CN103050442A - Power semiconductor device with antistatic discharge capacity and manufacturing method - Google Patents
Power semiconductor device with antistatic discharge capacity and manufacturing method Download PDFInfo
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- CN103050442A CN103050442A CN2012105592800A CN201210559280A CN103050442A CN 103050442 A CN103050442 A CN 103050442A CN 2012105592800 A CN2012105592800 A CN 2012105592800A CN 201210559280 A CN201210559280 A CN 201210559280A CN 103050442 A CN103050442 A CN 103050442A
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Abstract
The invention provides a manufacturing method for a power semiconductor device with antistatic discharge capacity. The manufacturing method comprises the following steps of: providing the power semiconductor device with a first port, a second port and a third port, wherein the power semiconductor device is formed by arranging cell arrays; and respectively connecting any one port or more than one port of the three ports to a resistor to form the power semiconductor device with the antistatic discharge capacity. The invention also provides the power semiconductor device with the antistatic discharge capacity. By the power semiconductor device with the antistatic discharge capacity and the manufacturing method, a series resistor of any one port or more than one port of three ports of the power semiconductor device serves as an electrostatic discharge (ESD) protective component to improve the ESD capacity; the series resistor can meet the requirements on a plurality of grades of ESD by slightly adjusting a protected device layout structure; and the design flexibility is high.
Description
Technical field
The invention belongs to power semiconductor static discharge technical field, relate in particular to a kind of power semiconductor and manufacture method with anti-static-discharge capability.
Background technology
Static discharge (Electrostatic Discharge; ESD) be the key factor that causes most of electronic building bricks to be damaged; wreck for fear of electronic building brick; Electronics Engineers have thought a lot of countermeasures; one of them mainstream thoughts is that individual devices or integrated circuit are carried out the ESD design, and namely protecting by adding ESD guard assembly needs protected device or integrated circuit.The ESD guard assembly that is widely adopted has diode (Diode), bipolar transistor (NPN/PNP), metal-oxide semiconductor fieldeffect transistor (MOSFET), thyristor (SCR) etc.
The people such as Edward John Coyne propose a kind of electrostatic defending assembly (referring to document 1:Edward JohnCoyne et al; ELECTROSTATIC PROTECTION DEVICE; In May 5; 2011; US2011/0101444A1; United States Patent), by introducing vertical NPN as the esd protection assembly, improve anti-ESD ability.In addition, the people such as Shi-Tron Lin propose a kind of closed gate MOSFET structure (referring to document 2:Shi-Tron Lin et al, DISTRIBUTED MOSFET STRUCTURE WITHENCLOSED GATE FOR IMPROVED TRANSISTOR SIZE/LAYOUT AREARATIO AND UNIFORM ESD TRIGGERING, In Dec 14,1999, US6,002,156, United States Patent), improve anti-ESD ability by the closed gate MOSFET structure that distributes as the ESD guard assembly.Yet the formation of these ESD guard assemblies is relatively complicated, and needs extra mask plate, has also increased cost when promoting the ESD ability.
Therefore, need to propose a kind of new power semiconductor, the ESD guard assembly needs additionally to increase mask plate as improving anti-ESD ability in the prior art to solve, and forms relatively complicated problem.
Summary of the invention
The object of the present invention is to provide a kind of power semiconductor and manufacture method with anti-static-discharge capability, so as with the series connection resistance as a kind of ESD guard assembly, promote the ESD ability.
For addressing the above problem, the invention provides a kind of manufacture method with power semiconductor of anti-static-discharge capability, comprise the steps: to provide the power semiconductor of the first port, the second port and the 3rd port, described power semiconductor is formed by the cellular array arrangement; Any port or a plurality of port in described three ports connect respectively a resistance, form the power semiconductor with anti-static-discharge capability.
Further, described power semiconductor is any one or the power semiconductor that is derived by MOSFET, IGBT and bipolar transistor in MOSFET, IGBT, the bipolar transistor; Wherein, when described power semiconductor was MOSFET, the first port of described MOSFET, the second port and the 3rd port be corresponding gate terminal, source terminal and drain electrode end respectively; When described power semiconductor was IGBT, the first port of described IGBT, the second port and the 3rd port be corresponding gate terminal, emitter terminal and collector terminal respectively; When described power semiconductor was bipolar transistor, the first port of described bipolar transistor, the second port and the 3rd port be corresponding base terminal, emitter terminal and collector terminal respectively.
Further, the step of described cellular formation is as follows: an epitaxial loayer is provided; In described epitaxial loayer, form a Second-Type light doping section; On described epitaxial loayer, form successively from the bottom to top gate dielectric layer and the first polysilicon strip; Described the first polysilicon strip of etching and gate dielectric layer expose described Second-Type light doping section; In described Second-Type light doping section, form one first type heavily doped region and Second-Type heavily doped region; Form a heavily doped region short circuit hole at described the first type heavily doped region and Second-Type heavily doped region.
Preferably, at described gate dielectric layer deposition the second polysilicon strip, establish the first port at the second polysilicon strip that is connected with described the first polysilicon strip one end, form grid on the second polysilicon strip beyond described the first port, described the second polysilicon strip is the resistance that the first port connects, and described the first port and grid are without direct electric connecting relation.
Further, according to the demand of anti-static-discharge capability width and/or the spacing of described the second polysilicon strip are adjusted the size of definite resistance that is connected with described the first port.
Preferably, establish the second port on described the first type heavily doped region, form source electrode or emitter on the described heavily doped region short circuit hole, described the first type heavily doped region zone that surrounds in the described Second-Type light doping section that is connected with heavily doped region short circuit hole is the resistance that the second port connects.
Further, according to the demand of anti-static-discharge capability adjust the spacing between described the first type heavily doped region and the Second-Type heavily doped region and/or adjust described heavily doped region short circuit hole and the first type heavily doped region between spacing, determine the size of the resistance be connected with described the second port.
Preferably, at described gate dielectric layer deposition the second polysilicon strip, establish the first port at the second polysilicon strip that is connected with described the first polysilicon strip one end, form grid on the second polysilicon strip beyond described the first port, described the second polysilicon strip is the resistance that the first port connects, and described the first port and grid are without direct electric connecting relation; Establish the second port on described the first type heavily doped region, form source electrode or emitter on the described heavily doped region short circuit hole, described the first type heavily doped region zone that surrounds in the described Second-Type light doping section that is connected with heavily doped region short circuit hole is the resistance that described the second port connects.
Further, adjust width and/or the spacing of described the second polysilicon strip according to the demand of anti-static-discharge capability, the size of definite resistance that is connected with described the first port; Adjust spacing between described the first type heavily doped region and the Second-Type heavily doped region and/or the spacing between described heavily doped region short circuit hole and the first type heavily doped region according to the demand of anti-static-discharge capability, determine the size of the resistance that is connected with described the second port.
According to another side of the present invention, the invention provides a kind of power semiconductor with anti-static-discharge capability, comprising: a power semiconductor is formed by the cellular array arrangement; The first port, the second port and the 3rd port are formed in the described power semiconductor; And one or more resistance, any port or a plurality of port in described three ports connect respectively a described resistance.
Further, described power semiconductor is any one or the power semiconductor that is derived by MOSFET, IGBT and bipolar transistor in MOSFET, IGBT, the bipolar transistor; Wherein, when described power semiconductor was MOSFET, the first port of described MOSFET, the second port and the 3rd port be corresponding gate terminal, source terminal and drain electrode end respectively; When described power semiconductor was IGBT, the first port of described IGBT, the second port and the 3rd port be corresponding gate terminal, emitter terminal and collector terminal respectively; When described power semiconductor was bipolar transistor, the first port of described bipolar transistor, the second port and the 3rd port be corresponding base terminal, emitter terminal and collector terminal respectively.
Further, described cellular comprises: an epitaxial loayer; One Second-Type light doping section is formed in the described epitaxial loayer; The first type heavily doped region and Second-Type heavily doped region are formed at respectively in the described Second-Type light doping section; Heavily doped region short circuit hole is formed on described the first type heavily doped region and the Second-Type heavily doped region; Gate dielectric layer is formed on the surface of part the first type heavily doped region of the Second-Type light doping section of epitaxial loayer, next-door neighbour's epitaxial loayer and next-door neighbour's Second-Type light doping section; The first polysilicon strip is formed on the described gate dielectric layer.
Preferably, described power semiconductor with anti-static-discharge capability comprises the first port, is arranged on the second polysilicon strip that is connected with described the first polysilicon strip one end, and described the second polysilicon strip is formed on the described gate dielectric layer; And grid, being formed on described the first port the second polysilicon strip in addition, described the second polysilicon strip is the resistance that the first port connects, described the first port and grid are without direct electric connecting relation.
Further, described the second polysilicon strip has width and/or the spacing of adjusting according to the demand of anti-static-discharge capability.
Preferably, described power semiconductor with anti-static-discharge capability comprises the second port, is arranged on described the first type heavily doped region; And source electrode or emitter, being formed on the described heavily doped region short circuit hole, described the first type heavily doped region zone that surrounds in the described Second-Type light doping section that is connected with heavily doped region short circuit hole is the resistance that the second port connects.
Further, have between described the first type heavily doped region and the Second-Type heavily doped region between the spacing adjusted according to the demand of anti-static-discharge capability and/or described heavily doped region short circuit hole and the first type heavily doped region and have the spacing of adjusting according to the demand of anti-static-discharge capability.
Preferably, described power semiconductor with anti-static-discharge capability comprises the first port and grid, described the first port is arranged on the second polysilicon strip that is connected with described the first polysilicon strip one end, described the second polysilicon strip is formed on the described gate dielectric layer, described grid is formed on described the first port the second polysilicon strip in addition, described the second polysilicon strip is the resistance that the first port connects, and described the first port and grid are without direct electric connecting relation; And second port and source electrode or emitter, described the second port is arranged on described the first type heavily doped region, described source electrode or emitter are formed on the described heavily doped region short circuit hole, and described the first type heavily doped region zone that surrounds in the described Second-Type light doping section that is connected with heavily doped region short circuit hole is the resistance that the second port connects.
Further, described the second polysilicon strip has width and/or the spacing of adjusting according to the demand of anti-static-discharge capability; Have between described the first type heavily doped region and the Second-Type heavily doped region between the spacing adjusted according to the demand of anti-static-discharge capability and/or described heavily doped region short circuit hole and the first type heavily doped region and have the spacing of adjusting according to the demand of anti-static-discharge capability.
Compared with prior art, the present invention is by introducing series resistance as a kind of ESD guard assembly in any port in three ports of power semiconductor or a plurality of port, promote the ESD ability, not only very effective to promoting the ESD ability, and the formation of resistance need not additionally to increase mask plate and technological process, effectively reduces cost.Simultaneously, resistance sizes can just can adapt to multiple grade ESD demand by the protected device domain structure is slightly adjusted, and the flexible design degree is large.
Description of drawings
Fig. 1 is the framework schematic diagram of the manufacture method of the power semiconductor of the present invention with anti-static-discharge capability;
Fig. 2 A to Fig. 2 C is the structural representation that the present invention has the power semiconductor of anti-static-discharge capability;
Fig. 3 to Fig. 5 is the circular array domain structure that the gate terminal series connection bar resistor that has the power semiconductor of anti-static-discharge capability in the embodiment of the invention one forms grid;
Fig. 6 is the block diagram that the gate terminal series connection bar resistor of VDMOS shown in Figure 5 forms the manufacture method of grid;
Fig. 7 is the test result schematic diagram that the gate terminal series connection bar resistor of VDMOS shown in Figure 6 forms the manufacture method of grid;
Fig. 8 to Fig. 9 is the circular array domain structure that the source terminal series connection bar resistor that has the power semiconductor of anti-static-discharge capability in the embodiment of the invention two forms source electrode;
Figure 10 is the block diagram that the source terminal series connection bar resistor of VDMOS shown in Figure 8 forms the manufacture method of source electrode;
Figure 11 is the test result schematic diagram that the source terminal series connection bar resistor of VDMOS shown in Figure 10 forms the manufacture method of source electrode;
Figure 12 is that the gate terminal and the source terminal that have the power semiconductor of anti-static-discharge capability in the embodiment of the invention three are distinguished the circular array domain structure that series resistance forms grid and source electrode simultaneously;
Figure 13 to Figure 14 is the square array domain structure that the source terminal that has the power semiconductor of anti-static-discharge capability in the embodiment of the invention four (or gate terminal, source terminal simultaneously) the square resistance of series connection forms source electrode (or grid, source electrode);
Figure 15 to Figure 16 is the hexagonal array domain structure that the power semiconductor source terminal that has anti-static-discharge capability in the embodiment of the invention five (or gate terminal, source terminal simultaneously) series connection hexagon resistance forms source electrode (or grid, source electrode);
Figure 17 to Figure 18 is the square array domain structure that the power semiconductor source terminal that has anti-static-discharge capability in the embodiment of the invention six (or gate terminal, source terminal simultaneously) series connection hexagon resistance forms source electrode (or grid, source electrode);
Figure 19 to Figure 20 is the square array domain structure that the power semiconductor source terminal that has anti-static-discharge capability in the embodiment of the invention seven (or gate terminal, source terminal simultaneously) the circular resistance of series connection forms source electrode (or grid, source electrode);
Figure 21 to Figure 22 is the square array domain structure that has the power semiconductor source terminal series connection bar resistor formation source electrode of anti-static-discharge capability in the embodiment of the invention eight.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with accompanying drawing the specific embodiment of the present invention is described in detail.
As shown in Figure 1, the invention provides the block diagram of the manufacture method of the power semiconductor with anti-static-discharge capability.One power semiconductor is provided in the square frame of Fig. 1, and described power semiconductor is formed by the cellular array arrangement, and described power semiconductor has the first port one ', the second port 2 ' and the 3rd port 3 '.When described the first port one ' when connecting a resistance R 1, described the second port 2 ' connection one resistance R 2, described the 3rd port 3 ' connection one resistance R 3, then three current drain path I, II and III can be respectively resistance R 1, R2 and R3 by series connection, effectively limit the esd discharge instantaneous peak current and absorb part energy, form the power semiconductor with anti-static-discharge capability.Size according to anti-ESD protective capacities, can be simultaneously the series resistance respectively of the optional two-port in described the first port, the second port and the 3rd port respectively, or the optional port series resistance in described the first port, the second port and the 3rd port, then each port all can effectively limit the esd discharge instantaneous peak current and absorb part energy by the current drain path of correspondence.
Therefore, the power semiconductor with anti-static-discharge capability of the present invention's formation comprises: a power semiconductor is formed by the cellular array arrangement; The first port one ', the second port 2 ' and the 3rd port 3 ', be formed at described power semiconductor; And one or more resistance, any port or a plurality of port in described three ports connect respectively a described resistance.
Further, described power semiconductor can be MOSFET (metal-oxide semiconductor fieldeffect transistor), IGBT (insulated gate bipolar transistor), bipolar transistor (NPN/PNP) and other power semiconductor that is derived by MOSFET, IGBT, bipolar transistor.Wherein, when described power semiconductor is MOSFET, the first port one of described MOSFET ', the second port 2 ' and the 3rd port 3 ' respectively corresponding gate terminal, source terminal and drain electrode end; When described power semiconductor is IGBT, the first port one of described IGBT ', the second port 2 ' and the 3rd port 3 ' respectively corresponding gate terminal, emitter terminal and collector terminal; When described power semiconductor is bipolar transistor, the first port one of described bipolar transistor ', the second port 2 ' and the 3rd port 3 ' respectively corresponding base terminal, emitter terminal and collector terminal.
The process that described cellular forms is as follows: an epitaxial loayer 6 is provided, forms a Second-Type light doping section 5 in described epitaxial loayer; On described epitaxial loayer, form successively from the bottom to top gate dielectric layer 7 and the first polysilicon strip 4; Described the first polysilicon strip 4 of etching and gate dielectric layer 7 expose described Second-Type light doping section 5; In described Second-Type light doping section 5, form one first type heavily doped region 3A and Second-Type heavily doped region 3B; Form a heavily doped region short circuit hole 3C at described the first type heavily doped region 3A and Second-Type heavily doped region 3B.
Therefore, in the power semiconductor with anti-static-discharge capability that the present invention forms, the described cellular that provides comprises: an epitaxial loayer 6; One Second-Type light doping section 5 is formed in the described epitaxial loayer 6; One first type heavily doped region 3A and Second-Type heavily doped region 3B are formed at respectively in the described Second-Type light doping section 5; One heavily doped region short circuit hole 3C is formed on described the first type heavily doped region 3A and the Second-Type heavily doped region 3B; Gate dielectric layer 7 is formed on the surface of part the first type heavily doped region 3A of the Second-Type light doping section 5 of described epitaxial loayer 6, next-door neighbour's epitaxial loayer 6 and next-door neighbour's Second-Type light doping section 5; The first polysilicon strip 4 is formed on the described gate dielectric layer 7.
If at described gate dielectric layer 7 depositions the second polysilicon strip 4 ', then establish the first port one at described the second polysilicon strip 4 ' ', at described the first port one ' in addition the second polysilicon strip 4 ' forms grid 1, described the second polysilicon strip 4 ' is the resistance R 1 that the first port connects, described the first port one ' and the direct electric connecting relation of grid 1 nothing, shown in Fig. 2 A.At this moment, according to the demand of anti-static-discharge capability width and/or the spacing of described the second polysilicon strip 4 ' are adjusted, can be determined and described the first port one ' size of the resistance R 1 that is connected.
Therefore, the power semiconductor with anti-static-discharge capability that the present invention forms comprises: the first port one ', be arranged on one second polysilicon strip 4 ', described the second polysilicon strip 4 ' is formed on the described gate dielectric layer 7; And grid 1, be formed at described the first port one ' in addition the second polysilicon strip 4 ' on, described the second polysilicon strip 4 ' is described resistance R 1, described the first port one ' and grid 1 is without direct electric connecting relation.Described the second polysilicon strip 4 ' has width and/or the spacing of adjusting according to the demand of anti-static-discharge capability.
If establish the second port 2 ' at described the first type heavily doped region 3A, form source electrode or emitter 2 at described heavily doped region short circuit hole 3C, then described the first type heavily doped region 3A zone that surrounds in the described Second-Type light doping section 5 that is connected with heavily doped region short circuit hole 3C is the resistance R 2 (shown in Fig. 2 B or 2C) that the second port 2 ' connects, and described resistance R 2 can be N-type light dope resistance or P type light dope resistance.It is as follows that described N-type light dope resistance or P type light dope resistance form principle: when described the first type heavily doped region is that the n+ type mixes, described Second-Type heavily doped region is that the p+ type mixes, and described resistance R 2 is P type light dope resistance; When described the first type heavily doped region is that the p+ type mixes, described Second-Type heavily doped region is that the n+ type mixes, and described resistance R 2 is N-type light dope resistance.At this moment, according to the demand of anti-static-discharge capability adjust the space D 1 between described the first type heavily doped region 3A and the Second-Type heavily doped region 3B and/or adjust described heavily doped region short circuit hole 3C and the first type heavily doped region 3A between space D 2, determine the size of the resistance R 2 connect with described the second port 2 '.Wherein, the difference of Fig. 2 B and Fig. 2 C is, Fig. 2 B is dissymmetrical structure about described the first type heavily doped region 3A, the power semiconductor that then forms is monolateral raceway groove, the EAS of power semiconductor (pulse avalanche energy) characteristic and OFF state Leakage Current are less, and series resistance is R2 between described the second port 2 ' and source electrode or the emitter 2; And Fig. 2 C is symmetrical structure about described the first type heavily doped region 3A, the power semiconductor that then forms is bilateral raceway groove, the ON state current of power semiconductor is larger, series resistance is R2/2 between described the second port 2 ' and source electrode or the emitter 2, this be about the result of two limit symmetrical structure parallel connections.
Therefore, the power semiconductor with anti-static-discharge capability of the present invention's formation comprises: the second port 2 ' is arranged on described the first type heavily doped region 3A; And source electrode or emitter 2, being formed on the described heavily doped region short circuit hole 3C, described the first type heavily doped region 3A zone that surrounds in the described Second-Type light doping section 5 that is connected with heavily doped region short circuit hole 3C is the resistance R 2 that the second port 2 ' connects.Have between described the first type heavily doped region 3A and the Second-Type heavily doped region 3B between the space D 1 adjusted according to the demand of anti-static-discharge capability and/or described heavily doped region short circuit hole 3C and the first type heavily doped region 3A and have the space D 2 of adjusting according to the demand of anti-static-discharge capability.
In like manner, can and drain accordingly or collector electrode at described cellular formation the 3rd port 3 ', can form R3 between described the 3rd port 3 ' and described drain electrode or collector electrode 3, described resistance R 3 also can be N-type light dope resistance or P type light dope resistance.The size of the resistance R 3 that can be connected with described the 3rd port 3 ' according to the demand adjustment of anti-static-discharge capability equally.
If simultaneously at the first port one ' and the second port 2 ' upper series resistance, then establish the first port one at described the second polysilicon strip 4 ' ', at described the first port one ' in addition the second polysilicon strip 4 ' forms grid 1, described the second polysilicon strip 4 ' is the resistance R 1 that the first port connects, described the first port one ' and the direct electric connecting relation of grid 1 nothing, shown in Fig. 2 A.At this moment, according to the demand of anti-static-discharge capability width and/or the spacing of described the second polysilicon strip 4 ' are adjusted, can be determined and described the first port one ' size of the resistance R 1 that is connected.Simultaneously establish the second port 2 ' at described the first type heavily doped region 3A according to the method described above, the mode that forms source electrode or emitter 2 at described heavily doped region short circuit hole 3C forms the power semiconductor with anti-static-discharge capability.
Referring to Fig. 3-22, the present invention also provides a kind of manufacture method of structure cell, a plurality of described cellulars are arranged formation cellular array structure and are formed power semiconductor, described power semiconductor has the first port, the second port and the 3rd port, any port or a plurality of port in described three ports connect respectively a resistance, take described power semiconductor be MOSFET as example, describe the present invention in detail by different embodiment and how promote the ESD ability by series resistance as a kind of ESD guard assembly.
Embodiment one
Fig. 3 is to Figure 5 shows that the gate terminal series connection bar resistor that the invention provides the power semiconductor with anti-static-discharge capability forms the circular array domain structure of grid.
To shown in Figure 5, the step that each described cellular 8 forms is as follows: an epitaxial loayer (not shown in the figures, as to see also the sign 6 among Fig. 2 A to Fig. 2 C) is provided such as Fig. 3; In described epitaxial loayer, form a Second-Type light doping section (not shown in the figures, as to see also the sign 5 among Fig. 2 A to Fig. 2 C); On described epitaxial loayer, form successively from the bottom to top gate dielectric layer (not shown in the figures, as to see also the sign 7 among Fig. 2 A to Fig. 2 C) and the first polysilicon strip 4; Described the first polysilicon strip 4 and the gate dielectric layer of etching exposes described Second-Type light doping section; In described Second-Type light doping section, form respectively the first type heavily doped region 3A and Second-Type heavily doped region 3B; Form a heavily doped region short circuit hole 3C at described the first type heavily doped region 3A and Second-Type heavily doped region 3B; Arrange formation cellular array structure by described cellular 8 and form power semiconductor.
Described cellular 8 can be bar shaped, square, hexagon or circle.Arranging by the difference of difform described cellular 8 to form different array structures, and for example the bar shaped cellular can form square array or circular array; Square cellular can form square array; The hexagon cellular can form square array or hexagonal array; Circular cellular can form square array etc., and particular content sees also the analytic explanation of subsequent embodiment.Therefore, described cellular array structure can be circular array, square array and hexagonal array.In the present embodiment, described cellular 8 is bar shaped, and the described cellular array structure of formation is circular array.
Do again second polysilicon strip 4 ' that can mate described structure cell shape on the described gate dielectric layer in described cellular array structure, the second polysilicon strip 4 ' that is connected at the end with described the first polysilicon strip 4 is drawn the gate terminal (the first port one ') of described power semiconductor, the other end of described the second polysilicon strip is drawn the grid 1 of described power semiconductor, and described the second polysilicon strip 4 ' becomes the resistance R 1 that the first port connects thus.
When cellular 8 adopted bar shaped as described, described the second polysilicon strip 4 ' also adopted bar shaped.Width 2B and the spacing 2A of described the second polysilicon strip 4 ' all can adjust, and as shown in Figure 3, the width 2B of described the second polysilicon strip 4 ' is narrower, spacing 2A is wider; As shown in Figure 4, the width 2B of described the second polysilicon strip 4 ' is wider, spacing 2A is narrower; As shown in Figure 5, the width 2B of described the second polysilicon strip 4 ' and resistance spacing 2A are all narrower.Therefore, according to the demand of anti-static-discharge capability, change width 2B and the spacing 2A of described the second polysilicon strip 4 ', can adjust the size of described resistance R 1.The structural representation of the manufacture method of the power semiconductor with anti-static-discharge capability shown in the domain structure corresponding diagram 2B of Fig. 3 to Fig. 5.
Specifically see the analysis of n raceway groove VDMOS gate terminal series resistance: as shown in Figure 6, the block diagram of the manufacture method of the VDMOS of a kind of 600V/30mA n-channel provided by the invention (n raceway groove) (vertical double diffusion power field effect transistor), the resistance R G that gate terminal G has connected and formed by the second polysilicon strip 4 ', its domain structure as shown in Figure 5,1A is gate contact region in the present embodiment; That series connection is resistance R G between gate terminal and the grid 1; 2A is the resistance spacing of the resistance R G that forms of the second polysilicon strip 4 ' by bar shaped, is worth to be 6um; 2B is the resistance width of the resistance R G that forms of the second polysilicon strip 4 ' by bar shaped, is worth to be 4um.Change resistance spacing 2A and the resistance width 2B of described resistance R G, can change the resistance of described resistance R G.Described the first type heavily doped region 3A is the n+ source region, and described Second-Type heavily doped region 3B is the p+ contact zone.
The test result of final ESD guard assembly as shown in Figure 7, when RG=20 Ω, ESD is lower than 100V, and the resistance sizes of described resistance R G is when changing RG=1.5K into, ESD crosses 300V, has obviously improved anti-ESD ability.
Embodiment two
Fig. 8 is to Figure 9 shows that source terminal series connection bar resistor that the present invention has a power semiconductor of anti-static-discharge capability forms the circular array domain structure of source electrode.
Shown in Fig. 8 and 9, the step that each described cellular 8 forms is as follows: an epitaxial loayer (not shown in the figures, as to see also the sign 6 among Fig. 2 A to Fig. 2 C) is provided; In described epitaxial loayer, form a Second-Type light doping section (not shown in the figures, as to see also the sign 5 among Fig. 2 A to Fig. 2 C); On described epitaxial loayer, form successively from the bottom to top gate dielectric layer (not shown in the figures, as to see also the sign 7 among Fig. 2 A to Fig. 2 C) and the first polysilicon strip 4; Described the first polysilicon strip 4 and the gate dielectric layer of etching exposes described Second-Type light doping section; In described Second-Type light doping section, form respectively the first type heavily doped region 3A and Second-Type heavily doped region 3B; Form a heavily doped region short circuit hole 3C at described the first type heavily doped region 3A and Second-Type heavily doped region 3B; Arrange formation cellular array structure by described cellular 8 and form power semiconductor; Wherein, the zone that surrounds in the described Second-Type light doping section 5 that is connected with heavily doped region short circuit hole 3C of the first type heavily doped region 3A in all described cellulars 8 is the resistance R 2 that the second port 2 ' connects.
Therefore, the present invention forms a kind of structure cell, and each described cellular 8 comprises: an epitaxial loayer; One Second-Type light doping section is formed in the described epitaxial loayer; The first type heavily doped region 3A and Second-Type heavily doped region 3B are formed at respectively in the described Second-Type light doping section; Heavily doped region short circuit hole 3C is formed on described the first type heavily doped region 3A and the Second-Type heavily doped region 3B; Gate dielectric layer is formed on the surface of part the first type heavily doped region 3A of the Second-Type light doping section of epitaxial loayer, next-door neighbour's epitaxial loayer and next-door neighbour's Second-Type light doping section; Polysilicon strip 4 is formed on the described gate dielectric layer; Wherein, the zone that surrounds in the described Second-Type light doping section that is connected with heavily doped region short circuit hole 3C of the first type heavily doped region 3A in all described cellulars 8 is the resistance R 2 that the second port 2 ' connects.
And the step that source terminal (the second port 2 ') forms is as follows: the first type heavily doped region 3A in all described cellulars is all connected, the first type heavily doped region 3A at a described cellular establishes the second port 2 ', and with after the whole connections of the heavily doped region short circuit hole 3C in all described cellulars, form source electrode at the heavily doped region short circuit hole 3C of another described cellular.
Described cellular 8 can be bar shaped, square, hexagon or circle.And described cellular array structure can be circular array, square array and hexagonal array.In the present embodiment, described cellular 8 is bar shaped, and the described cellular array structure of formation is circular array.Difform described cellular 8 is arranged by difference can form different array structures, and particular content sees also the analytic explanation of subsequent embodiment.
Has space D 1 between the first type heavily doped region 3A in described cellular and the Second-Type heavily doped region 3B, can directly adjust space D 1 or indirectly change width between described the first type heavily doped region 3A and the Second-Type heavily doped region 3B and adjust between the two space D 1, thereby determine the size of the resistance R 2 that is connected with described source terminal 2 '; Or adjust space D 2 between described heavily doped region short circuit hole 3C and the first type heavily doped region 3A, and deciding the size of the resistance R 2 that is connected with described source terminal 2 ', described resistance R 2 is N-type light dope resistance or P type light dope resistance.The structural representation of the power semiconductor with anti-static-discharge capability shown in the domain structure corresponding diagram 2B of Fig. 8 to Fig. 9.
Specifically see the analysis of n raceway groove VDMOS source terminal series resistance: as shown in figure 10, the block diagram of the manufacture method of a kind of 600V/30mA n-channel VDMOS provided by the invention, at the source terminal S resistance R S that connected, its domain structure as shown in Figure 8, in the present embodiment between source terminal 2 ' and source electrode or the emitter 2 the resistance R S of " S type " of series connection be P type light dope resistance; Described the first type heavily doped region 3A is the n+ source region, and its dosage is 1E16cm
-2Described Second-Type heavily doped region 3B is the p+ contact zone, and its dosage is 2E15cm
-2Described Second-Type light doping section is the p-district, and its dosage is 3E13cm
-2Described heavily doped region short circuit hole 3C is source contact area, and its width is 4um.
For example, by adjusting the space D 2 between described heavily doped region short circuit hole 3C and the first type heavily doped region 3A, decide the method for the size of series resistance between described power semiconductor source terminal 2 ' and source electrode or the emitter 2 as follows: the source terminal contact zone 3C shown in Fig. 8 is narrower, and the source terminal contact zone 3C shown in Fig. 9 is wider, therefore, when described Second-Type heavily doped region 3B width is constant, because described heavily doped region short circuit hole 3C is formed on the described Second-Type heavily doped region 3B, by the width between the described heavily doped region short circuit hole 3C of indirect change and the first type heavily doped region 3A, can change the spacing between described the first type heavily doped region 3A and the heavily doped region short circuit hole 3C, to reach the purpose of adjusting the resistance R S size that is connected with described source terminal 2 '.
In like manner, the size of series resistance R3 can also realize by the present embodiment two similar methods between described power semiconductor drain electrode end and drain electrode or the collector electrode, gives unnecessary details no longer one by one at this.
The test result of final ESD guard assembly as shown in figure 11, when RS=0.7K, ESD is lower than 100V, and the size of described resistance R S is when changing RS=1.4K into, ESD crosses 300V, has obviously improved anti-ESD ability.
Embodiment three
Embodiment shown in Figure 12 and embodiment one and twos' difference is to provide a kind of gate terminal and source terminal with power semiconductor of anti-static-discharge capability to distinguish the circular array domain structure that the while series resistance forms grid and source electrode.
In the present embodiment, the domain structure that embodiment one can be changed rear and embodiment two carries out combination, forms Figure 12.To theing contents are as follows that described embodiment one changes: establish the first port one at described the second polysilicon strip 4 ' ', at described the first port one ' in addition the second polysilicon strip 4 ' forms grid 1, described the second polysilicon strip 4 ' is the resistance R 1 that the first port connects, described the first port one ' and the direct electric connecting relation of grid 1 nothing.Then, can adjust according to the mode of embodiment one size of the resistance R 1 of connecting with described gate terminal, and the size of adjusting the resistance R 2 of connecting with described source terminal according to the mode of embodiment two, give unnecessary details no longer one by one at this.
Embodiment four
Figure 13 is to provide the square array domain structure of a kind of source terminal with power semiconductor of anti-static-discharge capability (or gate terminal, source terminal simultaneously) series resistance formation to the difference of embodiment shown in Figure 14 and embodiment one or embodiment two.
In the present embodiment, each described cellular 8 is square, and described cellular 8 repeats splicing and distributes, and the described cellular array structure of formation is the square array domain structure.
If need to described source terminal series resistance, can form according to the method for embodiment two described source terminal and source electrode, as shown in figure 13, described Second-Type heavily doped region 3B is narrower, as shown in figure 14, described Second-Type heavily doped region 3B is wider, changes space D 1 between described the first type heavily doped region 3A and the Second-Type heavily doped region 3B according to the mode of embodiment two, thereby can adjust the size of the resistance R 2 of connecting with described source terminal.
If also need and described gate terminal series resistance, form first second polysilicon strip 4 ' that forms a square ring on every side (indicating) of array at each described cellular, and can between gate terminal that described power semiconductor forms and grid, form resistance R 1 according to the method for embodiment one, and the size of the adjustment resistance R 1 of connecting with described gate terminal.
Embodiment five
Figure 15 is to provide the hexagonal array domain structure of a kind of source terminal with power semiconductor of anti-static-discharge capability (or gate terminal, source terminal simultaneously) series resistance formation to the difference of embodiment shown in Figure 16 and embodiment four.
In the present embodiment, described cellular 8 is hexagon, and described cellular 8 repeats splicing and distributes, and the described cellular array structure of formation is the hexagonal array domain structure.Wherein, Figure 15 and Figure 16 part that to have intercepted described cellular array structure be the hexagonal array domain structure.
If need to described source terminal series resistance, can form according to the method for embodiment two described source terminal and source electrode, as shown in figure 15, described Second-Type heavily doped region 3B is narrower, as shown in figure 16, described Second-Type heavily doped region 3B is wider, changes space D 1 between described the first type heavily doped region 3A and the Second-Type heavily doped region 3B according to the mode of embodiment two, thereby can adjust the size of the resistance R 2 of connecting with described source terminal.
If also need and described gate terminal series resistance, form first second polysilicon strip 4 ' that forms a hexagon ring-type on every side (indicating) of born of the same parents' array at each described cellular, and can between gate terminal that described power semiconductor forms and grid, form resistance R 1 according to the method for embodiment one, and the size of the adjustment resistance R 1 of connecting with described gate terminal.
Embodiment six
Figure 17 is to provide the square array domain structure of a kind of source terminal with power semiconductor of anti-static-discharge capability (or gate terminal, source terminal simultaneously) series resistance formation to the difference of embodiment shown in Figure 180 and embodiment four.
In the present embodiment, described cellular 8 is hexagon, and then described cellular 8 repeats the splicing distribution, and the described cellular array structure of formation is the square array domain structure.
If need to described source terminal series resistance, can form according to the method for embodiment two described source terminal and source electrode, as shown in figure 17, described Second-Type heavily doped region 3B is wider, as shown in figure 18, described Second-Type heavily doped region 3B is narrower, changes space D 1 between described the first type heavily doped region 3A and the Second-Type heavily doped region 3B according to the mode of embodiment two, thereby can adjust the size of the resistance R 2 of connecting with described source terminal and source electrode or emitter.
If also need and described source terminal series resistance, form first second polysilicon strip 4 ' that forms a square ring on every side (indicating) of array at each described cellular, and can between gate terminal that described power semiconductor forms and grid, form resistance R 1 according to the method for embodiment one, and the size of the adjustment resistance R 1 of connecting with described gate terminal.
Embodiment seven
Figure 19 is to provide the square array domain structure of a kind of source terminal with power semiconductor of anti-static-discharge capability (or gate terminal, source terminal simultaneously) series resistance formation to the difference of embodiment shown in Figure 20 and embodiment four.
In the present embodiment, described cellular 8 is circular, and described cellular 8 repeats splicing and distributes, and the described cellular array structure of formation is the square array domain structure.
If need to described source terminal series resistance, can form according to the method for embodiment two described source terminal and source electrode, as shown in figure 19, described Second-Type heavily doped region 3B is wider, as shown in figure 20, described Second-Type heavily doped region 3B is narrower, changes space D 1 between described the first type heavily doped region 3A and the Second-Type heavily doped region 3B according to the mode of embodiment two, thereby can adjust the size of the resistance R 2 of connecting with described source terminal.
If also need and described gate terminal series resistance, form first second polysilicon strip 4 ' that forms a circular ring-type on every side (indicating) of array at each described cellular, and can between gate terminal that described power semiconductor forms and grid, form resistance R 1 according to the method for embodiment one, and the size of the adjustment resistance R 1 of connecting with described gate terminal.
Embodiment eight
Figure 21 is to provide the another kind of technique of painting of the domain structure that a kind of source terminal with power semiconductor of anti-static-discharge capability connects bar resistor formation source electrode to embodiment shown in Figure 22 and the difference of embodiment two, the domain structure that provides with Fig. 8 among the embodiment two and Fig. 9 is that circular array is similar, the domain structure that the present embodiment provides is the square array domain structure, and wherein Figure 21 is the domain structure of the monolateral raceway groove of Fig. 2 B schematic diagram; Figure 22 is the domain structure of the bilateral raceway groove of Fig. 2 C schematic diagram.Therefore, all the other contents of the domain structure that the present embodiment provides see also the content of embodiment two, give unnecessary details no longer one by one at this.
Each embodiment adopts the mode of going forward one by one to describe in this specification, and what each embodiment stressed is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.For the disclosed system of embodiment, because corresponding with the disclosed method of embodiment, so description is fairly simple, relevant part partly illustrates referring to method and gets final product.
The professional can also further recognize, unit and the algorithm steps of each example of describing in conjunction with embodiment disclosed herein, can realize with electronic hardware, computer software or the combination of the two, for the interchangeability of hardware and software clearly is described, composition and the step of each example described in general manner according to function in the above description.These functions are carried out with hardware or software mode actually, depend on application-specific and the design constraint of technical scheme.The professional and technical personnel can specifically should be used for realizing described function with distinct methods to each, but this realization should not thought and exceeds scope of the present invention.
Obviously, those skilled in the art can carry out various changes and modification to invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these revise and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these change and modification.
Claims (18)
1. the manufacture method with power semiconductor of anti-static-discharge capability comprises the steps:
Provide the power semiconductor of the first port, the second port and the 3rd port, described power semiconductor is formed by the cellular array arrangement;
Any port or a plurality of port in described three ports connect respectively a resistance, form the power semiconductor with anti-static-discharge capability.
2. the manufacture method with power semiconductor of anti-static-discharge capability as claimed in claim 1, it is characterized in that, described power semiconductor is any one or the power semiconductor that is derived by MOSFET, IGBT and bipolar transistor in MOSFET, IGBT, the bipolar transistor; Wherein, when described power semiconductor was MOSFET, the first port of described MOSFET, the second port and the 3rd port be corresponding gate terminal, source terminal and drain electrode end respectively; When described power semiconductor was IGBT, the first port of described IGBT, the second port and the 3rd port be corresponding gate terminal, emitter terminal and collector terminal respectively; When described power semiconductor was bipolar transistor, the first port of described bipolar transistor, the second port and the 3rd port be corresponding base terminal, emitter terminal and collector terminal respectively.
3. the manufacture method with power semiconductor of anti-static-discharge capability as claimed in claim 2 is characterized in that, the step that described cellular forms is as follows:
One epitaxial loayer is provided;
In described epitaxial loayer, form a Second-Type light doping section;
On described epitaxial loayer, form successively from the bottom to top gate dielectric layer and the first polysilicon strip;
Described the first polysilicon strip of etching and gate dielectric layer expose described Second-Type light doping section;
In described Second-Type light doping section, form one first type heavily doped region and Second-Type heavily doped region;
Form a heavily doped region short circuit hole at described the first type heavily doped region and Second-Type heavily doped region.
4. the manufacture method with power semiconductor of anti-static-discharge capability as claimed in claim 3, it is characterized in that, at described gate dielectric layer deposition the second polysilicon strip, establish the first port at the second polysilicon strip that is connected with described the first polysilicon strip one end, form grid on the second polysilicon strip beyond described the first port, described the second polysilicon strip is the resistance that the first port connects, and described the first port and grid are without direct electric connecting relation.
5. the manufacture method with power semiconductor of anti-static-discharge capability as claimed in claim 4, it is characterized in that, demand according to anti-static-discharge capability is adjusted width and/or the spacing of described the second polysilicon strip, the size of definite resistance that is connected with described the first port.
6. the manufacture method with power semiconductor of anti-static-discharge capability as claimed in claim 3, it is characterized in that, establish the second port on described the first type heavily doped region, form source electrode or emitter on the described heavily doped region short circuit hole, described the first type heavily doped region zone that surrounds in the described Second-Type light doping section that is connected with heavily doped region short circuit hole is the resistance that the second port connects.
7. the manufacture method with power semiconductor of anti-static-discharge capability as claimed in claim 6, it is characterized in that, according to the demand of anti-static-discharge capability adjust the spacing between described the first type heavily doped region and the Second-Type heavily doped region and/or adjust described heavily doped region short circuit hole and the first type heavily doped region between spacing, determine the size of the resistance be connected with described the second port.
8. the manufacture method with power semiconductor of anti-static-discharge capability as claimed in claim 3, it is characterized in that, at described gate dielectric layer deposition the second polysilicon strip, establish the first port at the second polysilicon strip that is connected with described the first polysilicon strip one end, form grid on the second polysilicon strip beyond described the first port, described the second polysilicon strip is the resistance that the first port connects, and described the first port and grid are without direct electric connecting relation; Establish the second port on described the first type heavily doped region, form source electrode or emitter on the described heavily doped region short circuit hole, described the first type heavily doped region zone that surrounds in the described Second-Type light doping section that is connected with heavily doped region short circuit hole is the resistance that described the second port connects.
9. the manufacture method with power semiconductor of anti-static-discharge capability as claimed in claim 8, it is characterized in that, adjust width and/or the spacing of described the second polysilicon strip according to the demand of anti-static-discharge capability, the size of definite resistance that is connected with described the first port; Adjust spacing between described the first type heavily doped region and the Second-Type heavily doped region and/or the spacing between described heavily doped region short circuit hole and the first type heavily doped region according to the demand of anti-static-discharge capability, determine the size of the resistance that is connected with described the second port.
10. power semiconductor with anti-static-discharge capability comprises:
One power semiconductor is formed by the cellular array arrangement;
The first port, the second port and the 3rd port are formed in the described power semiconductor; And
One or more resistance, any port or a plurality of port in described three ports connect respectively a described resistance.
11. the power semiconductor with anti-static-discharge capability as claimed in claim 10, it is characterized in that, described power semiconductor is any one or the power semiconductor that is derived by MOSFET, IGBT and bipolar transistor in MOSFET, IGBT, the bipolar transistor; Wherein, when described power semiconductor was MOSFET, the first port of described MOSFET, the second port and the 3rd port be corresponding gate terminal, source terminal and drain electrode end respectively; When described power semiconductor was IGBT, the first port of described IGBT, the second port and the 3rd port be corresponding gate terminal, emitter terminal and collector terminal respectively; When described power semiconductor was bipolar transistor, the first port of described bipolar transistor, the second port and the 3rd port be corresponding base terminal, emitter terminal and collector terminal respectively.
12. the power semiconductor with anti-static-discharge capability as claimed in claim 11 is characterized in that, described cellular comprises:
One epitaxial loayer;
One Second-Type light doping section is formed in the described epitaxial loayer;
The first type heavily doped region and Second-Type heavily doped region are formed at respectively in the described Second-Type light doping section;
Heavily doped region short circuit hole is formed on described the first type heavily doped region and the Second-Type heavily doped region;
Gate dielectric layer is formed on the surface of part the first type heavily doped region of the Second-Type light doping section of epitaxial loayer, next-door neighbour's epitaxial loayer and next-door neighbour's Second-Type light doping section;
The first polysilicon strip is formed on the described gate dielectric layer.
13. the power semiconductor with anti-static-discharge capability as claimed in claim 12 is characterized in that, comprising:
The first port is arranged on the second polysilicon strip that is connected with described the first polysilicon strip one end, and described the second polysilicon strip is formed on the described gate dielectric layer; And
Grid is formed on described the first port the second polysilicon strip in addition, and described the second polysilicon strip is the resistance that the first port connects, and described the first port and grid are without direct electric connecting relation.
14. the power semiconductor with anti-static-discharge capability as claimed in claim 13 is characterized in that, described the second polysilicon strip has width and/or the spacing of adjusting according to the demand of anti-static-discharge capability.
15. the power semiconductor with anti-static-discharge capability as claimed in claim 12 is characterized in that, comprising:
The second port is arranged on described the first type heavily doped region; And
Source electrode or emitter are formed on the described heavily doped region short circuit hole, and described the first type heavily doped region zone that surrounds in the described Second-Type light doping section that is connected with heavily doped region short circuit hole is the resistance that the second port connects.
16. the power semiconductor with anti-static-discharge capability as claimed in claim 15, it is characterized in that having between described the first type heavily doped region and the Second-Type heavily doped region between the spacing adjusted according to the demand of anti-static-discharge capability and/or described heavily doped region short circuit hole and the first type heavily doped region and have the spacing of adjusting according to the demand of anti-static-discharge capability.
17. the power semiconductor with anti-static-discharge capability as claimed in claim 12, it is characterized in that, comprise: the first port and grid, described the first port is arranged on the second polysilicon strip that is connected with described the first polysilicon strip one end, described the second polysilicon strip is formed on the described gate dielectric layer, described grid is formed on described the first port the second polysilicon strip in addition, described the second polysilicon strip is the resistance that the first port connects, and described the first port and grid are without direct electric connecting relation; And second port and source electrode or emitter, described the second port is arranged on described the first type heavily doped region, described source electrode or emitter are formed on the described heavily doped region short circuit hole, and described the first type heavily doped region zone that surrounds in the described Second-Type light doping section that is connected with heavily doped region short circuit hole is the resistance that the second port connects.
18. the power semiconductor with anti-static-discharge capability as claimed in claim 17 is characterized in that, described the second polysilicon strip has width and/or the spacing of adjusting according to the demand of anti-static-discharge capability; Have between described the first type heavily doped region and the Second-Type heavily doped region between the spacing adjusted according to the demand of anti-static-discharge capability and/or described heavily doped region short circuit hole and the first type heavily doped region and have the spacing of adjusting according to the demand of anti-static-discharge capability.
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| CN201210559280.0A CN103050442B (en) | 2012-12-20 | 2012-12-20 | Power semiconductor device with antistatic discharge capacity and manufacturing method |
| CN201410383566.7A CN104157645B (en) | 2012-12-20 | 2012-12-20 | Power semiconductor device with electro-static discharging capability and manufacturing method |
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