CN102978348A - Method for improving interfacial bond strength of copper/aluminum cold rolling composite ultrathin strip - Google Patents
Method for improving interfacial bond strength of copper/aluminum cold rolling composite ultrathin strip Download PDFInfo
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- CN102978348A CN102978348A CN2012105166038A CN201210516603A CN102978348A CN 102978348 A CN102978348 A CN 102978348A CN 2012105166038 A CN2012105166038 A CN 2012105166038A CN 201210516603 A CN201210516603 A CN 201210516603A CN 102978348 A CN102978348 A CN 102978348A
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Abstract
The invention belongs to the technical field of processing of metal materials, and particularly relates to a method for improving interfacial bond strength of a copper/aluminum cold rolling composite ultrathin strip. The method comprises the following steps in sequence: thermally processing 0.1 to 0.15mm of ultrathin copper/aluminum cold rolling composite ultrathin strip; applying the a positive magnetic field, and increasing the strength of the positive magnetic field from 0 to 0.01-6T; heating a sample until reaching 350 to 450 DEG C at temperature increase rate of 5 to 10 DEG C per second; maintaining the temperature for 5 to 30 minutes; cooling to reach room temperature; reducing the strength of the magnetic field to reach 0T; and then taking out the sample. According to the method, the electromagnetic field is applied during thermally processing the copper/aluminum cold rolling ultrathin composite strip, the average dimension of a sample interface layer is reduced, the shear strength is improved, the yield ratio is reduced, the plasticity index-elongation is greatly improved, and the interfacial bond strength of the copper/aluminum cold rolling composite ultrathin strip is improved.
Description
Technical field
The invention belongs to the metal material processing technical field, particularly a kind of method that improves the cold rolling composite ultra-thin band of copper/aluminium interface bond strength.
Background technology
Along with modern industry is more and more higher, also more and more stronger to the improvement requirement of material structure for the performance requriements of metallic substance, single metal material can't satisfy these demands, so, the advanced composite material that integrates physics, chemistry, mechanical property and the price difference of differing materials arises at the historic moment, this is with the more effective properties of materials that utilizes, and overcome and remedy the deficiency of single-material performance, thereby obtain the more excellent novel material of over-all properties.Therefore develop and the research emphasis for preparing these correlation techniques that possess excellence or property novel material and also just become contemporary metallurgical material field technology personnel, wherein machine-shaping technology low-cost, high performance metal composite not only is subject to engineering technical personnel's attention, and listed the high-technology field that state key is supported in, will help from policy and two aspects of fund from now on.
China is the country of the rich aluminium of a poor copper, consume copper material in the Chinese electrician trade current－carrying conductor material year and account for the nearly 1/3rd of whole world copper material total amount consumed, so copper material becomes China's another important strategic resource except oil.Since the nineties in last century, along with nonferrous metal resource shortage aggravation, the copper material price sharp rises, and causes copper material manufacturing enterprise and client's production and use cost significantly to improve.Therefore guaranteeing on original copper material use properties basis, development of new material substitution traditional material becomes the focus of domestic and international manufacturing enterprise research and development, adopts substituting matrix material and then reduces a kind of development trend that raw materials cost has become domestic and international copper material production and application.
Metallic copper has good conductivity and welding property, but scarcity of resources, processing is expensive, the metallic aluminium good conductivity, relative low price, but poor than copper all such as the welding of aluminium, arc extinguishing, wear-resisting and conduction, heat conductivility, directly substitute difficulty of copper material in a lot of occasions with aluminium, form the composite strip of copper cover aluminum with copper cover aluminum, the consumption that both can save metallic copper can also keep the characteristics such as ductility that pure copper material has, electroconductibility, weldability, solidity to corrosion.Add that China's bauxite resource is very abundant, the price of aluminium is lower than copper, and its density is less than 1/3 of copper, and this just means that under the identical condition of weight the length of aluminium is 3 times of fine copper material.Particularly at communication field, cable TV signal and mobile communication signal frequency are higher, generally at 500-800MHZ, because " skin effect " makes high-frequency current concentrate on the surface transmission of conductor, when carrying out information transmission with fine copper, the copper in centre does not play the effect of main transmission signal, so the copper material that partly substitutes the middle layer with aluminium is ideal method, can save greatly that China comparatively lacks and expensive copper resource.In fact more than communications field,, the king-sized copper strips of demand wide especially with copper cover aluminum composite band replacement application surface also will have widely application prospect in the power transmission field, be expected to form huge industry.Exploitation is fit to efficient, the less energy-consumption compounding technology of industrial-scale production, preparation copper/aluminum composite belt type material, the industrial circles such as the electronics that will develop rapidly to China undoubtedly, electric power, machinofacture provide alternative desirable product innovation, produce significant economic benefit, and for making rational use of resources, guarantee that national economy sustainable development has important social benefit.So own target of making great efforts through becoming domestic and international investigator of the exploitation of technique.
The cold rolling compound rear combination on the interface of two kinds of metals of copper/aluminium only is physical bond, does not reach the degree of metallurgical binding, and is simultaneously, because the nonaffine deformation of bi-material can produce more serious unrelieved stress at matrix, very large to compound rear performance impact.Therefore, in order to improve the over-all properties of composite band, must roll after annealing.By annealing, can make the mutual diffusion of constituent element interlayer metal phase on the one hand, make bonding surface realize metallurgical binding, thereby improve bonding strength; Make on the other hand the matrix internal residual stress lax, plasticity is restored.Subject matter is form and the distribution problem of control compound interface width and interface compound.In the compound and heat treatment process, copper and aluminium can form sosoloid at copper/aluminium, also form compound with aluminium.When copper and aluminium interacted, interfacial layer generally comprised following a few part, was the solid solution tagma near matrix, and the centre is copper aluminium atomic interaction and the compound district that forms can form CuAl, CuAl between copper aluminium
2, Cu
2Al
4, Cu
4Al
9Etc. multiple hard and crisp compound, these compound growth speed are very fast, and existence form is complicated, no matter the spreading area produces the copper/Al intermetallic of which kind of lattice types, all can cause the bonding strength of composite band to reduce, and the electroconductibility variation, therefore this transition layer can not be too thick.Control interfacial layer thickness and form and the distribution problem of controlling interface compound, control diffusion problem after all, diffusion between control copper aluminium, make it both reach the purpose of metallurgical binding, keep again its interface thin and even, realize that composite band had both maintained some strength, plasticity improves a lot again.
For the ultra-thin composite band of thickness below 0.15mm, there is more significantly impact at its interface on the performance (mainly being plasticity) of matrix material, in implementing the research of thermal treatment with the raising boundary strength, people's prior art also only is confined to conventional thermal treatment means, but, a lot of problems of composite material interface, control problem such as compound rear interface form, the inhibition problem of interface compound, interface and composite band structure property concern problem, the answer of matrix, recrystallize problem etc., existing conventional heat treatment technics is not sufficient to solve, so that composite strip is in use because plasticity is low, be easy to broken belt, and the huge obstacle that causes the cold rolling composite strip of copper aluminium to use.
Along with the proposition of " material electromagnetic process " and the development of modern electromagnetic technique, magnetic field is widely used in the diffusion and phase transition process of metallic substance.The inhibition and promotion effect in magnetic field can make original complexity even chaotic process become comparatively simple, is easy to be directly acquainted with material person's character and scientific law, and the contactless property of the action of a magnetic field has been avoided the pollution to metallic substance.Therefore, magnetic field is subject to increasing attention to the impact of metal diffusing, phase transformation.
Diffusion generally is subjected to THERMODYNAMICAL STUDY and kinetic control with phase transition process.In metal diffusing and phase transition process, apply magnetic field, because the difference of magneticanisotropy susceptibility between each phase has affected the size of Gibbs free energy, thereby affected each phase stability; Also can cause each mutually stressed difference under the magnetic field, affect forming core, grain growth and grain orientation, improve tissue and arrange.So magnetic field is to improving the weave construction of metal, the performance that improves material has played vital role.
The size of susceptibility and symbol when magnetizing according to magnet can be divided into the magnetic of material five kinds: diamagnetism, paramagnetism, antiferromagnetism, ferromegnetism and ferrimagnetism.Because the susceptibility of diamagnetic substance is very little, for a long time, magnetic field is ignored by people the effect of diamagnetic substance always.In recent years, because the development of superconductor technology, high-intensity magnetic field has been applied in the preparation process of diamagnetic substance.This be since magnetizing force be proportional to magnetic induction density square, the suffered magnetizing force of the suffered magnetizing force of nonmagnetic material and the ferromagnetism body under the 0.0lT is suitable under the 10T.
Have benefited from the development of superconducting magnet technology, magneticsubstance and nonmagnetic substance can carry out processing treatment under magnetic field.Make material that orientation or modification occur by externally-applied magnetic field, and then improve electricity, magnetic, heat and the mechanical property of material, obtain new function material.Therefore, magnetic field treatment will become the effective tool of preparation new function material, and the progress of high-intensity magnetic field technology will further promote the development of new function material research.
Applying high-intensity magnetic field in the metal or alloy heat treatment process is to improve its weave construction, improve one of effective ways of mechanical property, at present, theory and the experimental study used in Materials science about high-intensity magnetic field increase rapidly, at present at crystallization and freezing, thermal treatment, plastic working, transmission of heat by convection, liquid suspension with the aspect such as separate and carried out widely exploratory study, relate to superconducting ceramics, magneticsubstance, macromolecular material, metallic substance etc., formed a research field brand-new, rich connotation.
Apply magnetic field in the thermal treatment of material, particularly high-intensity magnetic field can promote or suppress the diffusion of atom.Studies show that the interfacial layer thickness of Al-Cu diffusion couple is compared with the thickness of the diffusion layer that does not add magnetic field, and obvious variation has occured, growth of phase meets the para-curve law of development in the middle of it.The interfacial layer thickness of Al-Zn alloy diffusion idol is along with the increase of magneticstrength and frequency, and the diffusion of Al atom and Zn atom is obviously accelerated.Studies show that of ultra-high-strength aluminum alloy magnetic-field annealing, AC magnetic field have promoted the diffusion of solute atoms in the annealing process, thereby have accelerated the dissolving of second-phase, have reduced recrystallization temperature, have promoted the recrystallization process of alloy.
Although metallic copper, aluminium are nonmagnetic substances, but in magnetic field, can both be magnetized and demonstrate macroscopic magnetization, Cu is typical diamagnetic substance, and Al is paramagnetic material, and copper aluminium forms diffusion couple through rolling after compound, in high-intensity magnetic field, can show 2 kinds of different diffusion tendency, under forward high-intensity magnetic field (magnetic line of force points to aluminium lamination by the copper layer) effect, Al, Cu atom are to moving away from the interface direction, so that aluminum bronze atomic interaction ability weakens, the compound amount reduces, the interface attenuation; Otherwise when applying negative sense magnetic field (magnetic line of force points to the copper layer by aluminium lamination), Al, Cu atom promote at the interface aluminum bronze atomic diffusion towards the motion of interface direction, copper aluminium interpenetrates ability to be strengthened, and reaction is violent, shows as the interface thickening, the compound amount increases, complex shape, as shown in Figure 1.
Summary of the invention
Deficiency for prior art exists the invention provides a kind of heat treatment that applies electromagnetic field in the heat treatment process of the ultra-thin composite band of copper/aluminium.
A kind of method that improves the cold rolling composite ultra-thin band of copper/aluminium interface bond strength provided by the invention, carry out according to the following steps:
The cold rolling composite ultra-thin band of ultra-thin copper/aluminium of 0.1 ~ 0.15mm is heat-treated, apply simultaneously forward magnetic field and be raised to 0.01 ~ 6T by 0T, then begin sample is heated, after being raised to 350 ~ 450 ℃ with the heat-up rate of 5 ~ 10 ℃/s, at 350 ~ 450 ℃ of lower insulation 5 ~ 30min, then begin cooling, average cooling rate with 10 ~ 20 ℃/min is cooled to room temperature, when treating that temperature drops to room temperature, reduce magneticstrength to 0T, take out sample.
Beneficial effect of the present invention is:
The present invention applies electromagnetic field simultaneously in the heat treatment process of copper/aluminium cold rolling superthin composite band, in the thermal treatment of the ultra-thin composite band of 0.1 ~ 0.15mm, effect is remarkable at composite band thickness.Adding under the action of a magnetic field, the diffusion of atom can be promoted or suppress, under the forward the action of a magnetic field, the interfacial layer thickness of Al-Cu diffusion couple is compared with the thickness of the diffusion layer that does not add magnetic field, the trend that obvious attenuate has occured changes, mean sizes reduces, and growth of phase meets the para-curve law of development in the middle of it; The interfacial layer thickness of Al-Cu alloy diffusion idol is along with the increase of magneticstrength and frequency, and the velocity of diffusion of atom is obviously accelerated; AC magnetic field has promoted the diffusion of solute atoms in the annealing process, thereby has accelerated the dissolving of second-phase, has reduced recrystallization temperature, has promoted the recrystallization process of alloy; Aspect of performance has improved the cold rolling composite ultra-thin band of copper/aluminium interface bond strength, shows that interface shear strength is improved, and has reduced yield tensile ratio, has improved plasticity storage, and plasticity index-elongation has obtained significant lifting.
Description of drawings
The interface atom promotes (a) and suppresses (b) diffusion synoptic diagram Fig. 1 under the action of a magnetic field in order to apply;
Fig. 2 is thermal treatment unit synoptic diagram under the ultra-thin composite band magnetic field;
Fig. 3 is that the ultra-thin composite band of 0.12mm interface does not apply magnetic field (a), applies forward magnetic field (b) and applies negative sense magnetic field (c) pattern electromicroscopic photograph among the embodiment 1.
Among the figure: 1, water coolant; 2, thermopair; 3, heating unit; 4, vacuum sealing tube; 5, plumbago crucible; 6, corundum rod.
Embodiment
The present invention will be further described below in conjunction with embodiment.
The instrument model of measuring the compound cross-section mean sizes in the embodiment of the invention is Leica metaloscope and JSM-7001F field emission scanning electron microscope, the instrument model of surveying shearing resistance is CMT 5105 electronic universal testers, the instrument model of surveying the composite band yield strength is CMT 5105 electronic universal testers, the instrument model of surveying composite band tensile strength is CMT 5105 electronic universal testers, and the instrument model of surveying the composite band unit elongation is CMT 5105 electronic universal testers.
0.12mm the thermomagnetic treatment technique of the cold rolling composite strip of ultra-thin copper/aluminium
Carry out anneal with MVH-30 type high-intensity magnetic field process furnace, during thermal treatment, compound good composite band is cut into the small pieces of material of 3.4cm * 1cm, and sample put into plumbago crucible, apply forward magnetic field and be raised to 0.5T by 0T, then begin sample is heated, be raised to 380 ℃ with the heat-up rate of 5 ℃/s after, at 380 ± 3 ℃ of insulation 5min, then begin cooling, be cooled to room temperature with the average cooling rate of 15 ℃/min, when treating that temperature drops to room temperature, reduce magneticstrength to 0T, take out sample.
Fig. 3 is that the ultra-thin composite band of 0.12mm interface does not apply magnetic field (a), applies forward magnetic field (b) and applies negative sense magnetic field (c) pattern electromicroscopic photograph.Although metallic copper, aluminium are nonmagnetic substances, but in magnetic field, can both be magnetized and demonstrate macroscopic magnetization, Cu is typical diamagnetic substance, Al is paramagnetic material, copper aluminium forms diffusion couple through rolling after compound, in high-intensity magnetic field, can show two kinds of different diffusion tendency, under forward the action of a magnetic field (b), Al, Cu atom are to moving away from the interface direction, so that aluminium, the mutual diffusion of copper atom phase, interaction ability weaken, show that the compound amount reduces the interface attenuation, interfacial layer thickness is less than the interfacial layer thickness that does not apply magnetic field (a), successful; Otherwise, apply negative sense magnetic field (c), Al, Cu atom strengthen towards interface direction diffusibility, promote at the interface aluminium, the mutual diffusion of copper atom phase, interpenetrate, so that aluminium, copper atom reaction acutely show as the increase of compound amount, the interface thickening at the interface, complex shape, interfacial layer thickness is greater than the interfacial layer thickness that does not apply magnetic field (a).
Table 1 for the thermomagnetic treatment of the cold rolling composite strip of the ultra-thin copper/aluminium of 0.12mm and each Performance Ratio that does not add thermomagnetic treatment.
Table 1
Can be found out by above result, heat-treat after applying magnetic field, compare with the sample that does not apply thermomagnetic treatment, although copper layer and aluminium lamination have all reached the degree of perfect recrystallization, and the classes of compounds that forms does not change, but the mean sizes of compound interface layer reduces to 1.2 μ m by 2.2 μ m, reduced 45%, its shearing resistance is brought up to 95 MPa by 68 MPa, improved 40%, although its yield strength has had small size reduction, the yield tensile ratio decrease, especially its plasticity index-elongation has significantly promoted 5 times, successful.
0.10mm the thermomagnetic treatment technique of the cold rolling composite strip of ultra-thin copper/aluminium
Carry out anneal with MVH-30 type high-intensity magnetic field process furnace, during thermal treatment, compound good composite band is cut into the small pieces of material of 3.4cm * 1cm, and sample put into plumbago crucible, apply forward magnetic field and be raised to 0.01T by 0T, then begin sample is heated, be raised to 350 ℃ with the heat-up rate of 8 ℃/s after, at 350 ± 3 ℃ of insulation 10min, then begin cooling, be cooled to room temperature with the average cooling rate of 10 ℃/min, when treating that temperature drops to room temperature, reduce magneticstrength to 0T, take out sample.The sample compound interface mean sizes that obtains is 1.1 μ m, and shearing resistance is 98MPa, the perfect recrystallization of copper layer aluminium lamination, and the interface compound kind is Al
2Cu, AlCu, Al
4Cu
9, the composite band yield strength is 80MPa, and composite band tensile strength is 94 MPa, and the composite band unit elongation is 5.5%.
0.15mm the thermomagnetic treatment technique of the cold rolling composite strip of ultra-thin copper/aluminium
Carry out anneal with MVH-30 type high-intensity magnetic field process furnace, during thermal treatment, compound good composite band is cut into the small pieces of material of 3.4cm * 1cm, and sample put into plumbago crucible, apply forward magnetic field and be raised to 6T by 0T, then begin sample is heated, be raised to 450 ℃ with the heat-up rate of 10 ℃/s after, at 450 ± 3 ℃ of insulation 30min, then begin cooling, be cooled to room temperature with the average cooling rate of 20 ℃/min, when treating that temperature drops to room temperature, reduce magneticstrength to 0T, take out sample.The sample compound interface mean sizes that obtains is 1.3 μ m, and shearing resistance is 102MPa, the perfect recrystallization of copper layer aluminium lamination, and the interface compound kind is Al
2Cu, AlCu, Al
4Cu
9, the composite band yield strength is 79MPa, and composite band tensile strength is 93MPa, and the composite band unit elongation is 5.0%.
Claims (1)
1. method that improves the cold rolling composite ultra-thin band of copper/aluminium interface bond strength is characterized in that carrying out according to the following steps:
The cold rolling composite ultra-thin band of ultra-thin copper/aluminium of 0.1 ~ 0.15mm is heat-treated, apply simultaneously forward magnetic field and be raised to 0.01 ~ 6T by 0T, then begin sample is heated, after being raised to 350 ~ 450 ℃ with the heat-up rate of 5 ~ 10 ℃/s, at 350 ~ 450 ℃ of lower insulation 5 ~ 30min, then begin cooling, average cooling rate with 10 ~ 20 ℃/min is cooled to room temperature, when treating that temperature drops to room temperature, reduce magneticstrength to 0T, take out sample.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103934266A (en) * | 2014-04-11 | 2014-07-23 | 东北大学 | Copper/aluminum composite belt manufacturing method capable of thinning boundary layer |
| CN106166569A (en) * | 2016-07-28 | 2016-11-30 | 汉舟四川铜铝复合科技有限公司 | A kind of aftertreatment technology of copper aluminum composite material |
| CN111424274A (en) * | 2020-04-03 | 2020-07-17 | 温州宏丰电工合金股份有限公司 | Copper-aluminum composite material and preparation method thereof |
-
2012
- 2012-12-06 CN CN2012105166038A patent/CN102978348A/en active Pending
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| DONG-GANG LI, ETAL.: "Growth of diffusion layers at liquid Al–solid Cu interface under uniform and gradient high magnetic field conditions", 《MATERIALS CHEMISTRY AND PHYSICS》 * |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103934266A (en) * | 2014-04-11 | 2014-07-23 | 东北大学 | Copper/aluminum composite belt manufacturing method capable of thinning boundary layer |
| CN106166569A (en) * | 2016-07-28 | 2016-11-30 | 汉舟四川铜铝复合科技有限公司 | A kind of aftertreatment technology of copper aluminum composite material |
| CN111424274A (en) * | 2020-04-03 | 2020-07-17 | 温州宏丰电工合金股份有限公司 | Copper-aluminum composite material and preparation method thereof |
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Application publication date: 20130320 |