CN1030158C - Multilayer high-voltage large-capacity ceramic capacitor and encapsulation method and special encapsulation die thereof - Google Patents
Multilayer high-voltage large-capacity ceramic capacitor and encapsulation method and special encapsulation die thereof Download PDFInfo
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- CN1030158C CN1030158C CN 93112162 CN93112162A CN1030158C CN 1030158 C CN1030158 C CN 1030158C CN 93112162 CN93112162 CN 93112162 CN 93112162 A CN93112162 A CN 93112162A CN 1030158 C CN1030158 C CN 1030158C
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- ceramic capacitor
- capacitor
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- material baffle
- encapsulated
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000005538 encapsulation Methods 0.000 title abstract 4
- 239000003990 capacitor Substances 0.000 claims abstract description 18
- 238000005516 engineering process Methods 0.000 claims abstract description 12
- 238000007731 hot pressing Methods 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 9
- 230000000740 bleeding effect Effects 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000011229 interlayer Substances 0.000 claims description 4
- 238000010304 firing Methods 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 239000002002 slurry Substances 0.000 claims description 2
- 230000000295 complement effect Effects 0.000 claims 1
- 238000010276 construction Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000000919 ceramic Substances 0.000 abstract description 5
- 230000007123 defense Effects 0.000 abstract 1
- 238000005065 mining Methods 0.000 abstract 1
- 238000012856 packing Methods 0.000 abstract 1
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 238000005422 blasting Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000006255 coating slurry Substances 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000004079 fireproofing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
A multilayer high-voltage large-capacity ceramic capacitor, an encapsulation method and a special encapsulation die belong to the manufacturing technology and device of ceramic electronic components. The capacitor adopts a multi-chip parallel technology and a common electrode structure which can resist high voltage; in order to pack and densify, a special packing mould and a new negative pressure drainage process are adopted; in order to improve the yield, the single sheet is formed by hot pressing of a plurality of dielectric films. The ceramic capacitor of the present invention has the characteristics of high withstand voltage and large capacitance, such as 0.15 muF/2 KV 1 muF/2.1 KV and 10 muF/5 KV. And has small volume and excellent performance. Can be widely applied to high and new technology industries such as industrial and mining enterprise automation, national defense and military industry, electronic instruments and equipment, household appliances and the like.
Description
The present invention relates to a kind of multi-layer high-voltage large-capacity ceramic capacitor and encapsulating method thereof and seal particular manufacturing craft.
Capacitor is one of primary element of consumption maximum in the electronic technology, has in each field of computer, information technology, automation and household electrical appliance very widely to use.Especially ceramic capacitor owing to adopted the pottery of excellent performance to make dielectric material, has occupied critical role in electronic technology, replaces the capacitor of other kinds just step by step.The development of modern high technology has proposed more and more higher requirement to capacitor, for example miniature, weight, multi-functional, highly reliable, high stable etc., and this will capacitor reforms to some extent on structural design, manufacture method and technology and innovates.As everyone knows, existing high voltage ceramic capacitor (comprising the mesohigh ceramic capacitor) is a single chip architecture, it is after burning infiltration one deck silver electrode on two first type surfaces of the ceramic mating plate behind the sintering (being generally round), and welding lead is more finally sealed with the insulation fire proofing and formed.Because ceramic material mechanical strength height, can not resemble any coiling the organic media material, therefore, this pottery is less by container capacity, maximum also has only 0.22 μ F(F characteristic).Monolithic capacitor can be done capacity bigger, but proof voltage is very low, is generally tens volts, and the highest have only about 100 volts.
The present invention seeks to attempt to design and manufacture a kind of high pressure resistant, jumbo ceramic capacitor and a kind of encapsulating method is provided and seals particular manufacturing craft.
Ceramic capacitor of the present invention is designed to the high-tension multi-disc parallel-connection structure of ability.Each ceramic dielectric monolithic is square or is round, two first type surface silver coating slurry, burning infiltration electrode (or other thin metal layer), two electrodes are determined the staggered one-sided full limit of direction along one, each monolithic electrode is corresponding one by one, changes mutually successively, with conducting resinl or secondary silver ink firing technology each monolithic is combined.Constitute one electrode layer-interlayer electrode between per like this two media, be followed successively by the intervention shape, interleave is connected on the public electrode that is positioned at both sides respectively, is similar to the parallel connection of a plurality of monolithic electric capacity.Two public electrodes extend to the outside by outer encapsulated layer along same end.Two kinds of methods have been taked in the manufacturing of this capacitor monolithic, and to withstand voltage lower, the less employing of monolithic area is dry pressuring forming process routinely; And bigger for the monolithic area, withstand voltage higher employing the monolithic multilayer structure, promptly adopt routinely filming technology (curtain coating, prick film or crowded film), be processed into the film that thickness is 50-100 μ m, again that multilayer film hot pressing is in blocks.Can improve the withstand voltage and rate of finished products of monolithic like this.For avoiding public electrode and interlayer electrode connection place to seal the gap (this kind gap easily punctures, and influences withstand voltage) that material leaves owing to being difficult for soaking the pool, encapsulating method of the present invention adopts negative pressure drainage to seal, and selects for use and seal particular manufacturing craft accordingly.The mold shell body can be made cylindric or the square tube shape because of the capacitor shape, and metal material is made.The side wall of outer shell middle and lower part has bleeding point and charging aperture relatively, and switch is housed respectively.The inner first half of shell has and the closed mutually material baffle of outer casing inner wall, and this plate is linked to each other with loam cake by the connecting rod of its height of scalable.Have two holes on the material baffle symmetrically, geometrical clamp is equipped with in the perforate top.When sealing, first two public electrodes with multi-layer high-voltage large-capacity ceramic capacitor core body to be encapsulated pass the perforate on the material baffle, seal the requirement of the degree of depth fixes in the relevant position with geometrical clamp by the electrode root, regulate the connecting rod between loam cake and material baffle, make this capacitor core body to be encapsulated place suitable height in the encapsulating mold, sealing gasket and bayonet socket are arranged between loam cake and the housing, be that reliable sealing gasket seals naturally after bayonet socket is stuck, opening bleeding point earlier bleeds, make envelope space formation negative pressure in the mould, close bleeding point when reaching certain negative pressure value, open charging aperture, packaging slurry flows into envelope space naturally, because negative pressure makes and seals material and can enrich whole envelope space and seal with sealing.
The withstand voltage height of ceramic capacitor of the present invention, capacity is big, has enlarged the application of ceramic capacitor, can replace electrolytic capacitor (for example microwave oven) on some precision electronic device equipment; (for example electric blasting device of tertiary oil recovery and geological survey) is applied in some new and high technologies; Adopt capacitor of the present invention, also can obviously improve the overall performance of ceramic capacitor or reduce the external form volume of ceramic capacitor.
Fig. 1 is the structural representation of capacitor of the present invention, and wherein 1 is encapsulated layer, the 2nd, and ceramic dielectric body sheet, the 3rd, interlayer electrode, the 4th, public telegram.
Fig. 2 is containment device (mould and this capacitor core body to be encapsulated) figure.Wherein 6 is bleeding point and switch, and 7 is charging aperture and switch, the 8th, and mold shell, the 9th, material baffle, 10 is encapsulated capacitor core body, and 11 is the public telegram of capacitor, the 12nd, and loam cake, the 13rd, sealing gasket, the 14th, adjustable link, the 15th, material baffle perforate and geometrical clamp, the 16th, bayonet socket.
Fig. 3 is a dielectric monolithic electrode schematic diagram, and 1 and 2 is staggered the two poles of the earth layers of along continuous straight runs on dielectric two first type surfaces, the 3rd, and dielectric.
Claims (3)
1, a kind of multi-layer high-voltage large-capacity ceramic capacitor, repeatedly form mutually successively by multilayer dielectricity body sheet, each dielectric sheet two first type surface is along determining the staggered silver electrode of firing of direction, monolithic electrode correspondence one by one changes mutually, interlayer makes mutually repeatedly monolithic be combined into one with conducting resinl or secondary silver ink firing technology, electrode between cambium layer in the middle of two dielectric sheets, be the intervention shape, be connected in respectively on the public electrode of both sides, two public electrodes reach the outside by outer encapsulated layer at same end, it is characterized by described condenser dielectric body sheet is sandwich construction, is formed by multilayer dielectric film hot pressing.
2, a kind of special-purpose encapsulating mold that is used for the described capacitor of claim 1 is characterized by this mould and is made by metal material, and profile is cylindric or square tube shape housing, and the below has charging aperture and bleeding point relatively in its sidewall; In the housing there be and the closed mutually metal material baffle of its inwall the first half, symmetry has two holes that are complementary with encapsulated capacitor public electrode on this plate, the hole top has geometrical clamp, material baffle is connected with loam cake by Height Adjustable connecting rod, and this connects the distance between pole scalable loam cake and the material baffle.
3, a kind of encapsulating method that is used for the described multi-layer high-voltage large-capacity ceramic capacitor of claim 1, it is that public electrode with multi-layer high-voltage large-capacity ceramic capacitor core body to be encapsulated passes the perforate on the encapsulating mold material baffle, seal the requirement of the degree of depth fixes in the relevant position by the electrode root, adjust the distance between loam cake and material baffle, make this capacitor core body to be encapsulated place suitable height in the encapsulating mold, loam cake and housing bayonet socket is stuck, naturally seal by sealing gasket, it is characterized in that opening bleeding point earlier bleeds, make envelope space formation negative pressure in the mould, close bleeding point subsequently, open charging aperture, packaging slurry flows into naturally and seals with sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 93112162 CN1030158C (en) | 1993-09-14 | 1993-09-14 | Multilayer high-voltage large-capacity ceramic capacitor and encapsulation method and special encapsulation die thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 93112162 CN1030158C (en) | 1993-09-14 | 1993-09-14 | Multilayer high-voltage large-capacity ceramic capacitor and encapsulation method and special encapsulation die thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1087444A CN1087444A (en) | 1994-06-01 |
| CN1030158C true CN1030158C (en) | 1995-10-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 93112162 Expired - Fee Related CN1030158C (en) | 1993-09-14 | 1993-09-14 | Multilayer high-voltage large-capacity ceramic capacitor and encapsulation method and special encapsulation die thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1030158C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5745335A (en) * | 1996-06-27 | 1998-04-28 | Gennum Corporation | Multi-layer film capacitor structures and method |
| KR101290728B1 (en) * | 2008-03-07 | 2013-07-26 | 삼성전자주식회사 | Electrode module and deionization apparatus using the same |
| CN101488396B (en) * | 2009-02-25 | 2011-04-13 | 西安健信电力电子陶瓷有限责任公司 | AC high voltage ceramic capacitor and manufacturing method thereof |
| CN104616891B (en) * | 2015-02-04 | 2018-02-16 | 宁波波英电子有限公司 | Capacitor |
-
1993
- 1993-09-14 CN CN 93112162 patent/CN1030158C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1087444A (en) | 1994-06-01 |
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