CN103102864B - Hot-melting adhesive paste applied to addition type silicon rubber heat transfer printing, and preparation method of hot-melting adhesive paste - Google Patents
Hot-melting adhesive paste applied to addition type silicon rubber heat transfer printing, and preparation method of hot-melting adhesive paste Download PDFInfo
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- CN103102864B CN103102864B CN201210591687.1A CN201210591687A CN103102864B CN 103102864 B CN103102864 B CN 103102864B CN 201210591687 A CN201210591687 A CN 201210591687A CN 103102864 B CN103102864 B CN 103102864B
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Abstract
The invention provides a hot-melting adhesive paste applied to addition type silicon rubber heat transfer printing, and a preparation method of the hot-melting adhesive paste. The hot-melting adhesive paste mainly comprises distilled water, polyacrylic acid, copolyamide hot-melting adhesive powder, sodium silicate powder and absolute ethyl alcohol. The preparation method comprises the following steps of: firstly, adding the polyacrylic acid and the copolyamide hot-melting adhesive powder into the distilled water to be prepared into a suspension with good dispersity; secondly, adding the sodium silicate powder into the distilled water, and dropwise adding the absolute ethyl alcohol so as to obtain a sodium silicate sol; and finally mixing the two solutions and preparing the copolyamide hot-melting adhesive paste. The size is uniform and stable and can have good interface bonding with silica gel, so that the size can be applied to silica gel heat transfer printing and has better application prospects in the field of silicon rubber textile printing.
Description
(1) technical field
The present invention relates to a kind of hot melt adhesive slurry for the hot transfer printing of addition-type silicon rubber, be mainly used in the fields such as printing in textiles.
(2) background technology
Hot transfer printing is a new typography, due to its have simple to operate, rapidly and efficiently, the advantage such as be beautifully printed, more and more paid close attention in textile printing industry.Wherein, the hot transfer printing of ink is widely used.
Addition-type silicon rubber is taking the liquid silastic containing vinyl as matrix, with the polysiloxane containing Si-H key, be commonly called as containing hydrogen silicone oil, as linking agent (solidifying agent), under catalyst action, liquid silastic and containing hydrogen silicone oil generation addition reaction of silicon with hydrogen, thus be cross-linked into the solid elastomer of tridimensional network.Before addition-type silicon rubber sulfuration, the viscosity of sizing material is lower, is convenient to printing and pouring, and not low molecule by product is emitted when sulfuration, and shrinking percentage is little, can degree of depth sulfuration.Meanwhile, the elastic body soft that obtains after sulfuration, transparent, and there is good high temperature performance, can in-65 ~ 200 DEG C of temperature ranges, keep elasticity for a long time.In addition, addition-type silicon rubber has good electric property and chemical stability, and water-fast, resistance to ozone, resistance to irradiation, weather-resistant, hydrophobic protection against the tide, shockproof, nonflammable, have physiology inertia, nontoxic, tasteless.Due to these advantages, addition-type silicon rubber, except being applied to the industries such as Electronic Packaging, in recent years, has also obtained in printing in textiles field paying close attention to widely.Especially its good hand touch, the speciality such as environmental protection, make it become high-end symbol in stamp field.
In order to enhance productivity, produce in enormous quantities, the hot transfer technique of addition-type silicon rubber becomes the focus that industry is paid close attention to, due to the surface inertness of addition-type silicon rubber and conventional easily poisoning feature of platinum catalyst, the brute force that makes a lot of conventional hot melt adhesives be difficult to realize between silica gel is combined, thereby cause stamp or pictorial trademark bonding force after transfer printing not firm, easily play angle or repeatedly after washing, come off.
In addition, current hot melt adhesive slurry adopts benzene class or organic solvent of ketone more, and as toluene, dimethylbenzene, pimelinketone etc., these solvents often taste are large, toxic, uses for a long time, all can cause certain injury to operator and environment.Therefore, exploitation is suitable for the aqueous, environmental protective hot melt adhesive slurry of addition-type silicon rubber application, just becomes the key of hot transfer technique.
In the technology of water-dispersion hot melt glue, Shanghai Aishibo Organosilicon Material Co., Ltd. adopts the auxiliary agents such as EVA mixing hot melt adhesive, tackifier, filler, silicone antifoam agent, organosilicon mould inhibitor, obtain the hot melt adhesive slurry with good distribution, can be applicable to foodstuffs industry and carry out hot-seal (application number: 200810037016.4).Sinopec Group adopts the components such as ethene-vinyl acetate polymerized emulsion, wax, organic boric acid ester, polyvalent alcohol, tensio-active agent, water, makes the slurry that dispersing property and adhesive property are good.(application number: 201010535721.4).At present common water-based PU more belongs to elastomerics, for the footwear material that bonds.Except EVA hot melt adhesive, the copolyamide hot melt adhesive being obtained by the above nylon copolymerization of ternary, has that fusing point is low, good fluidity, adhesive speed is fast, cohesive strength is large, and has good consistency with silica gel, has been widely used in apparel industry.
For copolyamide nylon powder is mixed with to water paste, technician also has carried out some research, such as adopting sodium polyacrylate as thickening material, can obtain the good hot melt rubber cement of viscosity, be suitable for smearing or embedding, but because rubber cement wire drawing is oversize, and cannot be applied to conventional silk screen printing, so in printing in textiles field, the water-based copolyamide slurry using as slurry is still among exploitation is improved.
In addition, make solvent with water merely hot-melt adhesive granules is disperseed, because water is poor in addition-type silicon rubber surface wettability, the hot melt adhesive slurry being made into is difficult to uniform fold at silastic surface, after water evaporation, there will be local contraction starved phenomenon, is also a difficult point in printing technology.
(3) summary of the invention
Applicant of the present invention carries out the research that addition-type silicon rubber, inorganic silicic acid sodium tackiness agent and sol-gel process are prepared inorganic ceramic powder for a long time, to the surface adhesion modification of addition-type silicon rubber, and the dispersion that sol-gel method is prepared inorganic powder and inorganic powder has deep understanding.In hydrolysis of alkoxide system, crucial technology is exactly the gelation that forms uniform colloidal sol and colloidal sol.In process at water as solvent dispersion copolyamide rubber powder granule, if can form colloidal sol shape slurry, be conducive to printing, and after later stage moisture evaporation, this sol system is transformed into gelling system, is conducive to film forming.More than form the thinking of technical solution of the present invention.
The technical scheme that the present invention takes is:
For a hot melt adhesive slurry for the hot transfer printing of addition-type silicon rubber, described hot melt adhesive slurry is made up of the component of following mass parts:
100 parts of deionized waters, polyacrylic acid 0.1-2 part, copolyamide hot-melt adhesive powder 15-40 part, sodium silicate 1-10 part, dehydrated alcohol 0.25-2.5 part.
Hot melt adhesive slurry of the present invention is preferably made up of the component of following mass parts:
100 parts of deionized waters, 1 part of polyacrylic acid, 20 parts of copolyamide hot-melt adhesive powders, 5 parts of sodium silicates, 1.25 parts of dehydrated alcohols.
Copolyamide hot-melt adhesive powder of the present invention is business-like product, can on market, buy and obtain.Described copolyamide hot-melt adhesive powder preferred size is distributed in 0-80 μ m.
Sodium silicate of the present invention is business-like product, and modulus is preferably at 1-3.
Hot melt adhesive slurry of the present invention can make by the following method: (1) gets each raw material by ratio of component, the polyacrylic acid of 0.1-2 mass parts is added in the water of 80 mass parts, at 30-50 ° of C temperature, be stirred to polyacrylic acid and dissolve the transparent uniform solution of formation completely, add again the copolyamide hot-melt adhesive powder of 15-40 mass parts, continue to stir the homodisperse copolyamide slurry of formation; (2) sodium silicate of 1-10 part is added in the water of 20 mass parts, be stirred to sodium silicate and dissolve the uniform solution of formation completely at 30-65 ° of C temperature, general sodium silicate modulus used is higher, stirs temperature used also higher.Then drip the dehydrated alcohol of 0.25-2.5 mass parts, fully stir the water glass colloidal sol that forms homogeneous transparent; (3) the water glass colloidal sol that copolyamide slurry step (1) being made and step (2) make mixes, and makes described hot melt adhesive slurry.
Beneficial effect of the present invention is mainly reflected in: adopt aqueous dispersant polyacrylic acid to disperse copolyamide hot melt adhesive powder particle, be conducive to form the water fever colloidal sol slurry of good dispersion property, adopt the ethanol modified sodium silicate aqueous solution to form uniform and stable colloidal sol.Simultaneously, in the time that hot melt adhesive is applied, in later stage heat drying process, the less water glass dehydration of content forms silicon-dioxide amorphous powder, can carry out reinforcement to the copolyamide thermosol of fusing again, because water glass overall ratio is lower, can not have a negative impact to copolyamide thermosol cohesive force.The hot melt adhesive slurry obtaining so evenly, stable, viscosity is suitable, can produce good interface with silica gel and be combined, and is suitable for the silk screen printing of silica gel, and remarkable to the hot transfer printing bond effect of addition-type silicon rubber, cohesive strength is high, is difficult to peel off.Hot melt adhesive slurry provided by the invention has a good application prospect in silicon rubber printing in textiles field.
(4) brief description of the drawings
Fig. 1 is the hot melt adhesive slurry of the embodiment of the present invention 2 section SEM photo after for the hot transfer printing of silica gel.
(5) embodiment
Below in conjunction with specific embodiment, the present invention is described further, but protection scope of the present invention is not limited in this:
Embodiment 1 ~ 9:
(1): press the formula shown in table 1, polyacrylic acid is added in 80g deionized water, being stirred to polyacrylic acid at 35 ° of C dissolves completely, form transparent uniform solution, add again copolyamide hot melt adhesive powder (Shanghai Tianyang Hotmelt Adhesives Co., Ltd., fusing point: 110-130 ° C, granularity 0-80 micron), continue to stir the homodisperse copolyamide white slurry of formation.
(2) press the formula shown in table 1, by business-like PV3 type quick dissolved sodium silicate powder (Jing Hua chemical plant, fertility In Jiashan, modulus 2.85) add in 20g deionized water, be stirred to water glass powder at 65 ° of C and dissolve the solution that forms homogeneous transparent completely, then drip dehydrated alcohol, stir the water glass colloidal sol that forms homogeneous transparent.
(3) the water glass colloidal sol that copolyamide white slurry step (1) being made and step (2) make mixes, and obtains water-based copolyamide hot melt adhesive slurry.
The copolyamide hot melt adhesive slurry preparing is printed on transfer paper, evaporates completely at 140 ° of C baking 5 minutes to moisture, hot melt adhesive slurry melts completely, then cooling formation hot melt adhesive film.Adopt liquid addition-type silicon rubber (Dongguan Lianzhan Silicone Technology Co., Ltd., TG-1 stamp silica gel and B solidifying agent), the TG-1 that is 100:10 by mass ratio mixes with B solidifying agent, adopt silk-screen printing technique to be printed on hot melt adhesive rete, solidify at 110 ° of C, obtain hot transfer printing sample.Then with pressing machine by hot transfer printing sample at 150 ° of C pressing 20s to cotton, coolingly observe the bond effect after transfer printing by hand tearing layer of silica gel afterwards, result is as shown in table 1.
Embodiment 2 obtains cross-section morphology that hot melt adhesive slurry carries out the hot transfer printing of silica gel as shown in Figure 1.
Table 1
+: meet the demands, powerful peelable; ++: can tear part; +++: can not tear
Embodiment result can find out, hot melt adhesive slurry provided by the invention can act on the hot transfer printing bonding of addition-type silicon rubber preferably, and bond effect is good, is difficult to peel off.
Claims (2)
1. for a hot melt adhesive slurry for the hot transfer printing of addition-type silicon rubber, it is characterized in that described hot melt adhesive slurry is made up of the component of following mass parts:
100 parts of deionized waters, polyacrylic acid 0.1-2 part, copolyamide hot-melt adhesive powder 15-40 part, sodium silicate 1-10 part, dehydrated alcohol 0.25-2.5 part;
Described hot melt adhesive slurry makes by the following method: (1) gets each raw material by ratio of component, the polyacrylic acid of 0.1-2 mass parts is added in the water of 80 mass parts, at 30-50 DEG C of temperature, be stirred to polyacrylic acid and dissolve the transparent uniform solution of formation completely, add again the copolyamide hot-melt adhesive powder of 15-40 mass parts, continue to stir the homodisperse copolyamide slurry of formation; (2) sodium silicate of 1-10 part is added in the water of 20 mass parts, at 30-65 DEG C of temperature, be stirred to sodium silicate and dissolve the uniform solution of formation completely, then drip the dehydrated alcohol of 0.25-2.5 mass parts, fully stir the water glass colloidal sol that forms homogeneous transparent; (3) the water glass colloidal sol that copolyamide slurry step (1) being made and step (2) make mixes, and makes described hot melt adhesive slurry.
2. hot melt adhesive slurry as claimed in claim 1, is characterized in that described hot melt adhesive slurry is made up of the component of following mass parts:
100 parts of deionized waters, 1 part of polyacrylic acid, 20 parts of copolyamide hot-melt adhesive powders, 5 parts of sodium silicates, 1.25 parts of dehydrated alcohols.
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| CN201210591687.1A CN103102864B (en) | 2012-12-30 | 2012-12-30 | Hot-melting adhesive paste applied to addition type silicon rubber heat transfer printing, and preparation method of hot-melting adhesive paste |
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| CN201210591687.1A CN103102864B (en) | 2012-12-30 | 2012-12-30 | Hot-melting adhesive paste applied to addition type silicon rubber heat transfer printing, and preparation method of hot-melting adhesive paste |
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| DE2307346A1 (en) * | 1973-02-15 | 1974-08-29 | Huels Chemische Werke Ag | Aqueous DISPERSIONS FOR HIGH-TEMPERATURE-RESISTANT HOT-MELT ADHESIVES |
| KR20010040965A (en) * | 1998-02-13 | 2001-05-15 | 마크 에프. 웍터 | Process to prepare a polymer nanocomposite composition |
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| DE102007025435A1 (en) * | 2007-05-31 | 2008-12-04 | Evonik Degussa Gmbh | Adhesive and sealant systems |
| CN101818043A (en) * | 2010-02-08 | 2010-09-01 | 启东市鑫鑫粘合剂有限公司 | Grafted polyolefin resin modified polyamine hotmelt adhesive and preparation method thereof |
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