CN103060624A - Aluminum substrate material of copper-aluminum composite plate strip, copper-aluminum composite plate strip and processing method of copper-aluminum composite plate strip - Google Patents
Aluminum substrate material of copper-aluminum composite plate strip, copper-aluminum composite plate strip and processing method of copper-aluminum composite plate strip Download PDFInfo
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Abstract
The invention discloses an aluminum substrate material of a copper-aluminum composite plate strip, simultaneously relates to the copper-aluminum composite plate strip and a processing method thereof, and belongs to the technical field of a metal plate strip processing. According to the invention, the copper-aluminum composite plate strip adopts the aluminum substrate material containing Si, Fe, Cu and Mn and a copper clad material; the strength of the aluminum substrate material is increased by adding elements of Si, Fe, Cu and Mn, and the processing property of the aluminum material is changed to be identical to the processability of the copper clad material, so that the problems that the soft annealing temperatures of copper and aluminum are different in the plate strip manufacturing process and composite materials are difficult to be punched are solved; and the composite material can reach deep drawing properties of pure copper and pure aluminum. In a process of processing the plate strip, a billet is prepared through an oxygen-free high-pressure continuous casting, and then the billet is subjected to processes, such as cold rolling, intermediate annealing, finish rolling and finished product annealing, so that the integral property of the plate strip is further improved. The copper-aluminum composite plate strip processed by the method is high in production efficiency, stable in quality, advanced in technology, and remarkable in economic benefit, and saves energy and materials.
Description
Technical field
The present invention relates to a kind of aluminum substrate material of copper-aluminum composite board band, also relate to simultaneously a kind of copper-aluminum composite board band and working method thereof, belong to the metal plate and belt processing technique field.
Background technology
The copper-aluminum composite board carrying material is a kind of take aluminium as matrix, and copper is the double metallic composite material of coating.Wherein copper, aluminium all are important non-ferrous metals, are widely applied in industry and civil area.Copper possesses good conduction, heat conduction, corrosion resistant, bacteriostasis property, and aluminium possesses good conduction, heat conductivility.Both compare, copper resource relative shortage, and bauxite resource is relatively abundant, the proportion of aluminium is less, cheap simultaneously.The copper-aluminum composite board band has been concentrated copper and aluminium advantage separately just, high chemical stability, the low contact resistance of low cost, high specific strength and the copper of aluminium are complex as a whole, formed a kind of novel conductor material, this material instead of pure copper plate/strip is widely used in high-tech area and the high less salt electrical apparatus industries such as military project, aerospace, electronic devices and components, is the focus of current research.
Current, copper aluminium composite deep punch strip has widely purposes at electronic devices and components, kitchen tools and decoration industry, but because fine copper and fine aluminium physical properties there are differences, the thermal treatment process of the two is different, can't reach simultaneously the special soft material technical requirements of deep-draw, so not have the copper-aluminum composite board band that is fit to deep-draw on the market.At present, the preparation method of copper-aluminum composite board band mainly contains rolling crimping method, clad welded method, explosion composite algorithm and composite ingot hot rolling method, but still can't satisfy the processing characteristics of deep-draw.
Summary of the invention
The purpose of this invention is to provide a kind of copper-aluminum composite board carrying material, with solve copper, the soft attitude annealing temperature of aluminium is inconsistent, copper aluminum composite material is difficult to the problem of punching press.
Simultaneously, the present invention also provides a kind of copper-aluminum composite board band.
In order to realize above purpose, the technical solution adopted in the present invention is:
The aluminum substrate material of copper-aluminum composite board band is comprised of the component of following weight percentage: Si0.2～0.7%, and Fe0.45～1.0%, Cu0.05～0.2%, Mn0.05～0.15%, impurity composition≤0.03%, surplus is Al.
The copper-aluminum composite board band is comprised of aluminum base layer and copper coating, and the thickness of described copper coating accounts for 10～20% of whole strip thickness; Described aluminum base layer adopts the aluminum substrate material, and described aluminum substrate material is comprised of the component of following weight percentage: Si0.2～0.7%, and Fe0.45～1.0%, Cu0.05～0.2%, Mn0.05～0.15%, impurity composition≤0.03%, surplus is Al; Described copper coating adopts the copper clad material, and the trade mark of copper clad material is TU2, and state is TM.
Copper-aluminum composite board carrying material of the present invention adopts aluminum substrate material and the copper clad material that contains Si, Fe, Cu, Mn, by adding Si, Fe, Cu, the Mn element increase aluminum substrate strength of materials, changed the aluminum substrate Drawing abillity, and then consistent with the processing characteristics of copper clad material, solved copper in the strip course of processing, the soft attitude annealing temperature of aluminium is inconsistent, matrix material is difficult to the problem of punching press, and this matrix material can reach the deep drawability of fine copper and fine aluminium.
The copper-aluminum composite board band is made of aluminum base layer and copper coating, and the thickness of described copper coating accounts for 10～20% of whole strip thickness.Aluminum base layer adopts the aluminum base layer material, and the copper coating adopts the copper clad material.
The working method of copper-aluminum composite board band can be the conventional machining method.The invention provides a kind of working method of concrete copper-aluminum composite board band, to improve the overall performance of copper-aluminum composite board band.
The working method of copper-aluminum composite board band, concrete steps are as follows:
(1) accurately gets each component of aluminum substrate material by formula ratio, first with aluminium ingot 700～850 ℃ of lower meltings, add again Si, Fe, Cu, Mn melting, the refining degasification, fused solution after the refining degasification was left standstill under 690～820 ℃ 5～15 minutes, pour into again in the lip of preheating, water the aluminium alloy liquid that casts out through crystallisation by cooling to half melt;
(2) measure the copper clad material by prescription, after the alkali cleaning skimming treatment, carry out single face polishing again, polishing is to this face non-oxidation layer, polishes complete the copper clad material to be heated to 230～250 ℃;
(3) half melt aluminium alloy with step (1) contacts with the buffed surface of copper strips in the step (2), carries out anaerobic high pressure continuous casting and rolling and namely gets copper aluminium composite blank;
(4) the copper aluminium composite blank with step (3) carries out cold-rolling treatment, the pass reduction of cold-rolling treatment is 10～30%, and general working rate is 30～75%, then carries out process annealing again and processes, the condition of process annealing is: annealing temperature is 200～400 ℃, is incubated 3～8 hours;
(5) copper aluminum composite material after step (4) the process annealing processing being carried out finish rolling processes, the pass reduction that finish rolling is processed is 10～30%, general working rate is 30～60%, then carry out again the finished products processing and namely get the copper-aluminum composite board band, the condition of finished products is: annealing temperature is 150～380 ℃, and soaking time is 5～15 hours.
The temperature of refining degasification is 790～810 ℃ in the described step (1).
Preferably, the roll speed of anaerobic high pressure continuous casting and rolling is 0.5～1.5m/s in the described step (3), and rolling pressure is (6～12) * 10
6N.
The thickness of copper aluminium composite blank is 6～8mm in the described step (3).
Preferably, the condition of cold-rolling treatment is in the described step (4): roll speed is 0.5～3.0m/s, and rolling pressure is (5～20) * 10
6N, tension force are (1～5) * 10
6N.
The thickness of blank is 1.5～4.0mm after the middle cold-rolling treatment of described step (4).
Preferably, the staged heating schedule is adopted in process annealing in the described step (4), be the fs to be incubated 1.5～2.5 hours under 180～220 ℃, subordinate phase was 230～270 ℃ of lower insulations 1.5～2.5 hours, and the phase III is incubated 4～6 hours under 350～450 ℃ of conditions.This annealing process can satisfy the annealing demand of aluminum substrate material and copper clad material simultaneously.
The condition that finish rolling is processed in the described step (5) is: roll speed is 0.3～1.0m/s, and rolling pressure is (3～10) * 10
6N, tension force are (0.5～3) * 10
6N.
The dimensional thickness of finished product was 0.6～1.3mm after finish rolling was processed in the described step (5).
Preferably, finished products adopts the staged heating schedule in the described step (5), be the fs to be incubated 2.5～3.5 hours under 180～250 ℃, subordinate phase was 230～300 ℃ of lower insulations 2.5～3.5 hours, and the phase III is incubated 4～6 hours under 320～380 ℃ of conditions.This annealing process can satisfy the annealing demand of aluminum substrate material and copper clad material simultaneously, and two diverse techniques are brought to together.
Beneficial effect of the present invention:
Copper-aluminum composite board band of the present invention carries out anaerobic high pressure continuous casting and rolling with aluminum substrate material and copper clad material first and makes blank in the course of processing, realize again the deep-draw processing of copper aluminum composite material through cold rolling, process annealing, finish rolling, finished product annealing process, by adjusting the temperature and time of process annealing and finished products, satisfied simultaneously the annealing demand of aluminum substrate and copper coating, two diverse techniques are brought to together, have further improved the overall performance of strip.The protruding value of copper-aluminum composite board band cup that adopts this law to make reaches 10, filled up the blank of copper-aluminum composite board band stamping material, also expanded simultaneously the application space of copper-aluminum composite board band, can be used widely, thereby reduce raw materials cost largely in electronics, decoration, heat radiation industry.The production efficiency of copper-aluminum composite board band of the present invention is high, steady quality, and technique is advanced, energy-conservation, material-saving, remarkable in economical benefits.
Embodiment
Below in conjunction with specific embodiment the present invention is described in further detail, but does not consist of any limitation of the invention.
Embodiment 1
The aluminum substrate material of present embodiment copper-aluminum composite board band is comprised of the component of following weight percentage: Si0.2%, and Fe1.0%, Cu0.05%, Mn0.15%, impurity composition≤0.03%, surplus is Al.
Present embodiment copper-aluminum composite board band is comprised of aluminum base layer and copper coating, and the thickness of described copper coating accounts for 20% of whole strip thickness; Described aluminum base layer adopts the aluminum substrate material, and described aluminum substrate material is comprised of the component of following weight percentage: Si0.2%, and Fe1.0%, Cu0.05%, Mn0.15%, impurity composition≤0.03%, surplus is Al; Described copper coating adopts the copper clad material, and the trade mark of copper clad material is TU2, and state is TM, is high-purity, special soft copper.
The working method of present embodiment copper-aluminum composite board band specifically may further comprise the steps:
(1) accurately gets each component of aluminum substrate material by formula ratio, first with aluminium ingot 700 ℃ of lower meltings, add again Si, Fe, Cu, Mn melting, under 790 ℃, carry out the refining degasification, fused solution after the refining degasification was left standstill under 820 ℃ 5 minutes, pour into again in the lip of preheating, water the aluminium alloy liquid that casts out through crystallisation by cooling to half melt;
(2) measure the copper clad material by prescription, after the alkali cleaning skimming treatment, carry out single face polishing again, polishing is to this face non-oxidation layer, polishes complete the copper clad material to be heated to 230 ℃;
(3) half melt aluminium alloy with step (1) contacts with the buffed surface of copper strips in the step (2), carries out anaerobic high pressure continuous casting and rolling, and roll speed is 0.5m/s, and rolling pressure is 12 * 10
6N, making thickness is the copper aluminium composite blank of 6mm, the thickness of copper clad material is 20% of sotck thinkness;
(4) the copper aluminium composite blank with step (3) carries out cold-rolling treatment, and the condition of cold-rolling treatment is: roll speed is 0.5m/s, and rolling pressure is 20 * 10
6N, tension force are 5 * 10
6N, pass reduction are 10～30%, and general working rate is 60%, carrying out process annealing processes again, the condition of process annealing is: the fs, subordinate phase was 230 ℃ of lower insulations 2.5 hours 180 ℃ of lower insulations 2.5 hours, and the phase III is incubated 6 hours under 350 ℃ of conditions;
(5) copper aluminum composite material after step (4) the process annealing processing is carried out finish rolling and process, the condition that finish rolling is processed is: roll speed is 0.3m/s, and rolling pressure is 10 * 10
6N, tension force are 3 * 10
6N, pass reduction is 10～30%, general working rate is 50%, carrying out finished products processes again, the condition of finished products is: the fs was 180 ℃ of lower insulations 3.5 hours, subordinate phase was 230 ℃ of lower insulations 3.5 hours, and the phase III is incubated 6 hours under 320 ℃ of conditions, namely get the copper-aluminum composite board band.
Embodiment 2
The aluminum substrate material of present embodiment copper-aluminum composite board band is comprised of the component of following weight percentage: Si0.5%, and Fe0.8%, Cu0.1%, Mn0.1%, impurity composition≤0.03%, surplus is Al.
Present embodiment copper-aluminum composite board band is comprised of aluminum base layer and copper coating, and the thickness of described copper coating accounts for 15% of whole strip thickness; Described aluminum base layer adopts the aluminum substrate material, and described aluminum substrate material is comprised of the component of following weight percentage: Si0.5%, and Fe0.8%, Cu0.1%, Mn0.1%, impurity composition≤0.03%, surplus is Al; Described copper coating adopts the copper clad material, and the trade mark of copper clad material is TU2, and state is TM, is high-purity, special soft copper.
Described copper clad material is high-purity, special soft copper band, and the copper strips trade mark is TU2, and state is TM.
The working method of present embodiment copper-aluminum composite board band specifically may further comprise the steps:
(1) accurately gets each component of aluminum substrate material by formula ratio, first with aluminium ingot 770 ℃ of lower meltings, add again Si, Fe, Cu, Mn melting, under 800 ℃, carry out the refining degasification, fused solution after the refining degasification was left standstill under 750 ℃ 10 minutes, pour into again in the lip of preheating, water the aluminium alloy liquid that casts out through crystallisation by cooling to half melt;
(2) measure the copper clad material by prescription, after the alkali cleaning skimming treatment, carry out single face polishing again, polishing is to this face non-oxidation layer, polishes complete the copper clad material to be heated to 240 ℃;
(3) half melt aluminium alloy with step (1) contacts with the buffed surface of copper strips in the step (2), carries out anaerobic high pressure continuous casting and rolling, and roll speed is 1.0m/s, and rolling pressure is 9 * 10
6N, making thickness is the copper aluminium composite blank of 7mm, the thickness of copper clad material is 15% of sotck thinkness;
(4) the copper aluminium composite blank with step (3) carries out cold-rolling treatment, and the condition of cold-rolling treatment is: roll speed is 2.0m/s, and rolling pressure is 13 * 10
6N, tension force are 2.5 * 10
6N, pass reduction are 10～30%, and general working rate is 45%, carry out process annealing again and process, and the condition of process annealing is: the fs, subordinate phase was 250 ℃ of lower insulations 2 hours 200 ℃ of lower insulations 2 hours, and the phase III is incubated 5 hours under 400 ℃ of conditions;
(5) copper aluminum composite material after step (4) the process annealing processing is carried out finish rolling and process, the condition that finish rolling is processed is: roll speed is 0.7m/s, and rolling pressure is 6 * 10
6N, tension force are 2 * 10
6N, pass reduction are 10～30%, and general working rate is 40%, carry out finished products again and process, the condition of finished products is: the fs, subordinate phase was 250 ℃ of lower insulations 3 hours 200 ℃ of lower insulations 3 hours, phase III is incubated 5 hours under 350 ℃ of conditions, namely get the copper-aluminum composite board band.
Embodiment 3
The aluminum substrate material of present embodiment copper-aluminum composite board band is comprised of the component of following weight percentage: Si0.3%, and Fe0.45%, Cu0.2%, Mn0.15%, impurity composition≤0.03%, surplus is Al.
Present embodiment copper-aluminum composite board band is comprised of aluminum base layer and copper coating, and the thickness of described copper coating accounts for 15% of whole strip thickness; Described aluminum base layer adopts the aluminum substrate material, and described aluminum substrate material is comprised of the component of following weight percentage: Si0.3%, and Fe0.45%, Cu0.2%, Mn0.15%, impurity composition≤0.03%, surplus is Al; Described copper coating adopts the copper clad material, and the trade mark of copper clad material is TU2, and state is TM, is high-purity, special soft copper.
The working method of present embodiment copper-aluminum composite board band specifically may further comprise the steps:
(1) accurately gets each component of aluminum substrate material by formula ratio, first with aluminium ingot 800 ℃ of lower meltings, add again Si, Fe, Cu, Mn melting, under 800 ℃, carry out the refining degasification, fused solution after the refining degasification was left standstill under 750 ℃ 10 minutes, pour into again in the lip of preheating, water the aluminium alloy liquid that casts out through crystallisation by cooling to half melt;
(2) measure the copper clad material by prescription, after the alkali cleaning skimming treatment, carry out single face polishing again, polishing is to this face non-oxidation layer, polishes complete the copper clad material to be heated to 240 ℃;
(3) half melt aluminium alloy with step (1) contacts with the buffed surface of copper strips in the step (2), carries out anaerobic high pressure continuous casting and rolling, and roll speed is 0.75m/s, and rolling pressure is 8 * 10
6N, making thickness is the copper aluminium composite blank of 10mm, the thickness of copper clad material is 15% of sotck thinkness;
(4) the copper aluminium composite blank with step (3) carries out cold-rolling treatment, and the condition of cold-rolling treatment is: roll speed is 2.0m/s, and rolling pressure is 8 * 10
6N, tension force are 2 * 10
6N, carry out the processing of three passages, primary draught is 2mm, and working modulus is 20%, secondary draught is 2mm, working modulus is 25%, and draught for the third time is 1.5mm, and working modulus is 25%, the rolling general working rate of three passages is 55%, make the matrix material behind the 4.5mm, carry out process annealing again and process, insulation is 10 hours under 400 ℃ of conditions;
(5) copper aluminum composite material after step (4) the process annealing processing is carried out finish rolling and process, the condition that finish rolling is processed is: roll speed is 0.6m/s, and rolling pressure is 4 * 10
6N, tension force are 1.7 * 10
6N, carry out the processing of three passages, primary draught is 1mm, working modulus is 22.2%, secondary draught is 0.9mm, working modulus is 25.7%, draught for the third time is 0.6mm, and working modulus is that the rolling general working rate of 23.1%, three passage is 55.6%, make the thick finished product of 2.6mm, carry out finished products again and process, the condition of finished products is: the fs, subordinate phase was 300 ℃ of lower insulations 3 hours 250 ℃ of lower insulations 3 hours, phase III is incubated 5 hours under 380 ℃ of conditions, namely get the copper-aluminum composite board band.
Embodiment 4
The aluminum substrate material of present embodiment copper-aluminum composite board band is comprised of the component of following weight percentage: Si0.3%, and Fe0.8%, Cu0.08%, Mn0.14%, impurity composition≤0.03%, surplus is Al.
Present embodiment copper-aluminum composite board band is comprised of aluminum base layer and copper coating, and the thickness of described copper coating accounts for 16.7% of whole strip thickness; Described aluminum base layer adopts the aluminum substrate material, and described aluminum substrate material is comprised of the component of following weight percentage: Si0.3%, and Fe0.8%, Cu0.08%, Mn0.14%, impurity composition≤0.03%, surplus is Al; Described copper coating adopts the copper clad material, and the trade mark of copper clad material is TU2, and state is TM, is high-purity, special soft copper.
The working method of present embodiment copper-aluminum composite board band specifically may further comprise the steps:
(1) accurately gets each component of aluminum substrate material by formula ratio, first with aluminium ingot 750 ℃ of lower meltings, add again Si, Fe, Cu, Mn melting, under 810 ℃, carry out the refining degasification, fused solution after the refining degasification was left standstill under 800 ℃ 7 minutes, pour into again in the lip of preheating, water the aluminium alloy liquid that casts out through crystallisation by cooling to half melt;
(2) measure the copper clad material by prescription, after the alkali cleaning skimming treatment, carry out single face polishing again, polishing is to this face non-oxidation layer, polishes complete the copper clad material to be heated to 250 ℃;
(3) half melt aluminium alloy with step (1) contacts with the buffed surface of copper strips in the step (2), carries out anaerobic high pressure continuous casting and rolling, and roll speed is 0.1m/s, and rolling pressure is 9 * 10
6N, making thickness is the copper aluminium composite blank of 6mm, the thickness of copper clad material is 15% of sotck thinkness;
(4) the copper aluminium composite blank with step (3) carries out cold-rolling treatment, and the condition of cold-rolling treatment is: roll speed is 1.5m/s, and rolling pressure is 12 * 10
6N, tension force are 4 * 10
6N, carry out the processing of three passages, primary draught is 1.5mm, and working modulus is 25%, secondary draught is 1.2mm, working modulus is 26.7%, and draught for the third time is 0.8mm, and working modulus is 24%, the rolling general working rate of three passages is 58.3%, make the matrix material behind the 2.5mm, carry out process annealing again and process, insulation is 8 hours under 390 ℃ of conditions;
(5) copper aluminum composite material after step (4) the process annealing processing is carried out finish rolling and process, the condition that finish rolling is processed is: roll speed is 0.8m/s, and rolling pressure is 7 * 10
6N, tension force are 2 * 10
6N, carry out the processing of three passages, primary draught is 0.5mm, working modulus is 20%, secondary draught is 0.5mm, working modulus is 25%, draught for the third time is 0.3mm, and working modulus is that the rolling general working rate of 20%, three passage is 52%, make the thick finished product of 1.2mm, carry out finished products again and process, the condition of finished products is: the fs, subordinate phase was 300 ℃ of lower insulations 3 hours 250 ℃ of lower insulations 3 hours, phase III is incubated 5 hours under 360 ℃ of conditions, namely get the copper-aluminum composite board band.
Embodiment 5
The aluminum substrate material of present embodiment copper-aluminum composite board band is comprised of the component of following weight percentage: Si0.7%, and Fe0.6%, Cu0.2%, Mn0.05%, impurity composition≤0.03%, surplus is Al.
Present embodiment copper-aluminum composite board band is comprised of aluminum base layer and copper coating, and the thickness of described copper coating accounts for 10% of whole strip thickness; Described aluminum base layer adopts the aluminum substrate material, and described aluminum substrate material is comprised of the component of following weight percentage: Si0.7%, and Fe0.6%, Cu0.2%, Mn0.05%, impurity composition≤0.03%, surplus is Al; Described copper coating adopts the copper clad material, and the trade mark of copper clad material is TU2, and state is TM, is high-purity, special soft copper.
The working method of present embodiment copper-aluminum composite board band specifically may further comprise the steps:
(1) accurately gets each component of aluminum substrate material by formula ratio, first with aluminium ingot 850 ℃ of lower meltings, add again Si, Fe, Cu, Mn melting, under 810 ℃, carry out the refining degasification, fused solution after the refining degasification was left standstill under 690 ℃ 15 minutes, pour into again in the lip of preheating, water the aluminium alloy liquid that casts out through crystallisation by cooling to half melt;
(2) measure the copper clad material by prescription, after the alkali cleaning skimming treatment, carry out single face polishing again, polishing is to this face non-oxidation layer, polishes complete the copper clad material to be heated to 250 ℃;
(3) half melt aluminium alloy with step (1) contacts with the buffed surface of copper strips in the step (2), carries out anaerobic high pressure continuous casting and rolling, and roll speed is 1.5m/s, and rolling pressure is 6 * 10
6N, making thickness is the copper aluminium composite blank of 8mm, the thickness of copper clad material is 10% of sotck thinkness;
(4) the copper aluminium composite blank with step (3) carries out cold-rolling treatment, and the condition of cold-rolling treatment is: roll speed is 3.0m/s, and rolling pressure is 5 * 10
6N, tension force are 1 * 10
6N, pass reduction are 10～30%, and general working rate is 30%, carrying out process annealing processes again, the condition of process annealing is: the fs, subordinate phase was 270 ℃ of lower insulations 1.5 hours 220 ℃ of lower insulations 1.5 hours, and the phase III is incubated 4 hours under 450 ℃ of conditions;
(5) copper aluminum composite material after step (4) the process annealing processing is carried out finish rolling and process, the condition that finish rolling is processed is: roll speed is 1.0m/s, and rolling pressure is 3 * 10
6N, tension force are 0.5 * 10
6N, pass reduction is 10～30%, general working rate is 30%, carrying out finished products processes again, the condition of finished products is: the fs was 220 ℃ of lower insulations 2.5 hours, subordinate phase was 270 ℃ of lower insulations 2.5 hours, and the phase III is incubated 4 hours under 380 ℃ of conditions, namely get the copper-aluminum composite board band.
The performance of the copper-aluminum composite board band that embodiment 1～5 makes sees following table 1 for details.
The performance of table 1 embodiment 1～3 preparation copper-aluminum composite board band
| Project | Tensile strength/MPa | Unit elongation/% | The protruding value of cup |
| Embodiment 1 | 118 | 22 | 5 |
| Embodiment 2 | 120 | 23 | 5.5 |
| Embodiment 3 | 103 | 25 | 7 |
| Embodiment 4 | 120 | 30 | 10.2 |
| Embodiment 5 | 125 | 18 | 4 |
Claims (9)
1. the aluminum substrate material of copper-aluminum composite board band, it is characterized in that: the component by following weight percentage forms: Si0.2～0.7%, Fe0.45～1.0%, Cu0.05～0.2%, Mn0.05～0.15%, impurity composition≤0.03%, surplus is Al.
2. copper-aluminum composite board band, it is characterized in that: be comprised of aluminum base layer and copper coating, the thickness of described copper coating accounts for 10～20% of whole strip thickness; Described aluminum base layer adopts the aluminum substrate material, and described aluminum substrate material is comprised of the component of following weight percentage: Si0.2～0.7%, and Fe0.45～1.0%, Cu0.05～0.2%, Mn0.05～0.15%, impurity composition≤0.03%, surplus is Al; Described copper coating adopts the copper clad material, and the trade mark of copper clad material is TU2, and state is TM.
3. the working method of a copper-aluminum composite board band as claimed in claim 2 is characterized in that: below the concrete steps:
(1) accurately gets each component of aluminum substrate material by formula ratio, first with aluminium ingot 700～850 ℃ of lower meltings, add again Si, Fe, Cu, Mn melting, the refining degasification, fused solution after the refining degasification was left standstill under 690～820 ℃ 5～15 minutes, pour into again in the lip of preheating, water the aluminium alloy liquid that casts out through crystallisation by cooling to half melt;
(2) measure the copper clad material by prescription, after the alkali cleaning skimming treatment, carry out single face polishing again, polishing is to this face non-oxidation layer, polishes complete the copper clad material to be heated to 230～250 ℃;
(3) half melt aluminium alloy with step (1) contacts with the buffed surface of copper strips in the step (2), carries out anaerobic high pressure continuous casting and rolling and namely gets copper aluminium composite blank;
(4) the copper aluminium composite blank with step (3) carries out cold-rolling treatment, and the general working rate of cold-rolling treatment is 30～75%, then carries out process annealing again and processes, and the condition of process annealing is: annealing temperature is 200～400 ℃, is incubated 3～8 hours;
(5) copper aluminum composite material after step (4) the process annealing processing being carried out finish rolling processes, the general working rate that finish rolling is processed is 30～60%, then carry out again the finished products processing and namely get the copper-aluminum composite board band, the condition of finished products is: annealing temperature is 150～380 ℃, and soaking time is 5～15 hours.
4. the working method of copper-aluminum composite board band according to claim 3 is characterized in that: the temperature of refining degasification is 790～810 ℃ in the described step (1).
5. the working method of copper-aluminum composite board band according to claim 3 is characterized in that: the roll speed of anaerobic high pressure continuous casting and rolling is 0.5～1.5m/s in the described step (3), and rolling pressure is (6～12) * 10
6N.
6. the working method of copper-aluminum composite board band according to claim 3 is characterized in that: the condition of cold-rolling treatment is in the described step (4): roll speed is 0.5～3.0m/s, and rolling pressure is (5～20) * 10
6N, tension force are (1～5) * 10
6N.
7. the working method of copper-aluminum composite board band according to claim 3, it is characterized in that: the staged heating schedule is adopted in process annealing, be that the fs was 180～220 ℃ of lower insulations 1.5～2.5 hours, subordinate phase was 230～270 ℃ of lower insulations 1.5～2.5 hours, and the phase III is incubated 4～6 hours under 350～450 ℃ of conditions.
8. the working method of copper-aluminum composite board band according to claim 3 is characterized in that: the condition that finish rolling is processed in the described step (5) is: roll speed is 0.3～1.0m/s, and rolling pressure is (3～10) * 10
6N, tension force are (0.5～3) * 10
6N.
9. the working method of copper-aluminum composite board band according to claim 3, it is characterized in that: finished products adopts the staged heating schedule, be that the fs was 180～250 ℃ of lower insulations 2.5～3.5 hours, subordinate phase was 230～300 ℃ of lower insulations 2.5～3.5 hours, and the phase III is incubated 4～6 hours under 320～380 ℃ of conditions.
Priority Applications (1)
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104669705A (en) * | 2015-03-02 | 2015-06-03 | 东北大学 | Copper/aluminum composite strip and preparation method thereof |
| CN104889159A (en) * | 2015-05-29 | 2015-09-09 | 浙江嘉熙光电设备制造有限公司 | Aluminum composite belt and aluminum plate composite processing technology |
| CN106040773A (en) * | 2016-07-28 | 2016-10-26 | 汉舟四川铜铝复合科技有限公司 | Preparing method for copper and aluminum composite material |
| CN108237151A (en) * | 2018-01-22 | 2018-07-03 | 洛阳铜金属材料发展有限公司 | A kind of ultra-thin copper cladding copper aluminum composite material and its production method |
| CN108425081A (en) * | 2018-03-29 | 2018-08-21 | 河南科技大学 | A kind of copper aluminium rolling casting bonding strip online annealing method |
| CN108515085A (en) * | 2018-03-30 | 2018-09-11 | 湖南科罗德新材料有限公司 | The preparation method of Copper-Aluminum compound strip |
| CN108517476A (en) * | 2018-03-30 | 2018-09-11 | 湖南科罗德新材料有限公司 | The heat treatment method of copper aluminium cold rolling composite plate |
| CN109078983A (en) * | 2018-06-27 | 2018-12-25 | 河南科技大学 | A kind of preparation method of ultra-thin Copper-Aluminum compound foil |
| CN110773741A (en) * | 2019-10-11 | 2020-02-11 | 广州金纪金属制造有限公司 | Preparation method of copper-aluminum composite metal material and composite metal material |
| CN111618093A (en) * | 2020-05-29 | 2020-09-04 | 武汉科技大学 | Copper-aluminum double-layer structure composite thin strip and preparation method thereof |
| CN111850270A (en) * | 2020-07-20 | 2020-10-30 | 河南科技大学 | Processing method for improving peeling strength of copper-aluminum composite board |
| CN112605121A (en) * | 2020-12-30 | 2021-04-06 | 郑州金辉新能源电子材料有限公司 | Copper-aluminum composite foil for PCB and preparation process thereof |
| CN114260433A (en) * | 2022-01-04 | 2022-04-01 | 周新艳 | Novel superconducting high-purity aluminum-based multi-metal laminated material and preparation process thereof |
| CN117568669A (en) * | 2024-01-19 | 2024-02-20 | 江苏常铝铝业集团股份有限公司 | Creep-resistant copper-aluminum composite board for lithium battery negative electrode collecting column and manufacturing method thereof |
| CN117840219A (en) * | 2024-03-07 | 2024-04-09 | 洛阳铜一金属材料发展有限公司 | Copper-aluminum composite foil and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104669705A (en) * | 2015-03-02 | 2015-06-03 | 东北大学 | Copper/aluminum composite strip and preparation method thereof |
| CN104889159A (en) * | 2015-05-29 | 2015-09-09 | 浙江嘉熙光电设备制造有限公司 | Aluminum composite belt and aluminum plate composite processing technology |
| CN106040773A (en) * | 2016-07-28 | 2016-10-26 | 汉舟四川铜铝复合科技有限公司 | Preparing method for copper and aluminum composite material |
| CN108237151B (en) * | 2018-01-22 | 2019-08-30 | 洛阳铜一金属材料发展有限公司 | A kind of ultra-thin copper cladding copper aluminum composite material and its production method |
| CN108237151A (en) * | 2018-01-22 | 2018-07-03 | 洛阳铜金属材料发展有限公司 | A kind of ultra-thin copper cladding copper aluminum composite material and its production method |
| CN108425081A (en) * | 2018-03-29 | 2018-08-21 | 河南科技大学 | A kind of copper aluminium rolling casting bonding strip online annealing method |
| CN108425081B (en) * | 2018-03-29 | 2019-11-19 | 河南科技大学 | A kind of copper aluminium rolling casting bonding strip online annealing method |
| CN108515085A (en) * | 2018-03-30 | 2018-09-11 | 湖南科罗德新材料有限公司 | The preparation method of Copper-Aluminum compound strip |
| CN108515085B (en) * | 2018-03-30 | 2019-10-18 | 湖南科罗德新材料有限公司 | The preparation method of Copper-Aluminum compound strip |
| CN108517476A (en) * | 2018-03-30 | 2018-09-11 | 湖南科罗德新材料有限公司 | The heat treatment method of copper aluminium cold rolling composite plate |
| CN109078983B (en) * | 2018-06-27 | 2020-06-30 | 河南科技大学 | Preparation method of ultrathin copper-aluminum composite foil |
| CN109078983A (en) * | 2018-06-27 | 2018-12-25 | 河南科技大学 | A kind of preparation method of ultra-thin Copper-Aluminum compound foil |
| CN110773741A (en) * | 2019-10-11 | 2020-02-11 | 广州金纪金属制造有限公司 | Preparation method of copper-aluminum composite metal material and composite metal material |
| CN111618093B (en) * | 2020-05-29 | 2022-02-01 | 武汉科技大学 | Copper-aluminum double-layer structure composite thin strip and preparation method thereof |
| CN111618093A (en) * | 2020-05-29 | 2020-09-04 | 武汉科技大学 | Copper-aluminum double-layer structure composite thin strip and preparation method thereof |
| CN111850270A (en) * | 2020-07-20 | 2020-10-30 | 河南科技大学 | Processing method for improving peeling strength of copper-aluminum composite board |
| CN112605121A (en) * | 2020-12-30 | 2021-04-06 | 郑州金辉新能源电子材料有限公司 | Copper-aluminum composite foil for PCB and preparation process thereof |
| CN114260433A (en) * | 2022-01-04 | 2022-04-01 | 周新艳 | Novel superconducting high-purity aluminum-based multi-metal laminated material and preparation process thereof |
| CN114260433B (en) * | 2022-01-04 | 2024-04-02 | 周新艳 | Preparation process of novel superconductive high-purity aluminum-based multi-metal laminated material |
| CN117568669A (en) * | 2024-01-19 | 2024-02-20 | 江苏常铝铝业集团股份有限公司 | Creep-resistant copper-aluminum composite board for lithium battery negative electrode collecting column and manufacturing method thereof |
| CN117840219A (en) * | 2024-03-07 | 2024-04-09 | 洛阳铜一金属材料发展有限公司 | Copper-aluminum composite foil and preparation method thereof |
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