CN103009566A - Injection molding encapsulation die structure - Google Patents
Injection molding encapsulation die structure Download PDFInfo
- Publication number
- CN103009566A CN103009566A CN2012105266515A CN201210526651A CN103009566A CN 103009566 A CN103009566 A CN 103009566A CN 2012105266515 A CN2012105266515 A CN 2012105266515A CN 201210526651 A CN201210526651 A CN 201210526651A CN 103009566 A CN103009566 A CN 103009566A
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- core
- base
- male die
- gripper shoe
- injection moulding
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Abstract
The invention relates to an injection molding encapsulation die structure, which includes a support plate, wherein a bottom plate is arranged on the support plate; a base is arranged on the bottom plate; a male die insert is arranged above the base and fixed horizontally; return pins and movable cores both penetrating through the male die insert are arranged on the base; horizontally moving sliding block units are arranged under the base on the two sides of the support plate; a first female die insert and a second female die insert are arranged on the male die insert; and a cavity is arranged on the first female die insert to be matched with the return pins. Through the adoption of the structure, when the die is used for encapsulation, the edges of a casing can be encapsulated to prevent the casing from falling off, so that the service life of the product can be prolonged, and the ex-factory cost of the product can be reduced further.
Description
Technical field
The present invention relates to the mould structure in a kind of Injection Industry, especially relate to a kind of injection moulding encapsulation die structure.
Background technology
A kind of processing method of using when injection mo(u)lding is some complex-shaped parts of batch production.Specifically the finger material that melts that will be heated is injected die cavity by high pressure, behind cooling curing, obtains formed products.Existing product will carry out encapsulate after being injection molded into housing, be not carry out encapsulate because a direction is arranged, if gluing not firm housing and encapsulate are easy to come off, can reduce the service life of product like this, and reduce yield rate, increase the cost that dispatches from the factory.
Summary of the invention
Technical problem to be solved by this invention provides a kind ofly can so that encapsulate is attached on the housing, not allow caducous injection moulding encapsulation die structure yet when encapsulate separates with housing.
The present invention solves the technical scheme that its technical problem takes: a kind of injection moulding encapsulation die structure, comprise gripper shoe, gripper shoe is provided with backing plate, backing plate is provided with base, above base, be provided with male die core, male die core is fixing in the horizontal direction, it is characterized in that: described base plate is provided with the return pin and moving core runs through male die core, described gripper shoe both sides base plate has the slide unit of transverse shifting, described male die core is provided with the first mother module core and the second mother module core, and the first mother module core is provided with die cavity and cooperates with the return pin.
Further concrete, described slide unit comprises slide block, and slide block is provided with skewed slot, is provided with oblique lock in the skewed slot, and the height of slide block is higher than the height of gripper shoe.
Further concrete, at least two on described return pin.
Further concrete, at least two of described moving cores.
The invention has the beneficial effects as follows: adopted after the said structure, when using mould to carry out encapsulate, the limit of housing can have been encased, prevented that housing from coming off, can increase the service life of product, further reduced the cost that dispatches from the factory of product.
Description of drawings
Fig. 1 is the structural representation that the present invention uses the first mother module core;
Fig. 2 is the structural representation that the present invention uses the second mother module core.
Among the figure: 1, backing plate; 2, gripper shoe; 3, base; 4, return pin; 5, moving core; 6, male die core; 7, housing; 8, the first mother module core; 9, tiltedly lock; 10, slide block; 11, encapsulate; 12, the second mother module core.
The specific embodiment
A kind of injection moulding encapsulation die structure as depicted in figs. 1 and 2, comprise gripper shoe 2, gripper shoe 2 is provided with backing plate 1, backing plate 1 is provided with base 3, above base 3, be provided with male die core 6, male die core 6 is fixed in the horizontal direction, described base plate 3 is provided with return pin 4 and moving core 5 runs through male die core 6, described gripper shoe 2 both sides base plates 3 have the slide unit of transverse shifting, described male die core 6 is provided with the first mother module core 8 and the second mother module core 9, the first mother module cores 8 and is provided with die cavity and cooperates with return pin 4; Described slide unit comprises slide block 10, and slide block 10 is provided with skewed slot, is provided with oblique lock 9 in the skewed slot, and the height of slide block 10 is higher than the height of gripper shoe 2; Described return pin 4 is two; Described moving core 5 is two.
During injection-moulded housing 7, this moment, slide block 10 was with backing plate 1, base 3, moving core 5 and return pin 4 jack-up; Male die core 6 and the first mother module core 8 matched moulds, moving core 5 passes male die core 6 and extend in the die cavity, and this moment can injection mo(u)lding housing 7, and moving core 5 extrudes step in housing 7 ends.
During injection moulding encapsulate 11, at first, tiltedly lock 9 and rise, band movable slider 10 is outwards mobile; At this moment, base 3 and backing plate 1 have lacked support, can move down, and drive moving core 5 and return pin 4 and move down; Base 3 finally can be against on the gripper shoe 2, and male die core 6 maintains static, and changes the second mother module core 12, and matched moulds is finished the encapsulate injection moulding in housing 7 outsides, and the step that produce during injection-moulded housing 7 this moment is also encased by glue; The second mother module core 12 withstands return pin 4 afterwards, and after injection moulding finished, slide block 10 resetted, and return pin 4 can be with the second mother module core 12 jack-up.
It is emphasized that: above only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, every foundation technical spirit of the present invention all still belongs in the scope of technical solution of the present invention any simple modification, equivalent variations and modification that above embodiment does.
Claims (4)
1. injection moulding encapsulation die structure, comprise gripper shoe (2), gripper shoe (2) is provided with backing plate (1), backing plate (1) is provided with base (3), be provided with male die core (6) in base (3) top, male die core (6) is fixing in the horizontal direction, it is characterized in that: described base plate (3) is provided with return pin (4) and moving core (5) runs through male die core (6), described gripper shoe (2) both sides base plates (3) have the slide unit of transverse shifting, described male die core (6) is provided with the first mother module core (8) and the second mother module core (12), and the first mother module core (8) is provided with die cavity and cooperates with return pin (4).
2. injection moulding encapsulation die structure according to claim 1, it is characterized in that: described slide unit comprises slide block (10), and slide block (10) is provided with skewed slot, is provided with oblique lock (9) in the skewed slot, and the height of slide block (10) is higher than the height of gripper shoe (2).
3. injection moulding encapsulation die structure according to claim 1 is characterized in that: (4) two on described return pin at least.
4. injection moulding encapsulation die structure according to claim 1 is characterized in that: (5) two of described moving cores at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210526651.5A CN103009566B (en) | 2012-12-10 | 2012-12-10 | Injection molding encapsulation die structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210526651.5A CN103009566B (en) | 2012-12-10 | 2012-12-10 | Injection molding encapsulation die structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103009566A true CN103009566A (en) | 2013-04-03 |
| CN103009566B CN103009566B (en) | 2014-12-10 |
Family
ID=47958939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210526651.5A Active CN103009566B (en) | 2012-12-10 | 2012-12-10 | Injection molding encapsulation die structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103009566B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103624922A (en) * | 2013-11-25 | 2014-03-12 | 王助正 | Injection moulding and encapsulating method |
Citations (8)
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| JP2005254724A (en) * | 2004-03-15 | 2005-09-22 | Fukuda Kanagata Kk | Resin molding machine |
| CN200984802Y (en) * | 2006-12-25 | 2007-12-05 | 胡志军 | Filter sealing element glue-coating injection mould |
| JP2008162213A (en) * | 2006-12-29 | 2008-07-17 | Citizen Electronics Co Ltd | Injection molding mold |
| CN101607433A (en) * | 2009-06-12 | 2009-12-23 | 深圳创维－Rgb电子有限公司 | A kind of bicolor injection mould and injection moulding process |
| CN102120355A (en) * | 2011-01-24 | 2011-07-13 | 宁波横河模具有限公司 | Bicolor injection mould for wheels of dust collectors |
| CN102145518A (en) * | 2010-02-05 | 2011-08-10 | 勋龙精密模具(昆山)有限公司 | Die frame assembly |
| CN202156001U (en) * | 2011-07-22 | 2012-03-07 | 富港电子（东莞）有限公司 | Injection molding die |
| CN203046131U (en) * | 2012-12-10 | 2013-07-10 | 苏州奔腾塑业有限公司 | Die structure for injection molding and rubber coating |
-
2012
- 2012-12-10 CN CN201210526651.5A patent/CN103009566B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005254724A (en) * | 2004-03-15 | 2005-09-22 | Fukuda Kanagata Kk | Resin molding machine |
| CN200984802Y (en) * | 2006-12-25 | 2007-12-05 | 胡志军 | Filter sealing element glue-coating injection mould |
| JP2008162213A (en) * | 2006-12-29 | 2008-07-17 | Citizen Electronics Co Ltd | Injection molding mold |
| CN101607433A (en) * | 2009-06-12 | 2009-12-23 | 深圳创维－Rgb电子有限公司 | A kind of bicolor injection mould and injection moulding process |
| CN102145518A (en) * | 2010-02-05 | 2011-08-10 | 勋龙精密模具(昆山)有限公司 | Die frame assembly |
| CN102120355A (en) * | 2011-01-24 | 2011-07-13 | 宁波横河模具有限公司 | Bicolor injection mould for wheels of dust collectors |
| CN202156001U (en) * | 2011-07-22 | 2012-03-07 | 富港电子（东莞）有限公司 | Injection molding die |
| CN203046131U (en) * | 2012-12-10 | 2013-07-10 | 苏州奔腾塑业有限公司 | Die structure for injection molding and rubber coating |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103624922A (en) * | 2013-11-25 | 2014-03-12 | 王助正 | Injection moulding and encapsulating method |
| CN103624922B (en) * | 2013-11-25 | 2015-11-25 | 王助正 | Injection moulding encapsulation methods |
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| Publication number | Publication date |
|---|---|
| CN103009566B (en) | 2014-12-10 |
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