CN103117269A - Fuse wire assembly, fuse wire assembly manufacturing method and equipment - Google Patents
Fuse wire assembly, fuse wire assembly manufacturing method and equipment Download PDFInfo
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- CN103117269A CN103117269A CN2011103628856A CN201110362885A CN103117269A CN 103117269 A CN103117269 A CN 103117269A CN 2011103628856 A CN2011103628856 A CN 2011103628856A CN 201110362885 A CN201110362885 A CN 201110362885A CN 103117269 A CN103117269 A CN 103117269A
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Abstract
The invention discloses a fuse wire assembly which is used for improving mechanical properties of metal fuse wires. The fuse wire assembly comprises a substrate layer and a metal fuse wire, wherein the metal fuse wire is arranged on the upper surface of the substrate layer and is provided with four side faces, and the metal fuse wire is divided into two portions including a first portion and a second portion according to the width of the metal fuse wire, the width of the first portion is a first width value, and the width of the second portion is a second width value. The fuse wire assembly is characterized in that protective layers are covered on the upper surface of the first portion and the four side faces, the second portion is arranged in a protective cavity body, and a through hole is formed in the protective cavity body which is arranged above the second portion. The invention further discloses a fuse wire assembly manufacturing method and equipment.
Description
Technical field
The present invention relates to electricity and mechanical field, particularly a kind of fuse assembly, fuse assembly manufacture method and equipment.
Background technology
In integrated circuit (IC) design, the designer need to come the resistance value of some resistance in regulating circuit by the metal fuse (Metal fuse) that increases some in circuit, makes in circuit the resistance of some resistance adjustable, thereby satisfies the specific function of circuit.In concrete process for making, need produce the metal fuse of some, then in IC chip test, can regulate the resistance of resistance by blowing or keeping these metal fuses.Therefore need metal fuse to possess following feature: can be easy to blow when needs blow metal fuse, and need to keep preferably to connect when not needing to blow, namely need metal fuse that certain mechanical stress is arranged, avoid causing the metal fuse fracture due to the existence of external force, thereby affect the performance of circuit.
The present application people finds to exist in prior art following technical problem at least in the process that realizes the embodiment of the present application technical scheme:
Due to the defective of this body structure of metal fuse, caused metal fuse to be easy to the fracture due to the impact of external force in the course of processing of integrated circuit (IC) chip.And the method that does not also address this problem in prior art.
Summary of the invention
The embodiment of the present invention provides a kind of fuse assembly, fuse assembly manufacture method and equipment, is used for improving the mechanical performance of metal fuse.
A kind of fuse assembly; comprise: dielectric layer; be positioned at the metal fuse that one of described dielectric layer upper surface has four sides; it is the second portion of the second width value that described metal fuse is divided into by its width first and the width that width is the first width value; the upper surface of described first and described four sides are coated with protective layer; described second portion is arranged in a protection cavity, is positioned on the described protection cavity of described second portion top to be provided with a through hole.
A kind of fuse assembly manufacture method comprises the following steps:
Generate dielectric layer;
At described dielectric layer upper surface, one metal fuse with four sides is set; It is the second portion of the second width value that described metal fuse is divided into by its width first and the width that width is the first width value;
Upper surface and described four side protective mulches in described first;
Make described second portion be arranged in a protection cavity, wherein be positioned on the described protection cavity of described second portion top and be provided with a through hole.
A kind of fuse assembly manufacturing equipment comprises:
Generating apparatus is used for generating dielectric layer;
The first operating means is used at described dielectric layer upper surface, one metal fuse with four sides being set; It is the second portion of the second width value that described metal fuse is divided into by its width first and the width that width is the first width value;
Processing unit is used for upper surface and described four side protective mulches in described first;
The second operating means is used for making described second portion to be positioned at a protection cavity, wherein is positioned on the described protection cavity of described second portion top to be provided with a through hole.
Make metal fuse partly be arranged in protective layer in the embodiment of the present invention, in the course of processing of integrated circuit (IC) chip, metal fuse is out of shape or ruptures because of the impact of external force with regard to being difficult for, thereby guarantees the normal operation of circuit.
Description of drawings
Fig. 1 is the profile of fuse assembly in the embodiment of the present invention;
Fig. 2 is the profile of fuse assembly in prior art;
Fig. 3 is the primary structure figure of fuse assembly manufacturing equipment in the embodiment of the present invention;
Fig. 4 is the main flow chart of fuse assembly manufacture method in the embodiment of the present invention.
Embodiment
Make metal fuse partly be arranged in protective layer in the embodiment of the present invention, in the course of processing of integrated circuit (IC) chip, metal fuse is out of shape or ruptures because of the impact of external force with regard to being difficult for, thereby guarantees the normal operation of circuit.
Referring to Fig. 1, be the profile of fuse assembly in the embodiment of the present invention, comprising metal fuse 101, dielectric layer 102 and protective layer 103.Part relative with metal fuse 101 on described protective layer 103 can have a through hole.
In Fig. 1, dielectric layer 102 is positioned at the bottom, can be take ground level as the plane of reference in the embodiment of the present invention, and dielectric layer 102 can think that being parallel to ground level places.The material of making dielectric layer 102 can be silicon dioxide (SiO
2), dielectric layer 102 can by silicon directly and oxygen reaction generate, its quality is densification comparatively.
Referring to Fig. 3, the embodiment of the present invention also provides a kind of fuse assembly manufacturing equipment, and it comprises generating apparatus 301, the first operating means 302, processing unit 303 and the second operating means 304.
Generating apparatus 301 is used for generating dielectric layer 102.
The first operating means 302 is used at described dielectric layer 102 upper surfaces, one metal fuse 101 with four sides being set.It is the second portion of the second width value that described metal fuse 101 is divided into by its width first and the width that width is the first width value.A metal fuse 101 can be a bonding jumper, and it can be covered on dielectric layer 102 upper surfaces.
Upper surface and described four side protective mulches 103 that processing unit 303 is used in described first.Processing unit 303 is at upper surface and each side protective mulch 103 of the first of metal fuse 101.Protective layer 103 can tightly be covered on upper surface and each side of described first.
The second operating means 304 is used for making described second portion to be positioned at a protection cavity, wherein is positioned on the described protection cavity of described second portion top to be provided with a through hole.Described protection cavity can be the part of protective layer 103.
Referring to Fig. 4, the main method flow process that in the embodiment of the present invention, fuse assembly is made is as follows:
Step 401: generate dielectric layer 102.
Step 402: one metal fuse 101 with four sides is set at described dielectric layer 102 upper surfaces; It is the second portion of the second width value that described metal fuse 101 is divided into by its width first and the width that width is the first width value.
Step 403: upper surface and described four side protective mulches 103 in described first.
Step 404: make described second portion be arranged in a protection cavity, wherein be positioned on the described protection cavity of described second portion top and be provided with a through hole.
Make metal fuse 101 parts be arranged in protective layer 103 in the embodiment of the present invention, in the course of processing of integrated circuit (IC) chip, metal fuse 101 is out of shape or ruptures because of the impact of external force with regard to being difficult for, thereby guarantees the normal operation of circuit.When needs fused, metal fuse 101 can normally fuse, and when not needing its fusing, it can have stronger anti-pressure ability, and is not yielding.
Obviously, those skilled in the art can carry out various changes and modification and not break away from the spirit and scope of the present invention the present invention.Like this, if within of the present invention these are revised and modification belongs to the scope of claim of the present invention and equivalent technologies thereof, the present invention also is intended to comprise these changes and modification interior.
Claims (8)
1. fuse assembly; comprise: dielectric layer; be positioned at the metal fuse that one of described dielectric layer upper surface has four sides; it is the second portion of the second width value that described metal fuse is divided into by its width first and the width that width is the first width value; it is characterized in that; the upper surface of described first and described four sides are coated with protective layer, and described second portion is arranged in a protection cavity, are positioned on the described protection cavity of described second portion top to be provided with a through hole.
2. fuse assembly as claimed in claim 1, is characterized in that, described the first width value reaches the width less than described metal fuse greater than zero; Described the first width value and described the second width value sum are the width of described metal fuse.
3. fuse assembly as claimed in claim 1, is characterized in that, described protective layer is made by silicon dioxide.
4. fuse assembly as claimed in claim 1, is characterized in that, described protection cavity is made by silicon dioxide.
5. fuse assembly as claimed in claim 1, is characterized in that, described dielectric layer is made by silicon dioxide.
6. fuse assembly as claimed in claim 1, is characterized in that, making described metal fuse metal used is aluminium, copper or silver.
7. a fuse assembly manufacture method, is characterized in that, comprises the following steps:
Generate dielectric layer;
At described dielectric layer upper surface, one metal fuse with four sides is set; It is the second portion of the second width value that described metal fuse is divided into by its width first and the width that width is the first width value;
Upper surface and described four side protective mulches in described first;
Make described second portion be arranged in a protection cavity, wherein be positioned on the described protection cavity of described second portion top and be provided with a through hole.
8. a fuse assembly manufacturing equipment, is characterized in that, comprising:
Generating apparatus is used for generating dielectric layer;
The first operating means is used at described dielectric layer upper surface, one metal fuse with four sides being set; It is the second portion of the second width value that described metal fuse is divided into by its width first and the width that width is the first width value;
Processing unit is used for upper surface and described four side protective mulches in described first;
The second operating means is used for making described second portion to be positioned at a protection cavity, wherein is positioned on the described protection cavity of described second portion top to be provided with a through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110362885.6A CN103117269B (en) | 2011-11-16 | 2011-11-16 | Fuse wire assembly, fuse wire assembly manufacturing method and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110362885.6A CN103117269B (en) | 2011-11-16 | 2011-11-16 | Fuse wire assembly, fuse wire assembly manufacturing method and equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103117269A true CN103117269A (en) | 2013-05-22 |
| CN103117269B CN103117269B (en) | 2015-07-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110362885.6A Expired - Fee Related CN103117269B (en) | 2011-11-16 | 2011-11-16 | Fuse wire assembly, fuse wire assembly manufacturing method and equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN103117269B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1228608A (en) * | 1998-03-09 | 1999-09-15 | 西门子公司 | Guard cell for etching |
| CN1726592A (en) * | 2002-12-16 | 2006-01-25 | 皇家飞利浦电子股份有限公司 | Poly-silicon stringer fuse |
| US20070222028A1 (en) * | 2006-03-27 | 2007-09-27 | Fujitsu Limited | eFuse and method of manufacturing eFuse |
| US20090032959A1 (en) * | 2007-07-31 | 2009-02-05 | International Business Machines Corporation | Electrical fuses and resistors having sublithographic dimensions |
-
2011
- 2011-11-16 CN CN201110362885.6A patent/CN103117269B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1228608A (en) * | 1998-03-09 | 1999-09-15 | 西门子公司 | Guard cell for etching |
| CN1726592A (en) * | 2002-12-16 | 2006-01-25 | 皇家飞利浦电子股份有限公司 | Poly-silicon stringer fuse |
| US20070222028A1 (en) * | 2006-03-27 | 2007-09-27 | Fujitsu Limited | eFuse and method of manufacturing eFuse |
| US20090032959A1 (en) * | 2007-07-31 | 2009-02-05 | International Business Machines Corporation | Electrical fuses and resistors having sublithographic dimensions |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103117269B (en) | 2015-07-15 |
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Granted publication date: 20150715 Termination date: 20171116 |
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| CF01 | Termination of patent right due to non-payment of annual fee |