CN103001506A - Power source circuit for circuit board blind hole electroplating - Google Patents
Power source circuit for circuit board blind hole electroplating Download PDFInfo
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- CN103001506A CN103001506A CN2012104524026A CN201210452402A CN103001506A CN 103001506 A CN103001506 A CN 103001506A CN 2012104524026 A CN2012104524026 A CN 2012104524026A CN 201210452402 A CN201210452402 A CN 201210452402A CN 103001506 A CN103001506 A CN 103001506A
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- power circuit
- transformer
- power source
- circuit
- circuit board
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Abstract
The invention provides a power source circuit for circuit board blind hole electroplating. The power source circuit comprises a transformer, a rectifying diode, an inductor and a follow-current diode, a first output end of the transformer is connected with an anode of the rectifying diode, a second output end of the transformer is connected with a negative electrode of the power source circuit, a first end of the inductor is connected with a cathode of the rectifying diode, a second end of the inductor is connected with a positive electrode of the power source circuit, a cathode of the follow-current diode is serially connected with the first end of the inductor after being connected with the cathode of the rectifying diode in parallel, and an anode of the follow-current diode is serially connected with the negative electrode of the power source circuit after being connected with the second output end of the transformer in parallel. By the power source circuit without a capacitor for circuit board blind hole electroplating, copper distribution is improved, flatter electroplated sides are obtained and good performances of circuit boards are achieved.
Description
Technical field
The present invention relates to a kind of power circuit for the circuit board electroplating blind hole.
Background technology
At a kind of existing power circuit for the circuit board electroplating blind hole, be connected with electric capacity in the rectifier that adopts, the waveform of its output voltage be the continuous wave with the flat volatility peak, with the electric current of this output when the plating blind hole, cause the electroplating surface out-of-flatness, affect the quality of circuit board.
Summary of the invention
The technical problem that the present invention mainly solves is that the power circuit of available circuit plate plating blind hole causes the electroplating surface out-of-flatness.
In order to solve the problems of the technologies described above, the embodiment of the invention discloses the power circuit that a kind of blind holes of circuit board is electroplated, described power circuit comprises transformer, rectifier diode, inductance and fly-wheel diode, the first output of described transformer and the anodic bonding of described rectifier diode, the second output of described transformer is connected with the negative pole of described power circuit, the first end of described inductance is connected with the negative electrode of described rectifier diode, the second end of described inductance only is connected with the positive pole of described power circuit, connect with the first end of described inductance after the negative electrode parallel connection of the negative electrode of described fly-wheel diode and described rectifier diode, only connect with the negative pole of described power circuit after the second output parallel connection of the anode of described fly-wheel diode and described transformer.
In a preferred embodiment of the present invention, two inputs of described transformer link to each other with external circuit.
Compared to prior art, in the power circuit that described blind holes of circuit board of the present invention is electroplated, the second end of described inductance only is connected with the positive pole of described power circuit, only connect with the negative pole of described power circuit after the second output parallel connection of the anode of described fly-wheel diode and described transformer, do not adopt electric capacity in the described power circuit, therefore can export rough impulse waveform, wherein with the direct current of periodic breaks, not have the deposition of copper ion in its break time.Therefore, by the diffusion of electrolyte volume, the copper ion concentration of circuit board surface can be enhanced, and has promoted nucleus formation, and is favourable to the structure of copper, the distribution that has also improved copper simultaneously, so electroplating surface is comparatively smooth, and the better performances of the circuit board of acquisition.
Description of drawings
In order to be illustrated more clearly in the technical scheme in the embodiment of the invention, the accompanying drawing of required use was done to introduce simply during the below will describe embodiment, apparently, accompanying drawing in the following describes only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing, wherein:
Fig. 1 is the electrical block diagram of power circuit one preferred embodiment of blind holes of circuit board plating of the present invention;
Fig. 2 is the output voltage-time waveform figure of the power circuit of blind holes of circuit board plating shown in Figure 1.
Embodiment
The below will be clearly and completely described the technical scheme in the embodiment of the invention, and obviously, described embodiment only is a part of embodiment of the present invention, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making all other embodiment that obtain under the creative work prerequisite.
The embodiment of the invention discloses the power circuit that a kind of blind holes of circuit board is electroplated, see also Fig. 1, described power circuit 1 comprises transformer 2, rectifier diode 3, inductance 4 and fly-wheel diode 5, the first output 20 of described transformer 2 is connected with the anode 30 of described rectifier diode 3, the second output 22 of described transformer 2 is connected with the negative pole of described power circuit 1, the first end 40 of described inductance 4 is connected with the negative electrode 32 of described rectifier diode 3, the second end 42 of described inductance 4 only is connected with the positive pole of described power circuit 1, connect with the first end 40 of described inductance 4 after the negative electrode 50 of described fly-wheel diode 5 and the negative electrode of described rectifier diode 3 32 are in parallel, only connect with the negative pole of described power circuit 1 after the second output 22 parallel connections of the anode 52 of described fly-wheel diode 5 and described transformer 2.Wherein, two of described transformer 2 inputs (not indicating) link to each other with external circuit.
In the power circuit 1 that the blind holes of circuit board of the embodiment of the invention is electroplated, the second end 42 of described inductance 4 only is connected with the positive pole of described power circuit 1, only connect with the negative pole of described power circuit 1 after the second output 22 parallel connections of the anode 52 of described fly-wheel diode 5 and described transformer 2, do not adopt electric capacity in the described power circuit 1, therefore can export rough impulse waveform.See also Fig. 2, Fig. 2 be shown in the output voltage-time waveform figure of power circuit 1, wherein with the direct current of periodic breaks, be defined as break period its break time, in break period, do not have the deposition of copper ion.Therefore, by the diffusion of electrolyte volume, the copper ion concentration of circuit board surface can be enhanced, and has promoted nucleus formation, and is favourable to the structure of copper, the distribution that has also improved copper simultaneously, so electroplating surface is comparatively smooth, and the better performances of the circuit board of acquisition.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes description of the present invention to do; or directly or indirectly be used in other relevant technical field, all in like manner be included in the scope of patent protection of the present invention.
Claims (2)
1. the power circuit electroplated of a blind holes of circuit board, it is characterized in that, described power circuit comprises transformer, rectifier diode, inductance and fly-wheel diode, the first output of described transformer and the anodic bonding of described rectifier diode, the second output of described transformer is connected with the negative pole of described power circuit, the first end of described inductance is connected with the negative electrode of described rectifier diode, the second end of described inductance only is connected with the positive pole of described power circuit, connect with the first end of described inductance after the negative electrode parallel connection of the negative electrode of described fly-wheel diode and described rectifier diode, only connect with the negative pole of described power circuit after the second output parallel connection of the anode of described fly-wheel diode and described transformer.
2. the power circuit of blind holes of circuit board plating according to claim 1 is characterized in that two inputs of described transformer link to each other with external circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104524026A CN103001506A (en) | 2012-11-13 | 2012-11-13 | Power source circuit for circuit board blind hole electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104524026A CN103001506A (en) | 2012-11-13 | 2012-11-13 | Power source circuit for circuit board blind hole electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103001506A true CN103001506A (en) | 2013-03-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104524026A Pending CN103001506A (en) | 2012-11-13 | 2012-11-13 | Power source circuit for circuit board blind hole electroplating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103001506A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1092345A (en) * | 1993-03-17 | 1994-09-21 | 哈尔滨工业大学 | Pulse width modulating electric spark working pulse power source |
| CN1194494A (en) * | 1997-03-20 | 1998-09-30 | 康舒科技股份有限公司 | Constant coltage clamped forward switching voltage regulator |
| CN201153242Y (en) * | 2008-01-29 | 2008-11-19 | 王广辉 | Bias magnetic saturation resisting inverted full bridge topology circuit |
| JP2010059511A (en) * | 2008-09-05 | 2010-03-18 | Chuo Seisakusho Ltd | Direct-current power source apparatus |
-
2012
- 2012-11-13 CN CN2012104524026A patent/CN103001506A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1092345A (en) * | 1993-03-17 | 1994-09-21 | 哈尔滨工业大学 | Pulse width modulating electric spark working pulse power source |
| CN1194494A (en) * | 1997-03-20 | 1998-09-30 | 康舒科技股份有限公司 | Constant coltage clamped forward switching voltage regulator |
| CN201153242Y (en) * | 2008-01-29 | 2008-11-19 | 王广辉 | Bias magnetic saturation resisting inverted full bridge topology circuit |
| JP2010059511A (en) * | 2008-09-05 | 2010-03-18 | Chuo Seisakusho Ltd | Direct-current power source apparatus |
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Application publication date: 20130327 |