CN103042615A - Improved silicon wafer collecting device - Google Patents
Improved silicon wafer collecting device Download PDFInfo
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- CN103042615A CN103042615A CN2012105724871A CN201210572487A CN103042615A CN 103042615 A CN103042615 A CN 103042615A CN 2012105724871 A CN2012105724871 A CN 2012105724871A CN 201210572487 A CN201210572487 A CN 201210572487A CN 103042615 A CN103042615 A CN 103042615A
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- silicon chip
- silicon wafer
- silicon wafers
- cavity
- air outing
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Abstract
The invention relates to a novel silicon wafer collecting device comprising a collecting tank. Two cavities are arranged in two walls of the collecting tank respectively, an air outing device is arranged on the outer wall of each cavity, a plurality of longitudinal through holes are uniformly arranged on the inner wall of each cavity, and a timing control valve is arranged inside each air outing device. The air outing devices on the two walls are used for air outing at different times by setting the timing control valve, so that silicon wafers can fall into the collecting tank uniformly so as to avoid space waste. When the silicon wafers fall down, the air outing devices can eject gas which is uniformly blown out from the longitudinal through holes to buffer the silicon wafer, so that the silicon wafers can fall slowly without being damaged, further quality of the silicon wafers is guaranteed, and labor is saved.
Description
Technical field
The present invention relates to a kind of gathering-device, particularly a kind of gathering-device of silicon chip belongs to the technical field of silicon wafer processing equipment.
Background technology
In the silicon chip working process, by the line cutting silicon rod is processed into silicon chip.Silicon chip after the cutting is collected by gathering-device.Gathering-device of the prior art comprises feeder, and in the collection process, extruding was overlapping mutually when silicon chip fell, and easily made silicon chip surface impaired when picking up, thereby affected the silicon chip crudy.
Recently a kind of gathering-device occurred, comprised feeder, wherein feeder is provided with exhaust apparatus, can blow gas when silicon chip falls, silicon chip is cushioned.But the air outlet termination of its exhaust apparatus is positioned at gathering-device, also can cause damage to the silicon chip in falling.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of novel silicon chip collector for above drawback.
For solving the problems of the technologies described above, technical scheme of the present invention is:
A kind of silicon chip collector of improvement comprises feeder, wherein, respectively is provided with a cavity in described feeder two walls, and described cavity outer wall is provided with exhaust apparatus, and inwall evenly is provided with some longitudinal holes.
The silicon chip collector of above-mentioned a kind of improvement, wherein, the built-in timing control valve of described exhaust apparatus.
Beneficial effect of the present invention is: when silicon chip falls, can spray gas by exhaust apparatus, evenly blow out from each longitudinal hole, silicon chip is cushioned, but make the silicon chip slow decreasing, can not cause damage to silicon chip again, thereby guaranteed the quality of silicon chip, saved artificial.
The exhaust apparatus of two arms can make silicon chip drop on comparatively uniformly in the feeder by setting at times respectively air-out of timing control valve, has avoided the space waste, has saved artificial.
Description of drawings
Fig. 1 is structural representation of the present invention
The specific embodiment
The invention will be further described below in conjunction with accompanying drawing.
As shown in the figure, the present invention includes feeder 1, wherein, respectively be provided with a cavity 3 in 1 liang of wall of described feeder, described cavity 3 outer walls are provided with exhaust apparatus 41,42, and inwall evenly is provided with some longitudinal holes 2.When silicon chip falls, can pass through exhaust apparatus 41,42 ejection gases, from each longitudinal hole 2, evenly blow out, silicon chip is cushioned, but make the silicon chip slow decreasing, can not cause damage to silicon chip again, thereby guarantee the quality of silicon chip, saved artificial.
Simultaneously, exhaust apparatus 41,42 built-in timing control valves 51,52 are realized at times respectively air-out by setting timing control valve 51,52, and silicon chip is dropped in the feeder comparatively uniformly, have avoided the space waste, have saved artificial.
Claims (2)
1. the silicon chip collector of an improvement comprises feeder, it is characterized by, and respectively is provided with a cavity in described feeder two walls, and described cavity outer wall is provided with exhaust apparatus, and inwall evenly is provided with some longitudinal holes.
2. the silicon chip collector of a kind of improvement as claimed in claim 1 is characterized by, the built-in timing control valve of described exhaust apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105724871A CN103042615A (en) | 2012-12-26 | 2012-12-26 | Improved silicon wafer collecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105724871A CN103042615A (en) | 2012-12-26 | 2012-12-26 | Improved silicon wafer collecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103042615A true CN103042615A (en) | 2013-04-17 |
Family
ID=48055580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012105724871A Pending CN103042615A (en) | 2012-12-26 | 2012-12-26 | Improved silicon wafer collecting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103042615A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116274007A (en) * | 2023-04-27 | 2023-06-23 | 苏州天准科技股份有限公司 | Double-magazine receiving device and discharging and sorting equipment |
| CN116371751A (en) * | 2023-04-27 | 2023-07-04 | 苏州天准科技股份有限公司 | Energy level expansion blanking separation equipment and method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07196222A (en) * | 1993-06-04 | 1995-08-01 | Ito Kogyo Kk | Piling device for plate material |
| JP2000177904A (en) * | 1998-12-10 | 2000-06-27 | Tokin Corp | Sheet stock device |
| US20010048192A1 (en) * | 2000-06-02 | 2001-12-06 | Fuji Photo Film Co., Ltd. | Apparatus for stacking sheet members, apparatus for measuring dimensions of sheet members, and apparatus for and method of marking sheet members |
| EP1726549A1 (en) * | 2005-05-23 | 2006-11-29 | Fuji Photo Film Co., Ltd. | Sheet stacking apparatus and sheet stacking method |
| CN1989056A (en) * | 2005-07-06 | 2007-06-27 | 西门子公司 | Method and device for placing a flat freely movable object |
| CN203357709U (en) * | 2012-12-26 | 2013-12-25 | 镇江市港南电子有限公司 | Improved silicon wafer collecting device |
-
2012
- 2012-12-26 CN CN2012105724871A patent/CN103042615A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07196222A (en) * | 1993-06-04 | 1995-08-01 | Ito Kogyo Kk | Piling device for plate material |
| JP2000177904A (en) * | 1998-12-10 | 2000-06-27 | Tokin Corp | Sheet stock device |
| US20010048192A1 (en) * | 2000-06-02 | 2001-12-06 | Fuji Photo Film Co., Ltd. | Apparatus for stacking sheet members, apparatus for measuring dimensions of sheet members, and apparatus for and method of marking sheet members |
| EP1726549A1 (en) * | 2005-05-23 | 2006-11-29 | Fuji Photo Film Co., Ltd. | Sheet stacking apparatus and sheet stacking method |
| CN1989056A (en) * | 2005-07-06 | 2007-06-27 | 西门子公司 | Method and device for placing a flat freely movable object |
| CN203357709U (en) * | 2012-12-26 | 2013-12-25 | 镇江市港南电子有限公司 | Improved silicon wafer collecting device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116274007A (en) * | 2023-04-27 | 2023-06-23 | 苏州天准科技股份有限公司 | Double-magazine receiving device and discharging and sorting equipment |
| CN116371751A (en) * | 2023-04-27 | 2023-07-04 | 苏州天准科技股份有限公司 | Energy level expansion blanking separation equipment and method |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130417 |