CN102808105B - Method for preparing shape memory copper alloy - Google Patents
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- CN102808105B CN102808105B CN201210305678.1A CN201210305678A CN102808105B CN 102808105 B CN102808105 B CN 102808105B CN 201210305678 A CN201210305678 A CN 201210305678A CN 102808105 B CN102808105 B CN 102808105B
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 19
- 239000010949 copper Substances 0.000 claims abstract description 29
- 238000007669 thermal treatment Methods 0.000 claims abstract description 18
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 17
- 239000002994 raw material Substances 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 12
- 238000003723 Smelting Methods 0.000 claims abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000005242 forging Methods 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 238000003756 stirring Methods 0.000 claims abstract description 6
- 238000002360 preparation method Methods 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 238000005275 alloying Methods 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- 238000004458 analytical method Methods 0.000 claims description 5
- 239000000470 constituent Substances 0.000 claims description 5
- 238000007499 fusion processing Methods 0.000 claims description 5
- 239000004615 ingredient Substances 0.000 claims description 5
- 239000000956 alloy Substances 0.000 abstract description 24
- 229910045601 alloy Inorganic materials 0.000 abstract description 20
- 229910052759 nickel Inorganic materials 0.000 abstract description 15
- 229910052725 zinc Inorganic materials 0.000 abstract description 9
- 229910052748 manganese Inorganic materials 0.000 abstract description 8
- 229910052692 Dysprosium Inorganic materials 0.000 abstract description 7
- 229910052688 Gadolinium Inorganic materials 0.000 abstract description 7
- 229910052787 antimony Inorganic materials 0.000 abstract description 7
- 229910052790 beryllium Inorganic materials 0.000 abstract description 7
- 229910052727 yttrium Inorganic materials 0.000 abstract description 7
- 229910052746 lanthanum Inorganic materials 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 29
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 12
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 10
- 229910052733 gallium Inorganic materials 0.000 description 10
- -1 copper zinc-aluminium Chemical compound 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000011701 zinc Substances 0.000 description 8
- 239000011572 manganese Substances 0.000 description 7
- 229910052761 rare earth metal Inorganic materials 0.000 description 7
- 229910000896 Manganin Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000007334 memory performance Effects 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000006025 fining agent Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229910001000 nickel titanium Inorganic materials 0.000 description 3
- 150000002910 rare earth metals Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910000734 martensite Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 208000000044 Amnesia Diseases 0.000 description 1
- 208000031091 Amnestic disease Diseases 0.000 description 1
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- 208000036142 Viral infection Diseases 0.000 description 1
- 229910000611 Zinc aluminium Inorganic materials 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000006986 amnesia Effects 0.000 description 1
- 230000002929 anti-fatigue Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 239000005457 ice water Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
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Abstract
The invention discloses a method for preparing shape memory copper alloy. The copper alloy consists of the following components in percentage by weight: 2.5 to 3.5 percent of Ni, 5 to 6 percent of Al, 6 to 8 percent of Mn, 0.8 to 1.0 percent of Be, 2 to 3 percent of Zn, 1.0 to 1.4 percent of Sb, 0.05 to 0.1 percent of La, 0.12 to 0.14 percent of Gd, 0.02 to 0.03 percent of Dy, 0.002 to 0.004 percent of Y and the balance of Cu. The method for preparing the shape memory copper alloy comprises the following steps of: 1) preparing raw materials of all components, wherein the raw material of Al is an electrolysis aluminum plate, the raw material of Cu is an electrolysis copper rod, and the raw materials of residual components are industrial ingot metal; 2) placing the raw materials in a heating furnace and smelting at the smelting temperature of between 1,210 and 1,230 DEG C, uniformly stirring, analyzing components to ensure that the alloy components meet the requirement of the content range, preserving heat, standing for 10 to 20 minutes, adjusting pouring temperature to be 1,170 to 1,180 DEG C, and pouring to obtain a lath-shaped ingot block; 3) performing thermal treatment on the lath-shaped ingot block at the temperature of between 870 and 890 DEG C for 10 to 12 hours; and 4) after thermal treatment, performing die forging and forming at the temperature of between 880 and 920 DEG C to obtain a part or a thin plate.
Description
Technical field
The present invention relates to copper alloy technical field, particularly a kind of preparation method of shape memory copper alloy.
Background technology
Memorial alloy has nickel titanium alloy, copper base alloy and iron alloy three classes.Nickel titanium alloy memory performance is higher, reaches 4～8%.But NiTi is all strategic materials, price is surging at present, and complex manufacturing, and cost is very high; Copper base alloy has: copper zinc-aluminium, copper aluminium nickel, copper-aluminium and beryllium, copper aluminium manganese.The main drawback of cu-zn-al alloy is that amnesia phenomenon is serious; Other adopts melting, rolls and draw the copper base alloy of production to form coarse-grain, polycrystalline, and the directional performance difference of performance is large, causes perpendicular to the weak intercrystalline cracking of stress direction intensity, cause low plasticity, the mechanism of low super resilience energy power, performance is very crisp, be difficult to moulding, as can not be cold drawn silk, cold rolled sheet; Up-to-date therlo plasticity is better, but memory capability is not enough, between 1～3%; Copper-aluminium and beryllium alloy memory performance is fine, but very crisp, can not cold drawn cold rolling becoming a useful person; Ferrous alloy as the subject matter of FeMnSi system be that memory capability is poor, without round trip, remember.
Chinese patent CN200610161600.1 discloses a kind of copper-zinc-aluminum shape memory alloy abrasion resistance material and preparation method thereof, the preparing technical field that relates to a kind of shape memory alloy material, preparation method is: with electrolytic copper, 0# zinc, 00# aluminium, electrolytic nickel is starting material, by composition proportion, add compound rare-earth fining agent to carry out melting, when aluminium alloy temperature reaches 1230 ℃～1250 ℃, pour into ingot casting, be heated to 800 ℃～820 ℃ insulation 24 hours after furnace cooling, then remove the dezincify layer of surface 2～3mm, be forged into again sheet material, under 830～870 ℃+130～170 ℃+40～60 ℃ conditions, carry out the thermal treatment of two-stage timeliness.Copper-zinc-aluminum shape memory alloy abrasion resistance material by mass percentage, Zn24.5%～26%, Al3.7%～3.8%, Ni0.9%～1.0%, 0.06%～0.09% compound rare-earth fining agent, the composition of compound rare-earth fining agent is calculated in mass percent, for La45.5%, Ce44.9%, Gd7.7%, Nd1.9%, Yu Weitong.
Chinese patent CN200810019822.9 discloses a kind of method that improves composite rare earth copper-zinc-aluminum shape memory alloy double-pass memory effect.It is characterized by: prepare composite rare earth copper-zinc-aluminum shape memory alloy, its chemical composition (weight percent) is, Zn22%-26%, Al3%-4%, special composite rare-earth modifier 0.2%-0.6%, Yu Weitong.After melting, pour into the ingot casting that diameter is Φ 80 * 150mm.Anneal be heated to 820 ℃ insulation 24 hours after furnace cooling, then remove the dezincify layer of surperficial 2-3mm, then forge the thick sheet material to 11mm, be finally rolled into 0.3mm thin plate.Thermal treatment process is set, its concrete technology is: 820 ℃-850 ℃ insulations were quenched in room temperature oil after 20-40 minute, then carries out being successively incubated 20-40 minute in 140-160 ℃ of oil, is incubated 20-30 minute in 90-100 ℃ water, is incubated 20-30 minute three grades of ageing treatment in 40-50 ℃ water.The prestrain amount of choosing is to be respectively 15%.Circulatory mediator is respectively 100 ℃ of oil and room temperature water.Under this processing parameter, carry out 20 constraint circuit training.
Chinese patent CN200710009646.6 discloses a kind of nickel manganin gallium high-temperature shape memory alloy and preparation method thereof, relates to a kind of alloy.Provide a kind of high martensitic transformation temperature that has, better nickel manganin gallium high-temperature shape memory alloy of plasticity and preparation method thereof.Its composition and be nickel 50%～57%, manganese 17%～25%, copper 1%～8%, gallium 17%～25% by the content of atomic percent.Nickel, manganese, copper and gallium are put into stove, vacuumize and be filled with argon gas melting, obtain nickel manganin gallium high-temperature shape memory alloy ingot; By the thermal treatment of alloy ingot, temperature is 850～900 ℃, furnace cooling; To, through heat treated nickel manganin gallium high-temperature shape memory alloy ingot 850～950 ℃ of hot rollings, nickel manganin gallium high-temperature shape memory alloy ingot be rolled into sheet alloy material; The sheet alloy material obtaining is cut into sample with wire cutting method, and after thermal treatment, ice water quenching, obtains nickel manganin gallium high-temperature shape memory alloy.
The memorial alloy of above-mentioned patent, or use a large amount of zinc to cause being difficult to improve martensitic transformation temperature; Or add the amount of gallium very high, cause production cost to strengthen.
Summary of the invention
For the deficiencies in the prior art, one of object of the present invention is to provide a kind of preparation method of shape memory copper alloy.
For achieving the above object, the present invention adopts following technical scheme:
A kind of preparation method of shape memory copper alloy, this copper alloy is comprised of following component by weight percentage: Ni 2.5-3.5%, Al 5-6%, Mn 6-8%, Be 0.8-1.0%, Zn 2-3%, Sb 1.0-1.4%, La 0.05-0.1%, Gd 0.12-0.14%, Dy 0.02-0.03%, Y 0.002-0.004%, surplus is Cu.Described preparation method comprises the following steps:
1) prepare the raw material of each component, Al electrolysis aluminium sheet wherein, Cu electrolysis copper rod, all the other components adopt technical pure metal ingots.
2) raw material is placed in to process furnace and carries out melting, smelting temperature is about 1210-1230 ℃, in fusion process, stir, analysis ingredient, make its alloying constituent meet above-mentioned content range, then be incubated standing about 10-20 minute, adjust teeming temperature and be about 1170-1180 ℃, pour into lath-shaped ingot bar.
3) by the thermal treatment under the condition of about 870-890 ℃ of lath-shaped ingot bar, the time is about 10-12h.
4), after thermal treatment, between about 880-920 ℃, die-forging forming is part or thin plate.
The selection of the content of each composition of alloy of the present invention and composition thereof is based on the following reasons:
Ni, Al:Ni and Cu, Al form the matrix of shape memory alloy; But because Ni is more valuable, the invention its content is reduced to 2.5-3.5%, simultaneously Al content is reduced to 5-6%; Overcome Ni, Al content height in the past and could realize the technology prejudice of better technique effect, close other element synergy, obtained and Ni, technique effect that Al content is identical;
Sb, Mn:Sb and Cu, Mn form chemical combination phase.Put forward heavy alloyed plasticity and tensile strength.
Be, Zn: control its content and Ni, Al element and realize collaboratively, carry heavy alloyed shape-memory properties.
La, Gd, Dy, Y: these yuan have the effect of rounding Compound Phase, this has good antifriction function mutually, has alloy strengthening effect simultaneously.Gd, Dy and Y acting in conjunction not only can refinement complex compound particles, and the effect of energy refinement matrix, by grain refining, can reduce copper base alloy along the tendency of crystalline substance fracture, thereby improve ductility and the anti-fatigue performance of alloy, improve the stability of shape memory.
High temperature shape memory copper alloy of the present invention and preparation method thereof has following technique effect:
1, owing to having selected applicable composition and content thereof, between each composition, act synergistically, the alloy material performance of production is good, has better shape-memory properties; And overcome the defect of prior art, reduce the content of Ni, Al, Zn, avoided the high and defect that causes of single a kind of alloying element content, and do not used the virose gallium of tool; Adopt suitable rare earth element to coordinate, make the memory performance of alloy of preparation and the memorial alloy that mechanical property meets or exceeds prior art.
2, in preparation technology, coordinate the component adjustment of alloy, adjusted heat treating regime, make the microtexture precipitation size of the alloy after thermal treatment and be distributed with memory performance and the mechanical property that is beneficial to alloy.
3, after thermal treatment, adopt die-forging forming, the tissue of alloy is further optimized, carry heavy alloyed obdurability.4, alloy preparation technology is easy, and production cost is low.
Embodiment
Embodiment mono-
A preparation method for shape memory copper alloy, this copper alloy is comprised of following component by weight percentage: Ni 2.5%, and Al 6%, and Mn 6%, Be 1.0%, and Zn 2%, and Sb 1.4%, and La 0.05%, Gd 0.14%, and Dy 0.02%, and Y 0.004%, and surplus is Cu.Described preparation method comprises the following steps:
1) prepare the raw material of each component, Al electrolysis aluminium sheet wherein, Cu electrolysis copper rod, all the other components adopt technical pure metal ingots.
2) raw material is placed in to process furnace and carries out melting, smelting temperature is 1210 ℃, in fusion process, stirs, analysis ingredient, makes its alloying constituent meet above-mentioned content range, is then incubated standing 20 minutes, adjusting teeming temperature is 1170 ℃, pours into lath-shaped ingot bar.
3), by the thermal treatment under the condition of 870 ℃ of lath-shaped ingot bar, the time is 12h.
4), after thermal treatment, between 880-920 ℃, die-forging forming is part or thin plate.
Embodiment bis-
A preparation method for shape memory copper alloy, this copper alloy is comprised of following component by weight percentage: Ni 3.5%, and Al 5%, and Mn 8%, Be 0.8%, and Zn 3%, and Sb 1.0%, and La 0.1%, Gd 0.12%, and Dy 0.03%, and Y 0.002%, and surplus is Cu.Described preparation method comprises the following steps:
1) prepare the raw material of each component, Al electrolysis aluminium sheet wherein, Cu electrolysis copper rod, all the other components adopt technical pure metal ingots.
2) raw material is placed in to process furnace and carries out melting, smelting temperature is 1230 ℃, in fusion process, stirs, analysis ingredient, makes its alloying constituent meet above-mentioned content range, is then incubated standing 10 minutes, adjusting teeming temperature is 1180 ℃, pours into lath-shaped ingot bar.
3), by the thermal treatment under the condition of 890 ℃ of lath-shaped ingot bar, the time is 10h.
4), after thermal treatment, between 880-920 ℃, die-forging forming is part or thin plate.
Embodiment tri-
A preparation method for shape memory copper alloy, this copper alloy is comprised of following component by weight percentage: Ni 3.0%, and Al 5.5%, and Mn 7%, Be 0.9%, and Zn 2.5%, and Sb 1.2%, and La 0.08%, Gd 0.13%, and Dy 0.025%, and Y 0.003%, and surplus is Cu.Described preparation method comprises the following steps:
1) prepare the raw material of each component, Al electrolysis aluminium sheet wherein, Cu electrolysis copper rod, all the other components adopt technical pure metal ingots.
2) raw material is placed in to process furnace and carries out melting, smelting temperature is 1220 ℃, in fusion process, stirs, analysis ingredient, makes its alloying constituent meet above-mentioned content range, is then incubated standing 15 minutes, adjusting teeming temperature is 1175 ℃, pours into lath-shaped ingot bar.
3), by the thermal treatment under the condition of 880 ℃ of lath-shaped ingot bar, the time is 10-12h.
4), after thermal treatment, between 880-920 ℃, die-forging forming is part or thin plate.
Applicant's statement, the present invention illustrates detailed process equipment and process flow process of the present invention by above-described embodiment, but the present invention is not limited to above-mentioned detailed process equipment and process flow process, do not mean that the present invention must rely on above-mentioned detailed process equipment and process flow process and could implement.Person of ordinary skill in the field should understand, any improvement in the present invention, to the selection of the interpolation of the equivalence replacement of each raw material of product of the present invention and ancillary component, concrete mode etc., within all dropping on protection scope of the present invention and open scope.
Claims (1)
1. a preparation method for shape memory copper alloy, is characterized in that, this copper alloy is comprised of following component by weight percentage: Ni2.5-3.5%, Al5-6%, Mn6-8%, Be0.8-1.0%, Zn2-3%, Sb1.0-1.4%, La0.05-0.1%, Gd0.12-0.14%, Dy0.02-0.03%, Y0.002-0.004%, surplus is Cu; Described preparation method comprises the following steps:
1) prepare the raw material of each component, Al electrolysis aluminium sheet wherein, Cu electrolysis copper rod, all the other components adopt technical pure metal ingots;
2) raw material is placed in to process furnace and carries out melting, smelting temperature is 1210-1230 ℃, in fusion process, stirs, analysis ingredient, makes its alloying constituent meet above-mentioned content range, is then incubated standing 10-20 minute, adjustment teeming temperature is 1170-1180 ℃, pours into lath-shaped ingot bar;
3), by the thermal treatment under the condition of 870-890 ℃ of lath-shaped ingot bar, the time is 10-12h;
4), after thermal treatment, between 880-920 ℃, die-forging forming is part or thin plate.
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| CN104342580A (en) * | 2013-08-04 | 2015-02-11 | 镇江忆诺唯记忆合金有限公司 | Copper-based memory alloy composite additive for improving stability of phase transformation point under hot and cold cycle |
| CN104046839B (en) * | 2014-05-19 | 2016-04-13 | 安徽金大仪器有限公司 | A kind of preparation method of wear-resistance and anti-corrosion valve |
| CN104032185B (en) * | 2014-05-19 | 2016-06-01 | 安徽金大仪器有限公司 | The preparation method of a kind of high hardness wear-resisting valve |
| CN104831111B (en) * | 2015-05-19 | 2017-11-07 | 无锡源创机械科技有限公司 | A kind of copper-based memory alloy patching tube and preparation method thereof, subsidy method and purposes |
| CN106099086B (en) * | 2015-12-18 | 2018-07-20 | 华南理工大学 | The porous copper-zinc-aluminum shape memory alloy composite material and preparation method of micro-nano and application |
| CN107287469A (en) * | 2017-06-22 | 2017-10-24 | 合肥汇之新机械科技有限公司 | A kind of copper system marmem |
| CN108746583B (en) * | 2018-05-21 | 2019-12-03 | 江苏大学 | Laser gain material manufacture low damage type CuZnAl micro-nano powder cored filament material of function and preparation method thereof |
| CN108746581B (en) * | 2018-05-21 | 2019-12-03 | 江苏大学 | Laser gain material manufacture CuZnAl micro-nano powder cored filament material of rare earth enhancing and preparation method thereof |
| CN108746585B (en) * | 2018-05-21 | 2019-12-03 | 江苏大学 | Laser gain material manufacture low damage type FeMnSi micro-nano powder cored filament material of function and preparation method thereof |
| CN108746584B (en) * | 2018-05-21 | 2019-11-29 | 江苏大学 | Laser gain material manufacture FeMnSi micro-nano powder cored filament material of silicon boride enhancing and preparation method thereof |
| CN108746582B (en) * | 2018-05-21 | 2019-12-03 | 江苏大学 | Laser gain material manufacture NiTi micro-nano powder cored filament material of rare earth enhancing and preparation method thereof |
| CN108705076B (en) * | 2018-05-21 | 2019-12-03 | 江苏大学 | Laser gain material manufacture FeMnSi micro-nano powder cored filament material of rare earth enhancing and preparation method thereof |
| CN108746586B (en) * | 2018-05-21 | 2019-12-03 | 江苏大学 | The laser gain material manufacture low damage type marmem micro-nano powder cored filament material of function |
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| CN101886186A (en) * | 2010-07-14 | 2010-11-17 | 南京信息工程大学 | High temperature shape memory copper alloy and preparation method thereof |
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| JPH04311544A (en) * | 1991-04-08 | 1992-11-04 | Nikko Kyodo Co Ltd | Electrically conductive material |
| DE102005035709A1 (en) * | 2005-07-27 | 2007-02-15 | Technische Universität Clausthal | Copper alloy with high damping capacity and process for its preparation |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101407871A (en) * | 2008-11-17 | 2009-04-15 | 江苏科技大学 | High damping superelasticity alloy and preparation thereof |
| CN101886186A (en) * | 2010-07-14 | 2010-11-17 | 南京信息工程大学 | High temperature shape memory copper alloy and preparation method thereof |
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| Title |
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| JP特开平4-311544A 1992.11.04 * |
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