CN103131191A - Single-component self-molding lens silica gel for light-emitting diode (LED) package and package process of single-component self-molding lens silica gel - Google Patents
Single-component self-molding lens silica gel for light-emitting diode (LED) package and package process of single-component self-molding lens silica gel Download PDFInfo
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Abstract
The invention relates to a single-component self-molding lens silica gel for light-emitting diode (LED) package and package process of the single-component self-molding lens silica gel. The single-component self-molding lens silica gel for the LED package is composed of the following components, by mass, 35%-70% of vinyl silicone oil, 15%-50% of hydrogen silicone oil, 1-20 parts per million (ppm) of platinum catalyst, 1%-5% of stabilizer and 1%-10% of thixotropic materials. The package process of the single-component self-molding lens silica gel changes traditional process that a mould is used in the LED lens package and the brand-new LED lens package without the mould is achieved. The package process of the single-component self-molding lens silica gel is simple in process, easy to operate, small in investment, low in cost, high in productivity and suitable for large-scale industrial production.
Description
Technical field
The present invention relates to LED encapsulation and use the silica gel field, particularly a kind of LED encapsulates single-component self-forming lens silica gel and the packaging process thereof of use.
Background technology
LED is photodiode, owing to having the characteristics such as energy-saving and environmental protection, brightness is high, the life-span is long, is widely used in light source, display unit, backlight etc., and constantly enlarges the application in lighting field.The characteristics such as organo-silicone rubber is high due to transmittance, Heat stability is good, ultraviolet resistance is strong, internal stress is little, water absorbability is low have become the ideal chose of LED packaged material.Its main application is that chip is carried out mechanical protection, stress relief, and as a kind of guide structure, improve the LED performance and improve effective luminous efficiency.
Adopt at present silica gel to be packaged with planar package and mould closedtop dress dual mode to LED.Planar package mainly comprises paster planar package (accompanying drawing 1), integrated planar encapsulation (accompanying drawing 2).Planar package mode popularity rate simple to operate is higher, but is being not so good as the silica-gel lens packaged type aspect effective luminous efficiency and optical throughput.Mould closedtop dress is traditional silica-gel lens packaging process, method is that silica gel is annotated in the hemispherical lens mould, after silica gel heating solidifies again the demoulding form hemispherical lens, this technological operation is numerous and diverse, the running time is long, facility investment is large, labour cost is high, generally encapsulate enterprise can't bear.
Therefore, New LED lens packaged type simple, with low cost in the urgent need to technique, that be fit to scale operation occurs, use silica gel LED is carried out the research of lens packages at Chinese patent application (disclosing) CN101308885, CN102064241, CN102321371 reports in CN102514134.As disclose a kind of LED package potting mould in CN102514134, comprise lens die, lens die connects ceramics bracket, has through hole on ceramics bracket, the quantity of through hole is not less than 2, ceramics bracket is fixed on the mould of lens, from a hole injection silica gel of ceramics bracket bottom, air is just discharged from top hole, so just makes and does not stay bubble in LED.Yet above-mentioned research is all the improvement of mold for packaging lens and the change for the treatment of process basically, and the lens packages process still could not be broken away from the use mould, also the lens silica gel of LED encapsulation use is not done deep research.
Summary of the invention
In view of this, for the problems referred to above, the invention provides a kind of single-component self-forming lens silica gel of LED encapsulation use.
A kind of LED encapsulation is with single-component self-forming lens silica gel, is comprised of the following component of following mass percent:
Vinyl silicone oil 35-70%,
Containing hydrogen silicone oil 15-50%,
Platinum catalyst 1-20ppm,
Stablizer 1-5%,
Thixotropic materials 1-10%.
The viscosity of described vinyl silicone oil is 10000-60000mPas; Described containing hydrogen silicone oil viscosity is 100-5000mPas.
The viscosity of described vinyl silicone oil is 50000-60000mPas, and contents of ethylene is 0.8-2.5%.
Described containing hydrogen silicone oil viscosity is 2000-5000mPas, and hydrogen content is 0.7-2.5%.
Described platinum catalyst is a kind of in isopropyl alcohol solution of chloroplatinic acid or various platinum complex, and platinum content is 10-22%; Described stablizer is a kind of in ethynylcyclohexanol or methylbutynol; Thixotropic materials in described lens silica gel is smoke-like silicon-dioxide or organobentonite.
Described platinum catalyst is the vinylsiloxane platinum complex.
Described stablizer is the acetylene hexalin.
Described thixotropic materials is smoke-like silicon-dioxide, particle diameter 30nm.
A kind of packaging process of using LED encapsulation use single-component self-forming lens silica gel of the present invention, described lens encapsulation process is without the mould lens packages, directly LED encapsulated with single-component self-forming lens silica gel on the support of flat envelope or put glue on COB, namely forming the semispherical silicon glue lens through being heating and curing.
The described application LED encapsulation of the present invention packaging process of single-component self-forming lens silica gel comprises the following steps:
1) LED encapsulation each composition with single-component self-forming lens silica gel is added in stirring tank in mass ratio, mix at normal temperatures;
2) the LED encapsulation that mixes is carried out vacuum defoamation with single-component self-forming lens silica gel, until without Bubble formation;
3) with point gum machine the encapsulation of the LED after with deaeration with single-component self-forming lens silica gel on the support of flat envelope or put glue on COB, silica gel is by means of self property and action of gravity self-assembling formation semisphere colloid;
4) divide two sections to be heating and curing in the semisphere colloid, 80 ℃～120 ℃ curing of first section temperature 1～2 hour, 120 ℃～150 ℃ curing of two sections temperature 2～3 hours, colloid namely obtains the semispherical silicon glue lens after solidifying.
Compared with prior art, LED encapsulation of the present invention has changed the mould closedtop dress technique of using lens die in present LED lens packages with single-component self-forming lens silica gel, really realized without the mould lens packages.Because LED encapsulation of the present invention does not need to use mould with single-component self-forming lens silica gel, die treatment, installation in mould closedtop dress technique have been simplified, injecting glue, curing molding, peel off the steps such as the demoulding again, not only technique is simple, easy handling, and less investment, cost is low, production efficiency is high, thereby is more suitable for scale operation.
Description of drawings
Fig. 1 is traditional paster planar package LED and of silica gel of the present invention, paster is made the LED schematic diagram of lens packages; Figure is 1A tradition paster planar package LED side-view; Figure 1B is for making the LED side-view of lens packages to paster of silica gel of the present invention.
Fig. 2 is conventional planar encapsulation COB and the schematic diagram of being lens packages COB of silica gel of the present invention; Fig. 2 A is the side-view of conventional planar encapsulation COB; Fig. 2 B is for making the side-view of lens packages COB of silica gel of the present invention; Fig. 2 C is the vertical view of conventional planar encapsulation COB; Fig. 2 B is for making the vertical view of lens packages COB of silica gel of the present invention.
Embodiment
The invention will be further described below by specific embodiments and the drawings, but invention is not limited to following embodiment.
LED encapsulation of the present invention is a kind of silicon hydrogen add-on type silica gel with single-component self-forming lens silica gel, use this silica gel to do lens packages and do not need to add mould, directly putting down on the support that seals or putting glue on COB, silica gel relies on self property and action of gravity self-assembling formation semisphere colloid, colloid namely becomes the semispherical silicon glue lens through being heating and curing, and has really realized without the mould lens packages.Thereby LED encapsulation of the present invention is a kind of lens silica gel of self-forming with single-component self-forming lens silica gel.
Embodiment 1
In 2 liters of planet stirring stills, adding successively viscosity is that 60000mPas, contents of ethylene are 0.8% vinyl silicone oil 650 grams, viscosity is that 5000mPas, hydrogen content are 0.7% containing hydrogen silicone oil 300 grams, platinum content is 21% vinyl platinum complex 20ppm, ethynylcyclohexanol 40 grams, particle diameter is smoke-like silica 10 gram of 30nm, mixes at normal temperatures 3 hours and is mixed with single component silica gel.
The silica gel that mixes is carried out vacuum defoamation, until there is no Bubble formation.Silica gel with point gum machine after with deaeration is being put glue on 5050 pasters with the flat envelope of low refractive power silica gel, and silica gel relies on self property and action of gravity self-assembling formation semisphere colloid.Then according to 80 ℃ 2 hours, 150 ℃ of 2 hours order laser heatings solidify, in the process that is heating and curing, the semisphere colloid does not vary with temperature and is out of shape, colloid namely forms the semispherical silicon glue lens after solidifying, diameter is 4.000mm, is highly 1.560mm.
Embodiment 2
In 2 liters of planet stirring stills, adding successively viscosity is that 10000mPas, contents of ethylene are 2.5% vinyl silicone oil 500 grams, viscosity is that 100mPas, hydrogen content are 2.5% containing hydrogen silicone oil 400 grams, platinum content is 21% vinyl platinum complex 10ppm, ethynylcyclohexanol 40 grams, particle diameter is organobentonite 60 grams of 300nm, mixes at normal temperatures 2 hours and is mixed with single component silica gel.
To mix uniform silica gel and carry out vacuum defoamation, until there is no Bubble formation.Silica gel with point gum machine after with deaeration is being put glue on 5050 pasters with the flat envelope of low refractive power silica gel, and silica gel relies on self property and action of gravity self-assembling formation semisphere colloid.Then according to 100 ℃ 1 hour, 150 ℃ of 3 hours order laser heatings solidify, in the process that is heating and curing, the semisphere colloid does not vary with temperature and is out of shape, colloid namely forms the semispherical silicon glue lens after solidifying, diameter is 3.700mm, is highly 1.470mm.
Embodiment 3
In 2 liters of planet stirring stills, adding successively viscosity is that 30000mPas, contents of ethylene are that 1.0% vinyl silicone oil 700 grams, viscosity are 3000mPas, hydrogen content is 0.9% containing hydrogen silicone oil 250 grams, platinum content is 21% vinyl platinum complex 15ppm, acetylene hexalin 20 grams, particle diameter is vaporific silicon-dioxide 30 grams of 30nm, mixes at normal temperatures 3 hours and is mixed with single component silica gel.
The silica gel that mixes is carried out vacuum defoamation, until there is no Bubble formation.Silica gel with point gum machine after with deaeration is put glue on COB, silica gel relies on self property and action of gravity self-assembling formation semisphere colloid.Then according to 100 ℃ 2 hours, 120 ℃ of 2 hours order laser heatings solidify, in the process that is heating and curing, the semisphere colloid does not vary with temperature and is out of shape, colloid namely forms the semispherical silicon glue lens after solidifying, diameter is 4.000mm, is highly 1.900mm.
Embodiment 4
In 2 liters of planet stirring stills, adding successively viscosity is that 50000mPas, contents of ethylene are 2.0% vinyl silicone oil 500 grams, viscosity is that 3000mPas, hydrogen content are 1.7% containing hydrogen silicone oil 400 grams, platinum content is 21% vinyl platinum complex 20ppm, methylbutynol 36 grams, particle diameter is smoke-like silicon-dioxide 20 grams of 30nm, mixes at normal temperatures 2 hours and is mixed with single component silica gel.
The silica gel that mixes is carried out vacuum defoamation, until there is no Bubble formation.Silica gel with point gum machine after with deaeration is put glue on the high-power support with high refractive power silica gel point powder and the flat envelope of low refractive power silica gel in the bottom, and silica gel relies on self property and action of gravity self-assembling formation semisphere colloid.Then according to 120 ℃ 1 hour, 150 ℃ of 3 hours order laser heatings solidify, in the process that is heating and curing, the semisphere colloid does not vary with temperature and is out of shape, colloid namely forms the semispherical silicon glue lens after solidifying, diameter is 5.240mm, is highly 2.530mm.
Embodiment 5
In order to contrast traditional mould top packaged LED and to do packaging process without mould lens packages LED with silica gel of the present invention, under laboratory condition, prepare as follows mould top packaged LED sample:
1, A, B component and fluorescent material, the spread powder of high refractive power silica gel H-532 are allocated A: B: fluorescent material: spread powder=0.485: 1.455: 0.1 by following mass ratio: 0.025, mix and vacuum defoamation.
2, get the 0.5w high-power support and be placed in 150 ℃ of bakings of baking oven dehumidifying in 1 hour, be cooled to room temperature.
3, the silica gel H-532 after with deaeration is on the 0.5w high-power support after dehumidifying with point gum machine, and the adjustment colour temperature is 2850K, and 150 ℃ of baking half an hour.
4, get disposable lens die and be placed in 1 hour dehumidification treatments of 100 ℃, baking oven baking, be cooled to room temperature, then mould is pressed on the above-mentioned 0.5w high-power support of putting powder, and fixes with fixture.
The A, B two components that 5, will hang down refractive power silica gel EH-102 be A: B=1 in mass ratio: 1 allotment mixes and vacuum defoamation.
6, the silica gel EH-102 after with deaeration injects support from an aperture of lens die bottom margin with disposable syringe, adjusting pole direction during injection, bubble is discharged from another aperture of lens die bottom margin, allow silica gel EH-102 gently be full of the internal stent space, the a small amount of glue of relief is discharged from row's abscess, and guaranteeing does not have bubble in colloid.
7, the colloid with above-mentioned encapsulation is placed in 80 ℃ of bakings of baking oven 1 hour, then removes de-chucking, carefully takes off lens die, exposes silica-gel lens.
8, with the silica-gel lens after the demoulding 150 ℃ of bakings 4 hours, obtain mould top packaged LED sample.
Contrast the making processes of above-mentioned traditional mould top packaged LED and be not difficult to find with the making processes (embodiment 4) that silica gel of the present invention carries out without mould lens packages LED, tradition mould closedtop dress technique is more complicated without the mould lens encapsulation process than of the present invention, not only operation numerous and diverse, control that difficulty is large, the running time is long but also facility investment is large, production cost is high.Compare with it, use silica gel of the present invention and carry out without the mould lens packages, its technique simply, easily control, facility investment is little, production efficiency is high.
Embodiment 6
In order to contrast traditional paster planar package LED and to use silica gel of the present invention paster to be done the illumination effect of lens packages LED, existing two kinds of packaged LEDs that prepare take embodiment 1 have carried out the luminescent properties detection as sample in comparable reference color temperature, the results are shown in Table 1.
The traditional paster planar package of table 1 LED and the luminescent properties that uses silica gel of the present invention to be lens packages LED to paster detect
As shown in Figure 1, the LED of traditional paster planar package is plane (Figure 1A), and the LED that uses silica gel of the present invention to do lens packages to paster is hemispherical lens shape (Figure 1B).Find out from table 1 data, the optical throughput of traditional paster planar package LED is 12.10lm, and light efficiency is 62.33lm/W; Use silica gel of the present invention paster to be the LED of lens packages, its optical throughput is 13.42lm, and light efficiency is 73.19lm/W.Comparing result shows, two kinds of packaged LEDs use silica gel of the present invention paster to be the LED of lens packages better than the flat envelope of traditional paster LED illumination effect in comparable reference color temperature.
Embodiment 7
In order to contrast conventional planar encapsulation COB and to use silica gel of the present invention to do the illumination effect of lens packages COB, existing two kinds of encapsulation COB that prepare take embodiment 3 carry out luminescent properties and detect as sample in comparable reference color temperature, the results are shown in Table 2.
Table 2 conventional planar encapsulation COB and the luminescent properties that uses silica gel of the present invention to be lens packages COB detect
As shown in Figure 2, conventional planar encapsulation COB is tiled in (Fig. 2 A and Fig. 2 C) on whole base material to silica gel, not only serious waste silica gel but also be unfavorable for chip cooling; And the COB that uses silica gel of the present invention to do lens packages just puts glue (Fig. 2 B and Fig. 2 D) on each LED lamp pearl, namely saves silica gel and reduces the cost and be beneficial to chip cooling.Find out from table 2 data, the optical throughput of conventional planar encapsulation COB is 407.71lm, and light efficiency is 85.44lm/W; Use silica gel of the present invention to be the COB of lens packages, its optical throughput is 418.60lm, and light efficiency is 87.57lm/W; Comparing result finds out, two kinds of encapsulation COB use silica gel of the present invention to be the COB of lens packages better than the illumination effect that conventional planar encapsulates COB in comparable reference color temperature.
Embodiment 8
For the illumination effect without mould lens packages LED that contrasts traditional mould top packaged LED and make of silica gel of the present invention, in the embodiment 5 in the mould top packaged LED of preparation and embodiment 4 with silica gel of the present invention prepare without mould lens packages LED as specimen, carry out luminescent properties and detect in comparable reference color temperature, the results are shown in Table 3.
The traditional mould of table 3 top packaged LED and the luminescent properties detection without mould lens packages LED of using silica gel of the present invention to do
As seen from Table 3, the shape of two kinds of LED package lens is semisphere, and mould closedtop dress lens diameter is 5.120mm, is highly 2.520mm; The diameter without the die package lens of making of silica gel of the present invention is 5.240mm, is highly 2.530mm, and size is close.The LED colour temperature of two kinds of lens packages also is in comparable scope.The illumination effect of test shows, is 40.19lm with its optical throughput of LED of mould closedtop dress making, and light efficiency is 59.54lm/W; What make of silica gel of the present invention is 41.49lm without its optical throughput of die package LED, and light efficiency is 64.46lm/W.The latter is slightly better than the former, but difference of them is little.Because the illumination effect of lens packages LED is relevant with lens shape with silica gel character, as seen both silica gel character also relatively approaches.Yet importantly, even reaching under the prerequisite of equal illumination effect, with lens silica gel of the present invention and without mould self-forming lens encapsulation process be but traditional mould closedtop dress too late far away.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.Should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. LED encapsulation with single-component self-forming lens silica gel, is characterized in that, is comprised of the following component of following mass percent:
Vinyl silicone oil 35-70%,
Containing hydrogen silicone oil 15-50%,
Platinum catalyst 1-20ppm,
Stablizer 1-5%,
Thixotropic materials 1-10%.
2. LED encapsulation according to claim 1 with single-component self-forming lens silica gel, is characterized in that, the viscosity of described vinyl silicone oil is 10000-60000mPas; Described containing hydrogen silicone oil viscosity is 100-5000mPas.
3. LED encapsulation according to claim 2 with single-component self-forming lens silica gel, is characterized in that, the viscosity of described vinyl silicone oil is 50000-60000mPas, and contents of ethylene is 0.8-2.5%.
4. LED encapsulation according to claim 2 with single-component self-forming lens silica gel, is characterized in that, described containing hydrogen silicone oil viscosity is 2000-5000mPas, and hydrogen content is 0.7-2.5%.
5. LED according to claim 1 encapsulation with single-component self-forming lens silica gel, is characterized in that, described platinum catalyst is a kind of in isopropyl alcohol solution of chloroplatinic acid or various platinum complex, and platinum content is 10-22%; Described stablizer is a kind of in ethynylcyclohexanol or methylbutynol; Described thixotropic materials is smoke-like silicon-dioxide or organobentonite.
6. LED encapsulation according to claim 5 with single-component self-forming lens silica gel, is characterized in that, described platinum catalyst is the vinylsiloxane platinum complex.
7. LED encapsulation according to claim 5 with single-component self-forming lens silica gel, is characterized in that, described stablizer is the acetylene hexalin.
8. LED encapsulation according to claim 5 with single-component self-forming lens silica gel, is characterized in that, described thixotropic materials is smoke-like silicon-dioxide, particle diameter 30nm.
9. an application rights requires the 1 described LED encapsulation packaging process of single-component self-forming lens silica gel, it is characterized in that, described lens encapsulation process is without the mould lens packages, putting down on the support that seals or putting glue on COB, silica gel relies on self property and action of gravity self-assembling formation semisphere colloid, and being heating and curing Collapse Deformation do not occur yet.
10. application LED according to claim 9 encapsulates the packaging process with single-component self-forming lens silica gel, comprises the following steps:
1) LED encapsulation each composition with single-component self-forming lens silica gel is added in stirring tank in mass ratio, mix at normal temperatures;
2) the LED encapsulation that mixes is carried out vacuum defoamation with single-component self-forming lens silica gel, until without Bubble formation;
3) with point gum machine the encapsulation of the LED after with deaeration with single-component self-forming lens silica gel on the support of flat envelope or put glue on COB, silica gel is by means of self property and action of gravity self-assembling formation semisphere colloid;
4) divide two sections to be heating and curing in the semisphere colloid, 80 ℃～120 ℃ curing of first section temperature 1～2 hour, 120 ℃～150 ℃ curing of two sections temperature 2～3 hours, colloid namely obtains the semispherical silicon glue lens after solidifying.
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| CN108644639A (en) * | 2018-05-21 | 2018-10-12 | 广东恒润光电有限公司 | A kind of Waterproof LED light source and preparation method thereof |
| CN110805873A (en) * | 2019-12-21 | 2020-02-18 | 上海安珂麟汽车科技有限公司 | Matrix type headlamp |
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| CN108644639A (en) * | 2018-05-21 | 2018-10-12 | 广东恒润光电有限公司 | A kind of Waterproof LED light source and preparation method thereof |
| CN110805873A (en) * | 2019-12-21 | 2020-02-18 | 上海安珂麟汽车科技有限公司 | Matrix type headlamp |
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