CN103077910A - Dynamic isolation module for semiconductor integration and manufacture production line - Google Patents
Dynamic isolation module for semiconductor integration and manufacture production line Download PDFInfo
- Publication number
- CN103077910A CN103077910A CN201210570740XA CN201210570740A CN103077910A CN 103077910 A CN103077910 A CN 103077910A CN 201210570740X A CN201210570740X A CN 201210570740XA CN 201210570740 A CN201210570740 A CN 201210570740A CN 103077910 A CN103077910 A CN 103077910A
- Authority
- CN
- China
- Prior art keywords
- support piece
- isolation module
- bottom roll
- transport tape
- upper cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention relates to the design field of integration and manufacture of semiconductors, in particular to a dynamic isolation module for a semiconductor integration and manufacture production line. The invention provides a dynamic isolation module for a semiconductor integration and manufacture production line, the two sides of a casing are provided with an inlet and an outlet, a transmission band passes through the inlet and the outlet, and the inlet and the outlet are respectively provided with a cylinder group for dynamically clamping the transmission band, so the dynamic sealing effect is realized between the casing and the transmission band when the transmission band passes through the casing through the inlet and the outlet. The dynamic isolation module has the advantages that a continuous and dynamic isolation function is realized for a semiconductor substrate; the gas quality in the casing can be controlled in a real-time way in the isolation process; and meanwhile, the modularized design of the isolation process in the semiconductor integration and manufacture production line is realized.
Description
Technical field
The present invention relates to the design field of semiconductor production equipment, relate in particular to the dynamic isolation module for the integrated manufacturing line of semiconductor.
Background technology
Owing to need to be finished step by step by a plurality of techniques in the process of the integrated manufacturing of semiconductor, such as clean, dry processing, isolation processing, PVD plated film etc., and each processing step all need to carry out under airtight environment, to usually adopting the integrated seal manufacturing system in this prior art, each step process is carried out under same airtight environment.In the integrated manufacture process of whole semiconductor, isolation processing is generally between drying processing and PVD plated film, when the PVD plated film, requirement is carried out under certain vacuum environment, therefore the remaining impurity that semiconductor substrate contains after drying must being processed when isolation processing carries out cleaning to be processed, so that follow-up further PVD plated film.In the prior art, semiconductor usually adopts and prepare semiconductor in large-scale integrated seal manufacturing system, be that the techniques such as clean, dry processing, isolation processing and PVD plated film are normally carried out at same airtight environment, so cause the device structure of the mutual linking between each technique complicated, build an integrated seal manufacturing system and need spend a large amount of inputs.
Summary of the invention
The object of the invention is to overcome the defective of prior art, the dynamic isolation module that aims to provide for the integrated manufacturing line of semiconductor realizes modularized design to realize the interrupter in the semiconductor production equipment.
The present invention realizes like this, the dynamic isolation module that is used for the integrated manufacturing line of semiconductor, comprise a housing, described housing both lateral sides is respectively equipped with the entrance and exit that passes through for transport tape, and described transport tape is separated into epicoele and cavity of resorption with described housing, the entrance and exit place of described housing is provided with respectively the cylinder group of the described transport tape of dynamic clamp, each described cylinder group comprises the upper cylinder that is attached at the transport tape upside and the bottom roll that is attached at the transport tape downside, also be provided with the servomotor that drives described cylinder group running on the described housing, the sidewall of described epicoele is provided with the air admission hole of safe gas, the sidewall of described cavity of resorption is provided with steam vent, supporting air intake control valve and the gas exhausting valve of being provided with of described air admission hole and steam vent, this dynamic isolation module also comprises isolation control system, described isolation control system comprises to be located in the described epicoele and the barometer of the described epicoele internal gas pressure of Real-Time Monitoring, be located in the described epicoele and the described epicoele of Real-Time Monitoring in the humidity of humidity take into account the controller of the described air intake control valve of control and gas exhausting valve operating state, described controller respectively with described air intake control valve, gas exhausting valve, servomotor, air pressure is taken into account hygrometer and is electrically connected.
Particularly, described housing comprises aluminum hull skin, silicon rubber heat insulation layer and stainless steel internal layer from outside to inside successively.
Particularly, described housing comprises loam cake and the lower cover of mutual fastening, described loam cake and described transfer the band and upper cylinder enclose described epicoele, described lower cover and described transfer the band and bottom roll enclose described cavity of resorption, has the gap that forms described entrance and exit between the cross side of described loam cake and lower cover, be provided with the male and female groove syndeton between vertical side of described loam cake and lower cover, be provided with sealing joint strip in the described male and female groove.
Particularly, the surface of each described upper cylinder and bottom roll is provided with elastic layer, the surface, both ends of each described upper cylinder and bottom roll is in contact with one another and interference fit, have the gap of passing through for described transport tape between each described upper cylinder and the bottom roll, and interference fit between each described upper cylinder and bottom roll and the described transport tape.
Particularly, be provided with the upper support piece and the lower support piece that support respectively each described upper cylinder and bottom roll in the described housing, each described upper support piece is provided with the arc accepting groove that part is accommodated described upper cylinder, described lower support piece is provided with the arc accepting groove that part is accommodated described bottom roll, each described arc accepting groove respectively with each described upper cylinder and bottom roll interference fit, and each described upper support piece is connected with described housing seal with the lower support piece.
Particularly, each described upper support piece two ends is provided with bearing, the two ends of each described upper cylinder are installed in the described bearing, and each described upper support piece and described housing are slidingly connected on vertical direction, be provided with spring between each described upper support piece upside and the described case top, described spring is installed with between described upper support piece and described case top.
Particularly, each described upper cylinder and/or bottom roll surface are provided with pressure sensor.
Particularly, the vertical side of described housing is provided with man-machine interface and the display screen that intercoms mutually with described controller.
Particularly, described air admission hole is two, and two air admission holes all are equipped with air intake control valve, and two described air intake control valves all are electrically connected with described control.
Beneficial effect of the present invention: the dynamic isolation module for the integrated manufacturing line of semiconductor provided by the invention, by offer the entrance and exit that passes through for described transport tape in the both sides of described housing, and the cylinder group of the described transport tape of dynamic clamp is set in described entrance and exit place, so that described transport tape by described entrance and exit when the described housing, described housing and transport tape present the effect of dynamic seal (packing).In the present invention, the speed of the running of described cylinder group is controlled by the speed that servomotor rotates, the discharge rate of safe gas inlet and waste gas is controlled by corresponding air intake control valve and gas exhausting valve, the operating state of servomotor, air intake control valve and gas exhausting valve is then unified to be controlled by described controller, and described controller to produce the foundation of control signal be to be arranged at barometer in the described epicoele and the data of hygrometer Real-Time Monitoring gained are regulated and control.This shows, dynamic isolation module of the present invention can realize being positioned over the continuous buffer action of the semiconductor substrate on the described transport tape, and can implement real-time control to the gaseous mass in the housing in the isolation processes, to detect the clean level of semiconductor substrate, realized simultaneously the modularized design of isolation processing in the integrated manufacturing line of semiconductor.
Description of drawings
Fig. 1 is the external structure schematic diagram of one embodiment of the present invention;
Fig. 2 is the structural representation after Fig. 1 removes housing;
Fig. 3 is the forward view of Fig. 2;
Fig. 4 is the cutaway view of Fig. 1 section A-A;
Fig. 5 is the cutaway view of Fig. 3 section B-B.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
Please refer to Fig. 1 ~ 5, the dynamic isolation module that is used for the integrated manufacturing line of semiconductor, comprise a housing 1, described housing 1 both lateral sides is respectively equipped with entrance 11 and the outlet 12 of passing through for transport tape 2, the semi-conductive substrate of manufacturing of placing on the wherein said transport tape 2, and described transport tape 2 is separated into epicoele 13 and cavity of resorption 14 with described housing 1, the entrance 11 of described housing 1 and outlet 12 places are provided with respectively the cylinder group 3 of the described transport tape 2 of dynamic clamp, each described cylinder group 3 comprises the upper cylinder 31 that is attached at transport tape 2 upsides and the bottom roll 32 that is attached at transport tape 2 downsides, also be provided with the servomotor 4 that drives described cylinder group 3 runnings on the described housing 1, the sidewall of described epicoele 13 is provided with the air admission hole 15 of safe gas, the sidewall of described cavity of resorption 14 is provided with steam vent 16, described air admission hole 15 and steam vent 16 supporting air intake control valve (not drawing among the figure) and the gas exhausting valves (not drawing among the figure) of being provided with, this dynamic isolation module also comprises isolation control system, described isolation control system comprises to be located in the described epicoele 13 and the barometer of described epicoele 13 internal gas pressures of Real-Time Monitoring, be located in the described epicoele and the described epicoele of Real-Time Monitoring in the humidity of humidity take into account the controller of the described air intake control valve of control and gas exhausting valve operating state, described controller respectively with described air intake control valve, gas exhausting valve, servomotor, air pressure is taken into account hygrometer and is electrically connected.
Wherein, the operation principle of described isolation control system is as follows: described controller is by described barometer and described epicoele 13 internal gas pressure parameter and the humidity parameters of hygrometer Real-time Obtaining, and judge described epicoele 13 interior clean level by the above-mentioned gas mass parameter, and then control the operating state of described air intake control valve, gas exhausting valve and servomotor.In addition, described controller is communicated with servomotor 4 be connected, concrete communication connection mode can be RS232 communication, and whether the described servomotor 4 of described controller real-time judge is worked.When described servomotor 4 normal operation, described controller makes described air intake control valve air inlet, make safe gas enter described housing 1 inside, meanwhile open described gas exhausting valve and carry out exhaust, the continuous gas pressure intensity in the described epicoele 13 of monitoring and the gas humidity clean level that is positioned over the semiconductor substrate on the described transport tape 2 with detection in the whole process simultaneously is with the running speed of confirming described servomotor 4 and the open and-shut mode of described air intake control valve and gas exhausting valve.
In the present invention, the speed of described cylinder group 3 runnings is controlled by the speed that servomotor 4 rotates, the safe gas inlet is controlled by the switching degree of corresponding air intake control valve, the operating state of servomotor 4 and air intake control valve is then unified to be controlled by described controller, and described controller to produce the foundation of control signal be to be arranged at barometer in the described epicoele 13 and the data of hygrometer Real-Time Monitoring gained are regulated and control.This shows, dynamic isolation module of the present invention can realize realizing continuous isolation processing to being positioned over described transferring with the semiconductor substrate on 2, and can implement real-time control to the gaseous mass in the housing in the isolation processing, realize simultaneously the modularized design of isolation processing in the integrated manufacturing line of semiconductor.
In the present embodiment, described housing 1 comprises aluminum hull skin 17, silicon rubber heat insulation layer 18 and stainless steel internal layer 19 from outside to inside successively.Wherein, can to adopt silicon be that macromolecular material is made to described silicon rubber heat insulation layer 18.In the technique scheme, a kind of housing 1 structure better with insulation effect is provided, reduces whole dynamic isolation module in the course of the work to extraneous distribute heat, in order to improve operational environment with this, avoid operating ambient temperature too high, improve simultaneously the isolation effect of whole dynamic isolation module.
In the present embodiment, described housing 1 comprises the loam cake 101 and lower cover 102 of mutual fastening, described loam cake 101 encloses described epicoele 13 with described transport tape 2 and upper cylinder 31, described lower cover 102 encloses described cavity of resorption 14 with described transport tape 2 and bottom roll 32, has the gap that forms described entrance 11 and outlet 12 between the cross side of described loam cake 101 and lower cover 102, be provided with the male and female groove syndeton between vertical side of described loam cake 101 and lower cover 102, be provided with sealing joint strip in the described male and female groove.In the technique scheme, a kind of housing of being convenient to implement 1 structure is provided, this housing 1 is made of the loam cake 101 that separates and lower cover 102, vertical side of described loam cake 101 and lower cover 102 adopts the sealing of male and female groove syndeton and fitted seal adhesive tape, so can make described housing 1 be convenient to implement, possess again good sealing effectiveness simultaneously.
In the present embodiment, the surface of each described upper cylinder 31 and bottom roll 32 is provided with elastic layer, the surface, both ends of each described upper cylinder 31 and bottom roll 32 is in contact with one another and interference fit, the gap of passing through for described transport tape 2 is arranged between each described upper cylinder 31 and the bottom roll 32, and interference fit between each described upper cylinder 31 and bottom roll 32 and the transport tape 2.Wherein, described elastic layer adopts silicon rubber to be made.Technique scheme has been given the concrete sealing means of described cylinder group 3, be arranged to Elastic Contact by described upper cylinder 31, bottom roll 32 and transport tape 2 being in contact with one another part, so, in described cylinder group 3 operation process of described transport tape 2 companions, can constantly keep good sealing effectiveness, realize dynamic seal (packing).
In the present embodiment, be provided with the upper support piece 51 and the lower support piece 52 that support respectively each described upper cylinder 31 and bottom roll 32 in the described housing 1, each described upper support piece 51 is provided with the arc accepting groove 6 that part is accommodated described upper cylinder 31, described lower support piece 52 is provided with the arc accepting groove 6 that part is accommodated described bottom roll 32, each described arc accepting groove 6 respectively with each described upper cylinder 31 and bottom roll 32 interference fit, and each described upper support piece 51 and lower support piece 52 is tightly connected with described housing 1.Provided the concrete sealing mounting means of described cylinder group 3 in the technique scheme, it is by adopting the upper support piece 51 and lower support piece 52 that is tightly connected with described housing 1, and the arc accepting groove 6 that offers in described upper support piece 51 and described lower support piece 52 with described upper cylinder 31 and bottom roll 32 interference fit carries out accommodating of part, to realize being tightly connected between described upper support piece 51 and the described upper cylinder 31, being tightly connected between described lower support piece 52 and the described bottom roll 31, thus realize the relation of being tightly connected of described cylinder group 3 and described housing 1.Wherein, the radian of described arc accepting groove 6 preferably is set in
Between, in the present embodiment, the radian of described arc accepting groove 6 is π.
In the present embodiment, each described upper support piece 51 two ends is provided with bearing 511, the two ends of each described upper cylinder 31 are installed in the described bearing 511, and each described upper support piece 51 is slidingly connected on vertical direction with described housing 1, be provided with spring 7 between each described upper support piece 51 upside and described housing 1 top, described spring 7 is installed with between described upper support piece 51 and described housing 1 top.So, by at each described upper support piece 51 two ends bearing 511 being set, and described upper cylinder 31 is installed in the described bearing 511, so on position relationship, can make described upper support piece 51 relative fixing with described upper cylinder 31, described upper support piece 51 can be considered as an integral body with described upper cylinder 31.Therefore, the annexation between described upper support piece 51 and the described housing 1 is disposed on the vertical direction is slidingly connected, can make described upper cylinder 31 have the degree of freedom of displacement in vertical direction.When the substrate of different-thickness specification through out-of-date, described upper cylinder 31 can slide on vertical direction in company with described upper support piece 51, to adapt to the substrate of placing different-thickness specification on the described transport tape 2.Simultaneously, for making described upper cylinder 31 can keep that transport tape is possessed good pressuring action, be provided with the spring 7 of pressurized between each described upper support piece 51 upside and described housing 1 top, the external tension force that presents when utilizing described spring 7 pressurized, described upper cylinder 31 possesses under the downward effect constantly, to guarantee the sealing effectiveness between described upper cylinder 31 and the described transport tape 2.In addition, 32 sidewalls that are installed on described housing 1 of each described bottom roll, the mode that also adopts bearing to install, therefore not to repeat here.
In the present embodiment, each described upper cylinder 31 and/or bottom roll 32 surfaces are provided with pressure sensor.Wherein, so, can be by the compression degree of the described cylinder group 3 of the real-time monitoring of described pressure sensor with described transport tape 2, to obtain the judgement of sealing effectiveness between described cylinder group 3 and the described transport tape 2, and judge the damaged condition of described cylinder group with this, consider the cylinder that whether more renews.
In the present embodiment, described housing 1 vertical side is provided with man-machine interface and the display screen that intercoms mutually with described controller.So, can pneumatic parameter, temperature parameter and temperature parameters in the described epicoele 13 are sent to described man-machine interface and be shown by described display screen by described controller, so that the staff controls the operating state of whole dynamic isolation module.
In the present embodiment, described air admission hole 15 is two, and two air admission holes 15 all are equipped with air intake control valve, and two described air intake control valves all are electrically connected with described control.So, dynamic isolation module of the present invention can adopt air admission hole 15 air inlets according to the operating position of reality in the course of the work, or two together air inlets of air admission hole 15, to adapt to the regulatory demand of different air inflows.
The above is only for preferred embodiment of the present invention, and its structure is not limited to the above-mentioned shape of enumerating, and all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. the dynamic isolation module that is used for the integrated manufacturing line of semiconductor, comprise a housing, it is characterized in that: described housing both lateral sides is respectively equipped with the entrance and exit that passes through for transport tape, and described transport tape is separated into epicoele and cavity of resorption with described housing, the entrance and exit place of described housing is provided with respectively the cylinder group of the described transport tape of dynamic clamp, each described cylinder group comprises the upper cylinder that is attached at the transport tape upside and the bottom roll that is attached at the transport tape downside, also be provided with the servomotor that drives described cylinder group running on the described housing, the sidewall of described epicoele is provided with the air admission hole of safe gas, the sidewall of described cavity of resorption is provided with steam vent, supporting air intake control valve and the gas exhausting valve of being provided with of described air admission hole and steam vent, this dynamic isolation module also comprises isolation control system, described isolation control system comprises to be located in the described epicoele and the barometer of the described epicoele internal gas pressure of Real-Time Monitoring, be located in the described epicoele and the described epicoele of Real-Time Monitoring in the humidity of humidity take into account the controller of the described air intake control valve of control and gas exhausting valve operating state, described controller respectively with described air intake control valve, gas exhausting valve, servomotor, air pressure is taken into account hygrometer and is electrically connected.
2. the dynamic isolation module for the integrated manufacturing line of semiconductor according to claim 1 is characterized in that: described housing comprises successively from outside to inside that aluminum hull is outer, silicon rubber heat insulation layer and stainless steel internal layer.
3. the dynamic isolation module for the integrated manufacturing line of semiconductor according to claim 1, it is characterized in that: described housing comprises loam cake and the lower cover of mutual fastening, described loam cake and described transport tape and upper cylinder enclose described epicoele, described lower cover and described transport tape and bottom roll enclose described cavity of resorption, has the gap that forms described entrance and exit between the cross side of described loam cake and lower cover, be provided with the male and female groove syndeton between vertical side of described loam cake and lower cover, be provided with sealing joint strip in the described male and female groove.
4. the dynamic isolation module for the integrated manufacturing line of semiconductor according to claim 1, it is characterized in that: the surface of each described upper cylinder and bottom roll is provided with elastic layer, the surface, both ends of each described upper cylinder and bottom roll is in contact with one another and interference fit, have the gap of passing through for described transport tape between each described upper cylinder and the bottom roll, and interference fit between each described upper cylinder and bottom roll and the described transport tape.
5. the dynamic isolation module for the integrated manufacturing line of semiconductor according to claim 4, it is characterized in that: be provided with the upper support piece and the lower support piece that support respectively each described upper cylinder and bottom roll in the described housing, each described upper support piece is provided with the arc accepting groove that part is accommodated described upper cylinder, described lower support piece is provided with the arc accepting groove that part is accommodated described bottom roll, each described arc accepting groove respectively with each described upper cylinder and bottom roll interference fit, and each described upper support piece is connected with described housing seal with the lower support piece.
6. the dynamic isolation module for the integrated manufacturing line of semiconductor according to claim 4, it is characterized in that: each described upper support piece two ends is provided with bearing, the two ends of each described upper cylinder are installed in the described bearing, and each described upper support piece and described housing are slidingly connected on vertical direction, be provided with spring between each described upper support piece upside and the described case top, described spring is installed with between described upper support piece and described case top.
7. the dynamic isolation module for the integrated manufacturing line of semiconductor according to claim 4, it is characterized in that: each described upper cylinder and/or bottom roll surface are provided with pressure sensor.
8. the dynamic isolation module for the integrated manufacturing line of semiconductor according to claim 1, it is characterized in that: the vertical side of described housing is provided with man-machine interface and the display screen that intercoms mutually with described controller.
9. the dynamic isolation module for the integrated manufacturing line of semiconductor according to claim 1, it is characterized in that: described air admission hole is two, and two air admission holes all are equipped with air intake control valve, two described air intake control valves all are electrically connected with described control.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210570740XA CN103077910A (en) | 2012-12-25 | 2012-12-25 | Dynamic isolation module for semiconductor integration and manufacture production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210570740XA CN103077910A (en) | 2012-12-25 | 2012-12-25 | Dynamic isolation module for semiconductor integration and manufacture production line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103077910A true CN103077910A (en) | 2013-05-01 |
Family
ID=48154401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210570740XA Pending CN103077910A (en) | 2012-12-25 | 2012-12-25 | Dynamic isolation module for semiconductor integration and manufacture production line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103077910A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06310570A (en) * | 1993-04-23 | 1994-11-04 | Disco Abrasive Syst Ltd | Tab tape transport mechanism |
| CN101240414A (en) * | 2007-02-09 | 2008-08-13 | 应用材料股份有限公司 | Transport device in a facility for processing substrates |
| CN102326449A (en) * | 2009-02-05 | 2012-01-18 | 株式会社日立工业设备技术 | Substrate surface sealing device and organic el panel fabrication method |
| WO2012064371A1 (en) * | 2010-11-11 | 2012-05-18 | Axcelis Technologies, Inc | Post implant wafer heating using light |
| CN203134766U (en) * | 2012-12-25 | 2013-08-14 | 王奉瑾 | Dynamic isolation module used in semiconductor integrated manufacturing production line |
-
2012
- 2012-12-25 CN CN201210570740XA patent/CN103077910A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06310570A (en) * | 1993-04-23 | 1994-11-04 | Disco Abrasive Syst Ltd | Tab tape transport mechanism |
| CN101240414A (en) * | 2007-02-09 | 2008-08-13 | 应用材料股份有限公司 | Transport device in a facility for processing substrates |
| CN102326449A (en) * | 2009-02-05 | 2012-01-18 | 株式会社日立工业设备技术 | Substrate surface sealing device and organic el panel fabrication method |
| WO2012064371A1 (en) * | 2010-11-11 | 2012-05-18 | Axcelis Technologies, Inc | Post implant wafer heating using light |
| CN203134766U (en) * | 2012-12-25 | 2013-08-14 | 王奉瑾 | Dynamic isolation module used in semiconductor integrated manufacturing production line |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104347460B (en) | Wafer transmits chamber | |
| US20040237244A1 (en) | Purge system for product container and interface seal used in the system | |
| CN203134766U (en) | Dynamic isolation module used in semiconductor integrated manufacturing production line | |
| JP2014179431A5 (en) | ||
| CN103046776A (en) | Clean room for semiconductor plant | |
| CN103050426B (en) | For the continuous drying module in semiconductor Integrated manufacture production line | |
| CN103077910A (en) | Dynamic isolation module for semiconductor integration and manufacture production line | |
| CN203132293U (en) | Continuous drying module used in integrated manufacturing production line of semiconductor | |
| CN108052176A (en) | A kind of security application device of computer information | |
| CN106876304A (en) | A kind of wet etching gas extraction system and Wet-method etching device | |
| CN103225699B (en) | Glasses valve and valve plate guide drive mechanism thereof | |
| CN203386050U (en) | Wireless monitoring system of storage cabinet inflation system | |
| CN106569394A (en) | Mask trueing device | |
| CN104238474A (en) | Wireless monitoring system of storage cabinet inflation system | |
| CN104241164A (en) | Inflation purification system of wafer/photomask sealed carrier | |
| CN103711937B (en) | The microenvironment exhaust control device of a kind of semiconductor devices | |
| CN203339120U (en) | An air inflation purifying system of a wafer/ photomask sealing carrier | |
| CN203641568U (en) | Microenvironment exhaust control device of semiconductor equipment | |
| CN203128651U (en) | Miniature PVD (Physical Vapor Deposition) module for semiconductor integrated manufacturing production line | |
| CN215749221U (en) | Mechanical gripper for license plate of motor vehicle | |
| CN216902827U (en) | Vacuum conveying cavity of etching machine | |
| CN206212542U (en) | Switch board cooling device | |
| KR100669856B1 (en) | Device for connecting two pipes and apparatus for processing a semiconductor substrate using the same | |
| CN103050385B (en) | Micro PVD (Physical Vapor Deposition) module for use in semiconductor integrated manufacturing production line | |
| CN216012661U (en) | Multi-environment vibration test box sealed by expansion joint |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20160217 |
|
| C20 | Patent right or utility model deemed to be abandoned or is abandoned |