CN103031539A - Fixed sealing method for three-proofing membrane on surface of thermoelectric refrigeration component - Google Patents
Fixed sealing method for three-proofing membrane on surface of thermoelectric refrigeration component Download PDFInfo
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- CN103031539A CN103031539A CN2012105752443A CN201210575244A CN103031539A CN 103031539 A CN103031539 A CN 103031539A CN 2012105752443 A CN2012105752443 A CN 2012105752443A CN 201210575244 A CN201210575244 A CN 201210575244A CN 103031539 A CN103031539 A CN 103031539A
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Abstract
The invention relates to a fixed sealing method for a three-proofing membrane on the surface of a thermoelectric refrigeration component. The method comprises the steps that cleaned lead wires of the thermoelectric refrigeration component are subjected to welding spot bonding and plastic sealing, and hung in a settling chamber of a settling device, and polyphenylene ethyl is placed in an evaporation chamber of the settling device, subjected to evaporation and splitting, and settled on the surface of the thermoelectric refrigeration component to form the three-proofing membrane. The method adopts a settling technology to form the mould-proof, moisture-proof and salt-fog-proof polyphenylene ethyl three-proofing membrane on the surface of the thermoelectric refrigeration component, so that the three-proofing membrane is high in corrosion resistance, good in radiation resistance, good in water-proof effect and dust-proof effect; the insulating property and the adhesiveness of the thermoelectric refrigeration component are very high; the three-proofing membrane on the surface of the thermoelectric refrigeration component is not affected through performing mechanical tests such as vibration, impact and acceleration on the thermoelectric refrigeration component; the three-proofing membrane is high in temperature shock resistance, and is not stripped at a high temperature or in a severe environment; welding spots cannot fall off; and the service life of the thermoelectric refrigeration component is prolonged.
Description
Technical field
The invention belongs to thermoelectric cooling module manufacturing technology field, particularly relate to the solid encapsulation method of a kind of thermoelectric cooling module surface three anti-films.
Background technology
Existing commercial thermoelectric cooling module does not carry out solid envelope usually, for being arranged, requirement carries out solid envelope, adopt and carry out the sealing processing under the drying atmos environment, the one layer tape that namely bonds first on thermoelectric cooling module and the extraneous thermoelement surface that directly contacts, and then the surface of adhesive tape is coated with the processing mode of one deck 704 silicon rubber; This method can effectively protect thermoelement, inducer and the weld interface of thermoelectric cooling module to avoid humidity corrosion under atmospheric environment, reduce reliability and the work-ing life of thermoelectric cooling module, but in vacuum environment, if still adopt similar techniques will cause sealing because of the pressure projection, cause vacuum deflation, affect vacuum environment and be and impact during demanding to cleanliness factor; Therefore, thermoelectric cooling module does not adopt the measure of any sealing and solid envelope usually, but this application exists hidden danger simultaneously.
Thermoelectric cooling module requires normally to use under high temperature and rugged environment condition, in order to guarantee to weld reliability, usually adopt the high reactivity soldering flux that contains chlorion in the weldprocedure, guaranteed the welding quality of solder joint, but because the corrodibility of chlorion is high, and be difficult to all to wash residual chlorion, be easy to be combined with chlorion because thermoelectric cooling module is inner corrosion and cause the thermoelectric cooling module solder joint to come off to cause the inefficacy of thermoelectric cooling module.
Summary of the invention
The present invention provides a kind of non-corrosibility good for solving the technical problem that exists in the known technology, and solder joint does not come off, welds high conformity in high temperature and severe environment, reliability is high, the solid encapsulation method of the thermoelectric cooling module surface three anti-films of long service life.
The technical solution used in the present invention is:
The solid encapsulation method of thermoelectric cooling module surface three anti-films comprises the solid envelope of the thermoelectric cooling module after cleaning being carried out surface three anti-films, and be characterized in: the solid package of described three anti-films is drawn together following steps:
⑴ to the lead solder-joint sealing adhesive tape of thermoelectric cooling module, with the plastic casing pyrocondensation on adhesive tape;
⑵ the thermoelectric cooling module that finish step ⑴ is suspended in the sediment chamber of deposition apparatus, and described deposition apparatus comprises Controlling System, evaporator room, cracking room, sediment chamber and vacuum system;
⑶ all be evacuated to 10 by vacuum system to evaporator room, cracking room and sediment chamber after polyphenylene ethyl is placed the evaporator room of deposition apparatus
-2-10
-3Pa, the temperature of evaporator room is controlled to be 150-200 ℃, cracking room temperature is controlled to be 650-700 ℃, polyphenylene ethyl in the evaporator room forms the gaseous state polyphenylene ethyl and enters cracking room, in cracking room, be cracked into reactive monomer, reactive monomer enters in the sediment chamber of room temperature at the thermoelectric cooling module surface deposition 1-5h that hangs, and the thermoelectric cooling module surface forms the parylene film of 0.1-100 micron thickness as three anti-films;
⑷ be filled with rare gas element in the evaporator room of deposition apparatus, cracking room and the sediment chamber, when the deposition apparatus external and internal pressure is suitable, take out thermoelectric cooling module, remove plastic casing and adhesive tape on the lead solder-joint, finish the solid envelope process of thermoelectric cooling module of the present invention surface three anti-films.
The present invention can also adopt following technical scheme:
Described adhesive tape is the poly-imines adhesive tape that mills.
Described deposition apparatus is gas-phase deposition system.
The reactive monomer diameter that the polyphenylene ethyl Pintsch process becomes among the described step ⑶ is 10
-2-5 microns.
The hanger that hangs thermoelectric cooling module in the described sediment chamber is 360 ° and horizontally rotates.
Described rare gas element is argon gas.
Advantage and positively effect that the present invention has are:
1, the present invention adopts deposition technique to form one deck parylene film on the thermoelectric cooling module surface as three anti-films, this film has mould proof, moisture proof, three anti-protective effects of anti-salt fog, not only resistance to corrosion is strong, radiation resistance is good, waterproof, good dustproof effect, and insulating property and very strong with the adhesion property of thermoelectric cooling module, through the thermoelectric cooling module surface that three anti-films are arranged is vibrated, impact, the mechanical tests such as acceleration, the right three anti-films in thermoelectric cooling module surface are unaffected, heatproof degree impact capacity is strong, high temperature and severe environment can not cause peeling off of three anti-films, guarantee that solder joint does not come off, prolonged the work-ing life of thermoelectric cooling module;
2, the present invention is by the control of control scission reaction temperature, and the polyphenylene ethyl cracking performance is stable, diameter is 10
-2-5 microns reactive monomer in addition can 360 ° of thermoelectric cooling modules that horizontally rotate, and have guaranteed to form stability and the homogeneities of three anti-films;
3, guarantee the total amount of reactive monomer by control filler quantity, guarantee that the three anti-film thicknesses that thermoelectric cooling module forms are the 1-30 micron, neither can impact refrigerating function, can stop again the erosion of moisture, acid, oil and solvent, prevent that fifth wheel from causing opening circuit of thermoelectric cooling module or short circuit, Effective Raise the reliability of thermoelectric cooling module.
Description of drawings
Fig. 1 is vacuum three anti-solid encapsulation method process route views of the present invention;
Fig. 2 is thermoelectric cooling module cleaning route synoptic diagram among Fig. 1;
Fig. 3 tests process route view among Fig. 1
Fig. 4 is the present invention's gas-phase deposition system integral part synoptic diagram;
Fig. 5 is that the thermoelectric cooling module master that the present invention is sealed with three anti-films looks synoptic diagram;
Fig. 6 is A-A direction cross-sectional schematic among Fig. 5;
Fig. 7 is the enlarged view of B among Fig. 6.
Among the figure, 17-thermoelectric cooling module, 18-three anti-films, 19-lead solder-joint.
Embodiment
For further understanding summary of the invention of the present invention, Characteristic, hereby exemplify following examples, and cooperate accompanying drawing to be described in detail as follows:
The solid encapsulation method of thermoelectric cooling module surface three anti-films comprises the thermoelectric cooling module after cleaning is carried out the solid envelope in surface, and be characterized in: described solid package is drawn together following steps:
To the lead solder-joint of thermoelectric cooling module be sealing adhesive strong viscosity, resistant to elevated temperaturesly poly-ly mill the imines adhesive tape, with the heat-shrinkable T bush pyrocondensation on adhesive tape;
⑵ the thermoelectric cooling module that finish step ⑴ is suspended in the sediment chamber of gas-phase deposition system can 360 ° on the hanger that horizontally rotates; Gas-phase deposition system comprises Controlling System, evaporator room, cracking room, sediment chamber and vacuum system;
⑶ all be evacuated to 10 by vacuum system to evaporator room, cracking room and sediment chamber after polyphenylene ethyl is placed evaporator room
-2-10
-3Pa is controlled at 150-200 ℃, cracking room temperature by Controlling System with the temperature of evaporator room and is controlled at 650-700 ℃, and the temperature of sediment chamber is room temperature; Polyphenylene ethyl in the evaporator room forms the gaseous state polyphenylene ethyl and enters cracking room, is cracked into diameter 10 in cracking room
-2-5 microns reactive monomer; Reactive monomer enters in the sediment chamber of room temperature, and at the thermoelectric cooling module surface deposition 1-5h that hangs, the thermoelectric cooling module surface forms the parylene film of 0.1-100 micron thickness as three anti-films;
⑷ evaporator room, cracking room and sediment chamber all are filled with rare gas element, when the gas-phase deposition system external and internal pressure is suitable, take out thermoelectric cooling module, remove heat-shrinkable T bush and adhesive tape on the lead solder-joint, finish the solid envelope process of thermoelectric cooling module of the present invention surface three anti-films.
Embodiment:
1, cleaning, lead solder-joint protection
At first according to as shown in Figure 2 technique, thermoelectric cooling module is carried out normal developing, high temperature immersion, ultrasonic cleaning, dehydration and lead solder-joint protection successively; Normal developing is 3-5 time for adopting the deionized water rinsing number of times; High temperature soaks for deionized water is heated to 70-80 ℃, puts into thermoelectric cooling module, soaks more than the 4h; Ultrasonic cleaning is that deionized water is heated to 50-60 ℃, opens ultrasonic cleaning 3-5min, and excusing from death is cleaned 2 times; Dehydration is that thermoelectric cooling module is placed in the dehydrated alcohol, places 3-5min, takes out nature and dries; The lead solder-joint protection is: such as Fig. 5, shown in Figure 6,1. will lead solder-joint 19 usefulness of thermoelectric cooling module 17 gather and to mill the imines adhesive tape and bond, poly-mill the imines adhesive tape and have strong viscosity and resistant to elevated temperatures characteristics, bonding firmly, can effectively drive bubble out of, prevent that vacuum-deposited absolute dimethylbenzene from entering; 2. will be stained with the poly-solder joint that mills the imines adhesive tape with the heat-shrinkable T bush of Ф 2.5mm contracts; After repeating 1. to operate, will be stained with the poly-solder joint that mills the imines adhesive tape with the heat-shrinkable T bush of Ф 5mm again and contract, and prevent from forming at the solder joint position of lead-in wire three anti-films and cause insulation;
2, the anti-film of solid inside back cover
Select the Parylene gas-phase deposition system of U.S. SCS company, as shown in Figure 4, this gas-phase deposition system comprises Controlling System, evaporator room, cracking room, sediment chamber and vacuum system; To be suspended on the hanger of 360 ° of automatic rotatings in the sediment chamber through the thermoelectric cooling module after cleaning, the lead solder-joint protection, polyphenylene ethyl is filled out in evaporator room, and vacuum system is evacuated to 10 with evaporator room, cracking room and sediment chamber
-3Pa, Controlling System is controlled at 180 ℃, cracking room temperature with the temperature of evaporator room and is controlled to be 680 ℃; Polyphenylene ethyl in the evaporator room forms the gaseous state polyphenylene ethyl and enters cracking room, in cracking room, be cracked into the reactive monomer of 1 micron stable performance of diameter, entered in 25 ℃ of room temperature deposition chambers by Controlling System control reactive monomer, reactive monomer moment is adsorbed on the thermoelectric cooling module surface, reactive monomer is at thermoelectric cooling module surface deposition 4h, form good absorption by high temperature to room temperature process implementation good heat radiating and with the thermoelectric cooling module all surface with the reactive monomer of guaranteeing cracking room, the thermoelectric cooling module surface of 360 ° of rotations forms that bonding force is strong as shown in Figure 7,10 micron thickness parylene film of surface uniform are three anti-films 18;
3, pressure release
Evaporator room, cracking room, sediment chamber in the Parylene gas-phase deposition system are filled with argon gas, make the gas-phase deposition system external and internal pressure suitable, take out the thermoelectric cooling module that the surface is sealed with three anti-films, remove heat-shrinkable T bush and adhesive tape on the lead solder-joint, finish the solid envelope process of thermoelectric cooling module of the present invention surface three anti-films.
Without any difference, because three anti-films are colourless and have high-clarity, and three prevent that films and thermoelectric cooling module possess very strong bonding force before range estimation thermoelectric cooling module post-depositional state and the deposition; Utilize the electron microscope more than 100 times to watch the cut segment face thermoelectric cooling module dissection, obviously find thermoelectric cooling module surface attachment layer of transparent material; The lead solder-joint of thermoelectric cooling module is only zone of not implementing insulation three anti-films.
Process of the test of the present invention:
The thermoelectric cooling module of the anti-film of the solid inside back cover of effects on surface carry out successively as shown in Figure 3 pull out lattice test → insulation test → temperature shock test → insulation test → mechanical test → insulation test → irradiation test → insulation test;
1, pulls out the lattice test
Mill the imines adhesive tape sticking on the surface of hot and cold of thermoelectric cooling module with poly-, tear with the speed of 3m/s, after tested, the anti-film of three on the thermoelectric cooling module is not peeled off, is not come off;
2, insulation test
Thermoelectric cooling module is placed saturated aqueous common salt, and an end of insulation resistance meter is connected with the thermoelectric cooling module outlet line plus or minus utmost point, and an end directly inserts in the saturated aqueous common salt and tests, and insulation resistance is not less than 1000M Ω;
3, temperature shock test
Thermoelectric cooling module is placed-55 ℃ and 115 ℃ of environment, each temperature hold-time is 30min, testing campaign 50 times, and after tested, the thermoelectric cooling module no-welding-spot comes off;
4, insulation test
Process of the test and experimental result are with above-mentioned insulation test;
5, mechanical test
The mechanical test of thermoelectric cooling module comprises sinusoidal vibration, impact and acceleration test, wherein:
Sine vibration test proportion: 5-25Hz, amplitude (0-P): 10.1mm; Frequency: 25-100Hz, acceleration: 20g; Test period: 2oct/min; The test direction: three axially;
Shock test proportion: 100-800Hz, impact spectrum acceleration :+6dB/oct; Frequency: 800-4000Hz, impact spectrum acceleration: 1000g; Test number (TN): 3 times; The test direction: three axially;
Acceleration test adopts peak accelerator: 20g, hold-time: 5min, loading rate :≤0.5g/s; The test direction: three axially;
By above-mentioned mechanical test, after tested, the thermoelectric cooling module no-welding-spot comes off;
6, insulation test
Process of the test and experimental result are with above-mentioned insulation test;
7, irradiation test
Adopt
60The Co source of radiation carries out total dose 300Krad(Si to thermoelectric cooling module) irradiation test, after tested, the thermoelectric cooling module no-welding-spot comes off;
8, insulation test
Process of the test and experimental result are with above-mentioned insulation test; The thermoelectric cooling module of the present invention of finishing is as shown in Figure 1 prevented film from cleaning, solid inside back cover, to all processes of test.Above-mentioned test-results shows that three of the surperficial solid envelope of thermoelectric cooling module is prevented films firmly, reliably, and the thermoelectric cooling module no-welding-spot comes off.
Principle of work of the present invention:
The present invention adopts gas phase deposition technology, polyphenylene ethyl after the cracking is formed reactive monomer to be full of in whole sediment chamber, because reactive monomer enters the sediment chamber of room temperature from the cracking room of high temperature, the surface solidification that makes reactive monomer be deposited on thermoelectric cooling module becomes polyphenylene ethyl as three anti-films, rotating mechanism in the sediment chamber drives the rotation of thermoelectric cooling module hanger, the homogeneity of the deposition three anti-films of assurance.Because vapour deposition is not hindered by sight line, the all surfaces of thermoelectric cooling module all can closely be covered by gaseous monomer, form meticulous three even, high-quality anti-films, three anti-films can carry out three anti-protections of acid, alkali, salt effectively to thermoelectric cooling module, be applicable to simultaneously the protection of the gaseous state such as mould, smog or the solid-state floating matter of small molecules; Three anti-films can be strengthened the anti-oxidation protection of solder joint and thermoelectric material, and three anti-films can play the effect that butt welding point is reinforced simultaneously; Three anti-films can prevent that outside fifth wheel from entering thermoelectric cooling module inside, cause short circuit, thereby improve the reliability of thermoelectric cooling module; Envelope thermoelectric cooling module life-time service or because of aging self fifth wheel that produces, prevent its other ones to inner other element of thermoelectric cooling module or complete machine, element diffusion, cause short circuit or fifth wheel to pile up, improve the application reliability of thermoelectric cooling module.
Controlling System, is monitored temperature and the vacuum tightness data point selected, and can be shown with graphics mode in real time in vacuum deposition process by operator's setting operation parameter based on the computer control under the WindowsXP operating system; Controlling System all has the accurate deposition that the closed loop raw material monomer controls to guarantee three anti-films in addition; Evaporator room, cracking room and sediment chamber are independent chamber, possess the separately function of control of temperature, can satisfy by temperature control instrument setting the requirement of differing temps; Vacuum system is the safeguards system of whole deposition process.
Although the above is described the preferred embodiments of the present invention by reference to the accompanying drawings, but the present invention is not limited to above-mentioned embodiment, above-mentioned embodiment only is schematic, be not restrictive, those of ordinary skill in the art is under enlightenment of the present invention, not breaking away from the scope situation that aim of the present invention and claim protect, can also make a lot of forms; These all belong within protection scope of the present invention.
Claims (6)
1. the solid encapsulation method of thermoelectric cooling module surface three anti-films comprises the solid envelope of the thermoelectric cooling module after cleaning being carried out surface three anti-films, and it is characterized in that: the solid package of described three anti-films is drawn together following steps:
⑴ to the lead solder-joint sealing adhesive tape of thermoelectric cooling module, with the plastic casing pyrocondensation on adhesive tape;
⑵ the thermoelectric cooling module that finish step ⑴ is suspended in the sediment chamber of deposition apparatus, and described deposition apparatus comprises Controlling System, evaporator room, cracking room, sediment chamber and vacuum system;
⑶ all be evacuated to 10 by vacuum system to evaporator room, cracking room and sediment chamber after polyphenylene ethyl is placed the evaporator room of deposition apparatus
-2-10
-3Pa, the temperature of evaporator room is controlled to be 150-200 ℃, cracking room temperature is controlled to be 650-700 ℃, polyphenylene ethyl in the evaporator room forms the gaseous state polyphenylene ethyl and enters cracking room, in cracking room, be cracked into reactive monomer, reactive monomer enters in the sediment chamber of room temperature at the thermoelectric cooling module surface deposition 1-5h that hangs, and the thermoelectric cooling module surface forms the parylene film of 0.1-100 micron thickness as three anti-films;
⑷ be filled with rare gas element in the evaporator room of deposition apparatus, cracking room and the sediment chamber, when the deposition apparatus external and internal pressure is suitable, take out thermoelectric cooling module, remove plastic casing and adhesive tape on the lead solder-joint, finish the solid envelope process of thermoelectric cooling module of the present invention surface three anti-films.
2. the solid encapsulation method of described thermoelectric cooling module surface three anti-films according to claim 1, it is characterized in that: described adhesive tape is the poly-imines adhesive tape that mills.
3. the solid encapsulation method of described thermoelectric cooling module surface three anti-films according to claim 1, it is characterized in that: described deposition apparatus is gas-phase deposition system.
4. the solid encapsulation method of described thermoelectric cooling module surface three anti-films according to claim 1, it is characterized in that: the reactive monomer diameter that the polyphenylene ethyl Pintsch process becomes among the described step ⑶ is 10
-2-5 microns.
5. the solid encapsulation method of described thermoelectric cooling module surface three anti-films according to claim 1, it is characterized in that: the hanger that hangs thermoelectric cooling module in the described sediment chamber is 360 ° and horizontally rotates.
6. the solid encapsulation method of described thermoelectric cooling module surface three anti-films according to claim 1, it is characterized in that: described rare gas element is argon gas.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104404477A (en) * | 2014-11-03 | 2015-03-11 | 曾芳勤 | Method for compounding insulation heat radiation film and superconductor slice |
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| CN101465201A (en) * | 2007-12-18 | 2009-06-24 | 秦山核电公司 | Method for integrally winding pressurized-water reactor nuclear power plant winding connectionless point stick location probe coil |
| CN101603678A (en) * | 2009-07-15 | 2009-12-16 | 中国科学院上海有机化学研究所 | The waterproof sealing structure of LED module and preparation technology thereof |
| CN101860993A (en) * | 2009-04-09 | 2010-10-13 | 陈建中 | MCH co-fired ceramic heating substrate and preparation method thereof |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001515271A (en) * | 1997-09-03 | 2001-09-18 | オイペツク オイロペーイツシエ ゲゼルシヤフト フユール ライスツングスハルプライター エムベーハー ウント コンパニイ コマンデイートゲゼルシヤフト | Moisture barrier for borate glass passivation layer |
| CN201082900Y (en) * | 2007-09-28 | 2008-07-09 | 天津理工大学 | Multifunctional film forming system for packaging organic electroluminescence component |
| CN101465201A (en) * | 2007-12-18 | 2009-06-24 | 秦山核电公司 | Method for integrally winding pressurized-water reactor nuclear power plant winding connectionless point stick location probe coil |
| CN101860993A (en) * | 2009-04-09 | 2010-10-13 | 陈建中 | MCH co-fired ceramic heating substrate and preparation method thereof |
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| CN104404477A (en) * | 2014-11-03 | 2015-03-11 | 曾芳勤 | Method for compounding insulation heat radiation film and superconductor slice |
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