CN103060624B - Aluminum substrate material of copper-aluminum composite plate strip, copper-aluminum composite plate strip and processing method of copper-aluminum composite plate strip - Google Patents
Aluminum substrate material of copper-aluminum composite plate strip, copper-aluminum composite plate strip and processing method of copper-aluminum composite plate strip Download PDFInfo
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Abstract
The invention discloses an aluminum substrate material of a copper-aluminum composite plate strip, simultaneously relates to the copper-aluminum composite plate strip and a processing method thereof, and belongs to the technical field of a metal plate strip processing. According to the invention, the copper-aluminum composite plate strip adopts the aluminum substrate material containing Si, Fe, Cu and Mn and a copper clad material; the strength of the aluminum substrate material is increased by adding elements of Si, Fe, Cu and Mn, and the processing property of the aluminum material is changed to be identical to the processability of the copper clad material, so that the problems that the soft annealing temperatures of copper and aluminum are different in the plate strip manufacturing process and composite materials are difficult to be punched are solved; and the composite material can reach deep drawing properties of pure copper and pure aluminum. In a process of processing the plate strip, a billet is prepared through an oxygen-free high-pressure continuous casting, and then the billet is subjected to processes, such as cold rolling, intermediate annealing, finish rolling and finished product annealing, so that the integral property of the plate strip is further improved. The copper-aluminum composite plate strip processed by the method is high in production efficiency, stable in quality, advanced in technology, and remarkable in economic benefit, and saves energy and materials.
Description
Technical field
The present invention relates to a kind of aluminum substrate material of copper-aluminum composite board band, also relate to a kind of copper-aluminum composite board band and working method thereof simultaneously, belong to metal plate and belt processing technique field.
Background technology
Copper-aluminum composite board carrying material is a kind of taking aluminium as matrix, the double metallic composite material that copper is coating.Wherein copper, aluminium are all important non-ferrous metals, are widely applied in industry and civil area.Copper possesses good conduction, heat conduction, corrosion resistant, bacteriostasis property, and aluminium possesses good conduction, heat conductivility.Both compare, copper resource relative shortage, and bauxite resource is relatively abundant, the proportion of aluminium is less, cheap simultaneously.Copper-aluminum composite board band has been concentrated copper and aluminium advantage separately just, the high chemical stability of the low cost of aluminium, high specific strength and copper, low contact resistance are complex as a whole, form a kind of novel conductor material, this material instead of pure copper plate/strip is widely used in high-tech area and the high less salt electrical apparatus industries such as military project, aerospace, electronic devices and components, is the focus of current research.
Current, copper aluminium composite deep punch strip has purposes widely at electronic devices and components, kitchen tools and decoration industry, but because fine copper and fine aluminium physical properties there are differences, the thermal treatment process difference of the two, cannot reach the soft material technical requirements of spy of deep-draw simultaneously, therefore on market, not have the copper-aluminum composite board band that is applicable to deep-draw.At present, the preparation method of copper-aluminum composite board band mainly contains rolling crimping method, clad welded method, explosion composite algorithm and composite ingot hot rolling method, but still cannot meet the processing characteristics of deep-draw.
Summary of the invention
The object of this invention is to provide a kind of copper-aluminum composite board carrying material, solving copper, the soft state annealing temperature of aluminium is inconsistent, copper aluminum composite material is difficult to the problem of punching press.
Meanwhile, the present invention also provides a kind of copper-aluminum composite board band.
In order to realize above object, the technical solution adopted in the present invention is:
The aluminum substrate material of copper-aluminum composite board band, is made up of the component of following weight percentage: Si0.2～0.7%, and Fe0.45～1.0%, Cu0.05～0.2%, Mn0.05～0.15%, impurity composition≤0.03%, surplus is Al.
Copper-aluminum composite board band, is made up of aluminum base layer and copper coating, and the thickness of described copper coating accounts for 10～20% of whole strip thickness; Described aluminum base layer adopts aluminum substrate material, and described aluminum substrate material is made up of the component of following weight percentage: Si0.2～0.7%, and Fe0.45～1.0%, Cu0.05～0.2%, Mn0.05～0.15%, impurity composition≤0.03%, surplus is Al; Described copper coating adopts copper clad material, and the trade mark of copper clad material is TU2, and state is TM.
Copper-aluminum composite board carrying material of the present invention adopts aluminum substrate material and the copper clad material containing Si, Fe, Cu, Mn, by adding Si, Fe, Cu, Mn element to increase the aluminum substrate strength of materials, change aluminum substrate Drawing abillity, and then consistent with the processing characteristics of copper clad material, solved copper in the strip course of processing, the soft state annealing temperature of aluminium is inconsistent, matrix material is difficult to the problem of punching press, and this matrix material can reach the deep drawability of fine copper and fine aluminium.
Copper-aluminum composite board band, is made up of aluminum base layer and copper coating, and the thickness of described copper coating accounts for 10～20% of whole strip thickness.Aluminum base layer adopts aluminum base layer material, and copper coating adopts copper clad material.
The working method of copper-aluminum composite board band can be conventional machining method.The invention provides a kind of working method of concrete copper-aluminum composite board band, to improve the overall performance of copper-aluminum composite board band.
The working method of copper-aluminum composite board band, concrete steps are as follows:
(1) accurately get the each component of aluminum substrate material by formula ratio, first by aluminium ingot melting at 700～850 DEG C, add again Si, Fe, Cu, Mn melting, refining degasification, fused solution after refining degasification is left standstill to 5～15 minutes at 690～820 DEG C, pour into again in the lip of preheating, water the aluminium alloy liquid casting out through crystallisation by cooling to half melt;
(2) measure copper clad material by formula, after alkali cleaning skimming treatment, then carry out one side polishing, polishing is to this face non-oxidation layer, and polishing is completely heated to 230～250 DEG C by copper clad material;
(3) half melt aluminium alloy of step (1) is contacted with the buffed surface of copper strips in step (2), carry out anaerobic high pressure continuous casting and rolling and obtain copper aluminium composite blank;
(4) the copper aluminium composite blank of step (3) is carried out to cold-rolling treatment, the pass reduction of cold-rolling treatment is 10～30%, and general working rate is 30～75%, then carries out process annealing processing again, the condition of process annealing is: annealing temperature is 200～400 DEG C, is incubated 3～8 hours;
(5) step (4) process annealing copper aluminum composite material after treatment is carried out to finish rolling processing, the pass reduction of finish rolling processing is 10～30%, general working rate is 30～60%, then carry out again finished products processing and obtain copper-aluminum composite board band, the condition of finished products is: annealing temperature is 150～380 DEG C, and soaking time is 5～15 hours.
In described step (1), the temperature of refining degasification is 790～810 DEG C.
Preferably, in described step (3), the roll speed of anaerobic high pressure continuous casting and rolling is 0.5～1.5m/s, and rolling pressure is (6～12) × 10
6n.
In described step (3), the thickness of copper aluminium composite blank is 6～8mm.
Preferably, in described step (4), the condition of cold-rolling treatment is: roll speed is 0.5～3.0m/s, and rolling pressure is (5～20) × 10
6n, tension force is (1～5) × 10
6n.
In described step (4), after cold-rolling treatment, the thickness of blank is 1.5～4.0mm.
Preferably, in described step (4), process annealing adopts staged heating schedule, be the first stage to be incubated 1.5～2.5 hours at 180～220 DEG C, subordinate phase is incubated 1.5～2.5 hours at 230～270 DEG C, and the phase III is incubated 4～6 hours under 350～450 DEG C of conditions.This annealing process can meet the annealing demand of aluminum substrate material and copper clad material simultaneously.
In described step (5), the condition of finish rolling processing is: roll speed is 0.3～1.0m/s, and rolling pressure is (3～10) × 10
6n, tension force is (0.5～3) × 10
6n.
In described step (5), after finish rolling processing, the dimensional thickness of finished product is 0.6～1.3mm.
Preferably, in described step (5), finished products adopts staged heating schedule, be the first stage to be incubated 2.5～3.5 hours at 180～250 DEG C, subordinate phase is incubated 2.5～3.5 hours at 230～300 DEG C, and the phase III is incubated 4～6 hours under 320～380 DEG C of conditions.This annealing process can meet the annealing demand of aluminum substrate material and copper clad material simultaneously, and two diverse techniques are brought to together.
Beneficial effect of the present invention:
Copper-aluminum composite board band of the present invention first carries out anaerobic high pressure continuous casting and rolling by aluminum substrate material and copper clad material and makes blank in the course of processing, realize again the deep-draw processing of copper aluminum composite material through cold rolling, process annealing, finish rolling, finished product annealing process, by adjusting the temperature and time of process annealing and finished products, met the annealing demand of aluminum substrate and copper coating simultaneously, two diverse techniques are brought to together, have further improved the overall performance of strip.The protruding value of copper-aluminum composite board band cup that adopts this law to make reaches 10, fill up the blank of copper-aluminum composite board band stamping material, also expanded the application space of copper-aluminum composite board band, can be used widely, thereby reduce raw materials cost largely in electronics, decoration, heat radiation industry simultaneously.The production efficiency of copper-aluminum composite board band of the present invention is high, steady quality, technique advanced person, energy-conservation, material-saving, remarkable in economical benefits.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in further detail, but does not form any limitation of the invention.
Embodiment 1
The aluminum substrate material of the present embodiment copper-aluminum composite board band, is made up of the component of following weight percentage: Si0.2%, and Fe1.0%, Cu0.05%, Mn0.15%, impurity composition≤0.03%, surplus is Al.
The present embodiment copper-aluminum composite board band, is made up of aluminum base layer and copper coating, and the thickness of described copper coating accounts for 20% of whole strip thickness; Described aluminum base layer adopts aluminum substrate material, and described aluminum substrate material is made up of the component of following weight percentage: Si0.2%, and Fe1.0%, Cu0.05%, Mn0.15%, impurity composition≤0.03%, surplus is Al; Described copper coating adopts copper clad material, and the trade mark of copper clad material is TU2, and state is TM, is high-purity, special soft copper.
The working method of the present embodiment copper-aluminum composite board band specifically comprises the following steps:
(1) accurately get the each component of aluminum substrate material by formula ratio, first by aluminium ingot melting at 700 DEG C, add again Si, Fe, Cu, Mn melting, at 790 DEG C, carry out refining degasification, fused solution after refining degasification is left standstill to 5 minutes at 820 DEG C, pour into again in the lip of preheating, water the aluminium alloy liquid casting out through crystallisation by cooling to half melt;
(2) measure copper clad material by formula, after alkali cleaning skimming treatment, then carry out one side polishing, polishing is to this face non-oxidation layer, and polishing is completely heated to 230 DEG C by copper clad material;
(3) half melt aluminium alloy of step (1) is contacted with the buffed surface of copper strips in step (2), carry out anaerobic high pressure continuous casting and rolling, roll speed is 0.5m/s, and rolling pressure is 12 × 10
6n, making thickness is the copper aluminium composite blank of 6mm, the thickness of copper clad material is sotck thinkness 20%;
(4) the copper aluminium composite blank of step (3) is carried out to cold-rolling treatment, the condition of cold-rolling treatment is: roll speed is 0.5m/s, and rolling pressure is 20 × 10
6n, tension force is 5 × 10
6n, pass reduction is 10～30%, general working rate is 60%, carry out again process annealing processing, the condition of process annealing is: the first stage is incubated 2.5 hours at 180 DEG C, and subordinate phase is incubated 2.5 hours at 230 DEG C, and the phase III is incubated 6 hours under 350 DEG C of conditions;
(5) step (4) process annealing copper aluminum composite material after treatment is carried out to finish rolling processing, the condition of finish rolling processing is: roll speed is 0.3m/s, and rolling pressure is 10 × 10
6n, tension force is 3 × 10
6n, pass reduction is 10～30%, general working rate is 50%, carry out again finished products processing, the condition of finished products is: the first stage is incubated 3.5 hours at 180 DEG C, subordinate phase is incubated 3.5 hours at 230 DEG C, and the phase III is incubated 6 hours under 320 DEG C of conditions, obtains copper-aluminum composite board band.
Embodiment 2
The aluminum substrate material of the present embodiment copper-aluminum composite board band, is made up of the component of following weight percentage: Si0.5%, and Fe0.8%, Cu0.1%, Mn0.1%, impurity composition≤0.03%, surplus is Al.
The present embodiment copper-aluminum composite board band, is made up of aluminum base layer and copper coating, and the thickness of described copper coating accounts for 15% of whole strip thickness; Described aluminum base layer adopts aluminum substrate material, and described aluminum substrate material is made up of the component of following weight percentage: Si0.5%, and Fe0.8%, Cu0.1%, Mn0.1%, impurity composition≤0.03%, surplus is Al; Described copper coating adopts copper clad material, and the trade mark of copper clad material is TU2, and state is TM, is high-purity, special soft copper.
Described copper clad material is high-purity, special soft copper band, and the copper strips trade mark is TU2, and state is TM.
The working method of the present embodiment copper-aluminum composite board band specifically comprises the following steps:
(1) accurately get the each component of aluminum substrate material by formula ratio, first by aluminium ingot melting at 770 DEG C, add again Si, Fe, Cu, Mn melting, at 800 DEG C, carry out refining degasification, fused solution after refining degasification is left standstill to 10 minutes at 750 DEG C, pour into again in the lip of preheating, water the aluminium alloy liquid casting out through crystallisation by cooling to half melt;
(2) measure copper clad material by formula, after alkali cleaning skimming treatment, then carry out one side polishing, polishing is to this face non-oxidation layer, and polishing is completely heated to 240 DEG C by copper clad material;
(3) half melt aluminium alloy of step (1) is contacted with the buffed surface of copper strips in step (2), carry out anaerobic high pressure continuous casting and rolling, roll speed is 1.0m/s, and rolling pressure is 9 × 10
6n, making thickness is the copper aluminium composite blank of 7mm, the thickness of copper clad material is sotck thinkness 15%;
(4) the copper aluminium composite blank of step (3) is carried out to cold-rolling treatment, the condition of cold-rolling treatment is: roll speed is 2.0m/s, and rolling pressure is 13 × 10
6n, tension force is 2.5 × 10
6n, pass reduction is 10～30%, and general working rate is 45%, then carries out process annealing processing, and the condition of process annealing is: the first stage is incubated 2 hours at 200 DEG C, and subordinate phase is incubated 2 hours at 250 DEG C, and the phase III is incubated 5 hours under 400 DEG C of conditions;
(5) step (4) process annealing copper aluminum composite material after treatment is carried out to finish rolling processing, the condition of finish rolling processing is: roll speed is 0.7m/s, and rolling pressure is 6 × 10
6n, tension force is 2 × 10
6n, pass reduction is 10～30%, general working rate is 40%, carry out finished products processing, the condition of finished products is again: the first stage is incubated 3 hours at 200 DEG C, and subordinate phase is incubated 3 hours at 250 DEG C, phase III is incubated 5 hours under 350 DEG C of conditions, obtains copper-aluminum composite board band.
Embodiment 3
The aluminum substrate material of the present embodiment copper-aluminum composite board band, is made up of the component of following weight percentage: Si0.3%, and Fe0.45%, Cu0.2%, Mn0.15%, impurity composition≤0.03%, surplus is Al.
The present embodiment copper-aluminum composite board band, is made up of aluminum base layer and copper coating, and the thickness of described copper coating accounts for 15% of whole strip thickness; Described aluminum base layer adopts aluminum substrate material, and described aluminum substrate material is made up of the component of following weight percentage: Si0.3%, and Fe0.45%, Cu0.2%, Mn0.15%, impurity composition≤0.03%, surplus is Al; Described copper coating adopts copper clad material, and the trade mark of copper clad material is TU2, and state is TM, is high-purity, special soft copper.
The working method of the present embodiment copper-aluminum composite board band specifically comprises the following steps:
(1) accurately get the each component of aluminum substrate material by formula ratio, first by aluminium ingot melting at 800 DEG C, add again Si, Fe, Cu, Mn melting, at 800 DEG C, carry out refining degasification, fused solution after refining degasification is left standstill to 10 minutes at 750 DEG C, pour into again in the lip of preheating, water the aluminium alloy liquid casting out through crystallisation by cooling to half melt;
(2) measure copper clad material by formula, after alkali cleaning skimming treatment, then carry out one side polishing, polishing is to this face non-oxidation layer, and polishing is completely heated to 240 DEG C by copper clad material;
(3) half melt aluminium alloy of step (1) is contacted with the buffed surface of copper strips in step (2), carry out anaerobic high pressure continuous casting and rolling, roll speed is 0.75m/s, and rolling pressure is 8 × 10
6n, making thickness is the copper aluminium composite blank of 10mm, the thickness of copper clad material is sotck thinkness 15%;
(4) the copper aluminium composite blank of step (3) is carried out to cold-rolling treatment, the condition of cold-rolling treatment is: roll speed is 2.0m/s, and rolling pressure is 8 × 10
6n, tension force is 2 × 10
6n, carry out three passage processing, primary draught is 2mm, and working modulus is 20%, secondary draught is 2mm, working modulus is 25%, and draught is for the third time 1.5mm, and working modulus is 25%, the general working rate of three passage rollings is 55%, make the matrix material after 4.5mm, then carry out process annealing processing, under 400 DEG C of conditions, be incubated 10 hours;
(5) step (4) process annealing copper aluminum composite material after treatment is carried out to finish rolling processing, the condition of finish rolling processing is: roll speed is 0.6m/s, and rolling pressure is 4 × 10
6n, tension force is 1.7 × 10
6n, carry out three passage processing, primary draught is 1mm, working modulus is 22.2%, secondary draught is 0.9mm, working modulus is 25.7%, draught is for the third time 0.6mm, and working modulus is that the general working rate of 23.1%, three passage rolling is 55.6%, make the finished product that 2.6mm is thick, carry out finished products processing, the condition of finished products is again: the first stage is incubated 3 hours at 250 DEG C, and subordinate phase is incubated 3 hours at 300 DEG C, phase III is incubated 5 hours under 380 DEG C of conditions, obtains copper-aluminum composite board band.
Embodiment 4
The aluminum substrate material of the present embodiment copper-aluminum composite board band, is made up of the component of following weight percentage: Si0.3%, and Fe0.8%, Cu0.08%, Mn0.14%, impurity composition≤0.03%, surplus is Al.
The present embodiment copper-aluminum composite board band, is made up of aluminum base layer and copper coating, and the thickness of described copper coating accounts for 16.7% of whole strip thickness; Described aluminum base layer adopts aluminum substrate material, and described aluminum substrate material is made up of the component of following weight percentage: Si0.3%, and Fe0.8%, Cu0.08%, Mn0.14%, impurity composition≤0.03%, surplus is Al; Described copper coating adopts copper clad material, and the trade mark of copper clad material is TU2, and state is TM, is high-purity, special soft copper.
The working method of the present embodiment copper-aluminum composite board band specifically comprises the following steps:
(1) accurately get the each component of aluminum substrate material by formula ratio, first by aluminium ingot melting at 750 DEG C, add again Si, Fe, Cu, Mn melting, at 810 DEG C, carry out refining degasification, fused solution after refining degasification is left standstill to 7 minutes at 800 DEG C, pour into again in the lip of preheating, water the aluminium alloy liquid casting out through crystallisation by cooling to half melt;
(2) measure copper clad material by formula, after alkali cleaning skimming treatment, then carry out one side polishing, polishing is to this face non-oxidation layer, and polishing is completely heated to 250 DEG C by copper clad material;
(3) half melt aluminium alloy of step (1) is contacted with the buffed surface of copper strips in step (2), carry out anaerobic high pressure continuous casting and rolling, roll speed is 0.1m/s, and rolling pressure is 9 × 10
6n, making thickness is the copper aluminium composite blank of 6mm, the thickness of copper clad material is sotck thinkness 15%;
(4) the copper aluminium composite blank of step (3) is carried out to cold-rolling treatment, the condition of cold-rolling treatment is: roll speed is 1.5m/s, and rolling pressure is 12 × 10
6n, tension force is 4 × 10
6n, carry out three passage processing, primary draught is 1.5mm, and working modulus is 25%, secondary draught is 1.2mm, working modulus is 26.7%, and draught is for the third time 0.8mm, and working modulus is 24%, the general working rate of three passage rollings is 58.3%, make the matrix material after 2.5mm, then carry out process annealing processing, under 390 DEG C of conditions, be incubated 8 hours;
(5) step (4) process annealing copper aluminum composite material after treatment is carried out to finish rolling processing, the condition of finish rolling processing is: roll speed is 0.8m/s, and rolling pressure is 7 × 10
6n, tension force is 2 × 10
6n, carry out three passage processing, primary draught is 0.5mm, working modulus is 20%, secondary draught is 0.5mm, working modulus is 25%, draught is for the third time 0.3mm, and working modulus is that the general working rate of 20%, three passage rolling is 52%, make the finished product that 1.2mm is thick, carry out finished products processing, the condition of finished products is again: the first stage is incubated 3 hours at 250 DEG C, and subordinate phase is incubated 3 hours at 300 DEG C, phase III is incubated 5 hours under 360 DEG C of conditions, obtains copper-aluminum composite board band.
Embodiment 5
The aluminum substrate material of the present embodiment copper-aluminum composite board band, is made up of the component of following weight percentage: Si0.7%, and Fe0.6%, Cu0.2%, Mn0.05%, impurity composition≤0.03%, surplus is Al.
The present embodiment copper-aluminum composite board band, is made up of aluminum base layer and copper coating, and the thickness of described copper coating accounts for 10% of whole strip thickness; Described aluminum base layer adopts aluminum substrate material, and described aluminum substrate material is made up of the component of following weight percentage: Si0.7%, and Fe0.6%, Cu0.2%, Mn0.05%, impurity composition≤0.03%, surplus is Al; Described copper coating adopts copper clad material, and the trade mark of copper clad material is TU2, and state is TM, is high-purity, special soft copper.
The working method of the present embodiment copper-aluminum composite board band specifically comprises the following steps:
(1) accurately get the each component of aluminum substrate material by formula ratio, first by aluminium ingot melting at 850 DEG C, add again Si, Fe, Cu, Mn melting, at 810 DEG C, carry out refining degasification, fused solution after refining degasification is left standstill to 15 minutes at 690 DEG C, pour into again in the lip of preheating, water the aluminium alloy liquid casting out through crystallisation by cooling to half melt;
(2) measure copper clad material by formula, after alkali cleaning skimming treatment, then carry out one side polishing, polishing is to this face non-oxidation layer, and polishing is completely heated to 250 DEG C by copper clad material;
(3) half melt aluminium alloy of step (1) is contacted with the buffed surface of copper strips in step (2), carry out anaerobic high pressure continuous casting and rolling, roll speed is 1.5m/s, and rolling pressure is 6 × 10
6n, making thickness is the copper aluminium composite blank of 8mm, the thickness of copper clad material is sotck thinkness 10%;
(4) the copper aluminium composite blank of step (3) is carried out to cold-rolling treatment, the condition of cold-rolling treatment is: roll speed is 3.0m/s, and rolling pressure is 5 × 10
6n, tension force is 1 × 10
6n, pass reduction is 10～30%, general working rate is 30%, carry out again process annealing processing, the condition of process annealing is: the first stage is incubated 1.5 hours at 220 DEG C, and subordinate phase is incubated 1.5 hours at 270 DEG C, and the phase III is incubated 4 hours under 450 DEG C of conditions;
(5) step (4) process annealing copper aluminum composite material after treatment is carried out to finish rolling processing, the condition of finish rolling processing is: roll speed is 1.0m/s, and rolling pressure is 3 × 10
6n, tension force is 0.5 × 10
6n, pass reduction is 10～30%, general working rate is 30%, carry out again finished products processing, the condition of finished products is: the first stage is incubated 2.5 hours at 220 DEG C, subordinate phase is incubated 2.5 hours at 270 DEG C, and the phase III is incubated 4 hours under 380 DEG C of conditions, obtains copper-aluminum composite board band.
The performance of the copper-aluminum composite board band that embodiment 1～5 makes refers to following table 1.
Table 1 embodiment 1～3 prepares the performance of copper-aluminum composite board band
| Project | Tensile strength/MPa | Unit elongation/% | The protruding value of cup |
| Embodiment 1 | 118 | 22 | 5 |
| Embodiment 2 | 120 | 23 | 5.5 |
| Embodiment 3 | 103 | 25 | 7 |
| Embodiment 4 | 120 | 30 | 10.2 |
| Embodiment 5 | 125 | 18 | 4 |
Claims (6)
1. copper-aluminum composite board band, is characterized in that: be made up of aluminum base layer and copper coating, the thickness of described copper coating accounts for 10～20% of whole strip thickness; Described aluminum base layer adopts aluminum substrate material, and described aluminum substrate material is made up of the component of following weight percentage: Si0.2～0.7%, and Fe0.45～1.0%, Cu0.05～0.2%, Mn0.05～0.15%, impurity composition≤0.03%, surplus is Al; Described copper coating adopts copper clad material, and the trade mark of copper clad material is TU2, and state is TM;
Its working method concrete steps are as follows: (1) accurately gets the each component of aluminum substrate material by formula ratio, first by aluminium ingot melting at 700～850 DEG C, add again Si, Fe, Cu, Mn melting, refining degasification, fused solution after refining degasification is left standstill to 5～15 minutes at 690～820 DEG C, pour into again in the lip of preheating, water the aluminium alloy liquid casting out through crystallisation by cooling to half melt;
(2) measure copper clad material by formula, after alkali cleaning skimming treatment, then carry out one side polishing, polishing is to this face non-oxidation layer, and polishing is completely heated to 230～250 DEG C by copper clad material;
(3) half melt aluminium alloy of step (1) is contacted with the buffed surface of copper strips in step (2), carry out anaerobic high pressure continuous casting and rolling and obtain copper aluminium composite blank;
(4) the copper aluminium composite blank of step (3) is carried out to cold-rolling treatment, the general working rate of cold-rolling treatment is 30～75%, then carries out process annealing processing again, and the condition of process annealing is: annealing temperature is 200～400 DEG C, is incubated 3～8 hours; Process annealing adopts staged heating schedule, and the first stage is incubated 1.5～2.5 hours at 180～220 DEG C, and subordinate phase is incubated 1.5～2.5 hours at 230～270 DEG C, and the phase III is incubated 4～6 hours under 350～450 DEG C of conditions;
(5) step (4) process annealing copper aluminum composite material after treatment is carried out to finish rolling processing, the general working rate of finish rolling processing is 30～60%, then carry out again finished products processing and obtain copper-aluminum composite board band, the condition of finished products is: annealing temperature is 150～380 DEG C, and soaking time is 5～15 hours; Finished products adopts staged heating schedule, and the first stage is incubated 2.5～3.5 hours at 180～250 DEG C, and subordinate phase is incubated 2.5～3.5 hours at 230～300 DEG C, and the phase III is incubated 4～6 hours under 320～380 DEG C of conditions.
2. a working method for copper-aluminum composite board band as claimed in claim 1, is characterized in that: below concrete steps:
(1) accurately get the each component of aluminum substrate material by formula ratio, first by aluminium ingot melting at 700～850 DEG C, add again Si, Fe, Cu, Mn melting, refining degasification, fused solution after refining degasification is left standstill to 5～15 minutes at 690～820 DEG C, pour into again in the lip of preheating, water the aluminium alloy liquid casting out through crystallisation by cooling to half melt;
(2) measure copper clad material by formula, after alkali cleaning skimming treatment, then carry out one side polishing, polishing is to this face non-oxidation layer, and polishing is completely heated to 230～250 DEG C by copper clad material;
(3) half melt aluminium alloy of step (1) is contacted with the buffed surface of copper strips in step (2), carry out anaerobic high pressure continuous casting and rolling and obtain copper aluminium composite blank;
(4) the copper aluminium composite blank of step (3) is carried out to cold-rolling treatment, the general working rate of cold-rolling treatment is 30～75%, then carries out process annealing processing again, and the condition of process annealing is: annealing temperature is 200～400 DEG C, is incubated 3～8 hours; Process annealing adopts staged heating schedule, and the first stage is incubated 1.5～2.5 hours at 180～220 DEG C, and subordinate phase is incubated 1.5～2.5 hours at 230～270 DEG C, and the phase III is incubated 4～6 hours under 350～450 DEG C of conditions;
(5) step (4) process annealing copper aluminum composite material after treatment is carried out to finish rolling processing, the general working rate of finish rolling processing is 30～60%, then carry out again finished products processing and obtain copper-aluminum composite board band, the condition of finished products is: annealing temperature is 150～380 DEG C, and soaking time is 5～15 hours; Finished products adopts staged heating schedule, and the first stage is incubated 2.5～3.5 hours at 180～250 DEG C, and subordinate phase is incubated 2.5～3.5 hours at 230～300 DEG C, and the phase III is incubated 4～6 hours under 320～380 DEG C of conditions.
3. the working method of copper-aluminum composite board band according to claim 2, is characterized in that: in described step (1), the temperature of refining degasification is 790～810 DEG C.
4. the working method of copper-aluminum composite board band according to claim 2, is characterized in that: in described step (3), the roll speed of anaerobic high pressure continuous casting and rolling is 0.5～1.5m/s, and rolling pressure is (6～12) × 10
6n.
5. the working method of copper-aluminum composite board band according to claim 2, is characterized in that: in described step (4), the condition of cold-rolling treatment is: roll speed is 0.5～3.0m/s, and rolling pressure is (5～20) × 10
6n, tension force is (1～5) × 10
6n.
6. the working method of copper-aluminum composite board band according to claim 2, is characterized in that: in described step (5), the condition of finish rolling processing is: roll speed is 0.3～1.0m/s, and rolling pressure is (3～10) × 10
6n, tension force is (0.5～3) × 10
6n.
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| CN104669705B (en) * | 2015-03-02 | 2017-01-11 | 东北大学 | Copper/aluminum composite strip and preparation method thereof |
| CN104889159A (en) * | 2015-05-29 | 2015-09-09 | 浙江嘉熙光电设备制造有限公司 | Aluminum composite belt and aluminum plate composite processing technology |
| CN106040773A (en) * | 2016-07-28 | 2016-10-26 | 汉舟四川铜铝复合科技有限公司 | Preparing method for copper and aluminum composite material |
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| CN108425081B (en) * | 2018-03-29 | 2019-11-19 | 河南科技大学 | A kind of copper aluminium rolling casting bonding strip online annealing method |
| CN108517476B (en) * | 2018-03-30 | 2019-07-23 | 湖南科罗德新材料有限公司 | The heat treatment method of copper aluminium cold rolling composite plate |
| CN108515085B (en) * | 2018-03-30 | 2019-10-18 | 湖南科罗德新材料有限公司 | The preparation method of Copper-Aluminum compound strip |
| CN109078983B (en) * | 2018-06-27 | 2020-06-30 | 河南科技大学 | Preparation method of ultrathin copper-aluminum composite foil |
| CN110773741A (en) * | 2019-10-11 | 2020-02-11 | 广州金纪金属制造有限公司 | Preparation method of copper-aluminum composite metal material and composite metal material |
| CN111618093B (en) * | 2020-05-29 | 2022-02-01 | 武汉科技大学 | Copper-aluminum double-layer structure composite thin strip and preparation method thereof |
| CN111850270B (en) * | 2020-07-20 | 2022-03-15 | 河南科技大学 | Processing method for improving peeling strength of copper-aluminum composite board |
| CN112605121B (en) * | 2020-12-30 | 2023-03-17 | 郑州金辉新能源电子材料有限公司 | Copper-aluminum composite foil for PCB and preparation process thereof |
| CN114260433B (en) * | 2022-01-04 | 2024-04-02 | 周新艳 | Preparation process of novel superconductive high-purity aluminum-based multi-metal laminated material |
| CN117568669A (en) * | 2024-01-19 | 2024-02-20 | 江苏常铝铝业集团股份有限公司 | Creep-resistant copper-aluminum composite board for lithium battery negative electrode collecting column and manufacturing method thereof |
| CN117840219A (en) * | 2024-03-07 | 2024-04-09 | 洛阳铜一金属材料发展有限公司 | Copper-aluminum composite foil and preparation method thereof |
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