CN103013032B - High heat conductivity nanocomposite plastic - Google Patents
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- CN103013032B CN103013032B CN201210573976.9A CN201210573976A CN103013032B CN 103013032 B CN103013032 B CN 103013032B CN 201210573976 A CN201210573976 A CN 201210573976A CN 103013032 B CN103013032 B CN 103013032B
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Abstract
The invention discloses a kind of High heat conductivity nanocomposite plastic, the raw material of described High heat conductivity nanocomposite plastic comprises matrix and filler; Described matrix is ABS; Comprise filler to comprise: MgO, Al
2o
3, Si
3n
4, BN and ZnO; The parts by weight of described raw material are: ABS50-85 part, MgO22-28 part, Al
2o
310-16 part, Si
3n
43-8 part, BN8-12 part, ZnO8-15 part.Described filler can further include: high purity carbon dust 12-16 part.The present invention is by having carried out Experimental comparison to the thermal conduction capability of the filler of various different shapes and size raising polymer-based carbon used in combination.The present invention's mixed fillers makes the thermal conductivity of matrix material significantly improve.The present invention utilizes the particle, the whisker formation continuous print heat conduction network chain that there are certain length-to-diameter ratio.
Description
Technical field
The present invention relates to nanometer new material technology field, particularly relate to a kind of High heat conductivity nanocomposite plastic.
Background technology
Now, because electronic product is more and more tending towards miniaturization, therefore those easily integrated and miniaturization and the good complex plastic substrate of snappiness are widely used, but because the multiple stratification of the highly integrated and laminate of unicircuit certainly leads to heat release problem, therefore the task of top priority is just become to the requirement of the heat conductivility of these materials.
ABS resin can with injection moulding, extrude, vacuum, the method for forming such as blowing and roll-in be processed as plastic cement, go back available mechanical, bonding, coating, vacuum are steamed etc., and method carry out secondary processing.Due to its high comprehensive performance, purposes is relatively more extensive, is mainly used as engineering materials, also can be used for family life apparatus.Because its oil resistant and acid-and base-resisting, salt and chemical reagent etc. are functional, and have electrodepositable, after plating metal level, glossy good, the advantage such as light specific gravity, price are low, can be used to replace some metal.Also can synthesize many kinds such as self-extinguishing type and heat resistant type, to adapt to various uses.
People are with dielectric metal oxide and other compound filled polymers in recent years, tentatively solve this problem.The filler of insulated type heat conduction plastic cement mainly comprises: metal oxide is as BeO, MgO, A1
2o
3, CaO, NIO; Metal nitride is as AlN, BN etc.; Carbide is as SiC, B
4c
3deng.They have higher thermal conductivity, and what is more important compares the electrical insulating property having excellence with metal powder, and therefore they can ensure that end article has good electrical insulating property, and this is vital in electronic apparatus industry.
Investigation and application for heat conduction plastic cement is a lot, simply can classify, can be divided into thermoplasticity heat-conducting resin and thermoset heat-conducting resin according to body material kind to it; Can be divided into by the kind of particle filled composite: metal filled type, metal oxide filled-type, metal nitride filled-type, inorganic non-metallic filled-type, fiber filled type heat conduction plastic cement; Also can divide according to a certain character of heat conduction plastic cement, such as can be divided into insulated type heat conduction plastic cement and nonisulated type heat conduction plastic cement according to its electrical insulation capability.
Because plastic cement itself has insulativity, the therefore electrical insulation capability of most heat conduction plastic cement is finally determined by the insulating property of particle filled composite.Filler for nonisulated type heat conduction plastic cement is usually metal powder, graphite, carbon black, carbon fiber etc., the feature of this kind of filler has good thermal conductivity, material easily can be made to obtain high heat conductivility, but also make the decreasing insulating of material even become electro-conductive material simultaneously.Therefore at the Working environment of material in the less demanding situation of electrical insulating property, above-mentioned filler can be applied.And also necessarily require heat conduction plastic cement to have low electrical insulating property to meet specific requirement, as antistatic material, electromagnetic shielding material etc. under certain conditions.
Information industry flourish in the last few years, new requirement is proposed to the performance of macromolecular material, especially for the development of heat conduction plastic cement provides development space, the application of heat conduction plastic cement on computer fittings will improve the heat dissipation problem of computer and improve its travelling speed and stability, as CPU, notebook computer shell and various surface-mounted integrated circuit, these materials all require heat conductive insulating.Macromolecular material insulate, but as thermally conductive material, pure macromolecular material is generally inefficient, because macromolecular material is the poor conductor of heat mostly, macromolecular material thermal conductivity is about the 1/500-1/600 of metal.The thermal conductivity of foam plastic only has 0.02-0.046W/m.K, is about 1/1500 of metal, 1/40 of cement concrete, 1/20 of common brick, is desirable thermal insulation material. and expand its application in heat conduction field, modification must be carried out to macromolecular material.The thermal conductivity of macromolecular material, metal and metal oxide is in Table 1-1, table 1-2, table 1-3.
The high molecular thermal conductivity of table 1-1
The thermal conductivity of table 1-2 metal and metal oxide
Metal and the mineral filler that can be used as conductive particle have following several substantially:
(l) metal powder filler: copper powder, aluminium powder, bronze, silver powder.
(2) metal oxide: aluminum oxide, is oxidized secret, barium oxide, magnesium oxide, zinc oxide.
(3) metal nitride: aluminium nitride, boron nitride.
(4) inorganic non-metallic: graphite, silicon carbide.
When ceramic is as heat conductive filler filled high polymer material matrix, the quality of filling effect depends primarily on following factor: kind, the characteristic of (1) polymeric matrix; (2) shape, particle diameter, the distribution of sizes of filler; (3) interface binding characteristic of filler and matrix and the interaction of two-phase.
The thermal conductivity of some packing materials of table 1-3
Due to adding of filler, the mechanical property of material is declined.Therefore, the conductivity not only will considered in the design of matrix material, and require that stability of material is good, nontoxic, satisfactory mechanical property and inexpensive.The polymkeric substance that use itself has good heat conductive performance relative to another selection of filled polymer, but the expensive and deficient in stability in performance of this type of material price, become their main drawback on using.Plastic cement is the material that in macromolecular material, output is maximum.
The market requirement of conductivity macromolecular material is annual all in growth, and wherein the market demand of heat conduction plastic cement increases faster.Therefore the research of plastic cement heat conductivility has been caused to the interest of various countries investigator, and done good work.The research of current fillibility heat conduction plastic cement, the method that major part adopts physics to fill, heat conductivility is poor, and mechanical property declines serious, and production cost is high.But along with the market of expanding day and going deep into of research, heat conduction plastic cement will have a large development, especially the research and development of nano heat-conductive material, the preparation of high heat-conductive body polymer materials, the discussion of polymer bond mechanism should become the developing direction of heat-conducting polymer material.
Summary of the invention
Technical problem to be solved by this invention is, electric packaged material requires heat conduction, insulation have lower specific inductivity, good heat-conductive characteristic and low thermal expansivity.This type of material is the application market that heat-conducting polymer material is larger.The present invention is by inorganic particulate filler Ultrafine, and when even arriving nano-scale, the change of matter can occur because of the change of interatomic distance in particle and structure for itself thermal conductivity.Thermal conductivity as aluminium nitride is about 36w/ (m.K), and the thermal conductivity of nano level aluminium nitride can reach 320w/ (m.K).The trickle magnesium oxide of high purity, its thermal conductivity is not less than 50w/ (m.K), is equivalent to 4 times of silicon oxide, 3 times of aluminum oxide.
For solving the problems of the technologies described above, obtain the matrix material of high thermal conductivity, the invention provides a kind of High heat conductivity nanocomposite plastic, the raw material of described High heat conductivity nanocomposite plastic comprises matrix and filler; Described matrix is ABS; Comprise filler to comprise: MgO, Al
2o
3, Si
3n
4, BN and ZnO.
The parts by weight of described raw material can be: ABS50-85 part, MgO22-28 part, Al
2o
310-16 part, Si
3n
43-8 part, BN8-12 part, ZnO8-15 part.
Described filler may further include: high purity carbon dust 12-16 part.
Described filler can further include: AlN7-11 part.
Described filler also may further include: alum 2-4 part, kaolin 2-4 part.
Described ABS can be vinyl cyanide, divinyl and cinnamic terpolymer, and A represents vinyl cyanide, and B represents divinyl, and S represents vinylbenzene; Wherein, vinyl cyanide accounts for 25% ~ 30%, and divinyl accounts for 16% ~ 28%, and vinylbenzene accounts for 45% ~ 60%.
Described filler AlN can be: AlN whisker and AlN particle do filler.
Described Si
3n
4it can be highly heat-conductive silicon nitride.
Described BN can be nm-class boron nitride particle, meets following index:
Described High heat conductivity nanocomposite plastic, can be prepared by following steps:
The first step, synthetic rubber: by plastic modified mechanical pelleting, by the matrix in embodiment 1-8, auxiliary material, and plastic grains made by coupling agent;
Second step, shaping: by injection moulding machine injection moulding;
3rd step, dries material: add in injecting machine material tube by the plastic cement after shaping, dries material temperature degree 115-135 degree 2-4 hour; Again temperature be 225 degree-265 spend time injection moulding pressurization, injection moulding pressurization scope be 50-65kgf/ ㎝
2, the time is 45-50 second, carries out injection moulding.
The present invention is by having carried out Experimental comparison to the thermal conduction capability of the filler of various different shapes and size raising polymer-based carbon used in combination, and filler comprises MgO, Al
2o
3, Si
3n
4, BN, high purity carbon dust, AlN, ZnO, KAl (SO
4)
212H
2o(alum) and/or Al
2o
3-2SiO
2-2H
2o(kaolin) etc.The present invention's mixed fillers makes the thermal conductivity of matrix material significantly improve.The present invention utilizes the particle, the whisker formation continuous print heat conduction network chain that there are certain length-to-diameter ratio; Select the filler combination of different particle diameters, reach higher filling density: utilize coupling agent to improve the interface of filler and matrix, to reduce the thermal resistance of interface; Thermal conductivity is improved with nanomaterial-filled plastic cement.High heat conductivity nanocomposite plastic of the present invention is the thermoplastic composite resin of thermal conductivity up to 21.25 ~ 34.56w/mK.The technology of the present invention utilizes unique molecular designing, improves the interaction force of molecule between thermoplastic plastic and filler, and filler high-level efficiency contact each other defines thermal pathways, has increased substantially thermal conductivity.
Embodiment
Describe embodiments of the present invention in detail below with reference to embodiment, to the present invention, how utilisation technology means solve technical problem whereby, and the implementation procedure reaching technique effect can fully understand and implement according to this.
High heat conductivity nanocomposite plastic of the present invention, its raw materials comprises matrix and filler; Described matrix is ABS.
ABS resin is micro-yellow solid, and have certain toughness, density is about 1.04 ~ 1.06g/cm3.It is antiacid, the corrosive power of alkali, salt is stronger, also can tolerate organic solvent dissolution to a certain extent.ABS resin can be acted normally under the environment of-25 DEG C ~ 60 DEG C, and has good formability, and the product surface processed is bright and clean, is easy to dyeing and plating.Therefore it can be used to the articles for daily use such as appliance shell, toy.The high building blocks of common pleasure are exactly ABS goods.
When the adjustment of blended three kinds of component proportionss, the physicals of ABS resin has certain change: 1,3-butadiene provides low temperature ductility and shock resistance for ABS resin, but too much divinyl can reduce the hardness of resin, gloss and mobility; Vinyl cyanide provides the character of the chemical corrosions such as hardness, thermotolerance, acidproof alkali salt for ABS resin; Vinylbenzene provides hardness, the mobility of processing and the smooth finish of product surface for ABS resin.In ABS resin, rubber grain is disperse phase, is scattered in resin external phase.When being hit, crosslinked rubber grain bears and absorbs this energy, makes stress dispersion, thus stops breach development, improves impart tear with this.
ABS is vinyl cyanide, divinyl and cinnamic terpolymer, and A represents vinyl cyanide, and B represents divinyl, and S represents vinylbenzene.Wherein, vinyl cyanide accounts for 15% ~ 35%, and divinyl accounts for 5% ~ 30%, and vinylbenzene accounts for 40% ~ 60%, and modal ratio is A:B:S=20:30:50, and now ABS resin fusing point is 175 DEG C.
When the adjustment of blended three kinds of component proportionss, the physicals of resin has certain change: 1,3-butadiene provides low temperature ductility and shock resistance for ABS resin, but too much divinyl can reduce the hardness of resin, gloss and mobility; Vinyl cyanide provides the character of the chemical corrosions such as hardness, thermotolerance, acidproof alkali salt for ABS resin; Vinylbenzene provides hardness, the mobility of processing and the smooth finish of product surface for ABS resin.In ABS resin, rubber grain is disperse phase, is scattered in SAN resin external phase.When being hit, crosslinked rubber grain bears and absorbs this energy, makes stress dispersion, thus stops breach development, improves impart tear with this.
ABS resin is for raw material with divinyl, vinylbenzene, vinyl cyanide.Adopt emulsion polymerization to make polybutadiene latex, then carry out emulsion graft copolymerization with this latex and vinylbenzene and vinyl cyanide, just obtain ABS powder.Suspension polymerization is adopted to make AS(SAN) emulsified material.Then by ABS powder, SAN emulsified material and the blending according to a certain ratio of various additive, through extruding pelletization, ABS resin product is finally obtained.
Embodiment 1: the ABS that the embodiment of the present invention uses is vinyl cyanide, divinyl and cinnamic terpolymer, and A represents vinyl cyanide, and B represents divinyl, and S represents vinylbenzene; Wherein, vinyl cyanide accounts for 25% ~ 30%, and divinyl accounts for 16% ~ 28%, and vinylbenzene accounts for 45% ~ 60%.
High heat conductivity nanocomposite plastic of the present invention, the filler that raw materials comprises is one or more in following compounds (or mixture): MgO, Al
2o
3, Si
3n
4, BN, high purity carbon dust, AlN, ZnO, KAl (SO
4)
212H
2o(alum), Al
2o
3-2SiO
2-2H
2o(kaolin).
Embodiment 2: the MgO that the embodiment of the present invention uses is nano-MgO particle.
Nano-powder material industrialized producing technology requires that preparation method is simple, and production cost is suitable for, and reproducible, powder granularity is even, product purity is high, reunion degree is low.Method about nano magnesia synthesis in prior art is a lot, but in fact can be applied to industrial less.One is because problems such as equipment, cost, raw material, scale, investments; Two is that some technique is still in the laboratory study stage, and realize suitability for industrialized production and have any problem, even some may not realize suitability for industrialized production.
The present embodiment adopts indoor temperature solid phase method to prepare MgO particle.
Solid-phase reaction of the present invention overcomes conventional wet and prepares the agglomeration traits that magnesium oxide nanoparticle exists, and has reaction without the need to solvent, the advantage such as productive rate is high, reaction conditions is easy; And overcome that the efficiency existed in original solid-phase reaction is low, the shortcoming of the oxidizable distortion of particle.
The concrete grammar that the present embodiment indoor temperature solid phase method prepares MgO particle is: by MgCI solution and Na
2cO
3(raw material mass mixture ratio 1:1.2) solution, with PVA solution (polyvinyl alcohol solution) for properties-correcting agent, reaction produces precipitation MgCO
3precipitation, then under 75 ~ 85 DEG C of constant temperature, the mode transformed by precipitation obtains alkali formula carbon formula magnesium presoma.50 ~ 60 DEG C of standing alkali formula carbon formula magnesium presoma precipitation 24-30 hour.Finally pass at Ar air-flow, temperature is calcination under the condition of 600 ~ 650 DEG C, obtains nano-MgO particle.Adopt PVA as polymeric surface active agent, control the reunion of particle, obtained nano-MgO particle dispersion is better, and be cubic structure, substantially spherical in shape, its particle diameter is 25-35nm.
Embodiment 3-1: the Si that the embodiment of the present invention uses
3n
4for nano silicon nitride silicon grain, meet following index:
Embodiment 3-2: the Si that the embodiment of the present invention uses
3n
4it can also be highly heat-conductive silicon nitride.Common silicon nitride has randomly-oriented sintering structure.Highly heat-conductive silicon nitride adds kind of crystal grain (diameter 1um, long 3-4um) at material powder (below particle diameter 1um), makes the sub-orientations of this all crystal grain, forms the fibrous silicon nitride structure reaching 100um with orientation.Due to the formation of filamentary structure, thermal conductivity presents each diversity, and on oriented structure direction, thermal conductivity is 120w/ (mK), is 3 times of common silicon nitride, is equivalent to the thermal conductivity of steel.
Embodiment 4: the BN that the embodiment of the present invention uses is nano silicon nitride boron particles, meets following index:
Embodiment 5: the embodiment of the present invention use high purity carbon dust be: Dongguan pull together produce 10000 high-purity carbon dusts.Performance index are:
| Fixed carbon: | 99.99% | Specification: | 10000 orders |
| The trade mark: | 18925457433 | Moisture: | 0.015% |
| Turgidity: | 1-2 doubly | Screen overflow granularity: | 0.0006% |
| Ash content: | 0.85 | Volatile matter: | 0.01％ |
| Screen underflow granularity: | 0.0005% |
Embodiment 6: the AlN filler that the embodiment of the present invention uses is: AlN whisker and AlN particle do filler.In the embodiment of the present invention, using ABS as matrix, AlN whisker and AlN particle (below 6um) are filled, and obtain the matrix material of the highest thermal conductivity 28.2W/ (m.K), AlN whisker and AlN particle ratio (mass ratio) are 1:40 ~ 60.Invention further contemplates the confounding effect of filler and coupling agent to the impact of matrix material heat conductivility.By AlN whisker and the AlN mix particles of adequate rate, give matrix material higher heat-conductivity and lower thermal expansivity than independent whisker and particle.By using coupling agent silane treatment, the thermal conductivity of the ABS composite material of AlN particulate reinforcement improves 98%, and thermal conductivity raising is due to the interface by improving matrix and particle, and the contact resistance of filler-matrix reduces.
Embodiment 7: the ZnO that the embodiment of the present invention uses is: nano granular of zinc oxide.Its performance index are:
The embodiment of the present invention use nano zine oxide, for above-mentioned: 1 class nano-ZnO, 2 class nano-ZnOs, 3 class nano-ZnOs, in one.
Embodiment 8: embodiment of the present invention High heat conductivity nanocomposite plastic is prepared by following steps:
The first step, synthetic rubber: by plastic modified mechanical pelleting, by the matrix in embodiment 1-8, auxiliary material, and plastic grains made by coupling agent;
The parts by weight of described raw material are: ABS50-85 part, MgO22-28 part, Al
2o
310-16 part, Si
3n
43-8 part, BN8-12 part, ZnO8-15 part, high purity carbon dust 12-16 part, AlN7-11 part, alum 2-4 part, kaolin 2-4 part, coupling agent: 1-3 part;
Second step, shaping: by injection moulding machine injection moulding;
3rd step, dries material: add in injecting machine material tube by the plastic cement after shaping, dries material temperature degree 115-135 degree 2-4 hour; Again temperature be 225 degree-265 spend time injection moulding pressurization, injection moulding pressurization scope be 50-65kgf/ ㎝
2, the time is 45-50 second, carries out injection moulding.
Embodiment 9: performance test and characterization experiments contrast.
Heat conductivility: carry out with reference to national standard " plastics Determination of conductive coefficients method " (GB9342288), specimen finish is 100mm; Employing steady state method is measured; Tensile property is tested: carry out with reference to national standard " plastic tensile method for testing performance " (GB1040292); adopt I type sample; impact property is tested: undertaken by national standard " plastics charpy impact test method " (GB1043293), adopts non-notch impact specimen; Scanning electron microscope analysis: after tension specimen stretch broken, fracture surface of sample surface metal spraying is observed in JXA2840 scanning electronic microscope.
Prepared by sample
The pre-treatment of raw material: baking oven is put in the mineral filler adding coupling agent, drying conditions is dry 3 ~ 5h under 100 °, make coupling agent and filler grain further combined with.Must carry out drying to pellet before ABS is shaping, drying conditions dries 4 ~ 6h at 120 DEG C.
Extruding pelletization: the resin after oven dry, filler are put into height and stirred machine batch mixing, with TE234 twin screw extruder extruding pelletization.
Injection molding: with plastic injection agent injection stretch sample, impact specimen, carry out Mechanics Performance Testing.
The preparation of heat conduction sample: with hydropress by the disk mold heated of Φ 100mm to 120 DEG C, then the molten mass in injection moulding machine is expelled in disk mould, shaped by fluid pressure under the pressure of 11MPa.
Formulating of recipe: using ABS as matrix; Using one or more in following raw material as filler: MgO, Al
2o
3, Si
3n
4, BN, high purity carbon dust, AlN, ZnO, KAl (SO
4)
212H
2o(alum), Al
2o
3-2SiO
2-2H
2o(kaolin); Design 12 kinds is total to, in Table 2-1 using vinyltriethoxysilane (A-151) as coupling agent.The thermal conductivity of pure ABS matrix is 0.24W/m.K.
The table various formula heat conductivility of 2-1 and mechanical property
Filler 1:ABS50 part, MgO22 part, BN8 part, 1 class nano-ZnO 8 parts, high purity carbon dust 12 parts, AlN7 part, 2 parts, alum, kaolin 2 parts, coupling agent 1 part;
Filler 2:ABS85 part, MgO28 part, Al
2o
316 parts, Si
3n
4(high thermal conductivity) 8 parts, BN12 part, high purity carbon dust 16 parts, coupling agent 3 parts;
Filler 3:ABS61 part, MgO24 part, Al
2o
313 parts, Si
3n
4(nano particle) 5 parts, high purity carbon dust 14 parts, AlN9 part, 3 parts, alum, coupling agent 2 parts;
Filler 4:ABS66 part, MgO23 part, Al
2o
315 parts, Si
3n
4(high thermal conductivity) 7 parts, BN12 part, AlN8 part, 2 parts, alum, kaolin 4 parts, coupling agent 1 part;
Filler 5:ABS75 part, MgO27 part, Si
3n
4(nano particle) 6 parts, BN8 part, high purity carbon dust 16 parts, kaolin 2 parts, coupling agent 3 parts;
Filler 6:ABS77 part, Al
2o
315 parts, Si
3n
4(nano particle) 7 parts, BN11 part, high purity carbon dust 15 parts, AlN7 part, 3 parts, alum, kaolin 3 parts, coupling agent 3 parts;
Filler 7:ABS80 part, Al
2o
312 parts, Si
3n
4(high thermal conductivity) 8 parts, BN8 part, 1 class nano-ZnO 8 parts, high purity carbon dust 12 parts, AlN10 part, kaolin 2 parts, coupling agent 2 parts;
Filler 8:ABS82 part, MgO28 part, Al
2o
313 parts, Si
3n
4(high thermal conductivity) 4 parts, 2 class nano-ZnO 15 parts, high purity carbon dust 16 parts, AlN11 part, coupling agent 1 part;
Filler 9:ABS58 part, MgO23 part, BN10 part, 3 class nano-ZnOs 10 parts, high purity carbon dust 14 parts, AlN9 part, kaolin 3 parts, coupling agent 3 parts;
Filler 10:ABS84 part, Al
2o
313 parts, Si
3n
4(high thermal conductivity) 7 parts, BN8 part, 1 class nano-ZnO 8 parts, high purity carbon dust 16 parts, coupling agent: 1 part;
Filler 11:ABS69 part, MgO25 part, Al
2o
313 parts, BN11 part, 2 class nano-ZnOs 11 parts, high purity carbon dust 14 parts, AlN9 part, 2 parts, alum, coupling agent 1 part;
Filler 12:ABS78 part, MgO26 part, Al
2o
315 parts, Si
3n
4(high thermal conductivity) 5 parts, BN9 part, 3 class nano-ZnOs 11 parts, high purity carbon dust 14 parts, kaolin 3 parts, coupling agent 2 parts.
High heat conductivity nanocomposite plastic of the present invention is that thermal conductivity can up to the thermoplastic composite resin of 21.25 ~ 34.56w/mK.The technology of the present invention utilizes unique molecular designing, improves the interaction force of molecule between thermoplastic plastic and filler, and filler high-level efficiency contact each other defines thermal pathways, has increased substantially thermal conductivity.
All above-mentioned this intellecture properties of primary enforcement, not setting restriction this product innovation of other forms of enforcement and/or novel method.Those skilled in the art will utilize this important information, and foregoing is revised, to realize similar implementation status.But all modifications or transformation belong to the right of reservation based on product innovation of the present invention.
The above is only preferred embodiment of the present invention, and be not restriction invention being made to other form, any those skilled in the art may utilize the technology contents of above-mentioned announcement to be changed or be modified as the Equivalent embodiments of equivalent variations.But everyly do not depart from technical solution of the present invention content, any simple modification, equivalent variations and the remodeling done above embodiment according to technical spirit of the present invention, still belong to the protection domain of technical solution of the present invention.
Claims (1)
1. a High heat conductivity nanocomposite plastic, is characterized in that, the raw material of described High heat conductivity nanocomposite plastic comprises matrix and filler; Described matrix is ABS; Comprise filler to comprise: MgO, Al
2o
3, Si
3n
4, BN and ZnO;
The parts by weight of described raw material are: ABS 50-85 part, MgO 22-28 part, Al
2o
310-16 part, Si
3n
43-8 part, BN 8-12 part, ZnO 8-15 part;
Described filler comprises further: high purity carbon dust 12-16 part; Described filler comprises further: AlN7-11 part, alum 2-4 part, kaolin 2-4 part;
Described filler AlN is: AlN whisker and AlN particle do filler;
Described Si
3n
4for highly heat-conductive silicon nitride, described highly heat-conductive silicon nitride adds diameter 1 μm at particle diameter less than 1 μm material powder, and long 3-4 μm of kind crystal grain, makes the sub-orientations of this all crystal grain, form the fibrous silicon nitride structure reaching 100 μm with orientation;
Described BN is nano silicon nitride boron particles, meets following index:
Described High heat conductivity nanocomposite plastic, prepared by following steps:
The first step, synthetic rubber: by plastic modified mechanical pelleting, by described matrix, filler, and plastic grains made by coupling agent;
Second step, shaping: by injection moulding machine injection moulding;
3rd step, dries material: add in injecting machine material tube by the plastic cement after shaping, dries material temperature degree 115-135 degree 2-4 hour; Again temperature be 225 degree-265 spend time injection moulding pressurization, injection moulding pressurization scope be 50-65kgf/ ㎝
2, the time is 45-50 second, carries out injection moulding.
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|---|---|---|---|
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|---|---|---|---|---|
| CN102286207A (en) * | 2011-06-22 | 2011-12-21 | 四川大学 | Thermoplastic polymer based thermal conductive composite and preparation method thereof |
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|---|---|---|---|---|
| CN102286207A (en) * | 2011-06-22 | 2011-12-21 | 四川大学 | Thermoplastic polymer based thermal conductive composite and preparation method thereof |
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|---|---|---|---|---|
| WO2022214419A1 (en) * | 2021-04-09 | 2022-10-13 | Sensient Cosmetic Technologies | Whitening composition useful for the preparation of cosmetic formulations |
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