CN102980591A - Laser profile modification method for reducing modal coupling error of vibratory silicon micro-machined gyroscope - Google Patents
Laser profile modification method for reducing modal coupling error of vibratory silicon micro-machined gyroscope Download PDFInfo
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- CN102980591A CN102980591A CN2012104328393A CN201210432839A CN102980591A CN 102980591 A CN102980591 A CN 102980591A CN 2012104328393 A CN2012104328393 A CN 2012104328393A CN 201210432839 A CN201210432839 A CN 201210432839A CN 102980591 A CN102980591 A CN 102980591A
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Abstract
The invention discloses a laser profile modification method for reducing the modal coupling error of a vibratory silicon micro-machined gyroscope. The method comprises the following steps: 1, signal test: testing the driving signal Vd and the modal coupling error signal Vm of a silicon micro-machined gyroscope chip, and determining the peak values and the phase relationships of the two signals; 2, determining the laser profile modification type according to the signals in step 1; 3, determining the profile modification position according to the signals in the step 1; and 4, carrying out laser profile modification according to the type obtained in step 2 and the position obtained in step 3. The laser profile modification method has the advantages of simple principle, simple operation, reduction of the modal coupling error, and improvement of the working performances of the silicon micro-machined gyroscope.
Description
Technical field
The present invention is mainly concerned with the processing technique field in the MEMS (micro electro mechanical system), refers in particular to the laser correction method of the modal coupling error that a kind of reduced silicon micro-gyroscope vibrational structure mismachining tolerance of making for silicon micromechanical gyroscope causes.
Background technology
The advantage such as the oscillatory type silicon micro-mechanical gyroscope has that volume is little, lightweight, cost is low, reliability is high, be easy to circuit is integrated has been widely used in the fields such as communication apparatus, automotive safety and navigation, robot and Aero-Space, game machine.The oscillatory type silicon micro-mechanical gyroscope adopts the semiconducter process such as wet etching, dry etching to be made usually take thin slice monocrystalline silicon as material, and its physical dimension may diminish to submicron order.
Because the making of oscillatory type silicon micro-mechanical gyroscope is to adopt one-time formed mode basically, so in process, the mismachining tolerance that the techniques such as mask, photoetching, etching produce all can be accumulated in the structure of oscillatory type silicon micro-mechanical gyroscope and go, so that little gyro is in the situation without the angular velocity input, the vibrational energy of its driven-mode also can be coupled to sensed-mode, thereby produce the modal coupling error, and then badly influence the performance of little gyro.There are some researches show that the quadrature coupling error is topmost composition in the modal coupling error, so reduce the Main Means that quadrature error has also just become to reduce the modal coupling error.In order to eliminate the modal coupling error to the impact of little gyro performance, mainly contain at present two kinds of approach: the one, eliminate the modal coupling error by the vibrational structure of design decoupling zero.But little gyro of design decoupling zero can increase the complex structure degree, has unavoidable mismachining tolerance in the microstructure manufacturing process simultaneously, so this approach also can only partly reduce the modal coupling error.The 2nd, eliminate quadrature error to reduce the impact of modal coupling error by the method for synchronous demodulation.But the prerequisite of synchronous demodulation be reference signal must with the coriolis force signal with homophase frequently, and in the real work system, be difficult to guarantee reference signal and the complete homophase of coriolis force signal, so through the error signal that in angular velocity signal, can superpose after the synchronous demodulation, this error signal has consisted of little gyro zero inclined to one side part, and seriously restricts the raising of little gyro performance.
Summary of the invention
The technical problem to be solved in the present invention just is: for the technical matters that prior art exists, the invention provides the laser correction method that a kind of principle is simple, easy and simple to handle, can reduce the minimizing oscillatory type silicon micro-gyroscope modal coupling error of modal coupling error, raising silicon micro-gyroscope serviceability.
For solving the problems of the technologies described above, the present invention by the following technical solutions:
A kind of laser correction method that reduces oscillatory type silicon micro-gyroscope modal coupling error the steps include:
(1) signal testing: for the silicon micro-gyroscope chip of reality processing, the driving signal of the little GYROCHIP of test silicon
V d With the modal coupling error signal
V m , and determine the peak-to-peak value size of two signals and the phase relation between two signals;
(2) determine the type of laser correction of the flank shape: behind the signal testing of completing steps (1), if the modal coupling error signal
V m Peak-to-peak value greater than preset value
a, then the brace summer at the silicon micro-gyroscope chip carries out thick correction of the flank shape; If modal coupling error signal
V m Peak-to-peak value greater than preset value b and less than preset value
a, then carry out accurate correction of the flank shape at mass; If driving signal
V d Peak-to-peak value less than preset value
b, then need not carry out correction of the flank shape;
(3) determine the position of correction of the flank shape: behind the signal testing of completing steps (1), when being non-full symmetric formula structure, if the modal coupling error signal
V m Phase place drive of lead signal
V d 85 °～95 ° in phase place, then select in the silicon micro-gyroscope chip vibrational structure mass oscillation centre line left side to carry out the laser correction of the flank shape; If modal coupling error signal
V m Phase place lag behind to drive signal
V d 85 °～95 ° in phase place, then select in the silicon micro-gyroscope chip vibrational structure mass oscillation centre line right side to carry out the laser correction of the flank shape; When being full symmetric formula structure, if the modal coupling error signal
V m Phase place with drive signal
V d Leading-5 °～5 ° of phase place, then select in the silicon micro-gyroscope chip vibrational structure mass oscillation centre line left side to carry out the laser correction of the flank shape; If modal coupling error signal
V m Phase place with drive signal
V d Phase place lag behind-5 °～5 °, then select in the silicon micro-gyroscope chip vibrational structure mass oscillation centre line right side to carry out the laser correction of the flank shape;
(4) the laser correction of the flank shape is carried out in the type and the position that obtain according to step (2) and step (3).
As a further improvement on the present invention:
The idiographic flow of described step (4) is:
(4.1) adjusting of laser parameter: described step (2) if in be defined as slightly repairing, then need to increase the power of laser instrument; If be defined as the power that accurate correction of the flank shape then reduces laser instrument;
(4.2) enforcement of laser correction of the flank shape: after setting the running parameter of laser instrument, carry out the removal of material at the silicon micro-gyroscope vibrational structure according to the correction of the flank shape position that described step (3) is determined;
(4.3) finish a laser correction of the flank shape after, repeat above-mentioned steps (1)～(3), until the peak-to-peak value of modal coupling error signal Vm is less than preset value
bThe time, then finish the correction of the flank shape of this silicon micro-gyroscope model machine, carry out the correction of the flank shape of next silicon micro-gyroscope chip.
The idiographic flow of described step (1) is: in conjunction with test circuit, observe driving signal and the modal coupling error signal of silicon micro-gyroscope chip by oscillograph in the situation of zero angle speed input.
In the described step (3), preset value
A, bSize determine according to the silicon micro-gyroscope production level and to the requirement of silicon micro-gyroscope performance.
Described preset value
A, bBetween the pass be
A=5b～10b
Compared with prior art, the invention has the advantages that: the present invention reduces the laser correction method of oscillatory type silicon micro-gyroscope modal coupling error, principle is simple, easy and simple to handle, can effectively remedy design decoupling-structure and synchronous demodulation and reduce the deficiency that the modal coupling error exists.After adopting method of the present invention, laser correction of the flank shape position and laser profiling quantity can accurately be controlled according to the correlation parameter of regulating laser instrument.Because the essence of laser correction method is to carry out material at little gyro vibrational structure to remove, therefore of the present invention whole operation is simple and reliable.The quantity of material that should remove in the laser correction of the flank shape determines according to the modal coupling error amount that exists, thereby can be down to the modal coupling error very little even be zero.The present invention is reasonable in design, less demanding to processing conditions, be conducive to the silicon micro-gyroscope suitability for industrialized production, can effectively reduce quadrature coupling error that little gyroscope structure mismachining tolerance causes to improve the serviceability of gyro, helpful for the yield rate that improves little gyro.
Description of drawings
Fig. 1 adopts the schematic flow sheet that carries out the laser correction of the flank shape after the inventive method.
Fig. 2 is the synoptic diagram of the present invention's silicon micro-gyroscope vibrational structure in concrete application example.
Fig. 3 is the laser correction of the flank shape principle schematic of the present invention in concrete application example.
Marginal data:
1, the first anchor point; 2, the first mass; 3, the second anchor point; 4, mass oscillation centre line; 5, brace summer; 6, the second mass; M1, M2, B1, B2, the position of carrying out the laser correction of the flank shape.
Embodiment
Below with reference to Figure of description and specific embodiment the present invention is described in further details.
As shown in Figure 2, silicon micro-gyroscope chip in the concrete application example is as example, this silicon micro-gyroscope chip comprises brace summer 5 and several masses, the two ends of brace summer 5 are fixing by the first anchor point 1 and the second anchor point 3 respectively, the first mass 2 and the second mass 6 are one group and are the two ends that symmetry shape is arranged in brace summer 5 (about in this example being two pairs), the corresponding layout forms the mass oscillation centre line 4 between two pairs of masses when work in twos.
In the ideal case, there is not mismachining tolerance in the silicon micro-gyroscope vibrational structure, and this moment, the modal coupling error of little gyro was zero.When there is mismachining tolerance in the silicon micro-gyroscope vibrational structure of reality, causes that the elasticity of vibrational structure is asymmetric, thereby produce larger quadrature coupling error.For the oscillatory type silicon micro-gyroscope, the mismachining tolerance on the brace summer 5 is larger to the gyro performance impact with respect to other locational mismachining tolerance, and the same position place, modal coupling error and the positive correlation of mismachining tolerance size.
By little gyro vibrational structure mismachining tolerance is carried out simulation analysis, the mismachining tolerance of discovery mass oscillation centre line 4 both sides is the antiphase relation to the impact of modal coupling error.Therefore, on vibrational structure, then can reduce even eliminate the modal coupling error of little gyro by the anti-phase modal coupling error of the certain material production of laser ablation and existing modal coupling error, thereby laser correction of the flank shape principle of the present invention is: the modal coupling error signal of the little GYROCHIP of test silicon at first
V m Peak value and modal coupling error signal
V m With the driving signal
V d Phase relation.Next, determine the position of laser correction of the flank shape according to the size of error signal and the phase relation between signal and regulate the running parameter of laser instrument; At last, use high precision ultraviolet laser correct position on little gyro vibrational structure to remove certain material, partly or entirely offset already present modal coupling error, and correction of the flank shape and signal testing hocket.Reducing the modal coupling error by the laser correction of the flank shape is the process of a convergence, and the present invention can improve efficient and the precision of correction of the flank shape.
As shown in figures 1 and 3, the laser correction method of minimizing oscillatory type silicon micro-gyroscope modal coupling error of the present invention, its concrete steps are:
1, signal testing: for the silicon micro-gyroscope chip of reality processing, in conjunction with test circuit, in the situation of zero angle speed input, observe it by oscillograph and drive signal and modal coupling error signal, respectively with
V d ,
V m Expression drives signal and modal coupling error signal, and determines the peak-to-peak value size of two signals and the phase relation between two signals.
2, determine the type of laser correction of the flank shape: behind the signal testing of completing steps 1, if the modal coupling error signal
V m Peak-to-peak value greater than preset value
a, then the brace summer 5 at the silicon micro-gyroscope chip carries out thick correction of the flank shape; If modal coupling error signal
V m Peak-to-peak value greater than preset value b and less than preset value
a, then carry out accurate correction of the flank shape at mass; If driving signal
V d Peak-to-peak value less than preset value
b, then need not carry out correction of the flank shape.
In this step, preset value
A, bSize need to determine according to the silicon micro-gyroscope production level and to the requirement of silicon micro-gyroscope performance.In preferred embodiment, preset value
A, bBetween relation desirable
A=5b～10b
3, determine the position of correction of the flank shape: behind the signal testing of completing steps (1), when being non-full symmetric formula structure, if the modal coupling error signal
V m Phase place drive of lead signal
V d 85 °～95 ° in phase place, then select in the silicon micro-gyroscope chip vibrational structure mass oscillation centre line left side to carry out the laser correction of the flank shape; If modal coupling error signal
V m Phase place lag behind to drive signal
V d 85 °～95 ° in phase place, then select in the silicon micro-gyroscope chip vibrational structure mass oscillation centre line right side to carry out the laser correction of the flank shape; When being full symmetric formula structure, if the modal coupling error signal
V m Phase place with drive signal
V d Leading-5 °～5 ° of phase place, then select in the silicon micro-gyroscope chip vibrational structure mass oscillation centre line left side to carry out the laser correction of the flank shape; If modal coupling error signal
V m Phase place with drive signal
V d Phase place lag behind-5 °～5 °, then select in the silicon micro-gyroscope chip vibrational structure mass oscillation centre line right side to carry out the laser correction of the flank shape.
In example shown in Figure 2, behind the signal testing of completing steps 1, if the modal coupling error signal
V m Phase place drive of lead signal
V d 90 ° in phase place, then select in the silicon micro-gyroscope chip vibrational structure mass oscillation centre line 4 left sides to carry out laser correction of the flank shape (for example B1 in this instance graph or M1 place); If modal coupling error signal
V m Phase place lag behind to drive signal
V d 90 ° in phase place, then select in the silicon micro-gyroscope chip vibrational structure mass oscillation centre line 4 right sides to carry out laser correction of the flank shape (for example B2 in this instance graph or M2 place).
Because quadrature error is much larger than offset error, the phase place of modal coupling error is basic consistent with quadrature error.According to silicon micro-gyroscope De Geshi stress effect principle of work, for non-full symmetrical configuration, it is parallel with the coriolis force signal to drive signal, thereby it is vertical with the modal coupling error signal to drive signal; For full symmetrical configuration, it is vertical with the coriolis force signal to drive signal, thereby it is parallel with the modal coupling error signal to drive signal.So, for little gyro of dissimilar structures and used test circuit thereof, also should be in specific implementation process come by experiment to determine first: the phase relation between modal coupling error signal-drive voltage signal and on the left of mass oscillation centre line or the corresponding relation of right side correction of the flank shape.
4, the adjusting of laser parameter: if be defined as slightly repairing in the above-mentioned steps 2, then need suitably to increase the power of laser instrument; If be defined as the power that accurate correction of the flank shape then suitably reduces laser instrument.Selected then need of concrete power decided according to the performance parameter of used laser instrument.
5, the enforcement of laser correction of the flank shape: set the correction of the flank shape positions of determining according to above-mentioned steps 3 behind the running parameter of high precision ultraviolet laser and carry out the removal of material at the silicon micro-gyroscope vibrational structure.
6, finish a laser correction of the flank shape after, repeat above-mentioned steps 1～5, until the peak-to-peak value of modal coupling error signal Vm is less than preset value
bThe time, then finish the correction of the flank shape of this silicon micro-gyroscope model machine, carry out the correction of the flank shape of next silicon micro-gyroscope chip, and carry out according to above-mentioned same correction of the flank shape step.In the whole process, signal testing intersects with the laser correction of the flank shape and carries out, until the modal coupling error amount of silicon micro-gyroscope satisfies the regulation requirement.
Be appreciated that in other concrete application example, only need adjust its corresponding parameter for the silicon micro-gyroscope of other structure and get final product.Because silicon micro-gyroscope principle of work and modal coupling error form the similarity of mechanism, the usable range of laser correction method of the present invention is not limited to the silicon micro-gyroscope of certain ad hoc structure.
Below only be preferred implementation of the present invention, protection scope of the present invention also not only is confined to above-described embodiment, and all technical schemes that belongs under the thinking of the present invention all belong to protection scope of the present invention.Should be pointed out that for those skilled in the art the some improvements and modifications not breaking away under the principle of the invention prerequisite should be considered as protection scope of the present invention.
Claims (5)
1. laser correction method that reduces oscillatory type silicon micro-gyroscope modal coupling error is characterized in that step is:
(1) signal testing: for the silicon micro-gyroscope chip of reality processing, the driving signal of the little GYROCHIP of test silicon
V d With the modal coupling error signal
V m , and determine the peak-to-peak value size of two signals and the phase relation between two signals;
(2) determine the type of laser correction of the flank shape: behind the signal testing of completing steps (1), if the modal coupling error signal
V m Peak-to-peak value greater than preset value
a, then the brace summer at the silicon micro-gyroscope chip carries out thick correction of the flank shape; If modal coupling error signal
V m Peak-to-peak value greater than preset value b and less than preset value
a, then carry out accurate correction of the flank shape at mass; If driving signal
V d Peak-to-peak value less than preset value
b, then need not carry out correction of the flank shape;
(3) determine the position of correction of the flank shape: behind the signal testing of completing steps (1), when being non-full symmetric formula structure, if the modal coupling error signal
V m Phase place drive of lead signal
V d 85 °～95 ° in phase place, then select in the silicon micro-gyroscope chip vibrational structure mass oscillation centre line left side to carry out the laser correction of the flank shape; If modal coupling error signal
V m Phase place lag behind to drive signal
V d 85 °～95 ° in phase place, then select in the silicon micro-gyroscope chip vibrational structure mass oscillation centre line right side to carry out the laser correction of the flank shape; When being full symmetric formula structure, if the modal coupling error signal
V m Phase place with drive signal
V d Leading-5 °～5 ° of phase place, then select in the silicon micro-gyroscope chip vibrational structure mass oscillation centre line left side to carry out the laser correction of the flank shape; If modal coupling error signal
V m Phase place with drive signal
V d Phase place lag behind-5 °～5 °, then select in the silicon micro-gyroscope chip vibrational structure mass oscillation centre line right side to carry out the laser correction of the flank shape;
(4) the laser correction of the flank shape is carried out in the type and the position that obtain according to step (2) and step (3).
2. the laser correction method of minimizing oscillatory type silicon micro-gyroscope modal coupling error according to claim 1 is characterized in that the idiographic flow of described step (4) is:
(4.1) adjusting of laser parameter: described step (2) if in be defined as slightly repairing, then need to increase the power of laser instrument; If be defined as the power that accurate correction of the flank shape then reduces laser instrument;
(4.2) enforcement of laser correction of the flank shape: after setting the running parameter of laser instrument, carry out the removal of material at the silicon micro-gyroscope vibrational structure according to the correction of the flank shape position that described step (3) is determined;
(4.3) finish a laser correction of the flank shape after, repeat above-mentioned steps (1)～(3), until the peak-to-peak value of modal coupling error signal Vm is less than preset value
bThe time, then finish the correction of the flank shape of this silicon micro-gyroscope model machine, carry out the correction of the flank shape of next silicon micro-gyroscope chip.
3. the laser correction method of minimizing oscillatory type silicon micro-gyroscope modal coupling error according to claim 1 and 2, it is characterized in that, the idiographic flow of described step (1) is: in conjunction with test circuit, observe driving signal and the modal coupling error signal of silicon micro-gyroscope chip by oscillograph in the situation of zero angle speed input.
4. the laser correction method of minimizing oscillatory type silicon micro-gyroscope modal coupling error according to claim 1 and 2 is characterized in that, in the described step (3), and preset value
A, bSize determine according to the silicon micro-gyroscope production level and to the requirement of silicon micro-gyroscope performance.
5. the laser correction method of minimizing oscillatory type silicon micro-gyroscope modal coupling error according to claim 4 is characterized in that described preset value
A, bBetween the pass be
A=5b～
10b
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| CN113532406A (en) * | 2021-07-15 | 2021-10-22 | 中南大学 | Silicon gyroscope mass increasing type tuning method |
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Application publication date: 20130320 Assignee: Hunan Tianyi Navigation Technology Co. Ltd. Assignor: National Defence Science &. Technology Univ., PLA Contract record no.: 2016430000031 Denomination of invention: Laser profile modification method for reducing modal coupling error of vibratory silicon micro-machined gyroscope Granted publication date: 20150318 License type: Exclusive License Record date: 20161220 |