CN103009566B - Injection molding encapsulation die structure - Google Patents

Injection molding encapsulation die structure Download PDF

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Publication number
CN103009566B
CN103009566B CN201210526651.5A CN201210526651A CN103009566B CN 103009566 B CN103009566 B CN 103009566B CN 201210526651 A CN201210526651 A CN 201210526651A CN 103009566 B CN103009566 B CN 103009566B
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China
Prior art keywords
core
base
male die
gripper shoe
die insert
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CN201210526651.5A
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Chinese (zh)
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CN103009566A (en
Inventor
侯强
赖科敏
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SUZHOU BENTENG PLASTIC CO Ltd
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SUZHOU BENTENG PLASTIC CO Ltd
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Priority to CN201210526651.5A priority Critical patent/CN103009566B/en
Publication of CN103009566A publication Critical patent/CN103009566A/en
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Abstract

The invention relates to an injection molding encapsulation die structure, which includes a support plate, wherein a bottom plate is arranged on the support plate; a base is arranged on the bottom plate; a male die insert is arranged above the base and fixed horizontally; return pins and movable cores both penetrating through the male die insert are arranged on the base; horizontally moving sliding block units are arranged under the base on the two sides of the support plate; a first female die insert and a second female die insert are arranged on the male die insert; and a cavity is arranged on the first female die insert to be matched with the return pins. Through the adoption of the structure, when the die is used for encapsulation, the edges of a casing can be encapsulated to prevent the casing from falling off, so that the service life of the product can be prolonged, and the ex-factory cost of the product can be reduced further.

Description

Injection moulding encapsulation die structure
Technical field
The present invention relates to the mould structure in a kind of Injection Industry, especially relate to a kind of injection moulding encapsulation die structure.
Background technology
A kind of processing method of using when injection mo(u)lding is some complex-shaped parts of batch production.Specifically refer to the material melting that is heated to inject die cavity by high pressure, after cooling curing, obtain formed products.Existing product, after being injection molded into housing, carry out encapsulate, because there is a direction, is not carry out encapsulate, if gluing not firm housing and encapsulate are easy to come off, can reduce the service life of product like this, and reduce yield rate, increase the cost that dispatches from the factory.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of encapsulate that can make and is attached on housing, does not also allow caducous injection moulding encapsulation die structure when encapsulate is separated with housing.
The present invention solves the technical scheme that its technical problem takes: a kind of injection moulding encapsulation die structure, comprise gripper shoe, gripper shoe is provided with backing plate, backing plate is provided with base, above base, be provided with male die core, male die core is fixing in the horizontal direction, it is characterized in that: described base is provided with return pin and moving core runs through male die core, described gripper shoe two wing bases have the slide unit of transverse shifting, described male die core is provided with the first mother module core and the second mother module core, and the first mother module core is provided with die cavity and coordinates with return pin.
Further concrete, described slide unit comprises slide block, and slide block is provided with skewed slot, is provided with oblique lock in skewed slot, and the height of slide block is higher than the height of gripper shoe.
Further concrete, at least two, described return pin.
Further concrete, at least two of described moving cores.
The invention has the beneficial effects as follows: after having adopted said structure, when using mould to carry out encapsulate, the limit of housing can be encased, prevent that housing from coming off, can increase the service life of product, further reduce the cost that dispatches from the factory of product.
Accompanying drawing explanation
Fig. 1 is the structural representation that the present invention uses the first mother module core;
Fig. 2 is the structural representation that the present invention uses the second mother module core.
In figure: 1, backing plate; 2, gripper shoe; 3, base; 4, return pin; 5, moving core; 6, male die core; 7, housing; 8, the first mother module core; 9, tiltedly lock; 10, slide block; 11, encapsulate; 12, the second mother module core.
The specific embodiment
A kind of injection moulding encapsulation die structure as depicted in figs. 1 and 2, comprise gripper shoe 2, gripper shoe 2 is provided with backing plate 1, backing plate 1 is provided with base 3, above base 3, be provided with male die core 6, male die core 6 is fixing in the horizontal direction, described base 3 is provided with return pin 4 and moving core 5 runs through male die core 6, described 2 liang of wing bases 3 of gripper shoe have the slide unit of transverse shifting, described male die core 6 is provided with the first mother module core 8 and the second mother module core 9, the first mother module cores 8 and is provided with die cavity and coordinates with return pin 4; Described slide unit comprises slide block 10, and slide block 10 is provided with skewed slot, is provided with oblique lock 9 in skewed slot, and the height of slide block 10 is higher than the height of gripper shoe 2; Described return pin 4 is two; Described moving core 5 is two.
During injection-moulded housing 7, now slide block 10 is by backing plate 1, base 3, moving core 5 and return pin 4 jack-up; Male die core 6 and the first mother module core 8 matched moulds, moving core 5 extend in die cavity through male die core 6, now can injection mo(u)lding housing 7, moving core 5 extrudes steps in housing 7 ends.
During injection moulding encapsulate 11, first, tiltedly lock 9 risings, band movable slider 10 outwards moves; Now, base 3 and backing plate 1 have lacked support, can move down, and drive moving core 5 and return pin 4 to move down; Base 3 finally can be against in gripper shoe 2, and male die core 6 maintains static, and changes the second mother module core 12, and matched moulds, completes encapsulate injection moulding in housing 7 outsides, and the step now producing during injection-moulded housing 7 is also encased by glue; The second mother module core 12 withstands return pin 4 afterwards, and after injection moulding finishes, slide block 10 resets, and return pin 4 can be by the second mother module core 12 jack-up.
It is emphasized that: be only preferred embodiment of the present invention above, not the present invention is done to any pro forma restriction, any simple modification, equivalent variations and modification that every foundation technical spirit of the present invention is done above embodiment, all still belong in the scope of technical solution of the present invention.

Claims (3)

1. an injection moulding encapsulation die structure, comprise gripper shoe (2), gripper shoe (2) is provided with backing plate (1), backing plate (1) is provided with base (3), in base (3) top, be provided with male die core (6), male die core (6) is fixing in the horizontal direction, it is characterized in that: described base (3) is provided with return pin (4) and moving core (5) runs through male die core (6), described gripper shoe (2) two wing bases (3) have the slide unit of transverse shifting, described male die core (6) is provided with the first mother module core (8) and the second mother module core (12), the first mother module core (8) is provided with die cavity and coordinates with return pin (4), described slide unit comprises slide block (10), and slide block (10) is provided with skewed slot, is provided with oblique lock (9) in skewed slot, and the height of slide block (10) is higher than the height of gripper shoe (2).
2. injection moulding encapsulation die structure according to claim 1, is characterized in that: (4) at least two, described return pin.
3. injection moulding encapsulation die structure according to claim 1, is characterized in that: (5) at least two of described moving cores.
CN201210526651.5A 2012-12-10 2012-12-10 Injection molding encapsulation die structure Active CN103009566B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210526651.5A CN103009566B (en) 2012-12-10 2012-12-10 Injection molding encapsulation die structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210526651.5A CN103009566B (en) 2012-12-10 2012-12-10 Injection molding encapsulation die structure

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CN103009566A CN103009566A (en) 2013-04-03
CN103009566B true CN103009566B (en) 2014-12-10

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103624922B (en) * 2013-11-25 2015-11-25 王助正 Injection moulding encapsulation methods

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005254724A (en) * 2004-03-15 2005-09-22 Fukuda Kanagata Kk Resin molding machine
CN200984802Y (en) * 2006-12-25 2007-12-05 胡志军 Filter sealing element glue-coating injection mould
JP2008162213A (en) * 2006-12-29 2008-07-17 Citizen Electronics Co Ltd Injection molding mold
CN101607433A (en) * 2009-06-12 2009-12-23 深圳创维-Rgb电子有限公司 A kind of bicolor injection mould and injection moulding process
CN102120355A (en) * 2011-01-24 2011-07-13 宁波横河模具有限公司 Bicolor injection mould for wheels of dust collectors
CN102145518A (en) * 2010-02-05 2011-08-10 勋龙精密模具(昆山)有限公司 Die frame assembly
CN202156001U (en) * 2011-07-22 2012-03-07 富港电子(东莞)有限公司 Injection molding die
CN203046131U (en) * 2012-12-10 2013-07-10 苏州奔腾塑业有限公司 Die structure for injection molding and rubber coating

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005254724A (en) * 2004-03-15 2005-09-22 Fukuda Kanagata Kk Resin molding machine
CN200984802Y (en) * 2006-12-25 2007-12-05 胡志军 Filter sealing element glue-coating injection mould
JP2008162213A (en) * 2006-12-29 2008-07-17 Citizen Electronics Co Ltd Injection molding mold
CN101607433A (en) * 2009-06-12 2009-12-23 深圳创维-Rgb电子有限公司 A kind of bicolor injection mould and injection moulding process
CN102145518A (en) * 2010-02-05 2011-08-10 勋龙精密模具(昆山)有限公司 Die frame assembly
CN102120355A (en) * 2011-01-24 2011-07-13 宁波横河模具有限公司 Bicolor injection mould for wheels of dust collectors
CN202156001U (en) * 2011-07-22 2012-03-07 富港电子(东莞)有限公司 Injection molding die
CN203046131U (en) * 2012-12-10 2013-07-10 苏州奔腾塑业有限公司 Die structure for injection molding and rubber coating

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