CN114739431A - Optical fiber sensor glue-free packaging method and optical fiber sensor - Google Patents
Optical fiber sensor glue-free packaging method and optical fiber sensor Download PDFInfo
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- CN114739431A CN114739431A CN202210362185.5A CN202210362185A CN114739431A CN 114739431 A CN114739431 A CN 114739431A CN 202210362185 A CN202210362185 A CN 202210362185A CN 114739431 A CN114739431 A CN 114739431A
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- 238000000034 method Methods 0.000 title claims abstract description 59
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 22
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/268—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light using optical fibres
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/264—Mechanical constructional elements therefor ; Mechanical adjustment thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Optical Transform (AREA)
Abstract
The invention discloses a glue-free packaging method of an optical fiber sensor and the optical fiber sensor, and the method comprises the following steps: s1, preparing a substrate material: s2, temporarily fixing the optical fiber sensor on one surface of the substrate material; s3, dripping a polyamic acid solution on the surface of the substrate material to cover the part to be packaged of the optical fiber sensor; and S4, imidizing the polyamic acid solution by utilizing a thermal curing process to finally form a film, wherein the film encapsulates the optical fiber sensor on a substrate material. The glue-free packaging method is simple and convenient to operate, the grating waveform has no obvious deformation, welding operation is not needed, the problem of uneven stress is solved, and the optical fiber sensor can be effectively protected and bonded.
Description
Technical Field
The invention relates to the field of optical fiber sensor packaging, in particular to a glue-free packaging method of an optical fiber sensor and the optical fiber sensor.
Background
The optical fiber sensor has the advantages of light weight, small size, high precision, electromagnetic interference resistance, simultaneous measurement of multiple parameters and the like, is widely applied to the fields of buildings, petrochemistry, electric power, aerospace and the like, and is a different choice for measuring common physical quantities (such as temperature, humidity, strain, vibration, displacement, acceleration and the like) especially in some special application occasions such as oil-gas detection environments, strong electromagnetic environments and flammable and explosive environments.
At present, the package (including the fixing part and the protecting part) of the optical fiber sensor is mainly packaged by using organic glue, wherein epoxy adhesives are particularly commonly used. The glue packaging method brings many problems, such as long-term creep and aging of epoxy adhesives, inapplicability in high-temperature environments, poor controllability of actual operation and poor process stability, and the like, and greatly limits the application range of the optical fiber sensor. The method adopted for the glue-free packaging of the optical fiber sensor at present is the metallization treatment of the surface of the optical fiber, namely, a metal material coating layer is attached to the surface of the optical fiber in the modes of chemical plating, chemical vapor deposition, plasma deposition, magnetron sputtering and the like, and then the optical fiber is fixed on the surface of a metal test piece to be tested by welding and the like.
Although the situation that optical fiber protection and bonding must depend on an adhesive is completely changed by the metallization of the surface of the optical fiber, the metallization still has the following problems: firstly, a metal film formed by the metallization of the surface of the optical fiber has microscopic defects, holes, particles and the like, so that the optical fiber sensor is easily influenced by uneven stress to cause waveform deformation; secondly, the local temperature of the welding point is overhigh, the welding stress is distributed unevenly, and the like; thirdly, the metal film after the metallization of the surface of the optical fiber is easily corroded by air and acid and alkali, and the optical fiber sensor cannot be effectively protected for a long time.
It is to be noted that the information disclosed in the above background section is only for understanding the background of the present application and thus may include information that does not constitute prior art known to a person of ordinary skill in the art.
Disclosure of Invention
The invention provides a glue-free packaging method of an optical fiber sensor and the optical fiber sensor, which are used for solving the problems of complex operation, uneven stress and acid-base corrosion when the optical fiber sensor is packaged.
The technical problem of the invention is solved by the following technical scheme:
a glue-free packaging method for an optical fiber sensor comprises the following steps: s1, preparing a substrate material; s2, temporarily fixing the optical fiber sensor on one surface of the substrate material; s3, dripping a polyamic acid solution on the surface of the substrate material to cover the part to be packaged of the optical fiber sensor; and S4, imidizing the polyamic acid solution by utilizing a thermal curing process to finally form a film, wherein the film encapsulates the optical fiber sensor on a substrate material.
Further, the base material is at least one of: aluminum and aluminum alloy sheets or blocks thereof, stainless steel sheets or blocks, polyimide films; the step S1 includes: and (4) degreasing and roughening the surface of the substrate material, which needs to be dripped with the polyamic acid solution.
Further, the step S2 includes: one end of the optical fiber sensor to be packaged is temporarily fixed at a first preset position of the substrate material by using a high-temperature adhesive tape, then the other end of the optical fiber sensor is firstly straightened and flatly pressed on the substrate material, and then the optical fiber sensor is temporarily fixed at a second preset position of the substrate material by using the high-temperature adhesive tape.
Further, the step S4 includes: putting the substrate material with the surface dropwise added with the polyamic acid solution into a drying oven for thermosetting process treatment, wherein the thermosetting process comprises the following steps: raising the temperature from room temperature to 65-100 ℃ for 0.5-2 hours, raising the temperature to 120-180 ℃ for 0.5-2 hours, raising the temperature to 200-250 ℃ for 1-4 hours, and naturally cooling to room temperature.
Further, after the step S4, the high temperature adhesive tape that temporarily fixed the optical fiber sensor before is removed.
Further, the manufacturing method of the optical fiber sensor comprises the following steps: the common single-mode optical fiber is carried with hydrogen, so that hydrogen molecules are diffused into a cladding and a fiber core of the optical fiber.
Further, the manufacturing method of the optical fiber sensor further comprises the following steps: and (3) etching the grating by means of an excimer laser and a phase mask plate.
Further, the manufacturing method of the optical fiber sensor further comprises the following steps: and after the grating is inscribed, the fiber grating is placed into a temperature box for annealing operation, and the annealing operation is used for discharging hydrogen remaining in the fiber during hydrogen loading, so that the optical performance of the fiber grating is stable.
The invention also provides an optical fiber sensor, which comprises a substrate material, the optical fiber sensor and a polyimide film, wherein the optical fiber sensor is packaged on the substrate material by the polyimide film.
Further, the optical fiber sensor is packaged by adopting the method of any one of the above methods.
Compared with the prior art, the invention has the advantages that: the optical fiber sensor glue-free packaging method provided by the invention is characterized in that a proper amount of polyamic acid solution is dripped on the surface of a substrate material, and then the polyamic acid solution is imidized through a thermal curing process to finally form a film. The glue-free packaging method is simple and convenient to operate, welding operation is not needed, the problem of uneven stress is avoided, and the optical fiber sensor can be effectively protected and bonded.
Drawings
Fig. 1 is a flow chart of a method for glue-free packaging of an optical fiber sensor according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of an optical fiber sensor packaged without glue according to an embodiment of the present invention.
FIG. 3 is a graph showing the comparison of the grating waveforms before and after the film formation of the optical fiber sensor according to the embodiment of the present invention.
Fig. 4 is a schematic diagram of high and low temperature impact testing of the optical fiber sensor according to the embodiment of the invention.
Fig. 5a is a drawing of a tensile test object of the optical fiber sensor according to the embodiment of the invention.
FIG. 5b is a graph of tensile test data for a fiber optic sensor according to an embodiment of the present invention.
FIG. 6 is a schematic diagram of a compatibility test between an optical fiber sensor and a battery electrolyte according to an embodiment of the present invention.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the embodiments of the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element. In addition, the connection may be for either a fixing function or a circuit connection function.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the embodiments of the present invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be in any way limiting of the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.
The invention provides a glue-free packaging method of an optical fiber sensor, which is characterized in that a proper amount of polyamic acid solution is dripped on the surface of a substrate material, and then the polyamic acid solution is imidized through a thermal curing process to finally form a film. The method can completely fix the optical fiber sensor, is simple and convenient to operate, does not need welding operation, does not have the problem of uneven stress, and can effectively protect and bond the optical fiber sensor.
The manufacturing method of the optical fiber sensor provided by the embodiment of the invention comprises the following steps:
1. and carrying out hydrogen loading treatment on the common single-mode optical fiber. Specifically, the optical fiber is placed in a hydrogen tank under high pressure (10 MPa) and maintained for about two weeks. During which hydrogen molecules gradually diffuse into the cladding and core of the fiber.
2. And (3) writing the grating by means of an excimer laser and a phase mask plate. The method comprises the steps of firstly locally stripping a coating layer (the stripping length is about 12-15mm) from an optical fiber loaded with hydrogen, then placing the optical fiber behind a phase mask plate (the stripping position is opposite to the phase mask plate), emitting laser by using an excimer laser, irradiating the laser onto the phase mask plate after the laser passes through the action of a beam expanding lens and a condensing lens, forming diffracted light beams after passing through the phase mask plate, irradiating fiber cores of the optical fiber, and immediately carrying out chemical reaction on hydrogen molecules in the irradiated parts of the fiber cores and germanium to form Ge-OH bonds and Ge-H bonds, so that the refractive index of the parts is permanently increased. The above steps are the fiber grating writing process.
3. And after the grating is inscribed, putting the grating into a temperature box for annealing operation. The specific operation is as follows:
(1) putting the fiber into a temperature box for high-temperature long-time (keeping the temperature at 120 ℃ for 24 hours) annealing operation, and discharging hydrogen remaining in the fiber when carrying hydrogen, so that the optical performance of the fiber grating is stable;
(2) the well-written fiber grating is tested, which comprises a central wavelength, a reflectivity, a 3dB bandwidth and a side mode suppression ratio, and the fiber grating with better quality (the reflectivity is more than 90 percent, the 3dB bandwidth is less than 0.25nm, and the side mode suppression ratio is more than 20dB) is selected as a fiber sensor.
Referring to fig. 1, the method for glue-free packaging of an optical fiber sensor according to an embodiment of the present invention includes the following steps:
s1, preparing a substrate material. The method comprises cutting a substrate (such as at least one of aluminum and aluminum alloy sheet or block, stainless steel sheet or block, and polyimide film) into a geometric body with a length of 5-40mm, a width of 2-20mm, and a thickness of 0.03-1mm, and degreasing (removing oil stains adhered to the surface during substrate production) and roughening (enhancing the bonding strength between the substrate and the polyimide film) one surface of the substrate (the surface on which a polyamic acid solution is dropped subsequently).
And S2, temporarily fixing the optical fiber sensor on one surface of the substrate material. The specific method is that one end (left end of the fiber grating) of the selected optical fiber sensor is temporarily fixed at a first preset position (left side of the geometric center) of the substrate material by using a high-temperature adhesive tape, then the other end (right end) of the optical fiber sensor is firstly straightened and flatly pressed on the substrate material, and then the other end (right end) of the optical fiber sensor is temporarily fixed at a second preset position (right side of the geometric center) of the substrate material by using the high-temperature adhesive tape.
And S3, dripping a polyamic acid solution on the surface of the substrate material to cover the part to be packaged of the optical fiber sensor. The specific method comprises the following steps: dripping 2-10mL of polyamic acid solution into the optical fiber sensor grating fixed on the substrate material;
and S4, imidizing the polyamic acid solution by using a thermal curing process to finally form a film, and packaging the optical fiber sensor on a substrate material by using the film. Putting the devices prepared in the steps S1-S3 into a drying oven (such as an air-blowing drying oven) together for heat curing, wherein the heat curing process comprises the following steps: raising the temperature from room temperature to 65-100 ℃ for 0.5-2 hours, raising the temperature to 120-180 ℃ for 0.5-2 hours, raising the temperature to 200-250 ℃ for 1-4 hours, and naturally cooling to room temperature. For example: the heat curing process comprises the steps of raising the temperature from room temperature to 80 ℃ for 1 hour, raising the temperature to 160 ℃ for 1 hour, raising the temperature to 220 ℃ for 2 hours, closing the air blowing drying oven, and naturally cooling to room temperature.
After the optical fiber sensor is packaged without glue, the high-temperature adhesive tape for temporarily fixing the optical fiber sensor before the optical fiber sensor is removed. The optical fiber sensor can be firmly fixed on the substrate material through the steps of S1-S4, because the polyamic acid solution is imidized after being subjected to a thermal curing process, and finally a polyimide film is formed on the surface of the substrate material (the polyimide film is obtained from the polyamic acid solution through the thermal curing process, and is used for firmly fixing the grating in the optical fiber sensor on the substrate material and playing a role in protecting the grating). A strong adhesive force can be formed between the surface of the substrate material and the polyimide film, and the optical fiber sensor can be fixed by the adhesive force.
Referring to fig. 2, the structure of the optical fiber sensor (sample) packaged by the glue-free packaging method according to the embodiment of the present invention includes: the optical fiber sensor comprises a substrate material 1, an optical fiber sensor 2 and a polyimide film 3, wherein a proper amount of polyamic acid solution is dripped on the surface of the substrate material, and then the polyamic acid solution is imidized through a thermal curing process to finally form the polyimide film to firmly fix the optical fiber sensor on the substrate material.
Referring to fig. 3, the grating waveform patterns before and after the film formation of the optical fiber sensor are compared. In general, if there is uneven stress on the grating, a significant distortion occurs in the waveform of the grating (a side peak appears near the main peak and the strength of the side peak is large). Observing fig. 3, it can be found that no side peak appears near the main peak of the grating after film formation, i.e. no obvious distortion occurs in the waveform, which means that the stress distribution at the grating is uniform, which is also a great advantage of the glue-free packaging method of the embodiment of the present invention. It is noted that the grating after film formation has the following characteristics compared to the grating before film formation: (1) the center wavelength is reduced, that is, from 1540.100nm to 1537.225nm, because the polyimide film 3 needs to be formed at a high temperature (more than 180 ℃) to be too different from the thermal expansion coefficient of the base material 1 (15.0X 10-6/DEG C. -23.2X 10-6/DEG C.) and the optical fiber thermal expansion coefficient (0.5X 10-6/DEG C.); (2) the relative intensity shifts up as a whole due to the difference in test environmental noise before and after film formation. For a fiber demodulator (for demodulating fiber signals), the signals can be normally demodulated as long as the grating waveform is not obviously distorted. Therefore, the glue-free packaging method in the embodiment of the invention cannot influence the demodulation process of the optical fiber signal.
Referring to fig. 4, several samples were placed in a high and low temperature test chamber for high and low temperature impact testing, and the high and low temperature testing conditions were as follows: after the temperature is kept at minus 45 ℃ to minus 35 ℃ for 30-40 minutes, the temperature is raised to 80 ℃ to 85 ℃ in less than 2 minutes and kept for 30-40 minutes (1 cycle), after 21 temperature impact cycles, the polyimide film 3 is not obviously damaged and falls off, and the optical fiber sensor 2 is still fixed on the surface of the substrate material 1.
Referring to fig. 5a and 5b, a tensile test is performed on a specially configured sample (both ends of the optical fiber sensor grating are fixed by a glue-free packaging method, and required for observing the central wavelength of the grating) by using a tensile testing machine. Generally, when the tensile force value is about 10N, the optical fiber sensor without any protection of the gate region is directly pulled apart and the fracture part is often generated at the gate region, because the gate region is fragile without protection and has small mechanical strength. However, in the embodiment of the invention, because the gate region is protected by the polyimide film, the mechanical strength of the gate region is greatly improved, and when the tensile force value is 42.5N, the gate region is protected by encapsulation and is not pulled apart, but the optical fiber of the non-encapsulated part is pulled apart, which means that the glue-free encapsulation method of the embodiment of the invention can effectively protect the optical fiber sensor. It should be noted that after the optical fiber of the non-encapsulated portion is pulled apart, the polyimide film 3 still has no obvious damage or falling off, that is, a strong adhesion can be formed between the surface of the substrate material 1 and the polyimide film 3, so that the polyimide film 3 cannot fall off with a pull force of 42.5N. It is noted that the center wavelength of the grating does not change during the whole pulling process, that is, the glue-free packaging method can firmly fix the fiber sensor, because the center wavelength of the grating changes significantly when the pulling force is applied if the fiber sensor is not fixed.
Referring to fig. 6, several samples were placed in the electrolyte of a lithium ion battery (lithium salt LiPF6, solvent cyclic carbonate, chain carbonate) for compatibility (ability of the components of the blend to hold each other to form a macroscopically homogeneous material) test. A plurality of samples 4 were placed in a thermostatic vessel 6 containing an electrolyte 5, and electrolyte compatibility tests were performed for 10 days at a high temperature (temperature of 60 ℃) and for 30 days at a normal temperature (temperature of 25 ℃), with a temperature meter 7 for precise temperature control. The test result shows that the polyimide film 3 is not obviously damaged or shed under the high-temperature condition or the normal-temperature condition. In addition, when the precipitates of the polyimide film 3 after being soaked in the electrolyte solution are analyzed, no excessive or harmful precipitates are found, that is, the polyimide film 3 is compatible with the electrolyte solution and has little influence on the electrolyte solution, which means that the glue-free packaging method and the optical fiber sensor in the embodiment of the invention can be applied to the interior of the lithium ion battery.
The invention can also be applied to the fields of optical fiber sensing and film forming processes, and the glue-free packaging method can also be used for packaging a plurality of optical fibers or a plurality of optical fiber sensors.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several equivalent substitutions or obvious modifications can be made without departing from the spirit of the invention, and all the properties or uses are considered to be within the scope of the invention.
Claims (10)
1. A glue-free packaging method for an optical fiber sensor is characterized by comprising the following steps:
s1, preparing a substrate material;
s2, temporarily fixing the optical fiber sensor on one surface of the substrate material;
s3, dripping a polyamic acid solution on the surface of the substrate material to cover the part to be packaged of the optical fiber sensor;
and S4, imidizing the polyamic acid solution by utilizing a thermal curing process to finally form a film, wherein the film encapsulates the optical fiber sensor on a substrate material.
2. The method for glue-free packaging of an optical fiber sensor according to claim 1, wherein: the base material is at least one of: aluminum and aluminum alloy sheets or blocks, stainless steel sheets or blocks, polyimide films; the step S1 includes: and (4) degreasing and roughening the surface of the substrate material, which needs to be dripped with the polyamic acid solution.
3. The method for glue-free packaging of an optical fiber sensor according to claim 1, wherein: the step S2 includes: one end of the optical fiber sensor to be packaged is temporarily fixed at a first preset position of the substrate material by using a high-temperature adhesive tape, then the other end of the optical fiber sensor is firstly straightened and flatly pressed on the substrate material, and then the optical fiber sensor is temporarily fixed at a second preset position of the substrate material by using the high-temperature adhesive tape.
4. The method for glue-free packaging of an optical fiber sensor according to claim 1, wherein: the step S4 includes: putting the substrate material with the surface dropwise added with the polyamic acid solution into a drying oven for thermosetting process treatment, wherein the thermosetting process comprises the following steps: raising the temperature from room temperature to 65-100 ℃ for 0.5-2 hours, raising the temperature to 120-180 ℃ for 0.5-2 hours, raising the temperature to 200-250 ℃ for 1-4 hours, and naturally cooling to room temperature.
5. The method for glue-free packaging of an optical fiber sensor according to claim 4, wherein: after the step S4, the high temperature adhesive tape that temporarily fixed the optical fiber sensor before is removed.
6. The method for glue-free packaging of an optical fiber sensor according to claim 1, wherein: the manufacturing method of the optical fiber sensor comprises the following steps: the common single-mode optical fiber is carried with hydrogen, so that hydrogen molecules are diffused into a cladding and a fiber core of the optical fiber.
7. The method for glue-free packaging of an optical fiber sensor according to claim 6, wherein: the manufacturing method of the optical fiber sensor further comprises the following steps: and (3) writing the grating by means of an excimer laser and a phase mask plate.
8. The method for glue-free packaging of an optical fiber sensor according to claim 7, wherein: the manufacturing method of the optical fiber sensor further comprises the following steps: and after the grating is inscribed, the fiber grating is placed into a temperature box for annealing operation, and the annealing operation is used for discharging hydrogen remaining in the fiber during hydrogen loading, so that the optical performance of the fiber grating is stable.
9. An optical fiber sensor comprises a substrate material (1) and an optical fiber sensor (2), and is characterized by further comprising a polyimide film (3), wherein the optical fiber sensor is packaged on the substrate material through the polyimide film (3).
10. A fibre-optic sensor according to claim 9, packaged using a method according to any of claims 1 to 8.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115236797A (en) * | 2022-08-12 | 2022-10-25 | 武汉理工大学 | High-temperature-resistant weak-fiber grating array and preparation method thereof |
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| CN108426591A (en) * | 2018-01-30 | 2018-08-21 | 哈尔滨工业大学 | Fiber-optic grating sensor encapsulating structure and packaging method suitable for hot environment |
| CN110702266A (en) * | 2019-11-15 | 2020-01-17 | 哈尔滨理工大学 | Packaging method of high-temperature-resistant FBG temperature sensor |
| CN114136348A (en) * | 2021-11-15 | 2022-03-04 | 复旦大学 | Nano-pore fiber Bragg grating sensor and preparation method thereof |
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| CN108426591A (en) * | 2018-01-30 | 2018-08-21 | 哈尔滨工业大学 | Fiber-optic grating sensor encapsulating structure and packaging method suitable for hot environment |
| CN110702266A (en) * | 2019-11-15 | 2020-01-17 | 哈尔滨理工大学 | Packaging method of high-temperature-resistant FBG temperature sensor |
| CN114136348A (en) * | 2021-11-15 | 2022-03-04 | 复旦大学 | Nano-pore fiber Bragg grating sensor and preparation method thereof |
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