CN102975132B - Multi grinding wheel for OLED substrate and method for grinding OLED substrate using the multi grinding wheel - Google Patents
Multi grinding wheel for OLED substrate and method for grinding OLED substrate using the multi grinding wheel Download PDFInfo
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- CN102975132B CN102975132B CN201210322934.8A CN201210322934A CN102975132B CN 102975132 B CN102975132 B CN 102975132B CN 201210322934 A CN201210322934 A CN 201210322934A CN 102975132 B CN102975132 B CN 102975132B
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- 239000000758 substrate Substances 0.000 title claims abstract description 74
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000002245 particle Substances 0.000 claims abstract description 74
- 239000011230 binding agent Substances 0.000 claims abstract description 56
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 35
- 239000010432 diamond Substances 0.000 claims abstract description 35
- 239000005416 organic matter Substances 0.000 claims description 32
- 238000005498 polishing Methods 0.000 claims description 26
- 239000011521 glass Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 13
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 235000019580 granularity Nutrition 0.000 claims description 9
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 229920001568 phenolic resin Polymers 0.000 claims description 8
- 239000005011 phenolic resin Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 7
- 229920002635 polyurethane Polymers 0.000 claims description 7
- 239000004814 polyurethane Substances 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 6
- 229920001225 polyester resin Polymers 0.000 claims description 6
- 239000004645 polyester resin Substances 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 5
- 229920005596 polymer binder Polymers 0.000 claims description 4
- 239000002491 polymer binding agent Substances 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 150000002894 organic compounds Chemical class 0.000 abstract 1
- 239000000463 material Substances 0.000 description 11
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 229920005749 polyurethane resin Polymers 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910007610 Zn—Sn Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A multi-grinding wheel for an OLED(Organic Light Emitting Diode) substrate with high grinding quality and a method for grinding an OLED substrate using the multi-grinding wheel are provided to maintain grindability and minimize chipping in grinding by employing an elastic binder and controlling the grain size and shape of diamond particles of a grinding tip. A multi-grinding wheel for an OLED substrate with high grinding quality comprises a core member(210), wheel bodies(220,220a,220b), and grinding tips(225). The core member has a hollow portion to which a rotary shaft is coupled. The wheel bodies are separated in the axial direction of the rotary shaft and coupled to the exterior of the core member. The grinding tips are formed on the exterior of the respective wheel bodies. In the grinding tips, an elastic binder fixes grinding particles including diamond particles so as to reduce the chip scattered when grinding an edge of an organic compound laminated surface of an OLED substrate.
Description
Technical field
The present invention relates to the manufacturing technology of Organic Light Emitting Diode substrate grinding Grinding wheel (grinding wheel), more specifically, relate to and break (chipping) especially produced when the edge of grinding organic matter layer pressure surface when the edge of grinding Organic Light Emitting Diode substrate can be made to minimize and the method for grinding that can make to disperse to the minimized Multi-function grinding wheel of organic chip and the Organic Light Emitting Diode substrate that utilizes this Multi-function grinding to take turns.
Background technology
At present, most of display is all based on liquid crystal display (Liquid Crystal Display).
With regard to glass for liquid crystal display panel, be carry out panel machining with the edge (edge) that external diameter is about the Multi-function grinding wheel grinding face glass of 130mm at present.
On the other hand, just Organic Light Emitting Diode (Organic Light Emitting Diode) more outstanding than liquid crystal display in definition, slimming, lightweight is much studied recently.
Organic Light Emitting Diode is also identical with liquid crystal display, after cutting (cutting) Organic Light Emitting Diode substrate, also needs to implement edge grinding to Organic Light Emitting Diode substrate, to remove produced crackle, to improve fracture strength etc.
With regard to base-board of liquid crystal display, because two sides is glass, so the chip dispersed behind grinding edge (chip) easily can be removed in the cleaning process after grinding.But, with regard to Organic Light Emitting Diode substrate, because a lamination has organic matter, so the chip dispersed during the top edge of grinding substrate is embedded in the organic matter layer pressure surface of Organic Light Emitting Diode and cannot easily removes.Like this, the chip being embedded in organic matter layer pressure surface can become the bad reason of Organic Light Emitting Diode.
At present, for the Grinding wheel at the edge of grinding Organic Light Emitting Diode substrate, major part all has form phenolic resin being fixed the polishing particles such as diamond particles, carborundum as binding agent (binder).
As background technology related to the present invention, the Ginding process of flat-panel monitor described in No. 10-2011-0054589th, Korean Patent Laid (on 05 25th, 2011 open) can be proposed.
Summary of the invention
The object of the invention is to, the Multi-function grinding wheel minimizing and also can prevent chip from dispersing to organic matter layer that breaks that can make to produce when the edge of the organic matter layer pressure surface of grinding Organic Light Emitting Diode substrate is provided.
Another object of the present invention is to, provide and can the grinding machine head with distinct characteristics be adopted to improve the method for grinding of the Organic Light Emitting Diode substrate of grinding quality to the edge of the glass surface of Organic Light Emitting Diode substrate and the edge of organic matter layer pressure surface respectively.
Organic Light Emitting Diode substrate Multi-function grinding for the embodiments of the invention achieved the above object takes turns (multi grinding wheel), there is for grinding the edge of the above-mentioned organic matter layer pressure surface of the Organic Light Emitting Diode substrate of glass surface and organic matter layer pressure surface, it is characterized in that, comprise central module, it is formed with mesopore, with fastening rotating shaft, multiple wheel body, combine with the outer peripheral face of above-mentioned central module in the mode that the axis along above-mentioned rotating shaft is separated from each other, and multiple grinding machine head, be formed at above-mentioned multiple wheel bodies outer peripheral face separately, above-mentioned grinding machine head has by the form of elastic binder fixed packet containing the polishing particles of diamond particles, can reduce the chip dispersed when the edge of the organic matter layer pressure surface of the above-mentioned Organic Light Emitting Diode substrate of grinding.
At this moment, above-mentioned elastic binder can be formed by the resin selected from polyurethane based resin, polyester resin and acrylic resin.
Further, preferably, above-mentioned diamond particles has the granularity of 800 ~ 1200 orders (mesh).
Further, preferably, above-mentioned diamond particles is spheroidal particle.
In order to reach the method for grinding of the Organic Light Emitting Diode substrate of the embodiments of the invention of another object above-mentioned, it is characterized in that, the first Multi-function grinding wheel is utilized to come the edge that grinding has the above-mentioned glass surface of the Organic Light Emitting Diode substrate of glass surface and organic matter layer pressure surface, wherein, the first Multi-function grinding wheel comprises the multiple grinding machine heads being fixed the form of polishing particles by the first binding agent; The second Multi-function grinding wheel is utilized to come the edge of the above-mentioned organic matter layer pressure surface of grinding above-mentioned Organic Light Emitting Diode substrate, wherein, the second Multi-function grinding wheel comprises the multiple grinding machine heads being contained the form of the polishing particles of diamond particles by the second binding agent fixed packet that elasticity is higher than above-mentioned first binding agent.
At this moment, the first binding agent being contained in above-mentioned first Multi-function grinding wheel can be formed by the resin selected from phenolic resin and polyimide based resin; The second binding agent being contained in above-mentioned second Multi-function grinding wheel can be formed by the resin selected from polyurethane based resin, polyester resin and acrylic resin.
Organic Light Emitting Diode substrate Multi-function grinding of the present invention is taken turns, and by adopting as the elastic binder of polyurethane grinding machine head, can reduce breaking of producing when the edge of the organic matter layer pressure surface of grinding Organic Light Emitting Diode substrate.
Further, Organic Light Emitting Diode substrate Multi-function grinding of the present invention is taken turns, and to adopt while binding agent by regulating granularity and the shape of the diamond particles of grinding machine head, and breaking of can also making to produce during grinding while maintaining grindability minimizes.
And, the method for grinding of Organic Light Emitting Diode substrate of the present invention, what produce at organic matter layer pressure surface when suppressing grinding by adopting different binding agent respectively to the edge of glass surface and the edge of organic matter layer pressure surface breaking, and can improve the grinding quality of Organic Light Emitting Diode substrate.
Accompanying drawing explanation
Fig. 1 represents that the Organic Light Emitting Diode substrate Multi-function grinding of embodiments of the invention is taken turns.
Fig. 2 represents that the Organic Light Emitting Diode substrate Multi-function grinding of another embodiment of the present invention is taken turns.
Fig. 3 to Fig. 8 represents the example of the grinding machine head of the method for grinding being applicable to Organic Light Emitting Diode substrate of the present invention.
The explanation of Reference numeral
110: central module
120: wheel body
125: grinding machine head
Detailed description of the invention
The embodiment described in detail referring to accompanying drawing can allow advantages and features of the invention and realize these advantages and feature method definitely.But, the present invention is not limited to following the disclosed embodiments, can implement in mutually different various mode, the present embodiment is only for making disclosure of the present invention more complete, contribute to general technical staff of the technical field of the invention and intactly understand category of the present invention, the present invention defines according to the scope of claims.In description full text, identical Reference numeral represents identical structural detail.
Be described in detail referring to the method for grinding of accompanying drawing to the Organic Light Emitting Diode substrate that Organic Light Emitting Diode substrate Multi-function grinding of the present invention is taken turns and utilized this Multi-function grinding to take turns.
Multi-function grinding wheel of the present invention is used as the Grinding wheel (grinding wheel) that grinding has the edge of the Organic Light Emitting Diode substrate of glass surface and organic matter layer pressure surface.
Organic Light Emitting Diode substrate has four edges at glass surface, has four edges at organic matter layer pressure surface.Further, four edges connecting the summit of glass surface and the summit of organic matter layer pressure surface are had.
Multi-function grinding wheel of the present invention is used for multiple edges of grinding Organic Light Emitting Diode substrate.
As mentioned above, when the edge of the organic matter layer pressure surface of grinding Organic Light Emitting Diode substrate, there is the problem of breaking.To this, the material, polishing particles etc. of the binding agent of the pre-pass adjustment of the present invention grinding machine head 125 described later solve the debatable splintering problem when the edge of the organic matter layer pressure surface of grinding Organic Light Emitting Diode substrate.
Fig. 1 represents that the Organic Light Emitting Diode substrate Multi-function grinding of embodiments of the invention is taken turns.
With reference to Fig. 1, shown Multi-function grinding wheel comprises central module 110, wheel body 120 and grinding machine head 125.
Mesopore is formed with fastening rotating shaft in the inside of central module 110.Rotating shaft can be connected with driver elements such as motors.
Multiple wheel body 120 combines with the outer peripheral face of central module 110 in the mode that the axis along rotating shaft is separated from each other.This multiple wheel body 120 can have integral structure, also can have separation-type structure.Further, central module 110 also can have with multiple wheel body 120 respectively in one-piece type structure.
Grinding machine head 125 is formed at multiple wheel bodies outer peripheral face separately.
At this moment, grinding machine head 125 has by the form of elastic binder fixed packet containing the polishing particles of diamond particles.
In the present invention, grinding machine head 125 utilizes elastic binder.This is to reduce breaking of producing when the edge of the organic matter layer pressure surface of grinding Organic Light Emitting Diode substrate.The representative ground of elastic binder being applicable to this grinding machine head 125 can utilize the binding agent formed by polyurethane resin, can utilize the binding agent formed by polyester resin and acrylic resin etc. in addition.
Usually, the binding agent being applicable to grinding machine head utilizes phenolic resins or polyimide resin mostly.These resins, because having high rigidity and adhesion, are mainly used in the situation that area that wheel contacts with work material material is large, as plane lapping or cylinder grinding.
But using the grinding machine head that these resins adopt as binding agent, although hardness is very high, there is elasticity hardly.Grinding also has work material material together to drop by the binding agent of grinding machine head, polishing particles.But when adopting the resin glue that hardness is high, elasticity is low, although grinding force is very outstanding, fragmentation or the meeting of breaking of work material material are a lot.
In contrast, when using the grinding machine head of the elastic binder adopted as polyurethane resin, due to the impact produced when Grinding wheel can be absorbed in the work material material that grinding enbrittles as Organic Light Emitting Diode substrate, so the stability of work material material can be guaranteed.
Thus, when utilizing the Grinding wheel of the grinding machine head comprising employing elastic binder to come the edge of the organic matter layer pressure surface of grinding Organic Light Emitting Diode substrate, Organic Light Emitting Diode substrate crushing can be reduced by stable grinding, reduce the amount of chip that produces or reduction and to disperse distance, and the grinding heat produced when can reduce grinding.
Further, in the present invention, as be contained in grinding machine head 125 polishing particles utilize be diamond particles.At this moment, the diamond particles with 800 ~ 1200 object granularities is preferably utilized, the size of the chip produced during to reduce grinding.When the granularity of diamond particles is thick less than 800 orders, the size that there is chip becomes large problem.On the contrary, when the granularity of diamond particles is too small more than 1200 orders, grindability likely declines greatly.
Further, preferably, diamond particles utilizes the particle with ball shape, the chip produced during can reduce grinding, and easily cleans the chip produced.
On the other hand, cerium oxide (CeO
2) together can be contained in polishing particles with diamond particles.Because cerium oxide can realize physics grinding, and can by realizing chemical grinding with the chemical action of water, so remarkable grindability can be provided for glass grinding.
Therefore, when cerium oxide and diamond particles are together contained in polishing particles, have while can realizing physics grinding by means of diamond particles and cerium oxide, realize the advantage of chemical grinding by means of cerium oxide and water.
When using above-mentioned Multi-function grinding wheel, by adopting grinding machine head, there is as polyurethane flexible binding agent, and regulate granularity and the shape of diamond particles, can make at grinding Organic Light Emitting Diode substrate, especially when the edge of the organic matter layer pressure surface of grinding Organic Light Emitting Diode substrate, debatable splintering problem minimizes.
Next, be described to the method utilizing above-mentioned Multi-function grinding to take turns grinding Organic Light Emitting Diode substrate.
The present invention considers the two sides of Organic Light Emitting Diode substrate, and namely glass surface is different with the physical property of organic matter layer pressure surface, utilizes mutually different Multi-function grinding to take turns when the edge of each of grinding.Grinding to the edge of glass surface and the grinding to the edge of organic matter layer pressure surface can be carried out simultaneously.
That is, when the edge of the glass surface of grinding Organic Light Emitting Diode substrate, the first Multi-function grinding wheel comprising and fixed multiple grinding machine heads of the form of polishing particles by the first binding agent is utilized.On the other hand, when the edge of the organic matter layer pressure surface of grinding Organic Light Emitting Diode substrate, utilize to comprise and taken turns by second Multi-function grinding of the second binding agent fixed packet containing multiple grinding machine heads of the form of the polishing particles of diamond particles.
At this moment, the elasticity of the second binding agent is higher than the elasticity of the first binding agent, can use elastic binder as above.
The first binding agent being contained in the grinding machine head of the first Multi-function grinding wheel can be formed by the phenolic resin, polyimide based resin etc. of the binding agent being often used as grinding machine head.Even if also easily can be removed by cleaning this is because the glass surface of Organic Light Emitting Diode produces chip when grinding.
Further, the polishing particles being contained in the grinding machine head of the first Multi-function grinding wheel can utilize diamond particles, cerium oxide particles, iron oxide particles, carborundum particle etc. to be used as the various polishing particles of grinding agent.
The binding agent that the second binding agent being contained in the grinding machine head of the second Multi-function grinding wheel utilizes elasticity higher than the first binding agent.This binding agent can utilize the binding agent formed by polyurethane based resin, polyester resin, acrylic resin etc.
Further, preferably, the diamond particles being contained in the grinding machine head of the second Multi-function grinding wheel has 800 ~ 1200 object granularities, can obtain the effect of the size of the chip produced when reducing grinding.
Further, preferably, the diamond particles being contained in the second Multi-function grinding wheel is the particle with ball shape, can reduce the generation of chip, and can easily clean produced chip.
Further, the polishing particles being contained in the grinding machine head of the second Multi-function grinding wheel also can comprise cerium oxide.In this case, have and can not only realize physics grinding by means of diamond particles and cerium oxide, the advantage of chemical grinding can also be realized by means of the chemical action of cerium oxide and water.
Although the Multi-function grinding wheel shown in Fig. 1 contains 5 Grinding wheels being combined with grinding machine head respectively, be not limited to this.
Fig. 2 represents that the Organic Light Emitting Diode substrate Multi-function grinding of another embodiment of the present invention is taken turns, and this Multi-function grinding wheel comprises central module 210, wheel body 220 and grinding machine head 225.
Fig. 2 represents that wheel body 220 is the embodiment of 6.Because each element is identical with the explanation in Fig. 1, therefore by description is omitted.
At this moment, with regard to the wheel body 220a that is positioned at both sides of the edge for benchmark with the length direction of central module 210 and be positioned at center side wheel body 220b with regard to, the physical property of its shape, size and grinding machine head can be regulated.
Such as, be located in the wheel body 220a at the edge of central module 210, the face of grinding machine head can tilt about about 45 ° relative to the surface of wheel body.In this case, the wheel body 220a being positioned at the edge of central module 210 can be used as the so-called corner cut (corner cut) that grinding is connected with 4 sharp edges on the summit of the glass surface of OLED substrate and the summit of organic matter layer pressure surface.
For this reason, the grinding machine head of corner cut wheel body 220a can adopt the high metal adhesive of hardness or adopt the hybrid adhesive mixed by metal adhesive and high polymer binder.
As the example of hybrid adhesive, what can propose is by the binding agent of mixed with resin outstanding with heat endurance as engineering polyimide resin for the soft metal binding agent of Zn-Sn series lower for fusing point.When using hybrid adhesive, the size of chip can be reduced compared with only adopting the situation of metal adhesive, also can reduce the amount of the chip dispersed, therefore, it is possible to realize stable corner cut.
Fig. 3 to Fig. 8 represents the example of the grinding machine head of the method for grinding being applicable to Organic Light Emitting Diode substrate of the present invention.
With regard to the grinding machine head shown in Fig. 3, make use of phenolic resin adhesive as binding agent, make use of the diamond particles, carborundum, the iron oxide that are coated with nickel as polishing particles.
With regard to the grinding machine head shown in Fig. 3, can show remarkable grindability and free-cutting during the edge of the glass surface of grinding Organic Light Emitting Diode substrate, the size of the chip produced during grinding is less than 50 μm.
With regard to the grinding machine head shown in Fig. 4, make use of the hybrid adhesive mixed by tin (Sn) powder and polyimide resin as binding agent, make use of diamond particles as polishing particles.
With regard to the grinding machine head shown in Fig. 4, can show remarkable grindability and life characteristic, the size of the chip produced during grinding is less than 80 μm.Therefore, the grinding machine head shown in Fig. 4 is applicable to the Grinding wheel 220a being positioned at the edge of multi-functional resins wheel shown in Fig. 2, for the purposes such as corner cut of Organic Light Emitting Diode substrate.
With regard to the grinding machine head shown in Fig. 5, make use of zinc (Zn) powder as soft metal as binding agent, make use of diamond particles as polishing particles.
With regard to the grinding machine head shown in Fig. 5, can show remarkable grindability, especially life characteristic is outstanding.Therefore, the grinding machine head shown in Fig. 5 is also the same with the grinding machine head shown in Fig. 4, may be used for the purposes such as the corner cut of Organic Light Emitting Diode substrate.
On the other hand, the size of the chip produced when reducing grinding, guarantee grinding stability etc. in, the hybrid adhesive be composited by soft metal binding agent and polyimide resin is more outstanding than metal adhesive, and in the life-span of wheel, simple metal binding agent is more outstanding than hybrid adhesive.Further, hybrid adhesive is more outstanding than general high polymer binder in the life-span of wheel.
With regard to the grinding machine head shown in Fig. 6, make use of phenolic resins as binding agent, make use of the diamond particles, carborundum and the iron oxide that are coated with nickel as polishing particles.
With regard to the grinding machine head shown in Fig. 6, free-cutting is outstanding, during grinding, in maximum feed velocity (feed) for also realizing stable grinding during 600mm/s.
With regard to the grinding machine head shown in Fig. 7 and Fig. 8, make use of polyurethane resin as binding agent, make use of diamond particles and carborundum, cerium oxide as polishing particles.
With regard to shown in Fig. 3 utilize phenolic resins as binding agent grinding machine head with regard to, the hardness measured with shore D hardometer is 91, and with regard to shown in Fig. 7 and Fig. 8 utilize polyurethane resin as binding agent grinding machine head with regard to, the hardness measured with shore D hardometer is 58.
Be illustrated centered by embodiments of the invention above, but can various change or distortion be carried out in the level of those skilled in the art.Can say, as long as these change and distortion does not depart from the scope of the present invention, just all belong to the present invention.Therefore, interest field of the present invention should judge according to the scope of appending claims.
Claims (14)
1. an Organic Light Emitting Diode substrate Multi-function grinding is taken turns, and has the edge of the above-mentioned organic matter layer pressure surface of the Organic Light Emitting Diode substrate of glass surface and organic matter layer pressure surface, it is characterized in that, comprising for grinding:
Central module, it is formed with mesopore, with fastening rotating shaft,
Multiple wheel body, combines with the outer peripheral face of above-mentioned central module in the mode that the axis along above-mentioned rotating shaft is separated from each other, and
Multiple grinding machine head, is formed at above-mentioned multiple wheel bodies outer peripheral face separately;
Above-mentioned grinding machine head has by the form of elastic binder fixed packet containing the polishing particles of diamond particles, can reduce the chip dispersed when the edge of the organic matter layer pressure surface of the above-mentioned Organic Light Emitting Diode substrate of grinding,
The edge of described multiple wheel body is formed with corner cut wheel body,
Be formed with grinding machine head at the outer peripheral face of described corner cut wheel body, this grinding machine head adopted to the hybrid adhesive mixed by metal adhesive and high polymer binder.
2. Organic Light Emitting Diode substrate Multi-function grinding according to claim 1 is taken turns, and it is characterized in that, above-mentioned elastic binder is formed by the resin selected from polyurethane based resin, polyester resin and acrylic resin.
3. Organic Light Emitting Diode substrate Multi-function grinding according to claim 1 is taken turns, and it is characterized in that, above-mentioned diamond particles has 800 ~ 1200 object granularities.
4. Organic Light Emitting Diode substrate Multi-function grinding according to claim 1 is taken turns, and it is characterized in that, above-mentioned diamond particles is spheroidal particle.
5. Organic Light Emitting Diode substrate Multi-function grinding according to claim 1 is taken turns, and it is characterized in that, above-mentioned polishing particles also comprises cerium oxide particles.
6. Organic Light Emitting Diode substrate Multi-function grinding according to claim 1 is taken turns, and it is characterized in that, above-mentioned multiple wheel body has integral structure.
7. Organic Light Emitting Diode substrate Multi-function grinding according to claim 1 is taken turns, and it is characterized in that, above-mentioned multiple wheel body has separation-type structure.
8. a method for grinding for Organic Light Emitting Diode substrate, is characterized in that,
The first Multi-function grinding wheel is utilized to come the edge that grinding has the above-mentioned glass surface of the Organic Light Emitting Diode substrate of glass surface and organic matter layer pressure surface, wherein, described first Multi-function grinding wheel comprises the multiple grinding machine heads being fixed the form of polishing particles by the first binding agent;
The second Multi-function grinding wheel is utilized to come the edge of the above-mentioned organic matter layer pressure surface of grinding above-mentioned Organic Light Emitting Diode substrate, wherein, described second Multi-function grinding wheel comprises the multiple grinding machine heads being contained the form of the polishing particles of diamond particles by the second binding agent fixed packet that elasticity is higher than above-mentioned first binding agent
Described first Multi-function grinding wheel or above-mentioned second Multi-function grinding wheel have corner cut wheel body,
Be formed with grinding machine head at the outer peripheral face of described corner cut wheel body, this grinding machine head adopted to the hybrid adhesive mixed by metal adhesive and high polymer binder.
9. the method for grinding of Organic Light Emitting Diode substrate according to claim 8, is characterized in that, the first binding agent being contained in above-mentioned first Multi-function grinding wheel is formed by the resin selected from phenolic resin and polyimide based resin.
10. the method for grinding of Organic Light Emitting Diode substrate according to claim 8, it is characterized in that, the polishing particles being contained in above-mentioned first Multi-function grinding wheel comprise in diamond particles, cerium oxide particles, iron oxide particles and carborundum particle more than one.
The method for grinding of 11. Organic Light Emitting Diode substrates according to claim 8, it is characterized in that, the second binding agent being contained in above-mentioned second Multi-function grinding wheel is formed by the resin selected from polyurethane based resin, polyester resin and acrylic resin.
The method for grinding of 12. Organic Light Emitting Diode substrates according to claim 8, is characterized in that, the diamond particles being contained in above-mentioned second Multi-function grinding wheel has 800 ~ 1200 object granularities.
The method for grinding of 13. Organic Light Emitting Diode substrates according to claim 8, is characterized in that, the diamond particles being contained in above-mentioned second Multi-function grinding wheel is spheroidal particle.
The method for grinding of 14. Organic Light Emitting Diode substrates according to claim 8, is characterized in that, the polishing particles being contained in above-mentioned second Multi-function grinding wheel also comprises cerium oxide.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110089577A KR101103146B1 (en) | 2011-09-05 | 2011-09-05 | Multi grinding wheel for oled substrate and method for grinding oled substrate using the multi grinding wheel |
| KR10-2011-0089577 | 2011-09-05 |
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| Publication Number | Publication Date |
|---|---|
| CN102975132A CN102975132A (en) | 2013-03-20 |
| CN102975132B true CN102975132B (en) | 2015-05-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210322934.8A Active CN102975132B (en) | 2011-09-05 | 2012-09-04 | Multi grinding wheel for OLED substrate and method for grinding OLED substrate using the multi grinding wheel |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101103146B1 (en) |
| CN (1) | CN102975132B (en) |
| TW (1) | TWI541104B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103817571A (en) * | 2012-11-16 | 2014-05-28 | 3M材料技术(合肥)有限公司 | Glass polishing device |
| KR102608901B1 (en) | 2018-12-24 | 2023-12-01 | 삼성전자주식회사 | Wafer Grinding Wheel |
| CN113649891B (en) * | 2021-10-20 | 2021-12-17 | 江苏学霖电缆科技有限公司 | Power cable accessory rubber product grinding device |
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| KR20060034908A (en) * | 2004-10-20 | 2006-04-26 | 주식회사 신안에스엔피 | Method of polishing glass for oled and glass for oled manufactured using the same |
| CN101417405A (en) * | 2007-10-17 | 2009-04-29 | 硅电子股份公司 | Simultaneous double-side grinding of semiconductor wafers |
| CN201235498Y (en) * | 2008-07-30 | 2009-05-13 | 常州松晶电子有限公司 | Lapping machine for two-side of wafer |
| KR20090070302A (en) * | 2007-12-27 | 2009-07-01 | 주식회사 실트론 | Wafer edge grinding wheel with replaceable wheel ring |
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| JPH0674258A (en) * | 1992-08-27 | 1994-03-15 | Nippondenso Co Ltd | Electromagnetic clutch |
| KR20040097063A (en) * | 2004-10-22 | 2004-11-17 | 엠.씨.케이 (주) | Process for preparing foamed polyurethane polishing pad for fine polishing |
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- 2011-09-05 KR KR1020110089577A patent/KR101103146B1/en active IP Right Grant
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- 2012-09-04 CN CN201210322934.8A patent/CN102975132B/en active Active
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060034908A (en) * | 2004-10-20 | 2006-04-26 | 주식회사 신안에스엔피 | Method of polishing glass for oled and glass for oled manufactured using the same |
| CN101417405A (en) * | 2007-10-17 | 2009-04-29 | 硅电子股份公司 | Simultaneous double-side grinding of semiconductor wafers |
| KR20090070302A (en) * | 2007-12-27 | 2009-07-01 | 주식회사 실트론 | Wafer edge grinding wheel with replaceable wheel ring |
| CN201235498Y (en) * | 2008-07-30 | 2009-05-13 | 常州松晶电子有限公司 | Lapping machine for two-side of wafer |
| KR20110054589A (en) * | 2009-11-18 | 2011-05-25 | 주식회사 케이엔제이 | Method for grinding flat pannel display |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI541104B (en) | 2016-07-11 |
| CN102975132A (en) | 2013-03-20 |
| KR101103146B1 (en) | 2012-01-04 |
| TW201311399A (en) | 2013-03-16 |
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