CN103013412A - Adhesive for silicon rod/silicon ingot slicing and method for preparing same - Google Patents
Adhesive for silicon rod/silicon ingot slicing and method for preparing same Download PDFInfo
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- CN103013412A CN103013412A CN2012102833523A CN201210283352A CN103013412A CN 103013412 A CN103013412 A CN 103013412A CN 2012102833523 A CN2012102833523 A CN 2012102833523A CN 201210283352 A CN201210283352 A CN 201210283352A CN 103013412 A CN103013412 A CN 103013412A
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Abstract
The invention discloses an adhesive for silicon rod/silicon ingot slicing and a method for preparing the same. The adhesive is composed of two components A and B, wherein the mixing mass ratio of A to B is 1: 1; the component A is composed of 15-40% of epoxy resin E44, 15-40% of epoxy resin E51, 25-30% of acrylic polyurethane, 5-10% of titanium dioxide, 1-5% of magnesium oxide and 0.1-1% of imidazole by mass; and the component B is composed of 5% of lauric acid organic tin and 95% of polyamine by mass. The method comprises the preparation steps of mixing the ingredients of the component A and the ingredients of the component B evenly according to the mixing ratio at first, respectively; and then mixing the component A with the component B in the mass ratio of 1: 1, thereby obtaining the adhesive disclosed by the invention. The adhesive disclosed by the invention is capable of meeting the binding requirement for silicon rod/silicon ingot cutting and also easy to clean.
Description
Technical field
The invention belongs to technical field of adhesive, relate to a kind of tackiness agent for silicon rod/slicing silicon ingots and preparation method thereof.
Background technology
Silicon ingot is the important materials of sun power, and the silicon rod/silicon ingot after the moulding need to adopt the mode of line cutting to thinly slice for the preparation solar cell and use.In the cutting processing process, need tackiness agent just can cut with silicon rod/silicon ingot bonding, after fixing, and need to wash at an easy rate the tackiness agent on silicon rod/slicing silicon ingots surface after the cutting.So just require to guarantee that for the tackiness agent of silicon rod/slicing silicon ingots silicon rod/slicing silicon ingots can enough cohesive forces namely glue to such an extent that live, and makes the tackiness agent on silicon rod/slicing silicon ingots surface be washed at an easy rate again.Therefore the bonding time, bonding strength, scavenging period are the of paramount importance indexs of the bonding treatment characteristic of silicon rod/silicon ingot.In general, bonding force is preferably chosen certain proper range, to avoid the damage to silicon rod/slicing silicon ingots, exceed this scope and just cause easily the breakage of silicon rod/slicing silicon ingots, simultaneously, after the line cutting is complete, also be difficult to wash the tackiness agent on silicon rod/slicing silicon ingots surface.At present, although operational tackiness agent can satisfy the bonding requirements of silicon rod/silicon ingot cutting, the tackiness agent on silicon rod/slicing silicon ingots surface is difficult to clean, thereby causes the scrap rate of product to increase.Therefore, research and develop a kind of processing requirement that can satisfy silicon rod/silicon ingot cutting, the tackiness agent of easy cleaning is the technical problem that solution is badly in need of in this area again simultaneously.
Summary of the invention
The objective of the invention is in order to overcome defective and the deficiency of prior art existence, solve the fast technical problem of bonding and Rapid Cleaning of silicon rod/slicing silicon ingots tackiness agent, and provide a kind of satisfy the operating time greater than 15 minutes condition under, the primary solidification time was less than 50 minutes behind the room temperature coating adhesive, be in 5 hours set time fully, cohesive force reaches 16MPa, and chemical bond can be hydrolyzed rapidly at a certain temperature, the tackiness agent that is used for silicon rod/slicing silicon ingots that cleans easily.
In order to realize above-mentioned target, the present invention's technical scheme of taking of dealing with problems is:
A kind of tackiness agent for silicon rod/slicing silicon ingots is comprised of two groups of components of A, B, and A group component is 1:1 with the mixing quality ratio of B group component; Wherein to organize by mass percentage content be to be 15%～40% by Resins, epoxy E44 to A, and Resins, epoxy E51 is 15%～40%, and acroleic acid polyurethane is 25%～30%, and titanium dioxide is 5～10%, and magnesium oxide is 1～5%, and imidazoles is 0.1～1 to form.
The molecular structure of wherein said acroleic acid polyurethane is:
Wherein, n is the integer of 10-50, and R is phenyl or hexa-methylene, and R2 is the 1-4 carbon atom alkyl, comprises straight chain, or its isomer.It derives from the product of hydroxyl telechelic polyester polyvalent alcohol and isocyanate reaction, its reaction conditions is anhydrous, temperature of reaction is 70 degree, the mol ratio of its reaction is: isocyanic ester: polyester polyol=2.05:1, and the reaction times is 6 hours, after reaction is complete, add again Hydroxyethyl acrylate, additional proportion is: Hydroxyethyl acrylate: reaction product=2.05:1,5 hours reaction times, then discharging.
B group component is solidifying agent, and content is 5% by the lauric acid organotin by mass percentage, and polyamine is 95% composition, and the molecular structure of wherein said polyamine is:
Wherein m is the numerical value of 5-20, and R is the alkyl of 1-6 carbon atom, comprises its straight chained alkyl or isomer.
In order to realize above-mentioned target, the present invention's another technical scheme of taking of dealing with problems is:
The preparation method of described a kind of tackiness agent for silicon rod/slicing silicon ingots, step after first A component and B group component being mixed according to proportioning respectively, then mix A group and B group according to the 1:1 mass ratio, namely obtain tackiness agent of the present invention.
Advantage and the beneficial effect of tackiness agent for silicon rod/slicing silicon ingots of the present invention and preparation method thereof mainly are:
The one, satisfy the bonding requirements that silicon rod/silicon ingot cuts, the operating time was greater than 15 minutes; 50 minutes primary solidification time; Be cured as fully less than 5 hours.
The 2nd, easy cleaning is cleaned under 60 temperature, and the tackiness agent that washes the surface is no more than 15 minutes.
Embodiment
Below by specific embodiment the present invention is described in further detail.
Embodiment 1:
One, this tackiness agent is prepared from (mass percentage content) by following component proportion:
1, A group component:
Resins, epoxy E44 15%,
Resins, epoxy E51 40%,
Acroleic acid polyurethane 30%,
Titanium dioxide 10%,
Magnesium oxide 4.9%,
Imidazoles 0.1%.
2, B group component:
Lauric acid organotin 5%,
Polyamine 95%.
Two, preparation method:
Said ratio with A component and B group component mixes respectively first, then A group and B group is mixed according to the 1:1 mass ratio, namely obtains tackiness agent of the present invention.
Three, embodiment effect: 16 minutes ambient operation time, 5 minutes room temperature primary solidification time, complete 5 hours set times, bonding shearing force 18MPa., scavenging period 15 minutes.
Embodiment 2:
One, this tackiness agent is prepared from (mass percentage content) by following component proportion:
1, A group component:
Resins, epoxy E44 40%,
Resins, epoxy E51 15%,
Acroleic acid polyurethane 30%,
Titanium dioxide 10%,
Magnesium oxide 4.9%,
Imidazoles 0.1%.
2, B group component:
Lauric acid organotin 5%,
Polyamine 95%.
Two, this adhesive preparation method is with embodiment 1.
Three, embodiment effect: 5 minutes ambient operation time, the room temperature primary solidification time is 52 minutes, complete 5 hours set times, bonding shearing force 19MPa, scavenging period 12 minutes..
Embodiment 3:
One, this tackiness agent is prepared from (mass percentage content) by following component proportion:
1, A group component:
Resins, epoxy E44 30%,
Resins, epoxy E51 35%,
Acroleic acid polyurethane 25%,
Titanium dioxide 5%,
Magnesium oxide 4.9%,
Imidazoles 0.1%.
2, B group component:
Lauric acid organotin 5%,
Polyamine 95%.
Two, this adhesive preparation method is with embodiment 1.
Three, embodiment effect: 14 minutes ambient operation time, the room temperature primary solidification time is 53 minutes, complete 5 hours set times, bonding shearing force 17MPa., scavenging period 11 minutes.
Embodiment 4:
One, this tackiness agent is prepared from (mass percentage content) by following component proportion:
1, A group component:
Resins, epoxy E44 25%,
Resins, epoxy E51 32%,
Acroleic acid polyurethane 30%,
Titanium dioxide 10%,
Magnesium oxide 2%,
Imidazoles 1%.
2, B group component:
Lauric acid organotin 5%,
Polyamine 95%.
Two, this adhesive preparation method is with embodiment 1.
Three, embodiment effect: 16 minutes ambient operation time, the room temperature primary solidification time is 50 minutes, complete 5 hours set times, bonding shearing force 16.2MPa., scavenging period 10 minutes.
Embodiment 5:
One, this tackiness agent is prepared from (mass percentage content) by following component proportion:
1, A group component:
Resins, epoxy E44 28%,
Resins, epoxy E51 30%,
Acroleic acid polyurethane 30%,
Titanium dioxide 6%,
Magnesium oxide 5%,
Imidazoles 1%.
2, B group component:
Lauric acid organotin 5%,
Polyamine 95%.
Two, this adhesive preparation method is with embodiment 1.
Three, embodiment effect: 15 minutes ambient operation time, the room temperature primary solidification time is 45 minutes, complete 5 hours set times, bonding shearing force 10MPa., scavenging period 9 minutes.
Embodiment 6:
One, this tackiness agent is prepared from (mass percentage content) by following component proportion:
1, A group component:
Resins, epoxy E44 30%,
Resins, epoxy E51 30%,
Acroleic acid polyurethane 30%,
Titanium dioxide 5%,
Magnesium oxide 4%,
Imidazoles 1%.
2, B group component:
Lauric acid organotin 5%,
Polyamine 95%.
Two, this adhesive preparation method is with embodiment 1.
Three, embodiment effect: 13 minutes ambient operation time, the room temperature primary solidification time is 45 minutes, complete 5 hours set times, bonding shearing force 17MPa., scavenging period 9.5 minutes.
Embodiment of the present invention only is used for the explanation technical solution of the present invention, is not limited to the present invention.
Claims (2)
1. a tackiness agent that is used for silicon rod/slicing silicon ingots is characterized in that being comprised of two groups of components of A, B, and the mixing quality of A:B is than being 1:1; Wherein A group component by mass percentage content be 15%～40% by Resins, epoxy E44, Resins, epoxy E51 is 15%～40%, acroleic acid polyurethane is 25%～30%, titanium dioxide is 5～10%, magnesium oxide is 1-5%, imidazoles is that 0.1-1 forms; The molecular structure of wherein said acroleic acid polyurethane is:
Wherein, n is the integer of 10-50, and R is phenyl or hexa-methylene, and R2 is the 1-4 carbon atom alkyl, comprises straight chain, or its isomer;
B group component by mass percentage content is 5% by the lauric acid organotin, and polyamine is 95% composition, and the molecular structure of wherein said polyamine is:
Wherein m is the numerical value of 5-20, and R is the alkyl of 1-6 carbon atom, comprises its straight chained alkyl or isomer.
2. the preparation method of the tackiness agent for silicon rod/slicing silicon ingots as claimed in claim 1, it is characterized in that concrete steps are, first A component and B group component are mixed according to proportioning respectively, then A group and B group are mixed according to the 1:1 mass ratio, namely obtain tackiness agent of the present invention.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210283352.3A CN103013412B (en) | 2012-08-09 | 2012-08-09 | Adhesive for silicon rod/silicon ingot slicing and method for preparing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210283352.3A CN103013412B (en) | 2012-08-09 | 2012-08-09 | Adhesive for silicon rod/silicon ingot slicing and method for preparing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103013412A true CN103013412A (en) | 2013-04-03 |
| CN103013412B CN103013412B (en) | 2014-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210283352.3A Expired - Fee Related CN103013412B (en) | 2012-08-09 | 2012-08-09 | Adhesive for silicon rod/silicon ingot slicing and method for preparing same |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5620553A (en) * | 1991-06-29 | 1997-04-15 | Ciba-Geigy Corporation | Photopolymerisable liquid compositions for bonding friction material to metal |
| CN1699492A (en) * | 2005-07-11 | 2005-11-23 | 大连轻工业学院 | Photo-curable conductive adhesive and method for making same |
| CN102079810A (en) * | 2010-12-15 | 2011-06-01 | 北京航空航天大学 | Synthesis and application of light-cured polyurethane-acrylic acid-epoxy resin adhesive |
| CN102127386A (en) * | 2010-12-29 | 2011-07-20 | 东莞市新懿电子材料技术有限公司 | Photocuring and thermocuring conductive adhesive and preparation method |
-
2012
- 2012-08-09 CN CN201210283352.3A patent/CN103013412B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5620553A (en) * | 1991-06-29 | 1997-04-15 | Ciba-Geigy Corporation | Photopolymerisable liquid compositions for bonding friction material to metal |
| CN1699492A (en) * | 2005-07-11 | 2005-11-23 | 大连轻工业学院 | Photo-curable conductive adhesive and method for making same |
| CN102079810A (en) * | 2010-12-15 | 2011-06-01 | 北京航空航天大学 | Synthesis and application of light-cured polyurethane-acrylic acid-epoxy resin adhesive |
| CN102127386A (en) * | 2010-12-29 | 2011-07-20 | 东莞市新懿电子材料技术有限公司 | Photocuring and thermocuring conductive adhesive and preparation method |
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| CN103013412B (en) | 2014-04-16 |
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