, and bonding requirements for stones, wood, concrete, metal, ceramics, glass and the like can be met.
Description
Technical field
The invention belongs to the architecture adhesion agent technical field, be specifically related to a kind of monocomponent room-temperature cured epoxy building adhesive.
Background technology
Fast development along with China's building trade, New Building Materials are also continually developed, in order to satisfy the bonding requirements of most of material of construction such as stone material, timber, concrete, metal, pottery and glass, the tackiness agent take epoxy resin as main body is widely used in building field.
At present, epoxy adhesive commonly used in building trade be mostly two-pack, and namely the A component is by epoxy resin and media assemblage, and the B component is by epoxy hardener and media assemblage, and during use, needs are now with the current.All the bi-component epoxy architecture adhesion agent as Chinese invention patent application publication number CN101602926, CN102146266A and CN101712857A.The weak point that this two component epoxy architecture adhesion agent exists is: at first, the workmen needs strictly by A, B component proportion, stirs and could construct, if A, the B component proportion is incorrect and/or stir inhomogeneous, the capital causes bonding strength to descend, and even pollutes the disadvantageous effects such as material of construction; Secondly, the complete rear remaining glue of constructing can not be recycled and can only discard (because A, B component are concocted), causes serious waste.
Based on top prior art, the present inventor has done a large amount of further investigation work, and has done useful exploration, has invented the technical scheme that solves above-mentioned deficiency.
Summary of the invention
Task of the present invention is the monocomponent room-temperature cured epoxy building adhesive that a kind of easy construction is provided, is conducive to save material.
Top priority of the present invention is completed like this, a kind of monocomponent room-temperature cured epoxy building adhesive, and it is that raw material by following weight part proportioning consists of:
Epoxy resin 80-100 part;
Thinner 5-25 part;
Solidifying agent 10-20 part;
Coupling agent 3.0-5.0 part;
Promotor 0.5-2.0 part;
Filler 1.0-8.0 part.
In a specific embodiment of the present invention, one or more that described epoxy resin is oxirane value in the bisphenol A type epoxy resin of 0.41～0.54 equivalent/100g, bisphenol f type epoxy resin, polyglycidyl ether epoxy resin.
In another specific embodiment of the present invention, described thinner is one or more in ethylene glycol diglycidylether, BDDE, tetraethoxy.
In another specific embodiment of the present invention, described solidifying agent is one or more in diethylenetriamine, triethylene tetramine, hexahydropyridine.
Also have a specific embodiment of the present invention, described coupling agent is γ-aminopropyl triethoxysilane.
In another specific embodiment of the present invention, described promotor is three-(dimethylamino methyl) phenol.
More of the present invention and in specific embodiment, described filler is one or more in aerosil, precipitated silica, nano magnesia, nano aluminium oxide.
Technical scheme provided by the invention has following technique effect with respect to the double-component epoxy adhesive in prior art: one, and raw material sources are extensive and cheap; Its two, convenient when construction is used, the such wasting phenomenon of double-component epoxy adhesive can not appear; Its three, can at room temperature solidify, can satisfy the bonding requirements to stone material, timber, concrete, metal, pottery and glass etc.
Embodiment
The applicant need to prove: the following examples are only to reproduce the present invention program's preferred example, and do not mean that restriction to the present invention program, for example, although the applicant is one or more in these three kinds of bisphenol A type epoxy resins, bisphenol f type epoxy resin, polyglycidyl ether epoxy resin to the listed inventory of epoxy resin, but do not show that other the similar epoxy resin that excludes is left out, thinner, solidifying agent and filler are with example.Therefore, any immaterial variation of form of having done according to the present invention program all should be considered as technical scheme category disclosed in this invention.
Embodiment 1:
80 parts of bisphenol A type epoxy resins;
6 parts of ethylene glycol diglycidylethers;
12 parts of diethylenetriamines;
3 parts of γ-aminopropyl triethoxysilanes;
Three-(dimethylamino methyl) 0.5 part of phenol;
Silica 1 .2 part.
Wherein: the oxirane value of bisphenol A type epoxy resin is 0.52 equivalent/100g.
Embodiment 2:
Bisphenol f type epoxy resin (oxirane value 0.48 equivalent/100g) 85 parts;
12 parts of BDDEs;
14 parts of triethylene tetramines;
3.6 parts of γ-aminopropyl triethoxysilanes;
Three-(dimethylamino methyl) 0.7 part of phenol;
3.0 parts of precipitated silicas.
Embodiment 3:
Polyglycidyl ether epoxy resin (oxirane value 0.46 equivalent/100g) 90 parts;
15 parts of tetraethoxys;
10 parts of diethylenetriamines;
5 parts of hexahydropyridines;
4.2 parts of γ-aminopropyl triethoxysilanes;
Three-(dimethylamino methyl) 1.2 parts of phenol;
2.0 parts of aerosils;
2.0 parts of nano magnesias.
Embodiment 4:
Bisphenol f type epoxy resin (oxirane value 0.43 equivalent/100g) 24 parts;
Bisphenol A type epoxy resin (oxirane value 0.54 equivalent/100g) 70 parts;
5 parts of ethylene glycol diglycidylethers;
15 parts of tetraethoxys;
14 parts of triethylene tetramines;
5 parts of hexahydropyridines;
4.5 parts of γ-aminopropyl triethoxysilanes;
Three-(dimethylamino methyl) 1.8 parts of phenol;
1.0 parts of aerosils;
5.0 parts of nano aluminium oxides.
Embodiment 5:
Bisphenol A type epoxy resin (oxirane value 0.41 equivalent/100g) 36 parts;
Polyglycidyl ether epoxy resin (oxirane value 0.49 equivalent/100g) 64 parts;
25 parts of tetraethoxys;
10 parts of diethylenetriamines;
5.0 parts of hexahydropyridines;
5.0 parts of γ-aminopropyl triethoxysilanes;
Three-(dimethylamino methyl) 2.0 parts of phenol;
2.0 parts of aerosils;
6.0 parts of nano magnesias.
By the monocomponent room-temperature cured epoxy building adhesive of above-described embodiment gained, the technique effect with the excellence shown in following table.
Stretching in table, shearing resistance detect according to GB/T 7124-2008 tackiness agent tensile shear strength measuring method.
As can be seen from the above table, technical scheme provided by the present invention has reached the object of the invention preferably.
Claims (7)
1.
A kind of monocomponent room-temperature cured epoxy building adhesive is characterized in that it is that raw material by following weight part proportioning consists of:
Epoxy resin 80-100 part;
Thinner 5-25 part;
Solidifying agent 10-20 part;
Coupling agent 3.0-5.0 part;
Promotor 0.5-2.0 part;
Filler 1.0-8.0 part.
2.
Monocomponent room-temperature cured epoxy building adhesive according to claim 1 is characterized in that one or more that described epoxy resin is oxirane value in the bisphenol A type epoxy resin of 0.41～0.54 equivalent/100g, bisphenol f type epoxy resin, polyglycidyl ether epoxy resin.
3.
Monocomponent room-temperature cured epoxy building adhesive according to claim 1 is characterized in that described thinner is one or more in ethylene glycol diglycidylether, BDDE, tetraethoxy.
4.
Monocomponent room-temperature cured epoxy building adhesive according to claim 1 is characterized in that described solidifying agent is one or more in diethylenetriamine, triethylene tetramine, hexahydropyridine.
5.
Monocomponent room-temperature cured epoxy building adhesive according to claim 1 is characterized in that described coupling agent is γ-aminopropyl triethoxysilane.
6.
Monocomponent room-temperature cured epoxy building adhesive according to claim 1 is characterized in that described promotor is three-(dimethylamino methyl) phenol.
7.
Monocomponent room-temperature cured epoxy building adhesive according to claim 1 is characterized in that described filler is one or more in aerosil, precipitated silica, nano magnesia, nano aluminium oxide
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103888919A CN103131365A (en) | 2011-11-30 | 2011-11-30 | Single component room temperature curing epoxy construction glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103888919A CN103131365A (en) | 2011-11-30 | 2011-11-30 | Single component room temperature curing epoxy construction glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103131365A true CN103131365A (en) | 2013-06-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103888919A Pending CN103131365A (en) | 2011-11-30 | 2011-11-30 | Single component room temperature curing epoxy construction glue |
Country Status (1)
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| CN (1) | CN103131365A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103709984A (en) * | 2013-12-31 | 2014-04-09 | 中材金晶玻纤有限公司 | In-situ thread adhesive for fiber reinforced plastic pipeline |
| CN103773300A (en) * | 2013-12-23 | 2014-05-07 | 东莞市亚聚电子材料有限公司 | Repairable underfill and preparation method thereof |
| CN103880333A (en) * | 2014-03-07 | 2014-06-25 | 天地科技股份有限公司 | Resin anchoring agent realizing rapid loading under water and preparation method thereof |
| CN104371604A (en) * | 2014-10-31 | 2015-02-25 | 青岛昌安达药业有限公司 | Effective ceramic adhesive |
| CN104557135A (en) * | 2015-01-08 | 2015-04-29 | 黄文辉 | Rough stone block hardening agent and hardening method thereof |
| CN104893639A (en) * | 2015-06-09 | 2015-09-09 | 青岛科技大学 | Pipeline emergency plugging agent |
| CN107021684A (en) * | 2017-05-18 | 2017-08-08 | 镇江市龙门石刻艺术工程有限公司 | A kind of aging-resistant flame-proof clay for being used to bond stone material and composite |
| CN109160770A (en) * | 2018-09-20 | 2019-01-08 | 安徽中宝建材科技有限公司 | Assembled architecture precast concrete surface restoration agent and preparation method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101007932A (en) * | 2007-01-29 | 2007-08-01 | 刘永祥 | Accumulator sealant |
| CN101050344A (en) * | 2007-04-30 | 2007-10-10 | 湖南神力实业有限公司 | Epoxy binder modified by micropowder of crosslinked rubber, and preparation method |
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2011
- 2011-11-30 CN CN2011103888919A patent/CN103131365A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101007932A (en) * | 2007-01-29 | 2007-08-01 | 刘永祥 | Accumulator sealant |
| CN101050344A (en) * | 2007-04-30 | 2007-10-10 | 湖南神力实业有限公司 | Epoxy binder modified by micropowder of crosslinked rubber, and preparation method |
Non-Patent Citations (2)
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| 贺曼罗编著: "《环氧树脂胶粘剂》", 30 April 2004, 中国石化出版社 * |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103773300A (en) * | 2013-12-23 | 2014-05-07 | 东莞市亚聚电子材料有限公司 | Repairable underfill and preparation method thereof |
| CN103773300B (en) * | 2013-12-23 | 2015-07-01 | 东莞市亚聚电子材料有限公司 | Repairable underfill and preparation method thereof |
| CN103709984A (en) * | 2013-12-31 | 2014-04-09 | 中材金晶玻纤有限公司 | In-situ thread adhesive for fiber reinforced plastic pipeline |
| CN103880333A (en) * | 2014-03-07 | 2014-06-25 | 天地科技股份有限公司 | Resin anchoring agent realizing rapid loading under water and preparation method thereof |
| CN103880333B (en) * | 2014-03-07 | 2015-11-18 | 天地科技股份有限公司 | Resin anchoring agent of a kind of carrying fast under water and preparation method thereof |
| CN104371604A (en) * | 2014-10-31 | 2015-02-25 | 青岛昌安达药业有限公司 | Effective ceramic adhesive |
| CN104557135A (en) * | 2015-01-08 | 2015-04-29 | 黄文辉 | Rough stone block hardening agent and hardening method thereof |
| CN104893639A (en) * | 2015-06-09 | 2015-09-09 | 青岛科技大学 | Pipeline emergency plugging agent |
| CN104893639B (en) * | 2015-06-09 | 2018-12-18 | 青岛科技大学 | A kind of pipeline emergency leakage blocking material |
| CN107021684A (en) * | 2017-05-18 | 2017-08-08 | 镇江市龙门石刻艺术工程有限公司 | A kind of aging-resistant flame-proof clay for being used to bond stone material and composite |
| CN109160770A (en) * | 2018-09-20 | 2019-01-08 | 安徽中宝建材科技有限公司 | Assembled architecture precast concrete surface restoration agent and preparation method |
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Application publication date: 20130605 |