CN103108536B - Component feeder and component feeding method - Google Patents
Component feeder and component feeding method Download PDFInfo
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- CN103108536B CN103108536B CN201210457630.2A CN201210457630A CN103108536B CN 103108536 B CN103108536 B CN 103108536B CN 201210457630 A CN201210457630 A CN 201210457630A CN 103108536 B CN103108536 B CN 103108536B
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- Prior art keywords
- supply unit
- adsorption mouth
- bare crystalline
- receiving position
- supply
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
Abstract
The invention provides a component feeder and a component feeding method, wherein the improvement of the production takt is prevented from being hindered and the cost is avoided from increasing. The component feeder (10) comprises a suction head (16) used for conveying dies (D); a feeding bench (20) used for conveying the dies (D) to a surface mounting unit (1) after receiving the dies (D) from the suction head (16); and a suction nozzle (21) arranged on the feeding bench (20) and used for sucking the dies (D) conveyed by the suction head (16).
Description
Technical field
The present invention relates to a kind of part from deposit electronic unit conveys to electronic unit, and to erecting device supply
Assembly supply device and part supply method.
Background technology
There are following apparatus, it is easily carried out for the bare crystalline that will be supplied in the way of wafer or pallet in erecting device
Supply in the state of absorption, and from wafer or pallet, make the supply adsorption mouth for arranging at certain intervals adsorb the monolithic of bare crystalline,
And supplied.For example, a kind of assembly supply device with supply head has been recorded in patent documentation 1, the supply head has
The multiple adsorption mouths for arranging, and following actions are repeated by moving back and forth, i.e.,：Receiving position after positioning
Place, is carried out after absorption holding by the adsorption mouth to electronic unit, fixed on the transmission position to after being moved linearly using drive mechanism
Position, so as to transmit to the electronic unit.
Patent documentation 1：Japanese Unexamined Patent Publication 2009-99846 publications
The content of the invention
In the assembly supply device described in patent documentation 1, sometimes due to absorption mistake of erecting device etc., and in portion
Bare crystalline is remained in the supply adsorption mouth of part feedway side.Because the bare crystalline for remaining becomes obstacle when bare crystalline next time is supplied,
So must be removed using some methods.For example, it is removed using the adsorption mouth of erecting device, or is supplied using part
The adsorption mouth of device side is removed, or when making that there is the supply head for supplying adsorption mouth to return to bare crystalline supply pusher side, utilizes
Air blows away bare crystalline is remained.
But, due to the method that is removed using the adsorption mouth of erecting device and the suction using assembly supply device side
Method that attached mouth is removed so that the pitch time in production process shortens, so hindering the raising of production efficiency.Make
When supply unit returns bare crystalline supply pusher side, will be remained in the method that bare crystalline blows away using air, need to add special air spray
Injection device, the manufacturing cost for causing assembly supply device rises.
It is an object of the present invention to shorten will not the pitch time in production process and hinder the raising of production efficiency,
Manufacturing cost is avoided to rise.
The assembly supply device as first method of the present invention, it is characterised in that include：Conveyer device, it is to electronics
Part is conveyed；Supply unit, its after the electronic unit is received from the conveyer device, by the electronic unit to peace
Assembling device is transmitted, also, in the receiving position from the conveyer device reception electronic unit, to erecting device biography
Send between the transmission position of the electronic unit, moved back and forth；And adsorption mouth, it is arranged in the supply unit, right
The electronic unit conveyed by the conveyer device is adsorbed, also, starts movement from the transmission position in the supply unit
Timing and stop at least one of timing of the receiving position timing, release gas.
In the assembly supply device of the present invention, preferably start the timing of movement from the transmission position in the supply unit
In the case of making the adsorption mouth release gas, the supply unit has to departing from from the adsorption mouth in transmission position side
The electronic component storing portion that received of electronic unit.
In the assembly supply device of the present invention, the timing for preferably stopping at the receiving position in the supply unit makes institute
In the case of stating adsorption mouth releasing gas, the supply unit has the electricity to departing from from the adsorption mouth in the receiving position side
The electronic component storing portion that subassembly is received.
In the assembly supply device of the present invention, the assembly supply device according to technical scheme 1, wherein, to from institute
The electronic component storing portion that the electronic unit of adsorption mouth disengaging is received is stated, the transmission position or the reception is arranged on
Position.
In the assembly supply device of the present invention, preferably the supply unit is from being configured with the part of the adsorption mouth to institute
State between electronic component storing portion, with height with the rake of the step-down towards the electronic component storing portion.
The part supply method as second method of the present invention, it is characterised in that comprising following operations：Absorption process,
In the operation, electronic unit is adsorbed by the adsorption mouth of supply unit；Mobile process, in the operation, makes the supply
The receiving position that platform is adsorbed from the adsorption mouth to electronic unit, is moved to the supply unit described to erecting device transmission
The transmission position of electronic unit；And part removing step, in the operation, in the supply unit from the beginning of the transmission position
Mobile timing and at least one of timing of receiving position timing is stopped at, make the adsorption mouth release gas.
The effect of invention
The present invention shortens will not the pitch time in production process and hinder the raising of production efficiency, can avoid manufacture
Cost increase.
Description of the drawings
Fig. 1 is to represent assembly supply device involved by present embodiment and from assembly supply device receiving member supply
Surface-mount devices top view.
Fig. 2 is the top view for representing the assembly supply device involved by present embodiment.
Fig. 3 is the top view of the supply unit involved by present embodiment.
Fig. 4 is the A-A profiles of Fig. 3.
Fig. 5 is the profile of the supply unit involved by present embodiment.
Fig. 6 is for illustrating supply unit from the figure for transmitting action when position is moved.
Fig. 7 is for illustrating supply unit from the figure for transmitting action when position is moved.
Fig. 8 is for illustrating supply unit from the figure for transmitting action when position is moved.
Fig. 9 is the profile for representing the position relationship between bare crystalline resettlement section and adsorption mouth that supply unit has.
The figure of action when Figure 10 is for illustrating that supply unit stops at receiving position.
The figure of action when Figure 11 is for illustrating that supply unit stops at receiving position.
The figure of action when Figure 12 is for illustrating that supply unit stops at receiving position.
Figure 13 is the profile of the 1st variation for representing supply unit.
Figure 14 is the profile of the 2nd variation for representing supply unit.
Figure 15 is for illustrating the supply unit involved by the 2nd variation from the figure for transmitting action when position is moved.
Figure 16 is for illustrating the supply unit involved by the 2nd variation from the figure for transmitting action when position is moved.
Figure 17 is for illustrating the supply unit involved by the 2nd variation from the figure for transmitting action when position is moved.
The figure of action when Figure 18 is for illustrating that supply unit stops at receiving position.
The figure of action when Figure 19 is for illustrating that supply unit stops at receiving position.
The figure of action when Figure 20 is for illustrating that supply unit stops at receiving position.
Specific embodiment
Referring to the drawings, the concrete mode for implementing the present invention is described in detail（Embodiment）An example.The present invention
Do not limited by the content of the following record related to present embodiment.In addition, the structure of the present embodiment in following record
In key element, the content that can be readily apparent that comprising those skilled in the art and substantially the same content.In addition, following note
The structural element of the present embodiment of load can be with appropriately combined.In addition, without departing from the scope of the subject in the invention, can carry out
Various omissions, displacement or the change of structural element.
Fig. 1 is to represent assembly supply device 10 involved by present embodiment and from the receiving member of assembly supply device 10
The top view of the surface-mount devices 1 of supply.Have as the surface-mount devices 1 of an example of the present invention：The base of rectangle
Portions 1B, boarded head 2, X-axis mechanical arm 4X, Y-axis mechanical arm 4Y and conveyer device 5.Following portions are carried and supported to base portion 1B
Part：X-axis mechanical arm 4X and Y-axis mechanical arm 4Y；Boarded head 2, it is supported on X-axis mechanical arm 4X and Y-axis mechanical arm 4Y；With
And conveyer device 5.The surface-mount devices 1 carry the electronic unit supplied from assembly supply device 10 on substrate S.
Boarded head 2 has multiple adsorption mouths 3 adsorbed to the electronic unit supplied from assembly supply device 10.Absorption
Mouth 3 is adsorbed using negative pressure to electronic unit.Boarded head 2 is supported on X-axis mechanical arm 4X and Y-axis mechanical arm 4Y.Boarded head 2
Moved in X direction by X-axis mechanical arm 4X, moved along the Y-direction orthogonal with X-direction by Y-axis mechanical arm 4Y.Conveyer device 5
Have：A pair of guide rails 5R, 5R；And transport platform 5S, it is mounted on guide rail 5R, 5R, moves in X direction.Transport platform 5S is carried
And conveying substrate S.Electronic unit is carried on from boarded head 2 to substrate S.
When surface-mount devices 1 carry electronic unit on substrate S, boarded head 2 is by X-axis mechanical arm 4X and Y-axis
Mechanical arm 4Y and move, being supplied to the electronic unit of the part supply position of assembly supply device 10 using adsorption mouth 3 pairs is carried out
Absorption keeps.Then, boarded head 2 is taken to the surface of the substrate S for being conveyed and being positioned on surface-mount devices 1 by conveyer device 5
Carry electronic unit.Below, assembly supply device 10 is illustrated.
Fig. 2 is the top view for representing the assembly supply device 10 involved by present embodiment.Assembly supply device 10 has：
Reservoir 11, maintaining part 12, X-axis mechanical arm 15X, Y-axis mechanical arm 15Y, the adsorption head 16, absorption position as conveyer device are known
Other device 17, supply unit 20 and direct acting drive mechanism 30.Assembly supply device 10 installs dress via junction surface 10A and surface
Base portion 1B for putting 1 links, and is positioned.Assembly supply device 10 and surface-mount devices 1 internally have respectively
Independent control device, combines with one another action via communication interface.Below, for convenience of description, not to assembly supply device 10
Control device and the control device of surface-mount devices 1 especially distinguished, and illustrate as control device.
Assembly supply device 10 is as shown in Fig. 2 in the opposition side of the side of configuration surface erecting device 1, arrange reservoir
11.Reservoir 11 is by multiple cuttings（dicing）Wafer W is stacked across gap and taken care of.Cutting crystal wafer W will be by being used as chip
, silicon chip forming multiple electronic circuits, clathrate is cut in units of the circuit forming region for specifying, so as to as multiple
Bare crystalline D and separate, and overleaf paste adhesive sheet.
Maintaining part 12 has the keeper 13 of ring-type.The cutting that keeper 13 pairs is pulled out from reservoir 11 to maintaining part 12 is brilliant
Circle W is kept.X-axis mechanical arm 15X makes adsorption head 16 and absorption position identifying device 17 move in X direction as one
Dynamic, Y-axis mechanical arm 15Y makes adsorption head 16 and absorption position identifying device 17 as one along Y-direction movement.Adsorption head 16
With adsorption mouth 21, the adsorption mouth 21 is adsorbed by the use of negative pressure to bare crystalline D of an example as electronic unit.Adsorption head
16 from cutting crystal wafer W absorption bare crystallines D being maintained on keeper 13, and transmit to supply unit 20.
Absorption position identifying device 17 is photographing unit, laser designator or the range measurement sensing of such as image recognition
Device etc..Absorption position identifying device 17 is obtained should adsorb the position of bare crystalline D and to supply unit 20 transmit bare crystalline D from adsorption head 16
Position etc..Control device obtains the position acquired by absorption position identifying device 17.The control device is above-mentioned based on what is obtained
Position, to being adsorbed the position of bare crystalline D from adsorption head 16 or transmitting position of bare crystalline D etc. to supply unit 20 computing is carried out.
Supply unit 20 has：Adsorption mouth 21, it is adsorbed to bare crystalline D using negative pressure, is kept；And bare crystalline resettlement section
22, it receives bare crystalline D departed from from adsorption mouth 21.Supply unit 20 after bare crystalline D is received from adsorption head 16, by bare crystalline D to table
Face erecting device 1 is transmitted, and transmits naked in receiving position H from reception bare crystalline D of adsorption head 16, to surface-mount devices 1
Between the transmission position P of brilliant D, moved back and forth.Receiving position H is arranged in the coverage area of adsorption head 16, transmits position
It is arranged in the coverage area of boarded head 2 of surface-mount devices 1.The direction that supply unit 20 is moved back and forth is parallel with Y-direction
Direction.The construction of supply unit 20 is described below.
Direct acting drive mechanism 30 has：Direct acting guide rail 30R, jointless Timing Belt 31, the 1st belt wheel of receiving position H side
32H and the 2nd belt wheel 32P of transmission position P sides.Timing Belt 31 is winded at the 1st belt wheel 32H and traffic bit of receiving position H side
Put on the 2nd belt wheel 32P of P sides.In addition, Timing Belt 31 links with supply unit 20.Supply unit 20 by direct acting guide rail 30R by being guided
And moved along a straight line.Direct acting drive mechanism 30 for example using motor to the 1st belt wheel 32H or the 2nd belt wheel 32P in it is arbitrary
It is individual to be driven.Also, direct acting drive mechanism 30 is switched over by the direction of rotation to above-mentioned motor, so as in received bit
Put between H and transmission position P, make supply unit 20 carry out reciprocating linear movement along direct acting guide rail 30R.
In receiving position H and transmission position P, buffer gear 33H, 33P are respectively provided with.Buffer gear 33H, 33P lead to
Cross fastening unit 35H, 35P to fasten and be fixed on buffer gear supporter 34H, 34P.The buffer gear 33H of receiving position H with
Supply unit 20 is compared and is configured in the side of reservoir 11, and the buffer gear 33P for transmitting position P is configured in surface peace compared with supply unit 20
The side of assembling device 1.Using this configuration, buffer gear 33H, 33P are to the supply unit 20 mobile using direct acting drive mechanism 30
Impact during raw collision is absorbed.In addition, assembly supply device 10 can also have the bare crystalline reversion for inverting bare crystalline D
Mechanism.Below, the part supply method involved by present embodiment is performed to assembly supply device 10, bare crystalline D is pacified to surface
Action when assembling device 1 is supplied is illustrated.
First, cutting crystal wafer W of the control device by keeping in reservoir 11 is pulled out to maintaining part 12, on keeper 13
Position, fix.Then, control device is driven to X-axis mechanical arm 15X and Y-axis mechanical arm 15Y, makes adsorption head 16 in guarantor
Hold the top movement of the cutting crystal wafer W positioned in portion 12.Then, control device is using the 17 pairs of absorption of absorption position identifying device
The position of bare crystalline D measures, and the positioning of adsorption head 16 is carried out on the accurate location after being corrected.Then, control dress
The adsorption mouth that putting has adsorption head 16 declines, and in the timing that the leading section of above-mentioned adsorption mouth abuts with bare crystalline D, produces negative
Pressure, using the leading section of adsorption mouth bare crystalline D is adsorbed（Absorption process）.
Control device the adsorption head 16 for making to have adsorbed bare crystalline D adsorption mouth rise after, to X-axis mechanical arm 15X and Y-axis machine
Tool arm 15Y is driven, and the adsorption head 16 for having adsorbed bare crystalline D is moved to receiving position H（Mobile process）, with the institute of supply unit 20
The adsorption mouth 21 having is relative.Then, control device declines the adsorption mouth of the adsorption head 16 for having adsorbed bare crystalline D, make bare crystalline D with
The leading section of the adsorption mouth 21 of supply unit 20 abuts.The timing that control device is abutted in bare crystalline D with the leading section of adsorption mouth 21, makes
Adsorption mouth 21 produces negative pressure, and the absorption by adsorption head 16 to bare crystalline D is released.So, 21 pairs of suctions of the adsorption mouth of supply unit 20
Attached 16 bare crystalline D adsorbed is adsorbed.So, supply unit 20 receives bare crystalline D from adsorption head 16.
After supply unit 20 receives bare crystalline D, control device is repeated following actions, i.e.,：Adsorption head 16 is made to maintaining part
Other bare crystallines D are adsorbed again by 12 movements, and load is put in the movement in the adsorption mouth 21 of the supply unit 20 for not yet keeping bare crystalline D
Bare crystalline D.Become the timing of the state of the bare crystalline for keeping necessary amount in multiple adsorption mouths 21 of supply unit 20, control device makes directly
Dynamic drive mechanism 30 is driven, and makes supply unit 20 from receiving position H to transmission position P movements.
At transmission position P, absorption of the control device by the adsorption mouth 21 of supply unit 20 to bare crystalline D is released.Then, control
Device makes the boarded head 2 of surface-mount devices 1 to transmission position P movements, and makes the adsorption mouth 3 of boarded head 2 produce negative pressure, makes
Bare crystalline D in the adsorption mouth 21 of the absorption supply unit 20 of adsorption mouth 3 of boarded head 2.So, supply unit 20 pacifies bare crystalline D to surface
The boarded head 2 of assembling device 1 is transmitted.Then, control device carries bare crystalline D using boarded head 2 to substrate S.By the institute of supply unit 20
To after the transmission of boarded head 2, control device makes supply unit 20 move from transmission position P to receiving position H to whole bare crystallines D having.
So, assembly supply device 10 supplies bare crystalline D to surface-mount devices 1.Below, the construction of supply unit 20 is illustrated.
Fig. 3 is the top view of the supply unit involved by present embodiment.Fig. 4 is the A-A profiles of Fig. 3.Fig. 5 is this reality
Apply the profile of the supply unit involved by mode.Fig. 5 illustrates the section with the section same position of Fig. 4.Section shown below
Figure is also identical.Supply unit 20 has：It is the main part 23 of rectangular shape during top view；And wall portion 24, it is from main part
23 peripheral part is uprightly arranged.Multiple adsorption mouths 21 are arranged in supply unit 20, more specifically, are arranged on the master of supply unit 20
In the adsorption mouth setting unit 25 in body portion 23.Wall portion 24 to adsorption mouth 21 is uprightly arranged from the direction that adsorption mouth setting unit 25 is protruded.
The end 24T of wall portion 24 is located at the position higher than the surface 25P of adsorption mouth setting unit 25.
In the present embodiment, supply unit 20 has the bare crystalline resettlement section 22 as electronic component storing portion, and it is to from suction
Bare crystalline D as electronic unit that attached mouth 21 departs from is received.Supply unit 20 has bare crystalline resettlement section in transmission position P sides
22.In the present embodiment, bare crystalline resettlement section 22 is arranged on transmission position P sides, but it is also possible to be arranged on receiving position H side.It is naked
The bottom 22B of brilliant resettlement section 22 is located at the position lower than the surface 25P of adsorption mouth setting unit 25.Therefore, bare crystalline resettlement section 22 with
Adsorption mouth setting unit 25 compares depression.Adsorption mouth setting unit 25 and bare crystalline resettlement section 22 are surrounded by wall portion 24.
Around adsorption mouth setting unit 25, it is not necessary to certain providing walls 24, but using wall portion 24, can reduce from absorption
The probability that bare crystalline D that mouth 21 comes off falls and be mixed into from supply unit 20 to the inside of assembly supply device 10.The end of wall portion 24
Position relationship between the leading section of portion 24T and adsorption mouth 21 is not specially limited, and could be arranged to one party higher, it is also possible to
It is set to both highly identical.Because bare crystalline resettlement section 22 pairs receives from bare crystalline D that adsorption mouth 21 departs from, thus by
In the space that wall portion 24 is surrounded, be formed as being recessed compared with adsorption mouth setting unit 25.By structure as noted above, so as to naked
Brilliant resettlement section 22 reliably keeps bare crystalline D, the situation that bare crystalline D can be avoided to fall to the inside of assembly supply device 10.
Fig. 5 is the profile of the variation for representing supply unit.In supply unit 20a, the part of adsorption mouth 21 is configured with i.e.
Adsorption mouth setting unit 25, by height as the rake 25S towards the gradually step-down of bare crystalline resettlement section 22 is constituted.Rake 25S has
There is the function of guiding bare crystalline D for departing from from adsorption mouth 21 and falling to bare crystalline resettlement section 22.Therefore, with rake 25S's
Supply unit 20a, can be such that bare crystalline D departed from from adsorption mouth 21 reliably moves to bare crystalline resettlement section 22.
Adsorption mouth 21 is arranged in supply unit 20.21 pairs of bare crystallines D conveyed by adsorption head 16 of adsorption mouth are adsorbed, and
Start the timing of movement from transmission position P in supply unit 20 and stop at least one of timing of receiving position H timing,
Release gas.The adsorption mouth 3 that the boarded head 2 of surface-mount devices 1 has, cannot inhale from the adsorption mouth 21 of supply unit 20 sometimes
Attached bare crystalline D, so as to remain bare crystalline D in the leading section of adsorption mouth 21.Bare crystalline D of residual must be removed using some methods.
Supply unit 20 goes out gas by making adsorption mouth 21 in above-mentioned timing releasing, so that the leading section residual of adsorption mouth 21
Bare crystalline D departs from.For example, start mobile timing from transmission position P in supply unit 20, adsorption mouth 21 is released after gas, in bare crystalline D
From the timing that adsorption mouth 21 departs from, supply unit 20 is set to move towards receiving position H, i.e. gradually to leave from transmission position P.From suction
Stop at the position that bare crystalline D that attached mouth 21 departs from will be in the horizontal direction, but the process over time of supply unit 20 and direction
Receiving position H is moved.Therefore, the position relationship between bare crystalline D in horizontal direction and supply unit 20 changes.More specifically
Say, in the horizontal direction, bare crystalline D is left from adsorption mouth 21, and be close to bare crystalline resettlement section 22.
The bare crystalline D process over time that departs from from adsorption mouth 21 and fall.It is as noted above, due to Jing over time
Cross, in the horizontal direction, bare crystalline D is close to bare crystalline resettlement section 22, so bare crystalline resettlement section 22 is located at the underface of bare crystalline D.Cause
This, bare crystalline D for falling is caught by bare crystalline resettlement section 22.By structure as noted above, such that it is able to reliably remove absorption
Bare crystalline D remained on mouth 21.Below, following examples are illustrated, i.e. assembly supply device 10 is by performing present embodiment
Involved part supply method, so as to when supply unit 20 is moved from transmission position P to receiving position H, to bare crystalline D for remaining
Reclaimed.
Fig. 6 to Fig. 8 is for illustrating supply unit from the figure for transmitting action when position is moved.As shown in fig. 6, supply unit 20
Stop at transmission position P.Now, adsorption mouth 21 does not produce negative pressure, and bare crystalline D is not adsorbed mouth 21 and adsorbs.Shown in Fig. 1, Fig. 2
Control device, make supply unit 20 from transmission position P to receiving position H movement in the case of, as shown in fig. 7, with supply unit
20 start movement simultaneously or will start the timing before movement, and from adsorption mouth 21 gas G is released（Part removes work
Sequence）.So, bare crystalline D departs from from adsorption mouth 21.
In the timing that bare crystalline D departs from from adsorption mouth 21, supply unit 20 is just moved towards receiving position H.Due to supply unit 20
Transmission position P sides there is bare crystalline resettlement section 22, if so supply unit 20 towards receiving position H move, as shown in figure 8,
Bare crystalline resettlement section 22 is gradually moved to the lower section of bare crystalline D departed from from adsorption mouth 21.Then, bare crystalline resettlement section 22 will fall
Bare crystalline D is caught.As noted above, assembly supply device 10 is moved by starting from transmission position P to receiving position H in supply unit 20
Dynamic timing, makes adsorption mouth 21 release gas, such that it is able to make bare crystalline D depart from from adsorption mouth 21, and in bare crystalline resettlement section 22
Reclaim.As a result, assembly supply device 10 can reliably remove bare crystalline D on the leading section for remaining in adsorption mouth 21, and
Reclaimed.
It is preferred that no matter there is bare crystalline D of noresidue, adsorption mouth 21 is released when supply unit 20 starts to move to transmission position P
Gas G.Even if if so, then not using the device that detected of bare crystalline D to remaining, it is also possible to by bare crystalline D of residual to
Reliably reclaim in bare crystalline resettlement section 22.Below, other examples that bare crystalline D of 10 pairs of residuals of assembly supply device is reclaimed are illustrated
Son.
Fig. 9 is the profile for representing the position relationship between bare crystalline resettlement section and adsorption mouth that supply unit has.Figure 10
The figure of action when to Figure 12 being for illustrating that supply unit stops at receiving position.In this example embodiment, supply unit 20 is had
Bare crystalline resettlement section 22, be configured in the receiving position H side of supply unit 20.Also, adsorption mouth 21 stops at reception in supply unit 20
The timing releasing of position H goes out gas G.
First, as shown in Figure 10, supply unit 20 is moved from transmission position P to receiving position H.Now, adsorption mouth 21 is not produced
Raw negative pressure, in addition, not releasing gas G.Control device shown in Fig. 1, Fig. 2 as shown in figure 11, in supply unit 20 reception is stopped at
The timing while H of position or before it will stop, from adsorption mouth 21 gas G is released.So, bare crystalline D is de- from adsorption mouth 21
From.
In the timing that bare crystalline D departs from from adsorption mouth 21, supply unit 20 stops at receiving position H.Because supply unit 20 is connecing
The moving direction rear side for receiving position H has bare crystalline resettlement section 22, if so supply unit 20 stops at receiving position H, such as
Shown in Figure 12, the direction that bare crystalline D departed from from adsorption mouth 21 is come along the movement of supply unit 20（From transmission position P towards receiving position H
Direction）It is mobile.Because the direction side come in the movement of supply unit 20 has bare crystalline resettlement section 22, so bare crystalline resettlement section 22 will fall
Bare crystalline D got off is caught.
As noted above, assembly supply device 10 makes adsorption mouth by stopping at the timing of receiving position H in supply unit 20
21 release gas, such that it is able to make bare crystalline D depart from from adsorption mouth 21, and reclaim in bare crystalline resettlement section 22.As a result, part is supplied
Bare crystalline D remained on the leading section of adsorption mouth 21 can reliably be removed and reclaimed to device 10.
Start the timing of movement towards receiving position H in supply unit 20 or stop at the timing of receiving position H, make absorption
Mouth 21 releases this series of actions of gas, is included in supply unit 20 in the action for supplying next bare crystalline D.Therefore, no
The supply beat of bare crystalline D can be impacted, will not become hinder bare crystalline D supply beat to improve will be because.Further, since continuing to use
The adsorption mouth 21 that supply unit 20 has, makes bare crystalline D depart from from adsorption mouth 21, thus need not in order to by bare crystalline D from adsorption mouth
21 remove and add new special-purpose member.It can thus be avoided the rising of assembly supply device manufacturing cost and maintenance inspection
The rising of cost is looked into, thus it is very economical.
The species of bare crystalline D remained in adsorption mouth 21（Size etc.）It is previously known.Therefore, by the kind with bare crystalline D
Class is corresponding, time or intensity that adsorption mouth 21 releases gas G is controlled respectively for the species of each bare crystalline D, even so as to chi
Different bare crystalline D such as very little, it is also possible to reliably make bare crystalline D fall into bare crystalline resettlement section 22, and reclaimed.
（1st variation of supply unit）
Figure 13 is the profile of the 1st variation for representing supply unit.In this variation, supply unit 20b is relative to absorption
Mouth 21, has respectively bare crystalline resettlement section 22,22H on transmission position P and both positions of receiving position H.If using the confession
Platform 20b is given, then can be started the timing of movement towards receiving position H in supply unit 20 and be stopped at the timing of receiving position H
The two timings, from adsorption mouth 21 gas G is released.I.e., it is possible to increase to remaining in what bare crystalline D in adsorption mouth 21 was reclaimed
Chance.For example, though supply unit 20 towards receiving position H start movement timing, from 21 gas injection G of adsorption mouth when, nothing
Method is reclaimed to bare crystalline D for remaining, it is also possible to the timing of receiving position H is stopped in supply unit 20, again from adsorption mouth 21
Gas G is released, bare crystalline D of residual is reclaimed in bare crystalline resettlement section 22.
（2nd variation of supply unit）
Figure 14 is the profile of the 2nd variation for representing supply unit.In this variation, supply unit 20c is relative to absorption
Mouth 21, does not have bare crystalline resettlement section in transmission position P sides and receiving position H side.If in above-mentioned supply unit 20c towards reception
Position H starts the timing of movement or stops at the timing of receiving position H, makes adsorption mouth 21 release gas, then bare crystalline D for remaining
Fall to the moving direction opposition side or moving direction side of supply unit 20.
Even if using this supply unit 20c, performing the part supply method involved by present embodiment, it is also possible to will remain
Bare crystalline D in adsorption mouth 21 is removed from adsorption mouth 21.But, because bare crystalline D for falling is possible to assembly supply device 10
Inside it is mixed into, so in transmission position P or the lower section of receiving position H, bare crystalline resettlement section 26 of the configuration with recess 27, will fall
Bare crystalline D come is caught and is reclaimed.Below, following examples are illustrated, i.e.,：Part with supply unit 20c supply dress
10 are put, by performing the part supply method involved by present embodiment, so as to reclaim to bare crystalline D for remaining.
Figure 15 to Figure 17 is the action for illustrating when the supply unit involved by the 2nd variation is moved from transmission position
Figure.As shown in figure 15, supply unit 20 stops at transmission position P.In transmission position P, bare crystalline resettlement section 26 is set.More specifically,
The bare crystalline resettlement section 26 arranged on transmission position P, is configured in the lower section of supply unit 20c.Control device shown in Fig. 1, Fig. 2,
Make supply unit 20 from transmission position P to receiving position H in the case of movement, as shown in figure 16, starting to move with supply unit 20c
Move simultaneously or the timing before movement will started, from adsorption mouth 21 gas G is released.So, bare crystalline D is from adsorption mouth 21
Depart from.
In the timing that bare crystalline D departs from from adsorption mouth 21, supply unit 20 is just moved towards receiving position H.If supply unit 20c
Towards the movement of receiving position H, then as shown in figure 17, bare crystalline D departed from from adsorption mouth 21 falls in transmission position P.Due to passing
Position P configuration bare crystallines resettlement section 26 is sent, so bare crystalline resettlement section 26 catches bare crystalline D for falling.As noted above, part is supplied
To device 10 by starting mobile timing from transmission position P to receiving position H in supply unit 20c, adsorption mouth 21 is set to release gas
Body, such that it is able to make bare crystalline D depart from from adsorption mouth 21, and reclaims in bare crystalline resettlement section 26.As a result, assembly supply device 10
Bare crystalline D remained on the leading section of adsorption mouth 21 can reliably be removed, and be reclaimed.Below, illustrate with supply unit
The other examples that bare crystalline D of 10 pairs of residuals of assembly supply device of 20c is reclaimed.
The figure of action when Figure 18 to Figure 20 is for illustrating that supply unit stops at receiving position.First, as shown in figure 18,
Supply unit 20c is moved from transmission position P towards receiving position H.Now, adsorption mouth 21 does not produce negative pressure, in addition, not releasing gas
G.Control device shown in Fig. 1, Fig. 2, as shown in figure 19, while supply unit 20c stops at receiving position H or in general
Timing before stopping, from adsorption mouth 21 gas G is released.So, bare crystalline D departs from from adsorption mouth 21.In receiving position H from suction
Bare crystalline D that attached mouth 21 departs from, falls while direction of the edge from transmission position P towards receiving position H is moved.
Bare crystalline resettlement section 26 is set in receiving position H, more specifically, in receiving position H, is connect with stopping at a part
The mode that supply unit 20c of position H overlaps is received, in the lower section configuration bare crystalline resettlement section 26 of supply unit 20c.As shown in figure 19, exist
Supply unit 20c is stopped in the state of receiving position H, makes the recess 27 of bare crystalline resettlement section 26 along from transmission position P towards reception
Stretch out in the direction of position H.Due to bare crystalline D departed from from adsorption mouth 21 at receiving position H, fall more than supply unit 20c,
So bare crystalline D is caught and is reclaimed by bare crystalline resettlement section 26.
It is as noted above, though supply unit 20c not have bare crystalline resettlement section in the case of, as long as transmission position P or
Receiving position H, in the lower section configuration bare crystalline resettlement section 26 of supply unit 20c, and on this basis, performs involved by present embodiment
Part supply method, then can obtain that there is the effect of bare crystalline resettlement section identical, effect with supply unit 20c.In addition,
The timing for releasing gas G from adsorption mouth 21 is not limited to above-mentioned embodiment, or in transmission position P and receiving position H
Between in the way moved.In the case, by the timing that gas G is released from adsorption mouth 21, making the translational speed of supply unit
Change, changes the relative position on the moving direction between supply unit 20,20c and bare crystalline D after disengaging, it is also possible to obtain identical
Effect, effect.
Claims (5)
1. a kind of assembly supply device, it is characterised in that include：
Conveyer device, it is conveyed to electronic unit；
Supply unit, it passes the electronic unit to erecting device after the electronic unit is received from the conveyer device
Send, also, the electricity is transmitted in the receiving position from the conveyer device reception electronic unit, to the erecting device
Between the transmission position of subassembly, moved back and forth；
Buffer gear, it is arranged at the receiving position, the confession to moving to the receiving position from the transmission position
Impact when colliding to platform is absorbed；And
Adsorption mouth, it is arranged in the supply unit, and the electronic unit to being conveyed by the conveyer device adsorbs, also,
Collide with the buffer gear in the supply unit and stop at the timing of the receiving position, release gas.
2. assembly supply device according to claim 1, wherein,
The electronics that the supply unit is received in the receiving position side with the electronic unit to departing from from the adsorption mouth
Part resettlement section.
3. assembly supply device according to claim 1, wherein,
The electronic component storing portion received to the electronic unit departed from from the adsorption mouth, is arranged on the receiving position.
4. the assembly supply device according to Claims 2 or 3, wherein,
The supply unit from being configured with the part of the adsorption mouth between the electronic component storing portion, with height with
The rake of step-down towards the electronic component storing portion.
5. a kind of part supply method, it is characterised in that comprising following operations：
Absorption process, in the operation, is adsorbed by the adsorption mouth of supply unit to electronic unit；
Mobile process, in the operation, the receiving position for making the supply unit be adsorbed to electronic unit from the adsorption mouth,
It is moved to the transmission position that the supply unit transmits the electronic unit to erecting device；And
Part removing step, it is logical in the supply unit moved to the receiving position from the transmission position in the operation
Cross and collide with the buffer gear for being arranged at the receiving position and stop at the timing of the receiving position, put the adsorption mouth
Go out gas.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011249029A JP5925466B2 (en) | 2011-11-14 | 2011-11-14 | Component supply apparatus and component supply method |
| JP2011-249029 | 2011-11-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103108536A CN103108536A (en) | 2013-05-15 |
| CN103108536B true CN103108536B (en) | 2017-05-17 |
Family
ID=48315999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210457630.2A Active CN103108536B (en) | 2011-11-14 | 2012-11-14 | Component feeder and component feeding method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5925466B2 (en) |
| KR (1) | KR102025938B1 (en) |
| CN (1) | CN103108536B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000077439A (en) * | 1998-08-31 | 2000-03-14 | Matsushita Electric Ind Co Ltd | Electronic component bonding device |
| JP2005251978A (en) * | 2004-03-04 | 2005-09-15 | Matsushita Electric Ind Co Ltd | Electronic component mounting apparatus and method therefor |
| JP4412051B2 (en) * | 2004-05-10 | 2010-02-10 | パナソニック株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| JP2008147386A (en) * | 2006-12-08 | 2008-06-26 | Juki Corp | Surface mounting device |
| JP4903663B2 (en) * | 2007-10-18 | 2012-03-28 | Ｊｕｋｉ株式会社 | Parts supply device |
-
2011
- 2011-11-14 JP JP2011249029A patent/JP5925466B2/en active Active
-
2012
- 2012-11-12 KR KR1020120127175A patent/KR102025938B1/en active IP Right Grant
- 2012-11-14 CN CN201210457630.2A patent/CN103108536B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013105913A (en) | 2013-05-30 |
| KR102025938B1 (en) | 2019-09-26 |
| JP5925466B2 (en) | 2016-05-25 |
| CN103108536A (en) | 2013-05-15 |
| KR20130054155A (en) | 2013-05-24 |
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