CN103108536A - Component feeder and component feeding method - Google Patents
Component feeder and component feeding method Download PDFInfo
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- CN103108536A CN103108536A CN2012104576302A CN201210457630A CN103108536A CN 103108536 A CN103108536 A CN 103108536A CN 2012104576302 A CN2012104576302 A CN 2012104576302A CN 201210457630 A CN201210457630 A CN 201210457630A CN 103108536 A CN103108536 A CN 103108536A
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- China
- Prior art keywords
- platform
- adsorption mouth
- supply
- naked brilliant
- electronic unit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
Abstract
The invention provides a component feeder and a component feeding method, wherein the improvement of the production takt is prevented from being hindered and the cost is avoided from increasing. The component feeder (10) comprises a suction head (16) used for conveying dies (D); a feeding bench (20) used for conveying the dies (D) to a surface mounting unit (1) after receiving the dies (D) from the suction head (16); and a suction nozzle (21) arranged on the feeding bench (20) and used for sucking the dies (D) conveyed by the suction head (16).
Description
Technical field
The present invention relates to a kind of part from the deposit electronic unit electronic unit is carried, and assembly supply device and the parts supply method supplied with to erecting device.
Background technology
Have following apparatus, its naked crystalline substance in order to supply with in the mode of wafer or pallet is supplied with under the state that erecting device easily adsorbs, and from wafer or pallet, is made the monolithic of the naked crystalline substance of supply adsorption mouth absorption of arranging at certain intervals, and supplies with.For example, put down in writing a kind of assembly supply device with supply head in patent documentation 1, this supply head has a plurality of adsorption mouth that arrange, and repeatedly carry out following actions by moving back and forth, that is: the receiving position place behind the location, after by this adsorption mouth, electronic unit being adsorbed maintenance, locate on the delivering position that utilizes after the driving mechanism traveling priority, thereby this electronic unit is transmitted.
Patent documentation 1: TOHKEMY 2009-99846 communique
Summary of the invention
In the assembly supply device that patent documentation 1 is put down in writing, sometimes due to absorption mistake of erecting device etc., and on the supply adsorption mouth of assembly supply device side residual naked crystalline substance.Become obstacle due to residual naked crystalline substance when naked brilliant supply the next time, so must utilize some method to remove.For example, utilize the adsorption mouth of erecting device to remove, or utilize the adsorption mouth of assembly supply device side to remove, or when the supply head with supply adsorption mouth is returned to naked brilliant supply pusher side, utilize air that residual naked crystalline substance is blown away.
But the method that the method for removing due to the adsorption mouth of utilizing erecting device and the adsorption mouth of utilizing the assembly supply device side are removed makes the pitch time in production process shorten, so hindered the raising of production efficiency.Supply with platform and return naked brilliantly when supplying with pusher side making, utilize in the method that air will residual naked crystalline substance blows away, need to append special-purpose air jet system, cause the manufacturing cost rising of assembly supply device.
The object of the invention is to, the pitch time in production process is shortened and the raising of obstruction production efficiency, avoid manufacturing cost to rise.
Assembly supply device as the first mode of the present invention is characterized in that, comprises: conveying device, and it is carried electronic unit; Supply with platform, it is after receiving described electronic unit from described conveying device, described electronic unit is transmitted to erecting device, and, at the receiving position that receives described electronic unit from described conveying device, to between the delivering position of the described electronic unit of described erecting device transmission, move back and forth; And adsorption mouth, it is arranged on described supply platform, the electronic unit of being carried by described conveying device is adsorbed, and, begin mobile timing from described delivering position at described supply platform and stop at the timing of described receiving position at least one regularly, emit gas.
In assembly supply device of the present invention, preferably make described adsorption mouth emit gas in the situation that described supply platform begins mobile timing from described delivering position, described supply platform has the electronic component storing section that the electronic unit that breaks away from from described adsorption mouth is received in described delivering position side.
In assembly supply device of the present invention, preferably in the situation that the timing that described supply platform stops at described receiving position makes described adsorption mouth emit gas, described supply platform has the electronic component storing section that the electronic unit that breaks away from from described adsorption mouth is received in described receiving position side.
In assembly supply device of the present invention, assembly supply device described according to technical scheme 1, wherein, the electronic component storing section to the electronic unit that breaks away from from described adsorption mouth receives is arranged on described delivering position or described receiving position.
In assembly supply device of the present invention, preferred described supply platform is from the part that disposes described adsorption mouth between described electronic component storing section, has height along with towards described electronic component storing section and the rake of step-down.
Parts supply method as the second mode of the present invention is characterized in that, comprises following operation: absorption process, in this operation, adsorbed electronic unit by the adsorption mouth of supplying with platform; Mobile process, in this operation, make described supply platform from described adsorption mouth to the receiving position that electronic unit adsorbs, move to described supply platform and transmit the delivering position of described electronic unit to erecting device; And the parts removing step, in this operation, begin mobile timing from described delivering position at described supply platform and stop at the timing of described receiving position at least one regularly, make described adsorption mouth emit gas.
The effect of invention
The present invention can not make the pitch time in production process shorten and the raising of obstruction production efficiency, can avoid manufacturing cost to rise.
Description of drawings
Fig. 1 means the assembly supply device that present embodiment is related and accepts the vertical view of the surface-mount devices of parts supply from this assembly supply device.
Fig. 2 means the vertical view of the assembly supply device that present embodiment is related.
Fig. 3 is the vertical view of the related supply platform of present embodiment.
Fig. 4 is the A-A profile of Fig. 3.
Fig. 5 is the profile of the related supply platform of present embodiment.
Fig. 6 is the figure of the action when supplying with platform and move from delivering position for explanation.
Fig. 7 is the figure of the action when supplying with platform and move from delivering position for explanation.
Fig. 8 is the figure of the action when supplying with platform and move from delivering position for explanation.
Fig. 9 means and supplies with naked brilliant resettlement section that platform has and the profile of the position relationship between adsorption mouth.
Figure 10 is the figure of the action when stopping at receiving position for explanation supply platform.
Figure 11 is the figure of the action when stopping at receiving position for explanation supply platform.
Figure 12 is the figure of the action when stopping at receiving position for explanation supply platform.
Figure 13 means the profile of the 1st variation of supplying with platform.
Figure 14 means the profile of the 2nd variation of supplying with platform.
Figure 15 is the figure of the action when moving from delivering position for explanation the 2nd variation related supply platform.
Figure 16 is the figure of the action when moving from delivering position for explanation the 2nd variation related supply platform.
Figure 17 is the figure of the action when moving from delivering position for explanation the 2nd variation related supply platform.
Figure 18 is the figure of the action when stopping at receiving position for explanation supply platform.
Figure 19 is the figure of the action when stopping at receiving position for explanation supply platform.
Figure 20 is the figure of the action when stopping at receiving position for explanation supply platform.
Embodiment
With reference to accompanying drawing, describe an example that is used for implementing concrete mode of the present invention (execution mode) in detail.The present invention is not limited by the content of the following record relevant to present embodiment.In addition, in the structural element of the present embodiment of following record, comprise content and identical in fact content that those skilled in the art can easily expect.In addition, below the structural element of the present embodiment of record can appropriate combination.In addition, in the scope that does not break away from purport of the present invention, can carry out various omissions, displacement or the change of structural element.
Fig. 1 means the related assembly supply device of present embodiment 10 and accepts the vertical view of the surface-mount devices 1 of parts supply from this assembly supply device 10.Surface-mount devices 1 as an example of the present invention has: the base portion 1B of rectangle, boarded head 2, X-axis mechanical arm 4X, Y-axis mechanical arm 4Y and conveying device 5.Base portion 1B carries and supports following parts: X-axis mechanical arm 4X and Y-axis mechanical arm 4Y; Boarded head 2, it is supported on X-axis mechanical arm 4X and Y-axis mechanical arm 4Y; And conveying device 5.This surface-mount devices 1 will carry to substrate S from the electronic unit that assembly supply device 10 is supplied with.
Boarded head 2 has a plurality of adsorption mouth 3 that the electronic unit of supplying with from assembly supply device 10 is adsorbed.Adsorption mouth 3 utilizes negative pressure that electronic unit is adsorbed.Boarded head 2 is supported on X-axis mechanical arm 4X and Y-axis mechanical arm 4Y.Boarded head 2 moves along directions X by X-axis mechanical arm 4X, moves along the Y-direction with the directions X quadrature by Y-axis mechanical arm 4Y.Conveying device 5 has: pair of guide rails 5R, 5R; And transport platform 5S, it carries on guide rail 5R, 5R, moves along directions X.Transport platform 5S carries and conveying substrate S.Carry electronic unit from boarded head 2 to substrate S.
When surface-mount devices 1 carried electronic unit on the substrate S, boarded head 2 move by X-axis mechanical arm 4X and Y-axis mechanical arm 4Y, and the electronic unit that utilizes 3 pairs of adsorption mouth to be supplied to the parts supply position of assembly supply device 10 adsorbs maintenance.Then, boarded head 2 carries electronic unit to carried and be positioned the surface of the substrate S on surface-mount devices 1 by conveying device 5.Below, assembly supply device 10 is described.
Fig. 2 means the vertical view of the related assembly supply device of present embodiment 10.Assembly supply device 10 has: reservoir 11, maintaining part 12, X-axis mechanical arm 15X, Y-axis mechanical arm 15Y, the adsorption head 16 as conveying device, absorption position recognition device 17, supply with platform 20 and moving driving mechanism 30 directly.Assembly supply device 10 links via the base portion 1B of junction surface 10A and surface-mount devices 1, and positions.Assembly supply device 10 and surface-mount devices 1 have respectively independently control device in inside, via the communication interface action that combines with one another.Below, for convenience of explanation, the control device of assembly supply device 10 and the control device of surface-mount devices 1 are not distinguished especially, and described as control device.
Maintaining part 12 has the keeper 13 of ring-type.The 12 cutting crystal wafer W that pull out keep 13 pairs of keepers from reservoir 11 to maintaining part.X-axis mechanical arm 15X makes adsorption head 16 and absorption position recognition device 17 move along directions X as one, and Y-axis mechanical arm 15Y makes adsorption head 16 and absorption position recognition device 17 move along Y-direction as one.Adsorption head 16 has adsorption mouth 21, and this adsorption mouth 21 utilizes negative pressure that the naked brilliant D as an example of electronic unit is adsorbed.Adsorption head 16 adsorbs naked brilliant D from the cutting crystal wafer W that remains on keeper 13, and transmits to supplying with platform 20.
Absorption position recognition device 17 is camera, laser designator or distance measurement sensors etc. of using such as image recognition.Absorption position recognition device 17 is obtained should be by the position of the naked brilliant D of adsorption head 16 absorption and to the position etc. of supplying with platform 20 and transmitting naked brilliant D.Control device is obtained absorption position recognition device 17 obtained position.This control device is based on the above-mentioned position of obtaining, to carrying out computing by the position of the adsorption head 16 naked brilliant D of absorption or to the position etc. of supplying with platform 20 and transmit naked brilliant D.
Supplying with platform 20 has: adsorption mouth 21, and it utilizes negative pressure that naked brilliant D is adsorbed, keeps; And naked brilliant resettlement section 22, it receives the naked brilliant D that breaks away from from adsorption mouth 21.Supply with platform 20 after receiving naked brilliant D from adsorption head 16, naked brilliant D is transmitted to surface-mount devices 1, and at the receiving position H that receives naked brilliant D from adsorption head 16, to between the delivering position P of the surface-mount devices 1 naked brilliant D of transmission, move back and forth.Receiving position H is arranged in the coverage area of adsorption head 16, and delivering position is arranged in the coverage area of boarded head 2 of surface-mount devices 1.The direction that supply platform 20 moves back and forth is the direction parallel with Y-direction.Supplying with the back that is configured in of platform 20 records and narrates.
Straight moving driving mechanism 30 has: directly move guide rail 30R, jointless Timing Belt 31, the 1st belt wheel 32H of receiving position H side and the 2nd belt wheel 32P of delivering position P side.Timing Belt 31 is on the 2nd belt wheel 32P of the 1st belt wheel 32H that hangs over receiving position H side and delivering position P side.In addition, Timing Belt 31 links with supply platform 20.Supply with platform 20 by carrying out rectilinear motion by straight moving guide rail 30R guiding.Straight moving driving mechanism 30 for example utilizes motor that any in the 1st belt wheel 32H or the 2nd belt wheel 32P driven.And directly moving driving mechanism 30 switches by the direction of rotation to above-mentioned motor, thereby between receiving position H and delivering position P, makes supply platform 20 carry out reciprocating linear along straight moving guide rail 30R and move.
On receiving position H and delivering position P, buffer gear 33H, 33P are set respectively. Buffer gear 33H, 33P are fastening and be fixed on buffer gear supporter 34H, 34P by fastening unit 35H, 35P.The buffer gear 33H of receiving position H compares with supply platform 20 and is configured in reservoir 11 sides, and the buffer gear 33P of delivering position P compares with supply platform 20 and is configured in surface-mount devices 1 side.Utilize this configuration, the impact when the supply platform 20 that buffer gear 33H, 33P move utilizing straight moving driving mechanism 30 bumps absorbs.In addition, assembly supply device 10 also can have the naked brilliant reversing device that makes naked brilliant D counter-rotating.Below, assembly supply device 10 is carried out the related parts supply method of present embodiment, the action when naked brilliant D is supplied with to surface-mount devices 1 describes.
At first, the control device cutting crystal wafer W in reservoir 11 is certainly pulled out to maintaining part 12, location, fixing on keeper 13.Then, control device drives X-axis mechanical arm 15X and Y-axis mechanical arm 15Y, makes adsorption head 16 to moving above the cutting crystal wafer W that locates on maintaining part 12.Then, control device utilizes the position of the naked brilliant D of 17 pairs of absorption of absorption position recognition device to measure, in the location of having carried out carrying out on the accurate location after the correction adsorption head 16.Then, control device descends the adsorption mouth that adsorption head 16 has, and the timing at leading section and the naked brilliant D butt of above-mentioned adsorption mouth produces negative pressure, utilizes the leading section of adsorption mouth to adsorb naked brilliant D(absorption process).
Control device is after the adsorption mouth that makes the adsorption head 16 that has adsorbed naked brilliant D rises, X-axis mechanical arm 15X and Y-axis mechanical arm 15Y are driven, make the adsorption head 16 that has adsorbed naked brilliant D move (mobile process) to receiving position H, relative with the adsorption mouth 21 that supply platform 20 has.Then, control device descends the adsorption mouth of the adsorption head 16 that has adsorbed naked brilliant D, makes the leading section butt of the adsorption mouth 21 of naked brilliant D and supply platform 20.Control device makes adsorption mouth 21 produce negative pressure, and the absorption of 16 couples of naked brilliant D of adsorption head is removed in the timing of the leading section butt of naked brilliant D and adsorption mouth 21.Like this, supplying with the naked brilliant D that 21 pairs of adsorption heads 16 of adsorption mouth of platform 20 adsorb adsorbs.Like this, supply with platform 20 and receive naked brilliant D from adsorption head 16.
After supplying with platform 20 and receiving naked brilliant D, control device carries out following actions repeatedly, that is: adsorption head 16 is moved to maintaining part 12, again other naked brilliant D is adsorbed, and mobile putting carried a naked brilliant D on the adsorption mouth 21 of the supply platform 20 that not yet keeps naked brilliant D.Become the timing of the state of the naked crystalline substance that keeps necessary amount in a plurality of adsorption mouth 21 of supplying with platform 20, control device drives straight moving driving mechanism 30, and supply platform 20 is moved to delivering position P from receiving position H.
At delivering position P place, control device will be supplied with the absorption of 21 couples of naked brilliant D of adsorption mouth of platform 20 and remove.Then, control device makes the boarded head 2 of surface-mount devices 1 move to delivering position P, and makes the adsorption mouth 3 of boarded head 2 produce negative pressure, makes adsorption mouth 3 absorption of boarded head 2 supply with naked brilliant D on the adsorption mouth 21 of platforms 20.Like this, supplying with platform 20 transmits naked brilliant D to the boarded head 2 of surface-mount devices 1.Then, control device utilizes boarded head 2 to carry naked brilliant D to substrate S.After supplying with whole naked brilliant D that platform 20 has and transmitting to boarded head 2, control device makes to be supplied with platform 20 and moves to receiving position H from delivering position P.Like this, assembly supply device 10 is supplied with naked brilliant D to surface-mount devices 1.Below, the structure of supplying with platform 20 is described.
Fig. 3 is the vertical view of the related supply platform of present embodiment.Fig. 4 is the A-A profile of Fig. 3.Fig. 5 is the profile of the related supply platform of present embodiment.Fig. 5 illustrates the section with the section same position of Fig. 4.Profile shown below is also identical.Supplying with platform 20 has: overlooking when observing is the main part 23 of rectangular shape; And wall section 24, its peripheral part from main part 23 uprightly arranges.A plurality of adsorption mouth 21 are arranged on to be supplied with on platform 20, and more particularly, the adsorption mouth that is arranged on the main part 23 of supplying with platform 20 arranges in section 25.Wall section 24 arranges section's 25 protrusions to adsorption mouth 21 from adsorption mouth direction uprightly arranges.The end 24T of wall section 24 is positioned at the higher position of surperficial 25P that section 25 is set than adsorption mouth.
In the present embodiment, supply platform 20 has the naked brilliant resettlement section 22 as electronic component storing section, and it receives the naked brilliant D as electronic unit that breaks away from from adsorption mouth 21.Supply with platform 20 and have naked brilliant resettlement section 22 in delivering position P side.In the present embodiment, naked brilliant resettlement section 22 is arranged on delivering position P side, but also can be arranged on receiving position H side.The bottom 22B of naked brilliant resettlement section 22 is positioned at the low position of surperficial 25P that section 25 is set than adsorption mouth.Therefore, naked brilliant resettlement section 22 arranges section 25 with adsorption mouth and compares depression.Adsorption mouth arranges section 25 and naked brilliant resettlement section 22 and is surrounded by wall section 24.
Adsorption mouth arrange section 25 around, wall section 24 needn't necessarily be set, but utilize wall section 24, can reduce the possibility that the naked brilliant D that comes off from adsorption mouth 21 sneaks into from supplying with platform 20 and falling to the inside of assembly supply device 10.Position relationship between the end 24T of wall section 24 and the leading section of adsorption mouth 21 does not limit especially, can be set to one party higher, and the height that also can be set to both is identical.Because 22 pairs of naked brilliant resettlement sections receive from the naked brilliant D that adsorption mouth 21 breaks away from, so in the space that is surrounded by wall section 24, form and with adsorption mouth, section 25 is set and compares depression.By structure as noted above, thereby naked brilliant resettlement section 22 keeps naked brilliant D reliably, the situation that can avoid naked brilliant D to fall to assembly supply device 10 inside.
Fig. 5 means the profile of the variation of supplying with platform.In supplying with platform 20a, the part that disposes adsorption mouth 21 is that adsorption mouth arranges section 25, by height along with towards naked brilliant resettlement section 22 gradually the rake 25S of step-down consist of.Rake 25S has the naked brilliant D that will break away from from adsorption mouth 21 and fall to the function of naked brilliant resettlement section 22 guiding.Therefore, have the supply platform 20a of rake 25S, the naked brilliant D that breaks away from from adsorption mouth 21 is moved to naked brilliant resettlement section 22 reliably.
Supply with platform 20 by making adsorption mouth 21 go out gas at above-mentioned timing releasing, thereby the residual naked brilliant D of leading section of adsorption mouth 21 is broken away from.For example, begin mobile timing at supply platform 20 from delivering position P, after making adsorption mouth 21 emit gas, from the timing that adsorption mouth 21 breaks away from, supply platform 20 is moved at naked brilliant D towards receiving position H, that is, leave from delivering position P gradually.The naked brilliant D that breaks away from from adsorption mouth 21 will stop this position in the horizontal direction, moves towards receiving position H along with the process of time but supply with platform 20.Therefore, the position relationship between the naked brilliant D on horizontal direction and supply platform 20 changes.More particularly, in the horizontal direction, naked brilliant D leaves from adsorption mouth 21, and approaches with naked brilliant resettlement section 22.
The naked brilliant D that breaks away from from adsorption mouth 21 falls along with the process of time.As noted above, due to the process along with the time, in the horizontal direction, naked brilliant D and naked brilliant resettlement section 22 approaches, thus naked brilliant resettlement section 22 be positioned at naked brilliant D under.Therefore, the naked brilliant D that falls is caught by naked brilliant resettlement section 22.By structure as noted above, thereby can remove reliably naked brilliant D residual on adsorption mouth 21.Below, following example is described, that is, assembly supply device 10 passes through to carry out the related parts supply method of present embodiment, thereby when supply platform 20 moves from delivering position P to receiving position H, residual naked brilliant D is reclaimed.
Fig. 6 to Fig. 8 is the figure of the action when supplying with platform and move from delivering position for explanation.As shown in Figure 6, supply with platform 20 and stop at delivering position P.At this moment, adsorption mouth 21 does not produce negative pressure, and naked brilliant D is not adsorbed mouth 21 absorption.Fig. 1, control device shown in Figure 2, in the situation that supply platform 20 is moved to receiving position H from delivering position P, as shown in Figure 7, the timing before beginning to move simultaneously or will begin to move with supply platform 20 is emitted gas G(parts removing step from adsorption mouth 21).Like this, naked brilliant D breaks away from from adsorption mouth 21.
, supply with platform 20 and just move towards receiving position H from the timing that adsorption mouth 21 breaks away from naked brilliant D.Has naked brilliant resettlement section 22 owing to supplying with platform 20 in delivering position P side, so if supplying with platform 20 moves towards receiving position H, as shown in Figure 8, naked brilliant resettlement section 22 moves to gradually from the below of the naked brilliant D of adsorption mouth 21 disengagings.Then, fallen naked brilliant D is caught in naked brilliant resettlement section 22.As noted above, assembly supply device 10 makes adsorption mouth 21 emit gas by beginning mobile timing from delivering position P to receiving position H at supply platform 20, thereby naked brilliant D is broken away from from adsorption mouth 21, and reclaims in naked brilliant resettlement section 22.Its result, assembly supply device 10 can be removed the naked brilliant D that remains on the leading section of adsorption mouth 21 reliably, and reclaims.
The preferred naked brilliant D no matter noresidue is arranged, adsorption mouth 21 is all emitted gas G when delivering position P begins to move at supply platform 20.If like this, even do not use the device that residual naked brilliant D is detected, also residual naked brilliant D can be reclaimed in naked brilliant resettlement section 22 reliably.Below, other examples that 10 couples of residual naked brilliant D of assembly supply device reclaim are described.
Fig. 9 means and supplies with naked brilliant resettlement section that platform has and the profile of the position relationship between adsorption mouth.Figure 10 to Figure 12 is the figure of the action when stopping at receiving position for explanation supply platform.In this example, the naked brilliant resettlement section 22 with supply platform 20 has is configured in the receiving position H side of supplying with platform 20.And adsorption mouth 21 goes out gas G at the timing releasing that supply platform 20 stops at receiving position H.
At first, as shown in figure 10, supply with platform 20 and move to receiving position H from delivering position P.At this moment, adsorption mouth 21 does not produce negative pressure, in addition, does not emit gas G.Fig. 1, control device shown in Figure 2 as shown in figure 11, the timing when supplying with platform 20 to stop at receiving position H or before will stopping is emitted gas G from adsorption mouth 21.Like this, naked brilliant D breaks away from from adsorption mouth 21.
, supply with platform 20 and stop at receiving position H from the timing that adsorption mouth 21 breaks away from naked brilliant D.Has naked brilliant resettlement section 22 owing to supplying with platform 20 at the moving direction rear side of receiving position H, if stop at receiving position H so supply with platform 20, as shown in figure 12, it is mobile that the naked brilliant D that breaks away from from adsorption mouth 21 moves along supply platform 20 direction (from the direction of delivering position P towards receiving position H) of coming.There is naked brilliant resettlement section 22 owing to moving at supply platform 20 the direction side of coming, so fallen naked brilliant D is caught in naked brilliant resettlement section 22.
As noted above, assembly supply device 10 makes adsorption mouth 21 emit gas by stop at the timing of receiving position H at supply platform 20, thereby naked brilliant D is broken away from from adsorption mouth 21, and reclaims in naked brilliant resettlement section 22.Its result, assembly supply device 10 can be removed naked brilliant D residual on the leading section of adsorption mouth 21 and reclaim reliably.
Begin mobile timing or stop at the timing of receiving position H towards receiving position H supplying with platform 20, make adsorption mouth 21 emit this a series of actions of gas, be included in and supply with the actions that platform 20 is used for supplying with next naked brilliant D.Therefore, can the supply beat of naked brilliant D not impacted, can not become and hinder the essential factor that naked brilliant D supplies with the beat raising.In addition, supply with owing to continuing to use the adsorption mouth 21 that platform 20 has, naked brilliant D is broken away from from adsorption mouth 21, so need to be for naked brilliant D is not appended new special-purpose member from adsorption mouth 21 removals.Therefore, can avoid the rising of assembly supply device manufacturing cost and the rising of maintenance test cost, therefore very economical.
On adsorption mouth 21, the kind of residual naked brilliant D (size etc.) is known in advance.Therefore, by corresponding with the kind of naked brilliant D, control respectively for the kind of each naked brilliant D time or the intensity that adsorption mouth 21 is emitted gas G, thereby even the different naked brilliant D such as size, naked brilliant D is fallen in naked brilliant resettlement section 22, and reclaim.
(supplying with the 1st variation of platform)
Figure 13 means the profile of the 1st variation of supplying with platform.In this variation, supply with platform 20b with respect to adsorption mouth 21, have respectively naked brilliant resettlement section 22,22H on delivering position P and receiving position H these two kinds of positions.If use this supply platform 20b, can begin mobile timing and these two timings of timing that stop at receiving position H towards receiving position H at supply platform 20, emit gas G from adsorption mouth 21.That is, can increase the chance that the naked brilliant D that remains on adsorption mouth 21 is reclaimed.For example, even begin mobile timing at supply platform 20 towards receiving position H, during from adsorption mouth 21 gas jet G, can't residual naked brilliant D be reclaimed, also can stop at supply platform 20 timing of receiving position H, again emit gas G from adsorption mouth 21, residual naked brilliant D is reclaimed in naked brilliant resettlement section 22.
(supplying with the 2nd variation of platform)
Figure 14 means the profile of the 2nd variation of supplying with platform.In this variation, supply with platform 20c with respect to adsorption mouth 21, all do not have naked brilliant resettlement section in delivering position P side and receiving position H side.If begin mobile timing or stop at the timing of receiving position H towards receiving position H at above-mentioned supply platform 20c, make adsorption mouth 21 emit gas, residual naked brilliant D falls to moving direction opposition side or the moving direction side of supplying with platform 20.
Even use this supply platform 20c, carry out the related parts supply method of present embodiment, also the naked brilliant D that remains on adsorption mouth 21 can be removed from adsorption mouth 21.But, because the naked brilliant D that falls might sneak in assembly supply device 10, so below delivering position P or receiving position H, configuration has the naked brilliant resettlement section 26 of recess 27, and fallen naked brilliant D is caught and reclaims.Below, following example is described, that is: have the assembly supply device 10 of supplying with platform 20c, by the related parts supply method of execution present embodiment, thereby residual naked brilliant D is reclaimed.
Figure 15 to Figure 17 is the figure of the action when moving from delivering position for explanation the 2nd variation related supply platform.As shown in figure 15, supply with platform 20 and stop at delivering position P.At delivering position P, naked brilliant resettlement section 26 is set.More particularly, the naked brilliant resettlement section 26 that arranges on delivering position P is configured in the below of supplying with platform 20c.Fig. 1, control device shown in Figure 2 are supplied with platform 20 and are moved to receiving position H from delivering position P in the situation that make, as shown in figure 16, with supply with platform 20c and begin simultaneously mobile or will begin timing before mobile, emit gas G from adsorption mouth 21.Like this, naked brilliant D breaks away from from adsorption mouth 21.
, supply with platform 20 and just move towards receiving position H from the timing that adsorption mouth 21 breaks away from naked brilliant D.Move towards receiving position H if supply with platform 20c, as shown in figure 17, the naked brilliant D that breaks away from from adsorption mouth 21 falls at delivering position P.Owing to configuring naked brilliant resettlement section 26 at delivering position P, so fallen naked brilliant D is caught in naked brilliant resettlement section 26.As noted above, assembly supply device 10 makes adsorption mouth 21 emit gas by beginning mobile timing from delivering position P to receiving position H at supply platform 20c, thereby naked brilliant D is broken away from from adsorption mouth 21, and reclaims in naked brilliant resettlement section 26.Its result, assembly supply device 10 can the leading section with adsorption mouth 21 on residual naked brilliant D remove reliably, and reclaim.Below, illustrate to have other examples that 10 couples of residual naked brilliant D of assembly supply device of supplying with platform 20c reclaim.
Figure 18 to Figure 20 is the figure of the action when stopping at receiving position for explanation supply platform.At first, as shown in figure 18, supply with platform 20c and move towards receiving position H from delivering position P.At this moment, adsorption mouth 21 does not produce negative pressure, in addition, does not emit gas G.Fig. 1, control device shown in Figure 2, as shown in figure 19, the timing when supplying with platform 20c to stop at receiving position H or before will stopping is emitted gas G from adsorption mouth 21.Like this, naked brilliant D breaks away from from adsorption mouth 21., fall when the direction of receiving position H moves from delivering position P on the edge from the naked brilliant D that adsorption mouth 21 breaks away from receiving position H.
At receiving position H, naked brilliant resettlement section 26 is set, more particularly, at receiving position H, with the mode that a part overlaps with the supply platform 20c that stops at receiving position H, the naked brilliant resettlement section 26 of configuration below supply platform 20c.As shown in figure 19,20c stops under the state of receiving position H at the supply platform, makes the recess 27 of naked brilliant resettlement section 26 along stretching out towards the direction of receiving position H from delivering position P.Due to the naked brilliant D that breaks away from from adsorption mouth 21 at receiving position H place, surpass and supply with platform 20c and fall, so naked brilliant resettlement section 26 should be caught and reclaim by naked brilliant D.
As noted above, even do not have naked brilliant resettlement section in the situation that supply with platform 20c, as long as at delivering position P or receiving position H, the naked brilliant resettlement section 26 of configuration below supply platform 20c, and on this basis, carry out the related parts supply method of present embodiment, can obtain and supply with platform 20c and have the situation of naked brilliant resettlement section identical effect, effect.In addition, the timing of emitting gas G from adsorption mouth 21 is not limited to above-mentioned execution mode, can be also in the way of moving between delivering position P and receiving position H.In the case, by emitting the timing of gas G from adsorption mouth 21, the translational speed of supplying with platform is changed, the relative position on the moving direction between the naked brilliant D after change supply platform 20,20c and disengaging also can obtain identical effect, effect.
Claims (6)
1. an assembly supply device, is characterized in that, comprises:
Conveying device, it is carried electronic unit;
Supply with platform, it is after receiving described electronic unit from described conveying device, described electronic unit is transmitted to erecting device, and, at the receiving position that receives described electronic unit from described conveying device, to between the delivering position of the described electronic unit of described erecting device transmission, move back and forth; And
Adsorption mouth, it is arranged on described supply platform, the electronic unit of being carried by described conveying device is adsorbed, and, begin mobile timing from described delivering position at described supply platform and stop at the timing of described receiving position at least one regularly, emit gas.
2. assembly supply device according to claim 1, wherein,
In the situation that beginning mobile timing from described delivering position, described supply platform make described adsorption mouth emit gas,
Described supply platform has the electronic component storing section that the electronic unit that breaks away from from described adsorption mouth is received in described delivering position side.
3. assembly supply device according to claim 1, wherein,
In the situation that the timing that described supply platform stops at described receiving position makes described adsorption mouth emit gas,
Described supply platform has the electronic component storing section that the electronic unit that breaks away from from described adsorption mouth is received in described receiving position side.
4. assembly supply device according to claim 1, wherein,
Electronic component storing section to the electronic unit that breaks away from from described adsorption mouth receives is arranged on described delivering position or described receiving position.
5. the described assembly supply device of any one according to claim 2 to 4, wherein,
Described supply platform is from the part that disposes described adsorption mouth between described electronic component storing section, has height along with towards described electronic component storing section and the rake of step-down.
6. a parts supply method, is characterized in that, comprises following operation:
Absorption process in this operation, is adsorbed electronic unit by the adsorption mouth of supplying with platform;
Mobile process, in this operation, make described supply platform from described adsorption mouth to the receiving position that electronic unit adsorbs, move to described supply platform and transmit the delivering position of described electronic unit to erecting device; And
The parts removing step, in this operation, begin mobile timing from described delivering position at described supply platform and stop at the timing of described receiving position at least one regularly, make described adsorption mouth emit gas.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-249029 | 2011-11-14 | ||
| JP2011249029A JP5925466B2 (en) | 2011-11-14 | 2011-11-14 | Component supply apparatus and component supply method |
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| Publication Number | Publication Date |
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| CN103108536A true CN103108536A (en) | 2013-05-15 |
| CN103108536B CN103108536B (en) | 2017-05-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210457630.2A Active CN103108536B (en) | 2011-11-14 | 2012-11-14 | Component feeder and component feeding method |
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| Country | Link |
|---|---|
| JP (1) | JP5925466B2 (en) |
| KR (1) | KR102025938B1 (en) |
| CN (1) | CN103108536B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1697150A (en) * | 2004-05-10 | 2005-11-16 | 松下电器产业株式会社 | Apparatus and method for mounting electronic components |
| JP2008147386A (en) * | 2006-12-08 | 2008-06-26 | Juki Corp | Surface mounting device |
| CN101415320A (en) * | 2007-10-18 | 2009-04-22 | Juki株式会社 | Component supply device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000077439A (en) * | 1998-08-31 | 2000-03-14 | Matsushita Electric Ind Co Ltd | Electronic component bonding device |
| JP2005251978A (en) * | 2004-03-04 | 2005-09-15 | Matsushita Electric Ind Co Ltd | Electronic component mounting apparatus and method therefor |
-
2011
- 2011-11-14 JP JP2011249029A patent/JP5925466B2/en active Active
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2012
- 2012-11-12 KR KR1020120127175A patent/KR102025938B1/en active IP Right Grant
- 2012-11-14 CN CN201210457630.2A patent/CN103108536B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1697150A (en) * | 2004-05-10 | 2005-11-16 | 松下电器产业株式会社 | Apparatus and method for mounting electronic components |
| JP2008147386A (en) * | 2006-12-08 | 2008-06-26 | Juki Corp | Surface mounting device |
| CN101415320A (en) * | 2007-10-18 | 2009-04-22 | Juki株式会社 | Component supply device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130054155A (en) | 2013-05-24 |
| CN103108536B (en) | 2017-05-17 |
| JP5925466B2 (en) | 2016-05-25 |
| JP2013105913A (en) | 2013-05-30 |
| KR102025938B1 (en) | 2019-09-26 |
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