CN103013373A - Acid and alkali-resistant high-temperature-resistant double-sided tape and manufacturing method thereof - Google Patents
Acid and alkali-resistant high-temperature-resistant double-sided tape and manufacturing method thereof Download PDFInfo
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- CN103013373A CN103013373A CN2012105802777A CN201210580277A CN103013373A CN 103013373 A CN103013373 A CN 103013373A CN 2012105802777 A CN2012105802777 A CN 2012105802777A CN 201210580277 A CN201210580277 A CN 201210580277A CN 103013373 A CN103013373 A CN 103013373A
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Abstract
The invention relates to an acid and alkali-resistant high-temperature-resistant double-sided tape and a preparation method thereof. The double-sided tape is characterized by comprising a matrix as well as a first adhesive layer and a second adhesive layer which are coated on two surfaces of the matrix, wherein the thickness of the matrix is 15-38 micrometers; the thicknesses of the first adhesive layer and the second adhesive layer are 15-30 micrometers respectively; the matrix is prepared from polyethylene glycol terephthalate, polyimide or polyethylene naphthalate; and the weight compositions of the first adhesive layer and the second adhesive layer are described in the specification. Compared with the prior art, the tape provided by the invention is good in acid and alkali resistance and the preparation method of the tape is high in production efficiency and low in cost.
Description
Technical field
The present invention relates to a kind of acid and alkali-resistance, high temperature resistant double sticky tape and preparation method thereof.
Background technology
Along with the develop rapidly of electronic technology, the unicircuit physical size gradually reduces, integrated level is improving constantly.The manufacturing process of FPC up to now nearly all is to adopt subtractive process to claim again etching method processing, usually with copper coated foil plate for the material that sets out, utilize photolithography to form resist layer, the not copper face formation circuit conductor of part is removed in etching, and then High Temperature High Pressure pressing mulch film forms wiring board.In this wiring board formation technique, need acid and alkali-resistance, high temperature resistant adhesive tape; copper coated foil plate is protected; make it when circuit etching, do not corroded the circuit pack of photoetching by the acid-basicity liquid; and in mulch film pressing process, protect it not to be destroyed; mulch film needs to remove this adhesive tape after being laminated with end; therefore require this adhesive tape not only to have resistance to elevated temperatures, and want acid-alkali-corrosive-resisting, water-fast.
At present, the manufacturing process of FPC is still the individual layer operation, and production efficiency is relatively poor, can also further improve.
Summary of the invention
Technical problem to be solved by this invention is that the present situation for prior art provides a kind of acid and alkali-resistance, high temperature resistant double sticky tape.
Another technical problem to be solved by this invention provides the preparation method of the high acid and alkali-resistance of a kind of production efficiency, high temperature resistant double sticky tape.
The present invention solves the problems of the technologies described above the technical scheme that adopts: this acid and alkali-resistance, high temperature resistant double sticky tape is characterized in that comprising matrix and are coated on two lip-deep the first adhesive-layers and second adhesive-layer of described matrix;
Wherein, the thickness of described matrix is 15 μ m ~ 38 μ m, and the thickness of described the first adhesive-layer and described the second adhesive-layer is respectively 15 μ m ~ 30 μ m;
Described matrix is by polyethylene terephthalate, polyimide or PEN preparation;
The weight of described two adhesive-layers consists of:
Preferably, described acrylic ester adhesive is that main monomer is that Isooctyl acrylate monomer, monomer are that vinylformic acid and weight-average molecular weight are the polymkeric substance of 60-80 ten thousand.
Further, described acrylic ester adhesive is 0.05-1.25N/25mm to the clinging power of 304# stainless steel plate.
The storage modulus of preferred described acrylic ester adhesive is 1.0 * 10
5~ 3.3 * 10
5
The preparation method of above-mentioned acid and alkali-resistance, high temperature resistant double sticky tape is characterized in that comprising the steps:
1. described adhesive layer is uniformly coated on the first surface of described matrix, sends into temperature and be in 60 ℃-130 ℃ the baking oven and carry out drying, be 36 seconds-180 seconds time of drying, and compound with the first release material after dry, rolling obtains the first engineering product; Described compound pressure is 0.12-0.20Kg;
2. described adhesive layer evenly is coated on the second release material, sends into temperature and be in 60 ℃-130 ℃ the baking oven and carry out drying; Be 36 seconds-180 seconds time of drying, dry rear compound with described the first engineering product, and this adhesive layer is bonded on the second surface of described matrix, and composite pressure is 0.12-0.20KG, and rolling obtains the second engineering product;
3. with described the second engineering product 35~45 ℃ of lower maturations 2~8 days, namely obtain acid and alkali-resistance, high temperature resistant double sticky tape.
Preferably, described matrix carries out corona to matrix surface first before use, makes matrix surface tension force 〉=54 dyne; Corona discharge power is 0.8KW-1.8KW, and travelling speed is 15m/min.
Compared with prior art, it is that linking agent and aziridine crosslinker are united use that linking agent among the application is taked epoxy, form fine and close reticulated structure after the reaction, can reduce small molecular weight body free in the sizing agent, to the residual effect of stopping that essence is arranged of the small molecular weight body behind the high temperature, useful to the contaminative under the high ambient conditions, under the severe rugged environment condition, be not prone to the pollutions such as cull; The good compactness of adhesive-layer, high thermal resistance and resistance to acids and bases that can the Effective Raise adhesive-layer, and can improve the sticking power of sizing agent and base material; And the interpolation of polyoxyethylene glycol can the Effective Raise adhesive-layer water tolerance, simultaneously and the linking agent synergy, can further improve the resistance to acids and bases of adhesive-layer.
The preparation method of adhesive tape provided by the present invention can double production capacity under the prerequisite that equipment and manpower do not need to increase, improved greatly the production efficiency of enterprise, has saved production cost.Because present integrated circuit board technique all is the single plate operation, adopt double sticky tape, then can be laminated with wiring board by bilayer, only need to install one additional and be laminated with roller and can reach the two-sided function that is laminated with being laminated with equipment.
Embodiment
Below in conjunction with embodiment the present invention is described in further detail.
Embodiment 1 to embodiment 16 and comparative example
The preparation method of adhesive tape is as follows among the embodiment 1 to embodiment 16:
Matrix surface is carried out corona, corona discharge power 0.8KW-1.8KW, travelling speed 15m/min makes substrate surface tension force 〉=54 dyne;
1. described adhesive-layer is uniformly coated on the first surface of matrix, send into temperature and be in 60 ℃-130 ℃ the baking oven and carry out drying, be 36 seconds-180 seconds time of drying, dry after with the first release material be compound under the 0.12-0.20Kg at pressure, rolling obtains the first engineering product;
2. evenly be coated on the second release material than adhesion coating described, send into temperature and be in 60 ℃-130 ℃ the baking oven and carry out drying; Be 36 seconds-180 seconds time of drying, dry rear compound with described the first engineering product, and this is bonded in than adhesion coating on the second surface of described matrix, and composite pressure is 0.12-0.20KG, and rolling obtains the second engineering product;
3. with described the second engineering product 35~45 ℃ of lower maturations 2~8 days, namely obtain acid and alkali-resistance, high temperature resistant double sticky tape.
The concrete prescription of adhesive tape adhesive-layer and matrix sees table 1 and table 2 for details among each embodiment.
Comparative example
The preparation method of comparative example is identical with embodiment, does not just add aziridine crosslinker and Polyethylene Glycol-600 in the adhesive-layer.Concrete prescription sees table 1 for details.
Table 1
Table 2
Annotate: the unreceipted unit of consumption of each material all refers to solid weight part in (1) table 1 and the table 2.
(2) adhesive tape maturation condition: 40 ℃ * 3 days.
(3) the acid and alkali-resistance testing method 1.: in 23 ± 2 ℃, the environment of 65 ± 5%RH, on the adhesive tape two sides that 50mm is wide is compound with the PI face of 50 micron thick, after in 23 ± 2 ℃, the environment of 65 ± 5%RH, placing 20min, the solution of putting into HF:HCL=1:4 soaks 1Hr, take out, observe the phenomenon that has or not liquid infiltration and PI film surface to be corroded.
(4) acid and alkali-resistance test 2.: in 23 ± 2 ℃, the environment of 65 ± 5%RH, on the adhesive tape two sides that 50mm is wide is compound with the PI face of 50 micron thick, after in 23 ± 2 ℃, the environment of 65 ± 5%RH, placing 20min, through (1%NaCO3 soaks 24Hr → 5%NaCL immersion 24Hr → 3%NaOH and soaks 24Hr), take out, observation has or not liquid infiltration.
(5) high temperature resistant testing method: in 23 ± 2 ℃, the environment of 65 ± 5%RH, the adhesive tape gluing that 25mm is wide is on the PI of 50 micron thick face, after in 23 ± 2 ℃, the environment of 65 ± 5%RH, placing 20min, put into 150 ℃ high temperature oven, take out immediately behind the 1h, cool off 2h in 23 ± 2 ℃, the environment of 65 ± 5%RH, whether stripping tape is observed the PI face cull.
(6) E-5C is Resins, epoxy; E-AX is novolac epoxy.
Claims (6)
1. an acid and alkali-resistance, high temperature resistant double sticky tape is characterized in that comprising matrix and are coated on two lip-deep the first adhesive-layers and second adhesive-layer of described matrix;
Wherein, the thickness of described matrix is 15 μ m ~ 38 μ m, and the thickness of described the first adhesive-layer and described the second adhesive-layer is respectively 15 μ m ~ 30 μ m;
Described matrix is by polyethylene terephthalate, polyimide or PEN preparation;
The weight of described the first adhesive layer and the second adhesive-layer consists of:
2. acid and alkali-resistance according to claim 1, high temperature resistant double sticky tape is characterized in that described acrylic ester adhesive is that main monomer is that Isooctyl acrylate monomer, monomer are that vinylformic acid and weight-average molecular weight are the polymkeric substance of 60-80 ten thousand.
3. acid and alkali-resistance according to claim 1 and 2, high temperature resistant double sticky tape is characterized in that described acrylic ester adhesive is to 304# stainless steel plate clinging power 0.05-1.25N/25mm.
4. acid and alkali-resistance according to claim 3, high temperature resistant double sticky tape, the storage modulus that it is characterized in that described acrylic ester adhesive is 1.0 * 10
5~ 3.3 * 10
5
5. such as the preparation method of the described acid and alkali-resistance of claim 1 to 4, high temperature resistant double sticky tape, it is characterized in that comprising the steps:
1. described adhesive-layer is uniformly coated on the first surface of described matrix, sends into temperature and be in 60 ℃-130 ℃ the baking oven and carry out drying, be 36 seconds-180 seconds time of drying, and compound with the first release material after dry, rolling obtains the first engineering product; Described compound pressure is 0.12-0.20Kg;
2. evenly be coated on the second release material than adhesion coating described, send into temperature and be in 60 ℃-130 ℃ the baking oven and carry out drying; Be 36 seconds-180 seconds time of drying, dry rear compound with described the first engineering product, and this is bonded in than adhesion coating on the second surface of described matrix, and composite pressure is 0.12-0.20KG, and rolling obtains the second engineering product;
3. described the second engineering product were namely obtained acid and alkali-resistance, high temperature resistant double sticky tape in 2~8 days 35~45 ℃ of lower maturations.
6. preparation method according to claim 5 is characterized in that described matrix carries out corona to substrate surface first before use, makes substrate surface tension force 〉=54 dyne; Corona discharge power is 0.8KW-1.8KW, and travelling speed is 15m/min.
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CN2012105802777A CN103013373A (en) | 2012-12-26 | 2012-12-26 | Acid and alkali-resistant high-temperature-resistant double-sided tape and manufacturing method thereof |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103666307A (en) * | 2013-12-31 | 2014-03-26 | 杭州大华塑业有限公司 | Acid-resistant protection film rubber belt |
CN103788901A (en) * | 2014-01-26 | 2014-05-14 | 张家港康得新光电材料有限公司 | High temperature resistant pressure sensitive adhesive composition and preparation method thereof as well as double-sided adhesive tape |
CN104559822A (en) * | 2014-12-29 | 2015-04-29 | 宁波大榭开发区综研化学有限公司 | Strippable double-sided sticky tape for large-size sapphire glass grinding and preparation method of strippable double-sided sticky tape |
CN106675459A (en) * | 2016-12-30 | 2017-05-17 | 宁波大榭开发区综研化学有限公司 | Environment-friendly and low temperature-resistant acrylate adhesive |
CN114206030A (en) * | 2021-12-06 | 2022-03-18 | 博罗县精汇电子科技有限公司 | Production process of thin rigid-flex board |
CN115433527A (en) * | 2022-09-26 | 2022-12-06 | 江苏伊诺尔新材料科技有限公司 | Acid and alkali-resistant high-temperature-resistant removable double-sided adhesive tape |
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CN1212007A (en) * | 1996-02-26 | 1999-03-24 | 美国3M公司 | Pressure sensitive adhesives |
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CN1212007A (en) * | 1996-02-26 | 1999-03-24 | 美国3M公司 | Pressure sensitive adhesives |
WO2008046000A1 (en) * | 2006-10-13 | 2008-04-17 | 3M Innovative Properties Company | 2-octyl (meth)acrylate adhesive composition |
US20110124797A1 (en) * | 2009-11-23 | 2011-05-26 | 3M Innovative Properties Company | Acrylic Pressure-Sensitive Adhesives with Aziridinyl-Epoxy Crosslinking System |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103666307A (en) * | 2013-12-31 | 2014-03-26 | 杭州大华塑业有限公司 | Acid-resistant protection film rubber belt |
CN103666307B (en) * | 2013-12-31 | 2015-10-07 | 杭州大华塑业有限公司 | A kind of Acid-resistant protection film rubber belt |
CN103788901A (en) * | 2014-01-26 | 2014-05-14 | 张家港康得新光电材料有限公司 | High temperature resistant pressure sensitive adhesive composition and preparation method thereof as well as double-sided adhesive tape |
CN103788901B (en) * | 2014-01-26 | 2017-03-15 | 张家港康得新光电材料有限公司 | High temperature resistant pressure sensitive adhesive adhesive composition, preparation method and double-faced adhesive tape |
CN104559822A (en) * | 2014-12-29 | 2015-04-29 | 宁波大榭开发区综研化学有限公司 | Strippable double-sided sticky tape for large-size sapphire glass grinding and preparation method of strippable double-sided sticky tape |
CN106675459A (en) * | 2016-12-30 | 2017-05-17 | 宁波大榭开发区综研化学有限公司 | Environment-friendly and low temperature-resistant acrylate adhesive |
CN114206030A (en) * | 2021-12-06 | 2022-03-18 | 博罗县精汇电子科技有限公司 | Production process of thin rigid-flex board |
CN115433527A (en) * | 2022-09-26 | 2022-12-06 | 江苏伊诺尔新材料科技有限公司 | Acid and alkali-resistant high-temperature-resistant removable double-sided adhesive tape |
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Application publication date: 20130403 |