CN103013032A - High heat conductivity nanocomposite plastic - Google Patents
High heat conductivity nanocomposite plastic Download PDFInfo
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- CN103013032A CN103013032A CN2012105739769A CN201210573976A CN103013032A CN 103013032 A CN103013032 A CN 103013032A CN 2012105739769 A CN2012105739769 A CN 2012105739769A CN 201210573976 A CN201210573976 A CN 201210573976A CN 103013032 A CN103013032 A CN 103013032A
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Abstract
The invention discloses a high heat conductivity nanocomposite plastic. The raw materials of the high heat conductivity nanocomposite plastic comprise a matrix and fillers, wherein the matrix is 50-85 parts ABS (acrylonitrile butadiene styrene) by weight; the fillers comprise 22-28 parts of MgO, 10-16 parts of Al2O3, 3-8 parts of Si3N4, 8-12 parts of BN and 8-15 parts of ZnO by weight; and the fillers further comprise 12-16 parts of high purity carbon powder by weight. The nanocomposite plastic has the beneficial effects that experimental comparison is carried out on improving the heat conducting capability of the polymer matrix by using the fillers in different shapes and sizes in a mixed manner; the heat conductivity of the composite material is greatly improved by using the mixed fillers; and granules and whiskers with certain length-diameter ratios are utilized to form a continuous heat conduction network chain.
Description
Technical field
The present invention relates to the nanometer new material technology field, particularly relate to a kind of high heat conducting nano complex plastic.
Background technology
Now, because electronic product more and more is tending towards miniaturization, therefore those easily integrated and miniaturization and the good complex plastic substrate of snappiness are widely used, but because the multiple stratification of the highly integrated and laminate of unicircuit certainly leads to the heat release problem, so the requirement of the heat conductivility of these materials just become the task of top priority.
The methods of forming such as ABS resin can be with injection moulding, extrude, vacuum, blowing and roll-in are processed as plastic cement, and also available machinery, bonding, coating, the vacuum method such as steaming is carried out secondary processing.Because its high comprehensive performance, purposes is more extensive, mainly as engineering materials, also can be used for the family life apparatus.Because its oil resistant and acid-and base-resisting, salt and chemical reagent etc. are functional, and have electrodepositable, plate the advantages such as glossy good, light specific gravity behind the metal level, price are low, can be used to replace some metal.Also can synthesize many kinds such as self-extinguishing type and heat resistant type, to adapt to various uses.
People have tentatively solved this problem with dielectric metal oxide and other compound filled polymers in recent years.The filler of insulated type heat conduction plastic cement mainly comprises: metal oxide such as BeO, MgO, A1
2O
3, CaO, NIO; Metal nitride such as AlN, BN etc.; Carbide such as SiC, B
4C
3Deng.They have higher thermal conductivity, and what is more important compares with metal powder excellent electrical insulating property is arranged, so they can guarantee that end article has good electrical insulating property, and this is vital in electronic apparatus industry.
Research and application for the heat conduction plastic cement are a lot, can simply classify to it, can be divided into thermoplasticity heat-conducting resin and thermoset heat-conducting resin according to the body material kind; Kind by particle filled composite can be divided into: metal filled type, metal oxide filled-type, metal nitride filled-type, inorganic non-metallic filled-type, fiber filled type heat conduction plastic cement; Also can divide according to a certain character of heat conduction plastic cement, such as can be divided into insulated type heat conduction plastic cement and nonisulated type heat conduction plastic cement according to its electrical insulation capability.
Because plastic cement itself has insulativity, the therefore electrical insulation capability of most heat conduction plastic cement finally is that the insulating property by particle filled composite determine.The filler that is used for nonisulated type heat conduction plastic cement usually is metal powder, graphite, carbon black, carbon fiber etc., the characteristics of this class filler are to have good thermal conductivity, can easily make material obtain high heat conductivility, but simultaneously also so that the decreasing insulating of material even become electro-conductive material.Therefore in the less demanding situation, can use above-mentioned filler for electrical insulating property at the Working environment of material.And also necessarily require under certain conditions the heat conduction plastic cement to have low electrical insulating property to meet specific requirement, such as antistatic material, electromagnetic shielding material etc.
Flourish information industry in the last few years, performance to macromolecular material has proposed Secretary, especially the development for the heat conduction plastic cement provides development space, the application of heat conduction plastic cement on computer fittings will improve the heat dissipation problem of computer and improve its travelling speed and stability, such as CPU, notebook computer shell and various surface-mounted integrated circuit, these materials all require heat conductive insulating.Macromolecular material insulate, but as thermally conductive material, pure macromolecular material generally is inefficient, because macromolecular material is the poor conductor of heat mostly, the macromolecular material thermal conductivity is about the 1/500-1/600 of metal.The thermal conductivity of foam plastic only has 0.02-0.046W/m.K, is about 1/1500 of metal, 1/40 of cement concrete, and 1/20 of common brick is desirable thermal insulation material. expand it in the application in heat conduction field, must carry out modification to macromolecular material.The thermal conductivity of macromolecular material, metal and metal oxide sees Table 1-1, table 1-2, table 1-3.
The high molecular thermal conductivity of table 1-1
The thermal conductivity of table 1-2 metal and metal oxide
Can substantially have following several as metal and the mineral filler of heat conduction particle:
(l) metal powder filler: copper powder, aluminium powder, bronze, silver powder.
(2) metal oxide: aluminum oxide, oxidation is secret, barium oxide, magnesium oxide, zinc oxide.
(3) metal nitride: aluminium nitride, boron nitride.
(4) inorganic non-metallic: graphite, silicon carbide.
Ceramic is during as heat conductive filler filled high polymer material matrix, and the quality of filling effect depends primarily on following factor: kind, the characteristic of (1) polymeric matrix; (2) shape of filler, particle diameter, distribution of sizes; (3) interaction of the interface binding characteristic of filler and matrix and two-phase.
The thermal conductivity of some packing materials of table 1-3
Because the adding of filler descends the mechanical property of material.Therefore, the conductivity that in the design of matrix material, not only will consider, and require that stability of material is good, nontoxic, satisfactory mechanical property and inexpensive.Another selection with respect to filled polymer is the polymkeric substance that use itself has the good heat conductive performance, but materials is expensive and performance on deficient in stability, become their main drawback in the use.Plastic cement is the material of output maximum in the macromolecular material.
The market requirement of conductivity macromolecular material is all increasing every year, and wherein the market demand of heat conduction plastic cement increases faster.Therefore the research of plastic cement heat conductivility is caused various countries investigator's interest, and done good work.The at present research of fillibility heat conduction plastic cement, most of method that adopts physics to fill, heat conductivility is poor, and mechanical property descends serious, and production cost is high.But along with the market of expanding day and going deep into of research, the heat conduction plastic cement will have a large development, especially the research and development of nano heat-conductive material, high heat conduction mass polymer material preparation, the discussion of polymkeric substance thermal conduction mechanism should become the developing direction of heat-conducting polymer material.
Summary of the invention
Technical problem to be solved by this invention is to be, electric packaged material requires heat conduction, insulate and have lower specific inductivity, good heat-conductive characteristic and low thermal expansivity.Materials is the larger application market of heat-conducting polymer material.The present invention is inorganic particulate filler superfine, even during to nano-scale, the variation of matter can occur because of the variation of interatomic distance in the particle and structure the thermal conductivity of itself.Thermal conductivity such as aluminium nitride is about 36w/ (m.K), and the thermal conductivity of nano level aluminium nitride can reach 320w/ (m.K).The trickle magnesium oxide of high purity, its thermal conductivity are not less than 50w/ (m.K), are equivalent to 4 times of silicon oxide, 3 times of aluminum oxide.
For solving the problems of the technologies described above, obtain the matrix material of high thermal conductivity, the invention provides a kind of high heat conducting nano complex plastic, the raw material of described high heat conducting nano complex plastic comprises matrix and filler; Described matrix is ABS; Comprise that filler comprises: MgO, Al
2O
3, Si
3N
4, BN and ZnO.
The parts by weight of described raw material can be ABS50-85 part, MgO22-28 part, Al
2O
310-16 part, Si
3N
43-8 part, BN8-12 part, ZnO8-15 part.
Described filler may further include: high purity carbon dust 12-16 part.
Described filler can further include: AlN7-11 part.
Described filler also may further include: alum 2-4 part, kaolin 2-4 part.
Described ABS can be vinyl cyanide, divinyl and cinnamic terpolymer, and A represents vinyl cyanide, and B represents divinyl, and S represents vinylbenzene; Wherein, vinyl cyanide accounts for 25% ~ 30%, and divinyl accounts for 16% ~ 28%, and vinylbenzene accounts for 45% ~ 60%.
Described filler AlN can for: AlN whisker and AlN particle are done filler.
Described Si
3N
4Can be highly heat-conductive silicon nitride.
Described BN can be the nm-class boron nitride particle, satisfies following index:
Described high heat conducting nano complex plastic can prepare by following steps:
The first step, synthetic rubber: by plastic modified mechanical pelleting, with the matrix among the embodiment 1-8, auxiliary material, and coupling agent is made plastic grains;
Second step, moulding: by the injection moulding machine injection moulding;
The 3rd step, baking material: the plastic cement after the moulding is added in the injecting machine material tube baking material temperature degree 115-135 degree 2-4 hour; Be the injection moulding pressurizations when spending of 225 degree-265 in temperature again, injection moulding pressurization scope is 50-65kgf/ ㎝
2, the time is 45-50 second, carries out injection moulding.
The present invention mixes the thermal conduction capability that uses the raising polymer-based carbon by the filler to various different shapeies and size and has carried out the experiment contrast, and filler comprises MgO, Al
2O
3, Si
3N
4, BN, high purity carbon dust, AlN, ZnO, KAl (SO
4)
212H
2O(alum) and/or Al
2O
3-2SiO
2-2H
2O(kaolin) etc.The present invention significantly improves the thermal conductivity of matrix material with mixed fillers.Utilization of the present invention has particle, the whisker of certain length-to-diameter ratio to form continuous heat conduction network chain; Select the filler combination of different particle diameters, reach higher filling density: the interface that utilizes coupling agent to improve filler and matrix, to reduce thermal resistance at the interface; Improve thermal conductivity with nanomaterial-filled plastic cement.High heat conducting nano complex plastic of the present invention is that thermal conductivity is up to the thermoplastic composite resin of 21.25 ~ 34.56w/mK.The technology of the present invention is utilized unique molecular designing, has improved the interaction force of molecule between thermoplastic plastic and the filler, and filler high-level efficiency contact has each other formed the heat passage, has increased substantially thermal conductivity.
Embodiment
Describe embodiments of the present invention in detail below with reference to embodiment, how the utilisation technology means solve technical problem to the present invention whereby, and the implementation procedure of reaching technique effect can fully understand and implements according to this.
High heat conducting nano complex plastic of the present invention, its raw materials comprises matrix and filler; Described matrix is ABS.
ABS resin is little yellow solid, and certain toughness is arranged, and density is about 1.04 ~ 1.06g/cm3.It is antiacid, the corrosive power of alkali, salt is more intense, also can tolerate to a certain extent organic solvent dissolution.ABS resin can be acted normally under-25 ℃ ~ 60 ℃ environment, and good formability is arranged, and the product surface that processes is bright and clean, is easy to dyeing and plating.Therefore it can be used to the articles for daily use such as appliance shell, toy.The high building blocks of common pleasure are exactly the ABS goods.
When the adjustment of three kinds of component proportionss of blend, the physicals of ABS resin has certain variation: 1,3-butadiene provides low temperature ductility and shock resistance for ABS resin, but too much divinyl can reduce hardness, gloss and the flowability of resin; Vinyl cyanide provides the character of the chemical corrosions such as hardness, thermotolerance, acidproof alkali salt for ABS resin; Vinylbenzene provides the flowability of hardness, processing and the smooth finish of product surface for ABS resin.In ABS resin, rubber grain is disperse phase, is scattered in the resin external phase.When being hit, crosslinked rubber grain bears and absorbs this energy, makes stress dispersion, thereby stops the breach development, improves impart tear with this.
ABS is vinyl cyanide, divinyl and cinnamic terpolymer, and A represents vinyl cyanide, and B represents divinyl, and S represents vinylbenzene.Wherein, vinyl cyanide accounts for 15% ~ 35%, and divinyl accounts for 5% ~ 30%, and vinylbenzene accounts for 40% ~ 60%, and modal ratio is A:B:S=20:30:50, and this moment, the ABS resin fusing point was 175 ℃.
When the adjustment of three kinds of component proportionss of blend, the physicals of resin has certain variation: 1,3-butadiene provides low temperature ductility and shock resistance for ABS resin, but too much divinyl can reduce hardness, gloss and the flowability of resin; Vinyl cyanide provides the character of the chemical corrosions such as hardness, thermotolerance, acidproof alkali salt for ABS resin; Vinylbenzene provides the flowability of hardness, processing and the smooth finish of product surface for ABS resin.In ABS resin, rubber grain is disperse phase, is scattered in the SAN resin external phase.When being hit, crosslinked rubber grain bears and absorbs this energy, makes stress dispersion, thereby stops the breach development, improves impart tear with this.
ABS resin is as raw material take divinyl, vinylbenzene, vinyl cyanide.Adopt emulsion polymerization to make polybutadiene latex, carry out emulsion graft copolymerization with this latex and vinylbenzene and vinyl cyanide again, just make the ABS powder.Adopt suspension polymerization to make AS(SAN) emulsified material.Then with ABS powder, SAN emulsified material and the according to a certain ratio blending of various additive, through extruding pelletization, finally obtain the ABS resin product.
Embodiment 1: the ABS that the embodiment of the invention is used is vinyl cyanide, divinyl and cinnamic terpolymer, and A represents vinyl cyanide, and B represents divinyl, and S represents vinylbenzene; Wherein, vinyl cyanide accounts for 25% ~ 30%, and divinyl accounts for 16% ~ 28%, and vinylbenzene accounts for 45% ~ 60%.
High heat conducting nano complex plastic of the present invention, the filler that comprises in the raw materials are one or more in the following compounds (or mixture): MgO, Al
2O
3, Si
3N
4, BN, high purity carbon dust, AlN, ZnO, KAl (SO
4)
212H
2O(alum), Al
2O
3-2SiO
2-2H
2O(kaolin).
Embodiment 2: the MgO that the embodiment of the invention is used is the nano-MgO particle.
The nano-powder material industrialized producing technology requires the preparation method simple, and production cost is suitable, good reproducibility, and powder granularity is even, product purity is high, the reunion degree is low.A lot of about the synthetic method of nano magnesia in the prior art, but in fact can be applied to industrial less.The one, because problems such as equipment, cost, raw material, scale, investments; The 2nd, some technique still is in the laboratory study stage, and the realization suitability for industrialized production is had any problem, even some may not realize suitability for industrialized production.
The present embodiment adopts indoor temperature solid phase method to prepare the MgO particle.
Solid-phase reaction of the present invention has overcome conventional wet and has prepared the agglomeration traits that the bitter earth nano particle exists, and has reaction and need not the advantages such as solvent, productive rate is high, reaction conditions is easy; And overcome that the efficient that exists in original solid-phase reaction is low, the shortcoming of the easy oxidation distortion of particle.
The concrete grammar that the present embodiment indoor temperature solid phase method prepares the MgO particle is: with MgCI solution and Na
2CO
3(raw material mass mixture ratio 1:1.2) solution, take PVA solution (polyvinyl alcohol solution) as properties-correcting agent, reaction produces precipitation MgCO
3Precipitation, then under 75 ~ 85 ℃ of constant temperature, the mode that transforms by precipitation has obtained alkali formula carbon formula magnesium presoma.50 ~ 60 ℃ left standstill alkali formula carbon formula magnesium presoma precipitation 24-30 hour.Pass at the Ar air-flow at last, temperature is calcination under 600 ~ 650 ℃ the condition, has obtained the nano-MgO particle.Adopt PVA as polymeric surface active agent, controlled the reunion of particle, prepared nano-MgO particle dispersion is better, is cubic structure, and is substantially spherical in shape, and its particle diameter is 25-35nm.
Embodiment 3-1: the Si that the embodiment of the invention is used
3N
4Be the nano silicon nitride silicon grain, satisfy following index:
Embodiment 3-2: the Si that the embodiment of the invention is used
3N
4Can also be highly heat-conductive silicon nitride.Common silicon nitride has randomly-oriented sintering structure.Highly heat-conductive silicon nitride is to add kind of crystal grain (diameter 1um, long 3-4um) at material powder (below the particle diameter 1um), makes the sub-orientations of this all crystal grain, forms the fibrous silicon nitride structure that reaches 100um with orientation.Because the formation of filamentary structure, thermal conductivity presents each diversity, and thermal conductivity is 120w/ (mK) on the oriented structure direction, is 3 times of common silicon nitride, is equivalent to the thermal conductivity of steel.
Embodiment 4: the BN that the embodiment of the invention is used is the nano silicon nitride boron particles, satisfies following index:
Embodiment 5: the high purity carbon dust that the embodiment of the invention is used is: the 10000 high pure carbon powder of pulling together to produce in the Dongguan.Performance index are:
| Fixed carbon: | 99.99% | Specification: | 10000 orders |
| The trade mark: | 18925457433 | Moisture: | 0.015% |
| Turgidity: | 1-2 doubly | The screen overflow granularity: | 0.0006% |
| Ash content: | 0.85 | Volatile matter: | 0.01％ |
| The screen underflow granularity: | 0.0005% | ? | ? |
Embodiment 6: the AlN filler that the embodiment of the invention is used is: AlN whisker and AlN particle are done filler.In the embodiment of the invention, as matrix, AlN whisker and AlN particle (6um is following) are filled, and obtain the matrix material of the highest thermal conductivity 28.2W/ (m.K) with ABS, and AlN whisker and AlN particle ratio (mass ratio) are 1:40 ~ 60.What the present invention had further studied filler mixes effect and coupling agent to the impact of matrix material heat conductivility.With AlN whisker and the AlN mix particles of adequate rate, give matrix material higher heat-conductivity and lower thermal expansivity than independent with whisker and particle.By using the coupling agent silane treatment, the thermal conductivity of the ABS matrix material of AlN particulate reinforcement improves 98%, and it is because by improving the interface of matrix and particle, the contact resistance of filler-matrix reduces that thermal conductivity improves.
Embodiment 7: the ZnO that the embodiment of the invention is used is: nano granular of zinc oxide.Its performance index are:
The nano zine oxide that the embodiment of the invention is used, for above-mentioned: 1 class nano-ZnO, 2 class nano-ZnOs, 3 class nano-ZnOs, in a kind of.
Embodiment 8: embodiment of the invention high heat conducting nano complex plastic prepares by following steps:
The first step, synthetic rubber: by plastic modified mechanical pelleting, with the matrix among the embodiment 1-8, auxiliary material, and coupling agent is made plastic grains;
The parts by weight of described raw material are: ABS50-85 part, MgO22-28 part, Al
2O
310-16 part, Si
3N
43-8 part, BN8-12 part, ZnO8-15 part, high purity carbon dust 12-16 part, AlN7-11 part, alum 2-4 part, kaolin 2-4 part, coupling agent: 1-3 part;
Second step, moulding: by the injection moulding machine injection moulding;
The 3rd step, baking material: the plastic cement after the moulding is added in the injecting machine material tube baking material temperature degree 115-135 degree 2-4 hour; Be the injection moulding pressurizations when spending of 225 degree-265 in temperature again, injection moulding pressurization scope is 50-65kgf/ ㎝
2, the time is 45-50 second, carries out injection moulding.
Embodiment 9: performance test and sign experiment contrast.
Heat conductivility: (GB9342288) carry out with reference to national standard " plastics Determination of conductive coefficients method ", specimen finish is 100mm; The employing steady state method is measured; Tensile property test: (GB1040292) carry out with reference to national standard " plastic tensile method for testing performance ", adopt I type sample, impact property test: (GB1043293) carry out by national standard " plastics charpy impact test method ", adopt the non-notch impact specimen; Scanning electron microscope analysis: after the tension specimen stretch broken, fracture surface of sample surface metal spraying is observed in the JXA2840 scanning electronic microscope.
The sample preparation
The pre-treatment of raw material: baking oven is put in the mineral filler that will add coupling agent, and drying conditions is 100 ° of lower oven dry 3～5h, make coupling agent and filler grain further combined with.Must carry out drying to pellet before the ABS moulding, drying conditions is at 120 ℃ of oven dry 4～6h.
Extruding pelletization: the resin after will drying, filler are put into height and are stirred the machine batch mixing, with TE234 twin screw extruder extruding pelletization.
Injection molding: with plastic injection agent injection stretch sample, impact specimen, carry out Mechanics Performance Testing.
The preparation of heat conduction sample: with the disk mold heated to 120 of Φ 100mm ℃, then the molten mass in the injection moulding machine is expelled in the disk mould shaped by fluid pressure under the pressure of 11MPa with hydropress.
Formulating of recipe: with ABS as matrix; With in the following raw material one or more as filler: MgO, Al
2O
3, Si
3N
4, BN, high purity carbon dust, AlN, ZnO, KAl (SO
4)
212H
2O(alum), Al
2O
3-2SiO
2-2H
2O(kaolin); Be total to 12 kinds of designs with vinyltriethoxysilane (A-151) as coupling agent, see Table 2-1.The thermal conductivity of pure ABS matrix is 0.24W/m.K.
The table various prescription heat conductivilitys of 2-1 and mechanical property
Filler 1:ABS50 part, MgO22 part, BN8 part, 8 parts of 1 class nano-ZnOs, 12 parts of high purity carbon dusts, AlN7 part, 2 parts in alum, 2 parts of kaolin, 1 part of coupling agent;
Filler 2:ABS85 part, MgO28 part, Al
2O
316 parts, Si
3N
4(high thermal conductivity) 8 parts, BN12 part, 16 parts of high purity carbon dusts, 3 parts of coupling agents;
Filler 3:ABS61 part, MgO24 part, Al
2O
313 parts, Si
3N
4(nano particle) 5 parts, 14 parts of high purity carbon dusts, AlN9 part, 3 parts in alum, 2 parts of coupling agents;
Filler 4:ABS66 part, MgO23 part, Al
2O
315 parts, Si
3N
4(high thermal conductivity) 7 parts, BN12 part, AlN8 part, 2 parts in alum, 4 parts of kaolin, 1 part of coupling agent;
Filler 5:ABS75 part, MgO27 part, Si
3N
4(nano particle) 6 parts, BN8 part, 16 parts of high purity carbon dusts, 2 parts of kaolin, 3 parts of coupling agents;
Filler 6:ABS77 part, Al
2O
315 parts, Si
3N
4(nano particle) 7 parts, BN11 part, 15 parts of high purity carbon dusts, AlN7 part, 3 parts in alum, 3 parts of kaolin, 3 parts of coupling agents;
Filler 7:ABS80 part, Al
2O
312 parts, Si
3N
4(high thermal conductivity) 8 parts, BN8 part, 8 parts of 1 class nano-ZnOs, 12 parts of high purity carbon dusts, AlN10 part, 2 parts of kaolin, 2 parts of coupling agents;
Filler 8:ABS82 part, MgO28 part, Al
2O
313 parts, Si
3N
4(high thermal conductivity) 4 parts, 15 parts of 2 class nano-ZnOs, 16 parts of high purity carbon dusts, AlN11 part, 1 part of coupling agent;
Filler 9:ABS58 part, MgO23 part, BN10 part, 10 parts of 3 class nano-ZnOs, 14 parts of high purity carbon dusts, AlN9 part, 3 parts of kaolin, 3 parts of coupling agents;
Filler 10:ABS84 part, Al
2O
313 parts, Si
3N
4(high thermal conductivity) 7 parts, BN8 part, 8 parts of 1 class nano-ZnOs, 16 parts of high purity carbon dusts, coupling agent: 1 part;
Filler 11:ABS69 part, MgO25 part, Al
2O
313 parts, BN11 part, 11 parts of 2 class nano-ZnOs, 14 parts of high purity carbon dusts, AlN9 part, 2 parts in alum, 1 part of coupling agent;
Filler 12:ABS78 part, MgO26 part, Al
2O
315 parts, Si
3N
4(high thermal conductivity) 5 parts, BN9 part, 11 parts of 3 class nano-ZnOs, 14 parts of high purity carbon dusts, 3 parts of kaolin, 2 parts of coupling agents.
High heat conducting nano complex plastic of the present invention is that thermal conductivity can be up to the thermoplastic composite resin of 21.25 ~ 34.56w/mK.The technology of the present invention is utilized unique molecular designing, has improved the interaction force of molecule between thermoplastic plastic and the filler, and filler high-level efficiency contact has each other formed the heat passage, has increased substantially thermal conductivity.
This intellecture property of primary enforcement that all are above-mentioned is not set restriction this product innovation of other forms of enforcement and/or novel method.Those skilled in the art will utilize this important information, and foregoing is revised, to realize similar implementation status.But all modifications or transformation belong to the right of reservation based on product innovation of the present invention.
The above only is preferred embodiment of the present invention, is not to be the restriction of invention being made other form, and any those skilled in the art may utilize the technology contents of above-mentioned announcement to be changed or be modified as the equivalent embodiment of equivalent variations.But every technical solution of the present invention content that do not break away to any simple modification, equivalent variations and remodeling that above embodiment does, still belongs to the protection domain of technical solution of the present invention according to technical spirit of the present invention.
Claims (10)
1. a high heat conducting nano complex plastic is characterized in that, the raw material of described high heat conducting nano complex plastic comprises matrix and filler; Described matrix is ABS; Comprise that filler comprises: MgO, Al
2O
3, Si
3N
4, BN and ZnO.
2. described high heat conducting nano complex plastic according to claim 1, its feature exists, and the parts by weight of described raw material are: ABS50-85 part, MgO22-28 part, Al
2O
310-16 part, Si
3N
43-8 part, BN8-12 part, ZnO8-15 part.
3. described high heat conducting nano complex plastic according to claim 2 is characterized in that, described filler further comprises: high purity carbon dust 12-16 part.
4. each described high heat conducting nano complex plastic is characterized in that according to claim 1-3, and described filler further comprises: AlN7-11 part.
5. each described high heat conducting nano complex plastic is characterized in that according to claim 1-4, and described filler further comprises: alum 2-4 part, kaolin 2-4 part.
6. each described high heat conducting nano complex plastic is characterized in that according to claim 1-5, and described ABS is vinyl cyanide, divinyl and cinnamic terpolymer, and A represents vinyl cyanide, and B represents divinyl, and S represents vinylbenzene; Wherein, vinyl cyanide accounts for 25% ~ 30%, and divinyl accounts for 16% ~ 28%, and vinylbenzene accounts for 45% ~ 60%.
7. each described high heat conducting nano complex plastic is characterized in that according to claim 1-6, and described filler AlN is: AlN whisker and AlN particle are done filler.
8. each described high heat conducting nano complex plastic is characterized in that described Si according to claim 1-7
3N
4Be highly heat-conductive silicon nitride.
9. each described high heat conducting nano complex plastic is characterized in that according to claim 1-8, and described BN is the nano silicon nitride boron particles, satisfies following index:
10. each described high heat conducting nano complex plastic is characterized in that according to claim 1-9, prepares by following steps:
The first step, synthetic rubber: by plastic modified mechanical pelleting, with described matrix, filler, and coupling agent is made plastic grains;
Second step, moulding: by the injection moulding machine injection moulding;
The 3rd step, baking material: the plastic cement after the moulding is added in the injecting machine material tube baking material temperature degree 115-135 degree 2-4 hour; Be the injection moulding pressurizations when spending of 225 degree-265 in temperature again, injection moulding pressurization scope is 50-65kgf/ ㎝
2, the time is 45-50 second, carries out injection moulding.
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