CN103022367B - There is OLED and the preparation method thereof of glass material packaging body - Google Patents
There is OLED and the preparation method thereof of glass material packaging body Download PDFInfo
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- CN103022367B CN103022367B CN201110288700.1A CN201110288700A CN103022367B CN 103022367 B CN103022367 B CN 103022367B CN 201110288700 A CN201110288700 A CN 201110288700A CN 103022367 B CN103022367 B CN 103022367B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The present invention discloses a kind of OLED with glass material packaging body and preparation method thereof.Display comprises an encapsulating structure, this encapsulating structure comprises the first substrate of a piece of first substrate cutting side including at least one cleaved formation, the second substrate of a piece of second substrate cutting side including at least one cleaved formation, one organic light-emitting units, one glass material packaging body connecting this first substrate and this second substrate respectively, and the first colloid of a first colloid facet including at least one cleaved formation and neighbouring this first substrate cutting side and second substrate cutting side, whereby, this first colloid can make this encapsulating structure when cutting, produce the effect of buffering cutting stress, and this encapsulating structure tolerance external impacts ability can be strengthened further.It addition, the present invention also provides for a kind of OLED preparation method.
Description
Technical field
The present invention relates to a kind of OLED and preparation method thereof, particularly relate to one and there is glass material
The OLED of matter packaging body and preparation method thereof.
Background technology
The encapsulating structure of general OLED comprise a piece of first substrate, a piece of be stacked and placed on this
The second substrate of one substrate, an organic light-emitting units between this first substrate and this second substrate,
And one connect this first substrate and this second substrate respectively, and there is good barrier aqueous vapor and machinery is strong
The glass material packaging body (frit) of degree, makes organic of this encapsulating structure by this glass material encapsulation physical ability
Light unit is protected from oxygen or aqueous vapor impact, and causes damage or usefulness to reduce, and extends this organic
The life-span of light unit.
This glass material packaging body be one comprise by one can hot melt inorganic matter pottery and glass dust
End material composition, this glass-ceramic material component can be solidified densely by mode of heating, and and glass
Material firmly welding, lacks flexibility the most on the contrary and absorbs the impact of external force, cause aforesaid base plate easy
Because slight collision produces embrittlement.
For improving the problems referred to above, it is thus proposed that the encapsulating structure preparation method of a kind of OLED, cutting
After cutting the several encapsulating structures of formation, then by capillarity, one filling glue material is diffused to each encapsulation
Structure gap between first substrate and this second substrate, and utilize this filling glue material as aforesaid base plate
Reinforcement.But, the time of this preparation method operation increases along with the viscosity of this filling glue material and increases and diffusion
Scope also has its limit, adds and just have to can carry out this filling making work after cutting into encapsulating structure
Skill, but substrate for want of elastic can absorb external impacts and easily produce embrittlement, so, along with aforementioned envelope
Assembling structure quantity increase causes the degree of difficulty in operation the most relatively.
Summary of the invention
It is an object of the invention to provide one and can buffer cutting stress and strengthening tolerance external impacts energy
The OLED with glass material packaging body of the encapsulating structure of power.
The present invention has the OLED of glass material packaging body and comprises an encapsulating structure, this envelope
Assembling structure comprises:
A piece of first substrate, the first substrate including at least one cleaved formation cuts side；
A piece of second substrate, the second substrate including at least one cleaved formation cuts side；
One organic light-emitting units between this first substrate and this second substrate, this organic light-emitting units
Including an array of organic light emitting pixels and an electrical ties in the wire portion of this array of organic light emitting pixels；
One glass material packaging body, connects this first substrate and this second substrate and organic around this respectively
Luminescence unit；And
One the first colloid, connects this first substrate and this second substrate respectively and is distributed in this glass material
Outside packaging body, cut side and the second base including at least one cleaved formation and this first substrate neighbouring
First colloid facet of plate cutting side.
The OLED with glass material packaging body of the present invention, gluing of this first colloid
Degree is more than 200Pa.s, and the material solidification that the coefficient of expansion is less than 200ppm/ DEG C forms.
The OLED with glass material packaging body of the present invention, this first colloid is not
It is distributed in continuously outside this glass material packaging body.
The OLED with glass material packaging body of the present invention, gluing of this first colloid
Degree is less than 80ppm/ DEG C less than 10Pa.s, the coefficient of expansion.
The OLED with glass material packaging body of the present invention, this encapsulating structure also wraps
Containing this first substrate of several connections and this second substrate and be positioned at this first colloid and this organic light-emitting units
The second colloid between wire portion, the viscosity of aforementioned second colloid is more than 200Pa.s, and the coefficient of expansion is less than
200ppm/℃。
The OLED with glass material packaging body of the present invention, this encapsulating structure also wraps
Connect this first substrate containing one, and be distributed in outside this glass material packaging body, and be positioned at this first colloid
And the glass material body between this glass material packaging body.
The OLED with glass material packaging body of the present invention, this first colloid with should
The wire portion of organic light-emitting units is contactless.
The present invention has having the beneficial effects that of the OLED of glass material packaging body: by this
The setting of the first colloid, can make the encapsulating structure of this OLED along by aforementioned first colloid
Top when cutting, produce the effect of buffering cutting stress, and tolerance external force punching can be strengthened further
Hit ability.
Another object of the present invention, is i.e. providing one can buffer cutting stress and strengthening tolerance external force punching
Hit the OLED preparation method with glass material packaging body of ability.
Then, a kind of OLED preparation method with glass material packaging body of the present invention comprises one
Encapsulating structure preparation method, this encapsulating structure preparation method comprises the steps of
A () is coated with, at a piece of first mother substrate, the glass material packaging body that several closings are ring-like and are not about mutually；
(b) by foregoing glass material packaging body heat cure in this first mother substrate；
C several first colloids are respectively coated outside the foregoing glass material packaging body of this first mother substrate by ()
At least side；
(d) the second mother substrate of several for a piece of surface configuration organic light-emitting units is superimposedly covered be placed in this
One mother substrate, each organic light-emitting units have an array of organic light emitting pixels and electrical ties in
The wire portion of this array of organic light emitting pixels, and aforementioned array of organic light emitting pixels is respectively arranged at aforementioned glass
Inside glass material packaging body；
E () solidifies aforementioned first colloid, the most aforementioned first colloid connect respectively this first mother substrate with this
Two mother substrates, and by foregoing glass material packaging body respectively with this second mother substrate welding；And
F (), along by cutting above aforementioned first colloid, forms several encapsulating structure, each encapsulation
Structure forms at least one first substrate cutting side, at least one second substrate in cutting process respectively
Cutting side, and at least one is adjacent to this first substrate cutting side and the first of second substrate cutting side
Colloid facet.
The OLED preparation method with glass material packaging body of the present invention, before step (c)
The viscosity stating the first colloid is more than 200Pa.s, and the coefficient of expansion is less than 200ppm/ DEG C.
The OLED preparation method with glass material packaging body of the present invention, before step (e)
State the first colloid for be distributed in outside foregoing glass material packaging body the most discontinuously.
The OLED preparation method with glass material packaging body of the present invention, before step (c)
The viscosity stating the first colloid is less than 80ppm/ DEG C less than 10Pa.s, the coefficient of expansion.
The OLED preparation method with glass material packaging body of the present invention, this encapsulating structure
Preparation method also comprises a step (g) after step (b) and before step (d), and this step (g) is aforementioned first
Several second colloid it is coated with, gluing of aforementioned second colloid between the wire portion of colloid and aforementioned organic light-emitting units
Degree is more than 200Pa.s, and the coefficient of expansion is less than 200ppm/ DEG C.
The OLED preparation method with glass material packaging body of the present invention, this encapsulating structure
Preparation method also comprises a step (h) after step (a) and before step (b), and this step (h) is aforementioned first
Several glass material body it is coated with between colloid and foregoing glass material packaging body.
The OLED preparation method with glass material packaging body of the present invention, before step (c)
State strengthening colloid contactless with the wire portion of aforementioned organic light-emitting units.
The present invention has having the beneficial effects that of the OLED preparation method of glass material packaging body: logical
Cross the setting of this first colloid, the encapsulating structure of this OLED can be made along by aforementioned first
When the top of colloid is cut, produce the effect of buffering cutting stress, and can strengthen outside tolerance further
Power impact capacity.
Accompanying drawing explanation
Fig. 1 is the top view of an array structure；
Fig. 2 is OLED the first preferred embodiment that the present invention has glass material packaging body
One encapsulating structure top view；
Fig. 3 is the sectional view of III-III hatching in Fig. 2；
Fig. 4 is the schematic diagram of an active organic light-emitting diode array；
Fig. 5 is the top view that this array structure comprises two encapsulating structures；
Fig. 6 is an encapsulating structure preparation flow chart of this first preferred embodiment；
Fig. 7 is OLED the second preferred embodiment that the present invention has glass material packaging body
One encapsulating structure top view；
Fig. 8 is the sectional view of VIII-VIII hatching in Fig. 7；
Fig. 9 is an encapsulating structure preparation flow chart of this second preferred embodiment；
Figure 10 is OLED the 3rd preferred embodiment that the present invention has glass material packaging body
An encapsulating structure top view；
Figure 11 is the sectional view of XI-XI hatching in Figure 10；
Figure 12 is an encapsulating structure preparation flow chart of the 3rd preferred embodiment.
Detailed description of the invention
Below in conjunction with the accompanying drawings and embodiment the present invention is described in detail:
Before the present invention is described in detail, it is noted that, in the following description content, similar
Element is to be identically numbered to represent.
Refering to Fig. 1, an array structure 2 is described, is commonly called as motherboard, comprise the encapsulation of several continuous configuration
Structure 3, is commonly called as daughter board, forms several daughter boards after motherboard is cleaved, and the present invention has glass material encapsulation
One the first preferred embodiment of the OLED of body comprises wherein the one of aforementioned encapsulation structure 3
Individual a, drive circuit, and a framework housing this encapsulating structure 3 and this drive circuit.
This array structure 2 also comprises a piece of first female base including several pieces first substrates 31 configured continuously
Plate 21, a piece of be stacked and placed on this first mother substrate 21 and include several pieces continuously configuration second substrates 32 the
Two mother substrates 22, several organic be respectively interposed between this first mother substrate 21 and this second mother substrate 22
Light unit 33, several closing be ring-like and the glass material packaging body (frit) 34 that is not about mutually, and several difference
It is distributed in the first colloid 35 outside foregoing glass material packaging body 34, each organic light-emitting units 33
It is electrically connected to this array of organic light emitting pixels 331 including an array of organic light emitting pixels 331 and one
Wire portion 332, and aforementioned array of organic light emitting pixels 331 is the most man-to-man is arranged at foregoing glass material
Inside matter packaging body 34.
Refering to Fig. 1 to Fig. 3, each encapsulating structure 3 comprises a piece of first substrate 31, a piece of second base
32, organic light emission list including an array of organic light emitting pixels 331 and a wire portion 332 of plate
33, closed-loop of unit is around the glass material of the array of organic light emitting pixels 331 of this organic light-emitting units 33
Matter packaging body 34, and several the first colloid 35 being distributed in outside this glass material packaging body 34.
This first substrate 31 and second substrate 32 are all used to protection and encapsulate this organic light-emitting units 33
Clear glass.This organic light-emitting units 33 between this first substrate 31 and this second substrate 32,
And it is arranged at the surface of this second substrate 32.This organic light-emitting units 33 includes an organic light emissive pixels
Array 331 and one be electrically connected to this array of organic light emitting pixels 331 and with this glass material packaging body 34
The staggered wire portion 332 passed through in the height direction.
This array of organic light emitting pixels 331 is a passive organic light-emitting diode array or an active
Formula organic LED array.As shown in Figure 4, with this active organic LED array it is
Example, one may embodiment be that this active organic light-emitting diode array 4 comprises a negative electrode 41, number
Individual be arranged respectively in this array 4 anode 42, several be folded in this negative electrode 41 and aforesaid anode respectively
Organic luminous layer 43 between 42, several it is arranged respectively in this array 4 and electric coupling aforesaid anode respectively
The drive circuit 44 of 42, several it is arranged respectively in this array 4 and the aforementioned drive circuit of electric coupling respectively
The data circuit 45 of 44, and several be arranged respectively in this array 4 and respectively electric coupling is aforementioned drives electricity
The sweep circuit 46 on road 44.
This glass material packaging body 34 connects this first substrate 31 and this second substrate 32 respectively, by this
Glass material packaging body 34 and this first substrate 31 and this second substrate 32 close adhesion reduce oxygen with
Aqueous vapor is penetrated into via the adhesive surface of aforementioned material, and this glass material packaging body 34 itself has ceramic state
Compact texture also can stop the infiltration of oxygen and aqueous vapor.
Aforementioned first colloid 35 connects this first substrate 31 and this second substrate 32 respectively, and discontinuously
It is distributed in outside this glass material packaging body 34, it is preferred that the viscosity of aforementioned first colloid 35 is more than
The 200Pa.s unit of MKS system of unit medium power viscosity (Pa Sec (Pa.s) be), and the coefficient of expansion is less than
200ppm/ DEG C (ppm/ DEG C is the unit of thermal coefficient of expansion, is defined as every degree Celsius of a few parts per million),
It is preferred that aforementioned first colloid 35 is contactless with the wire portion 332 of this organic light-emitting units 33, it is possible to
Avoid aforementioned first colloid 35 to cover this wire portion 332 and hinder this wire portion 332 follow-up and other yuan
Electrical connection effect during part contact.
When this array structure 2 cuts, cut along several lines of cut 23,23 ', 24,25, wherein, front
The projection stating line of cut 23,23 ' can be by aforementioned first colloid 35.Respectively along aforementioned line of cut 23,23 '
After cutting, each encapsulating structure 3 comprises three facets, and the facet of each encapsulating structure 3 can wrap
Include second substrate cutting side 321,311, one, first substrate cutting side, and one neighbouring should
First substrate cutting side 311 and the first colloid facet 351 of second substrate cutting side 321.
What deserves to be explained is: the first colloid facet 351 of the facet of each encapsulating structure 3 is with this
First substrate cutting side 311 and second substrate cutting side 321 can be alignment, as it is shown on figure 3,
Or the first colloid facet 351 also is able to protrude slightly above or be recessed in this first substrate cutting side 311
And second substrate cutting side 321, not shown.
This drive circuit electrically connects the wire portion 332 of this encapsulating structure 3 organic light-emitting units 33, this driving
Circuit is understood by having usually intellectual in art with this framework, is not described in detail in this.
Refering to Fig. 5, as a example by this array structure 2 comprising two encapsulating structures 3, aforementioned first colloid
35 can coat outside foregoing glass material packaging body 34, and are the either side of non-wire portion 332, figure
As a example by 5 only select the wherein side in other three sides of non-wire portion 332, and aforementioned first colloid 35
With this wire portion 332 on the direction being perpendicular to this first substrate 31 the most overlapped.Along aforementioned envelope
After between assembling structure 3 and being cut by this line of cut 23 ' of aforementioned first colloid 35, each encapsulating structure
3 comprise a facet, and the facet of each encapsulating structure 3 can include that a first substrate cuts side
311, second substrate cutting side 321, and neighbouring this first substrate cutting side 311 and the
First colloid facet 351 of two substrate cut sides 321.
The present invention has the first preferred embodiment of the OLED of glass material packaging body can
Being obtained by following preparation method, this preparation method comprises the encapsulating structure preparation method preparing this encapsulating structure 3, and
After this encapsulating structure 3 is connected with a drive circuit, then this encapsulating structure 3 is pacified with this drive circuit
Being loaded in a framework, this drive circuit connects the method for this encapsulating structure 3 and installs this encapsulating structure 3
And the method for this drive circuit by art have usually intellectual understood, the most detailed at this
State.
Refering to Fig. 1, Fig. 2 and Fig. 6, as a example by this encapsulating structure 3 shown in Fig. 2, this encapsulating structure
Preparation method comprises the steps of
Step 101 is coated with, at a piece of first mother substrate 21, the glass material that several closing is ring-like and is not about mutually
Matter seal 34, foregoing glass material seal 34 comprises one respectively can the glass-ceramic material of hot melt
Matter component and a solvent component improving painting etamine making process, this glass-ceramic material component can pass through
Mode of heating solidifies densely, and with glass material firmly welding, be coated with this glass material seal 34
Mode comprise a glue (dispense) and screen painting (print).
Step 102 by foregoing glass material packaging body 34 heat cure in this first mother substrate 21, heat cure
Temperature regard different glass-ceramic material components and different, be typically in the range of between 400 DEG C to 500 DEG C, energy
Baking box (oven) or laser (laser) is enough used to heat.
Several first colloids 35 are respectively coated the foregoing glass material at this first mother substrate 21 by step 103
Matter packaging body 34 outer the most at least side, it is possible to regarding the glass material packaging body 34 of this first mother substrate 21
Configuration is coated with aforementioned first colloid 35, in this preferred embodiment, is coated with respectively by aforementioned first colloid 35
It is distributed between each two glass material packaging body 34, and is three sides of non-wire portion 332, or, with bag
As a example by this array structure 2 containing two encapsulating structures 3 (as shown in Figure 5), aforementioned first colloid 35 is respectively
Coat between two glass material packaging bodies 34, and so long as not being positioned at wire portion 332 side.Relatively
Goodly, aforementioned first colloid 35 is for be distributed in outside foregoing glass material packaging body 34 discontinuously, relatively
Goodly, the viscosity of aforementioned first colloid 35 is more than 200Pa.s, and the coefficient of expansion is less than 200ppm/ DEG C,
By the high viscosity of aforementioned first colloid 35 can effective distribution after the glue of control point, without overflowing
It flow on neighbouring wire portion 332 or glass material packaging body 34, it is preferred that aforementioned first colloid 35
Contactless with the wire portion 332 of aforementioned organic light-emitting units 33, to avoid because aforementioned first colloid 35 covers
Electrical connection effect when covering this wire portion 332 and hinder that this wire portion 332 is follow-up to be contacted with other elements.
It should be noted that aforementioned first colloid 35 coefficient of expansion reason less than 200ppm/ DEG C is:
Aforementioned first colloid 35 is solidified on foregoing glass material packaging body 34 or encapsulates between foregoing glass material
Between body 34 and this second mother substrate 22, can follow-up by foregoing glass material packaging body 34 respectively with this
During the second mother substrate 22 welding, cause this second mother substrate because of aforementioned first colloid 35 expanded by heating
22 rupture, or affect the welding effect of foregoing glass material packaging body 34 and this second mother substrate 22.
Step 104 is by the second mother substrate 22 of several for a piece of surface configuration organic light-emitting units 33 superimposedly
Lid is placed in this first mother substrate 21, and each organic light-emitting units 33 has an organic light emissive pixels battle array
Row 331 and an electrical ties are in the wire portion 332 of this array of organic light emitting pixels 331 and aforementioned organic
Luminescence pixel array 331 is arranged at the most one to one in closing ring-like foregoing glass material packaging body
Inside 34.
Step 105 solidifies aforementioned first colloid 35, the most aforementioned first colloid 35 connect respectively this first
Mother substrate 21 and this second mother substrate 22, and by foregoing glass material packaging body 34 and this second mother substrate
22 weldings, generally use laser sintered mode welding foregoing glass material packaging body 34 and this second female base
Plate 22, this optical maser wavelength between 750nm～1024nm, it is preferred that this optical maser wavelength be 808nm or
940nm, the most firmly bonds this second mother substrate 22 by foregoing glass material packaging body 34, subtracts
Few oxygen penetrates into via the adhesive surface of aforementioned material with aqueous vapor.
Step 106 is cut along a line of cut 23,23 ' of the top by aforementioned first colloid 35,
Forming several encapsulating structure, each encapsulating structure forms at least one first base in cutting process respectively
Plate cutting side 311, at least one second substrate cutting side 321, and at least one adjacent to this first
Substrate cut side 311 and the first colloid facet 351 of second substrate cutting side 321.
So, aforementioned first colloid 35 can not only cut this array structure 2 encapsulating structure 3 time,
Produce the effect of buffering cutting stress, and this encapsulating structure 3 tolerance external impacts itself can be strengthened further
Ability.
Refering to Fig. 7 and Fig. 8, the encapsulating structure 3 of second preferred embodiment of the present invention is for being similar to
The encapsulating structure 3 of this first preferred embodiment, is at its Main Differences:
The viscosity of this first colloid 36 is less than 10Pa.s, and the coefficient of expansion is less than 80ppm/ DEG C, and glass turns
Move temperature more than 110 DEG C, this second preferred embodiment also comprise two connect this first substrate 31 with this
Two substrates 32, and lay respectively between this first colloid 36 and this organic light-emitting units 33 wire portion 332
Second colloid 37, the viscosity of aforementioned second colloid 37 is more than 200Pa.s, and the coefficient of expansion is less than
200ppm/℃。
What deserves to be explained is: the first colloid 36 uses low viscosity to be conducive to being coated with etamine making process can be accurate
The gel quantity controlling to drip is uniformly to fill up this glass material packaging body 34 and aforementioned line of cut 23,23 '
Between space；The setting of aforementioned second colloid 37 can avoid this first colloid 36 low viscous further
When overflow is to the most neighbouring wire portion 332, cover this wire portion 332 and hinder this wire portion 332 follow-up with
Other elements contact time electrical connection effect, if but consider this first colloid 36 be unlikely overflow cover should
During wire portion 332, it is possible to exempt the setting of aforementioned second colloid 37.
Refering to Fig. 8, along between aforementioned encapsulation structure 3 and by the aforementioned line of cut of aforementioned first colloid 36
23, after 23 ' cuttings, the facet of each encapsulating structure 3 can include a first substrate cutting side
311, second substrate cutting side 321, and neighbouring this first substrate cutting side 311 and the
First colloid facet 361 of two substrate cut sides 321.
What deserves to be explained is: the first colloid facet 361 of the facet of each encapsulating structure 3 is with this
First substrate cutting side 311 and second substrate cutting side 321 can be alignment, or the first colloid
Facet 361 also is able to protrude slightly above or be recessed in this first substrate cutting side 311 and second substrate is cut
Cut side 321, not shown.
Refering to Fig. 9, the encapsulating structure 3 of this second preferred embodiment can be obtained by following preparation method, this system
Method is the encapsulating structure preparation method being similar to this first preferred embodiment, is at its Main Differences:
The viscosity of aforementioned first colloid 36 of step 103 is less than 10Pa.s, and the coefficient of expansion is less than
80ppm/ DEG C, and glass transition temperature is more than 110 DEG C, this preparation method also comprise one after step 103 and
Step 201 before step 104, this step 201 is at aforementioned first colloid 36 and this wire portion 332
Between be coated with several second colloid 37, the viscosity of aforementioned second colloid 37 be more than 200Pa.s, the coefficient of expansion is little
In 200ppm/ DEG C, aforementioned second colloid 37 can solidify in subsequent steps, preferably implements at this
In example, aforementioned second colloid 37, when this step 105 solidifies aforementioned first colloid 36, solidifies simultaneously.
It should be noted that the coefficient of expansion of this first colloid 36 reason less than 80ppm/ DEG C is:
When this first colloid 36 contacts the most neighbouring foregoing glass material packaging body 34 side, because of glass transfer temperature
Degree is more than 110 DEG C, it is to avoid when subsequent heat curing foregoing glass material packaging body 34, because this first glue
Body 36 expanded by heating change in size is excessive and causes this second mother substrate 22 to rupture, or this first colloid 36
When being heated, form flow regime and cannot keep linking this first mother substrate 21 and this second female base respectively
Plate 22.
So, the encapsulating structure 3 of this second preferred embodiment also is able to reach preferably to implement with above-mentioned first
Purpose that the encapsulating structure 3 of example is identical and effect, and, utilize this first colloid 36 low viscous to produce
The effect of raw overflow, and be distributed in outside this glass material packaging body 34, can make this second preferably implement
The distribution of the first colloid 36 of example expands further, and increases the effect of buffering and strengthening further.
Refering to Figure 10 and Figure 11, the encapsulating structure 3 of the 3rd preferred embodiment of the present invention is similar
In the encapsulating structure 3 of this second preferred embodiment, it is at its Main Differences:
This encapsulating structure 3 also comprises this first substrate 31 of a connection, and is distributed in this glass material packaging body
Outside 34, and it is positioned at the glass material body 38 between this first colloid 36 and this glass material packaging body 34.
Refering to Figure 11, along between aforementioned encapsulation structure 3 and by the aforementioned line of cut of aforementioned first colloid 36
23, after 23 ' cuttings, the facet of each encapsulating structure 3 can include a first substrate cutting side
311, second substrate cutting side 321, and neighbouring this first substrate cutting side 311 and the
First colloid facet 361 of two substrate cut sides 321.
What deserves to be explained is: the first colloid facet 361 of the facet of each encapsulating structure 3 is with this
First substrate cutting side 311 and second substrate cutting side 321 can be alignment, or the first colloid
Facet 361 also is able to protrude slightly above or be recessed in this first substrate cutting side 311 and second substrate is cut
Cut side 321, not shown.
Refering to Figure 12, the encapsulating structure 3 of the 3rd preferred embodiment can be obtained by following preparation method, this system
Method is the encapsulating structure preparation method being similar to this second preferred embodiment, is at its Main Differences:
This encapsulating structure preparation method also comprises a step 301 after step 101 and before step 102,
This step 301 is coated with several around this between aforementioned first colloid 36 and foregoing glass material packaging body 34
The glass material body 38 of glass material packaging body 34, foregoing glass material body 38 can be in follow-up step
Middle solidification, in this preferred embodiment, foregoing glass material body 38 solidifies aforementioned glass in this step 102
During glass material packaging body 34, solidify simultaneously.
So, the encapsulating structure 3 of the 3rd preferred embodiment also is able to reach preferably to implement with above-mentioned second
Purpose that the encapsulating structure 3 of example is identical and effect, and, the setting of this glass material body 38 can be entered
One step avoids this first colloid 36 overflow low viscous to burn above this neighbouring glass material packaging body 34
Knot contact surface, and affect the bonding effect of this glass material packaging body 34 and this second substrate 32.
By described above, the present invention have glass material packaging body OLED and
Preparation method has a following beneficial effect:
One, the encapsulating structure 3 of the present invention is by the setting of full-bodied aforementioned first colloid 35, can make
This array structure 2, when cutting, produces the effect of buffering cutting stress, and can shape the most after dicing
Tolerance external impacts ability can be strengthened when becoming encapsulating structure 3.
Two, the encapsulating structure 3 of the present invention utilizes this first colloid 36 low viscous to produce the effect of overflow,
The distribution that can make this first colloid 36 expands further, and increases the effect of buffering and strengthening further
Really.
Three, the encapsulating structure 3 of the present invention can be avoided further by the setting of aforementioned second colloid 37
When this first colloid 36 overflow low viscous is to the most neighbouring wire portion 332, cover this wire portion 332 and
Hinder electrical connection effect when this wire portion 332 is follow-up to be contacted with other elements.
Four, the encapsulating structure 3 of the present invention utilizes the setting of this glass material body 38 to avoid further
On this glass material packaging body 34 that this first colloid 36 overflow low viscous is the most neighbouring, and affect this glass
Glass material packaging body 34 and the bonding effect of this second substrate 32.
Claims (12)
1. an OLED with glass material packaging body, it is characterised in that: this has
The OLED of glass material packaging body comprises an encapsulating structure, and this encapsulating structure comprises:
A piece of first substrate, the first substrate including at least one cleaved formation cuts side；
A piece of second substrate, the second substrate including at least one cleaved formation cuts side；
One organic light-emitting units between this first substrate and this second substrate, this organic light-emitting units
Including an array of organic light emitting pixels and an electrical ties in the wire portion of this array of organic light emitting pixels；
One glass material packaging body, connects this first substrate and this second substrate and organic around this respectively
Luminescence unit；And
One the first colloid, connects this first substrate and this second substrate respectively and is distributed in this glass material
Outside packaging body, including at least one cleaved formation and this first substrate neighbouring cutting side and this second
First colloid facet of substrate cut side, is adjacent to the side of this wire portion without setting in this first substrate
Putting this first colloid, this first colloid is contactless with this wire portion of this organic light-emitting units, and this first
Colloid and this wire portion are the most overlapped on the direction be perpendicular to this first substrate.
The OLED with glass material packaging body the most according to claim 1, its
It is characterised by: the viscosity of this first colloid is more than 200Pa.s, and the material that the coefficient of expansion is less than 200ppm/ DEG C
Material solidification forms.
The OLED with glass material packaging body the most according to claim 2, its
It is characterised by: this first colloid is for be distributed in outside this glass material packaging body discontinuously.
The OLED with glass material packaging body the most according to claim 1, its
Being characterised by: the viscosity of this first colloid is less than 10Pa.s, the coefficient of expansion is less than 80ppm/ DEG C.
The OLED with glass material packaging body the most according to claim 4, its
Be characterised by: this encapsulating structure also comprise this first substrate of several connection and this second substrate and be positioned at this
The second colloid between this wire portion of colloid and this organic light-emitting units, the viscosity of aforementioned second colloid is big
In 200Pa.s, and the coefficient of expansion is less than 200ppm/ DEG C.
The OLED with glass material packaging body the most according to claim 5, its
It is characterised by: this encapsulating structure also comprises: connect this first substrate and be distributed in this glass material packaging body
Outside and the glass material body being positioned between this first colloid and this glass material packaging body.
7. an OLED preparation method with glass material packaging body, it is characterised in that: should
There is the OLED preparation method of glass material packaging body, comprise an encapsulating structure preparation method, this envelope
Assembling structure preparation method comprises the steps of
A () is coated with, at a piece of first mother substrate, the glass material packaging body that several closings are ring-like and are not about mutually；
(b) by foregoing glass material packaging body heat cure in this first mother substrate；
C several first colloids are respectively coated outside the foregoing glass material packaging body of this first mother substrate by ()
At least side；
(d) the second mother substrate of several for a piece of surface configuration organic light-emitting units is superimposedly covered be placed in this
One mother substrate, each organic light-emitting units have an array of organic light emitting pixels and electrical ties in
The wire portion of this array of organic light emitting pixels, and aforementioned array of organic light emitting pixels is respectively arranged at aforementioned glass
Inside glass material packaging body, it is adjacent to the side in aforementioned wire portion without arranging aforementioned in this first mother substrate
Colloid, aforementioned first colloid is contactless with the aforementioned wire portion of aforementioned organic light-emitting units, and aforementioned
Colloid and aforementioned wire portion are the most overlapped on the direction being perpendicular to this first mother substrate；
E () solidifies aforementioned first colloid, the most aforementioned first colloid connect respectively this first mother substrate with this
Two mother substrates, and by foregoing glass material packaging body respectively with this second mother substrate welding；And
F (), along by cutting above aforementioned first colloid, forms several encapsulating structure, each encapsulation
Structure forms at least one the first submounts cutting side, at least one second son in cutting process respectively
Substrate cut side, and at least one is adjacent to this first submounts cutting side and the cutting of this second submounts
First colloid facet of side.
The OLED preparation method with glass material packaging body the most according to claim 7,
It is characterized in that: the viscosity of aforementioned first colloid of step (c) is more than 200Pa.s, and the coefficient of expansion is less than
200ppm/℃。
The OLED preparation method with glass material packaging body the most according to claim 8,
It is characterized in that: aforementioned first colloid of step (e) is for being distributed in foregoing glass material envelope the most discontinuously
Fill external side.
The OLED preparation method with glass material packaging body the most according to claim 8,
It is characterized in that: the viscosity of aforementioned first colloid of step (c) is less than 10Pa.s, and the coefficient of expansion is less than
80ppm/℃。
The 11. OLED systems with glass material packaging body according to claim 10
Method, it is characterised in that: this encapsulating structure preparation method also comprises one after step (b) and before step (d)
Step (g), this step (g) is coated with between the aforementioned wire portion of aforementioned first colloid and aforementioned organic light-emitting units
Several second colloid of cloth, the viscosity of aforementioned second colloid is more than 200Pa.s, and the coefficient of expansion is less than
200ppm/℃。
The 12. OLED systems with glass material packaging body according to claim 10
Method, it is characterised in that: this encapsulating structure preparation method also comprises a step after step (a) and before step (b)
Suddenly (h), this step (h) is coated with several glass material between aforementioned first colloid and foregoing glass material packaging body
Plastid.
Priority Applications (2)
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| CN201110288700.1A CN103022367B (en) | 2011-09-26 | 2011-09-26 | There is OLED and the preparation method thereof of glass material packaging body |
| CN201610482387.8A CN106159106B (en) | 2011-09-26 | 2011-09-26 | Organic light emitting display and its preparation method |
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| CN201110288700.1A CN103022367B (en) | 2011-09-26 | 2011-09-26 | There is OLED and the preparation method thereof of glass material packaging body |
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| CN201610482387.8A Active CN106159106B (en) | 2011-09-26 | 2011-09-26 | Organic light emitting display and its preparation method |
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Cited By (1)
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|---|---|---|---|---|
| USRE49770E1 (en) | 2013-08-13 | 2023-12-26 | Samsung Display Co., Ltd. | Flexible display having a crack suppressing layer |
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| KR102124457B1 (en) * | 2013-07-09 | 2020-06-19 | 삼성디스플레이 주식회사 | Display apparatus and method of manufacturing the same |
| CN104681577B (en) * | 2013-11-28 | 2018-04-06 | 群创光电股份有限公司 | Organic LED display panel and preparation method thereof |
| CN103904253A (en) * | 2014-04-17 | 2014-07-02 | 上海和辉光电有限公司 | Packaging structure of OLED device and method thereof |
| CN107768418B (en) | 2017-11-02 | 2019-05-03 | 武汉华星光电技术有限公司 | Organic light-emitting display device and its packaging method |
| CN108364981A (en) * | 2018-01-31 | 2018-08-03 | 昆山国显光电有限公司 | A kind of cutting method of display panel, sub- display panel and display panel |
| CN110211999B (en) * | 2019-05-31 | 2021-05-18 | 昆山国显光电有限公司 | Display panel preparation method and display panel |
| CN112306272A (en) * | 2019-07-25 | 2021-02-02 | 上海和辉光电有限公司 | Touch mother board, touch panel and touch display device |
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| Publication number | Publication date |
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| CN103022367A (en) | 2013-04-03 |
| CN106159106A (en) | 2016-11-23 |
| CN106159106B (en) | 2019-03-15 |
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